CN218502911U

CN218502911U - Wiping tool

Info

Publication number: CN218502911U
Application number: CN202222461221.1U
Authority: CN
Inventors: 陈飞洋; 梁新夫; 林煜斌; 康奇兴; 姜泽芳
Original assignee: Changdian Integrated Circuit Shaoxing Co ltd
Current assignee: Changdian Integrated Circuit Shaoxing Co ltd
Priority date: 2022-09-16
Filing date: 2022-09-16
Publication date: 2023-02-21
Anticipated expiration: 2032-09-16

Abstract

The utility model discloses a wiping tool, which comprises a body and a gasket, wherein a first channel communicated with an adsorption mechanism is arranged in the body; the upper surface of body is located to the packing ring, and the packing ring is used for supporting the edge of chip wafer active surface, and the active surface of chip wafer is equipped with the welding part, and the packing ring is suitable for making the upper surface of welding part and body have a certain distance, is equipped with the second passageway on the packing ring, and adsorption apparatus adsorbs the lower surface of chip wafer through first passageway and second passageway. The utility model discloses correspond the active face of chip wafer and set up the packing ring, make weld part and body contactless, make the weld part be in the suspension in the cavity between chip wafer and body, consequently, do not have the phenomenon of weld part and the contact of silica gel pad among the prior art, and then avoid because of the condition that the weld part surface that the clean action of cleaning leads to stains. The cleaning tool disclosed by the invention ensures the integrity of the surface appearance of the welding part and avoids the problem of poor welding in the subsequent welding process.

Description

Wiping tool

Technical Field

The utility model relates to a chip package technical field, in particular to clean frock.

Background

As shown in fig. 1, in the conventional wafer level packaging process, when the chip wafer 10 with the conductive connection parts is transferred to the subsequent process, the passive surface of the chip wafer 10 causes much contamination in the process flow, and thus the passive surface of the chip wafer 10 needs to be wiped to clean the contamination. The wiping and cleaning operation is performed by first adsorbing the active surface of the chip wafer 10 on the vacuum chuck 20 through the silicone pad 30, providing a mechanical support for the cleaning and wiping operation of the passive surface of the chip wafer through the vacuum chuck 20, and adsorbing the active surface of the contact chip wafer by using the open porous structure of the silicone material in the silicone pad 30, and simultaneously adsorbing the active surface of the contact chip wafer on the vacuum chuck by using the open porous structure.

The vacuum suction cup 20 is provided with a vacuum duct 201 therein to provide a vacuum suction force, and the silica gel pad 30 is sucked on the vacuum suction cup under the combined action of the vacuum suction force and a capillary suction force formed by an open porous structure of silica gel, and the vacuum suction force can form a vertical downward suction force while sucking the silica gel pad, and the suction of the silica gel pad is realized by the aid of the vertical downward suction force. Because the contact between the silicone pad and the soldering portion 40 is elastic physical contact, when the passive surface of the chip wafer is wiped and cleaned, a horizontal "saw-type" acting force is formed along with the wiping action, and when the "saw-type" acting force is transmitted to the soldering portion 40, a horizontal "saw-type" friction is formed between the soldering portion 40 and the silicone pad 30, so that the silicone material in the silicone pad is transferred to the surface of the soldering portion 40 by friction, and the surface of the soldering portion 40 is stained. The contamination may cause poor welding between the soldering portion 40 and the pad in the subsequent welding process, which may cause an excessive impedance at the joint of the soldering portion 40 and the pad, thereby greatly reducing the reliability of the chip package structure.

SUMMERY OF THE UTILITY MODEL

The application aims to provide a wiping tool to solve the problems in the background technology.

In order to achieve the above purpose, the present application provides the following technical solutions:

a wiping fixture, comprising:

the body is internally provided with a first channel communicated with the adsorption mechanism;

the gasket is arranged on the upper surface of the body and used for supporting the edge of the active surface of the chip wafer, a welding part is arranged on the active surface of the chip wafer, the longitudinal height of the gasket is adjusted to enable the welding part to have a certain distance with the upper surface of the body, a second channel is arranged on the gasket, and the adsorption mechanism adsorbs the edge of the active surface of the chip wafer through the first channel and the second channel;

wherein the edge of the active surface of the chip wafer does not include the bonding portion.

Further, the upper surface of the body is also provided with a check ring, and the check ring is attached to the side wall of the chip wafer.

Further, the upper surface of body still be equipped with the protection pad that the welding part corresponds, the welding part with physical contact does not take place for the protection pad.

Further, one or more notches are formed in the upper end of the retainer ring to expose the side walls of the chip wafer.

Furthermore, the gasket is a plurality of, a plurality of the gasket with the edge laminating of chip wafer active surface.

Furthermore, all the gaskets are arc-shaped.

Further, each gasket is provided with the second channel.

Further, adjacent washers are arranged at intervals, and the notch is arranged between the adjacent washers.

Further, the upper end of the retainer ring exceeds the passive surface of the chip wafer.

Further, the first channel comprises a middle channel and a branch channel, and the middle channel is arranged in the middle of the body and is communicated with the second channel through the branch channel.

To sum up, the utility model discloses a technological effect and advantage:

this application carries out the repacking design through the structure to current frock of cleaning, and the edge of chip wafer active surface corresponds the laminating with the packing ring, makes welding part and body contactless, makes the welding part be in the cavity of suspension between chip wafer and body, consequently, does not have the phenomenon of welding part and the contact of silica gel pad among the prior art, and then avoids the condition of staiing because of cleaning the welding part surface that the action leads to. Compared with the prior art, the cleaning tool has the advantages that the structural design ensures the integrity of the surface appearance of the welding part, and the problem of poor welding in the subsequent welding process is avoided.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative efforts.

FIG. 1 is a schematic diagram of a wiping tool in the prior art;

fig. 2 is a schematic structural view of a wiping tool according to an embodiment of the present invention;

fig. 3 is a top view of a wiping tool according to an embodiment of the present invention.

In the figure: 10. a chip wafer; 20. a vacuum chuck; 30. a silica gel pad; 40. welding the part; 201. a vacuum duct; 1. a body; 2. a gasket; 3. a retainer ring; 4. a protection pad; 5. a notch; 11. a first channel; 11a, a middle channel; 11b, branch channels; 21. a second channel.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood as a specific case by those skilled in the art.

Furthermore, the technical features mentioned in the different embodiments of the invention described below can be combined with each other as long as they do not conflict with each other.

In order to solve the problems in the prior art. The embodiment provides a wiping tool, as shown in fig. 2 and 3, which comprises a body 1 and a gasket 2. Wherein, a first channel 11 for vacuum adsorption is arranged in the body 1. The gasket 2 is arranged on the upper surface of the body 1, the gasket 2 is used for supporting the edge of the active surface of the chip wafer 10, the welding part 40 is arranged on the active surface of the chip wafer 10, the longitudinal height of the gasket 2 is adjusted to enable the welding part 40 to have a certain distance with the upper surface of the body 1, and the distance can ensure that the welding part 40 is not contacted with the body 1 during wiping, so that the welding part 40 is prevented from being polluted; the gasket 2 is provided with a second channel 21, and the active surface of the chip wafer 10 is adsorbed and fixed by the vacuum adsorption force formed by the first channel 11 and the second channel 21, wherein the vacuum adsorption force formed by the second channel 21 exerts a longitudinal adsorption force on the edge of the active surface of the chip wafer 10 to fix the chip wafer, so that the longitudinal stability of the chip wafer 10 during wiping is ensured. Wherein the edge of the active surface of the chip wafer 10 does not include the bonding portion 40.

In the embodiment, the structure of the existing wiping tool is modified, the gasket 2 is arranged corresponding to the active surface of the chip wafer 10, so that the welding part 40 is not in direct physical contact with the body 1, and the welding part 40 is suspended in the space between the chip wafer 10 and the body 1, therefore, the phenomenon that the welding part 40 is in contact with the silica gel pad 30 in the prior art does not exist, and the situation that the surface of the welding part 40 is stained by the silica gel pad 30 due to wiping and cleaning actions is avoided. Compared with the prior art, the cleaning tool has the advantages that the structural design of the cleaning tool guarantees the integrity of the surface appearance of the welding part 40, and the problem of poor welding in the subsequent welding process is avoided. The shape and number of the gaskets 2 are not particularly limited, and the gaskets 2 may be rectangular, circular, elliptical, or the like.

Further, the upper surface of the body 1 is further provided with a retaining ring 3, and the retaining ring 3 is attached to the side wall of the chip wafer 10. The check ring 3 limits the chip wafer 10, the welding part 40 is fixed between the chip wafer 10 and the body 1 through the check ring 3 and the gasket 2, the chip wafer 10 is further limited and reinforced in the horizontal direction, and horizontal displacement caused when the passive surface of the chip wafer is horizontally wiped in a saw-pulling mode is prevented.

Furthermore, the upper surface of the body 1 is further provided with a protection pad 4 corresponding to the welding portion 40, and the welding portion 40 and the protection pad 4 have a certain longitudinal distance, so that the welding portion 40 does not physically contact with the protection pad 4.

Further, the upper end of the retainer ring 2 is provided with one or more notches 5, and the notches 5 are adapted to expose a portion of the side walls of the chip wafer 10. The notch 5 is provided to facilitate the picking and placing of the chip wafer 10.

Further, the gasket 2 is disposed at an edge of the active surface of the corresponding chip wafer 10. Since the soldering portion 40 includes a plurality of solder balls disposed on the active surface of the die wafer 10 in an array manner, the gasket 2 corresponds to the edge of the active surface of the die wafer 10, which is beneficial for disposing the gasket 2 and positioning the die wafer 10 by the gasket 2.

Further, the chip wafer 10 is circular, the number of the gaskets 2 is multiple, the gaskets 2 are all arc-shaped, and the multiple gaskets 2 are distributed along the edge of the active surface of the chip wafer 10. Each gasket 2 is provided with a second passage 21. The cross section of the second channel 21 can be circular, rectangular, triangular and other arbitrary shapes. The lower end of the second channel 21 communicates with the first channel 11, and the upper end of the second channel 21 communicates with the active surface of the chip wafer 10.

Further, adjacent washers 2 are disposed at intervals, and the gap 5 is disposed between the adjacent washers 2. Further, the upper end of the retainer ring 3 exceeds the passive surface of the chip wafer 10. Further, the first passage 11 includes a middle passage 11a and a branch passage 11b, the middle passage 11a is provided at the middle portion of the body 1, and the middle passage 11a communicates with the second passage 21 through the branch passage 11 b.

The working process of the embodiment: set up packing ring 2 on the body 1 that the edge of solder ball portion corresponds, set up second passageway 21 in packing ring 2, establish second passageway 21 through packing ring 2 and realize the absorption to chip wafer 10 edge in, and then realize the absorption to whole chip wafer 10, retaining ring 3 carries on spacingly to chip wafer 10, fixes weld part 40 between chip wafer 10 and body 1 through retaining ring 3 and the packing ring 2 of establishing second passageway 21 in. When the passive surface (upper surface) of the chip wafer 10 is wiped and cleaned, the check ring 3 limits the welding part 40 which moves left and right in a 'saw pulling' manner in the horizontal direction, and prevents the horizontal 'saw pulling' displacement of the welding part 40; when the wiping cleaning action is completed, the chip wafer 10 can be taken out and put in through the notch 5.

Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some technical features, and any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A wiping tool is characterized by comprising:

the device comprises a body (1), wherein a first channel (11) communicated with an adsorption mechanism is arranged in the body (1);

the gasket (2) is arranged on the upper surface of the body (1), the gasket (2) is used for supporting the edge of the active surface of the chip wafer (10), the active surface of the chip wafer (10) is provided with a welding part (40), the longitudinal height of the gasket (2) is adjusted to enable the welding part (40) to have a certain distance with the upper surface of the body (1), the gasket (2) is provided with a second channel (21), and the adsorption mechanism adsorbs the edge of the active surface of the chip wafer (10) through the first channel (11) and the second channel (21);

wherein the edge of the active face of the chip wafer (10) does not comprise the bond (40).

2. The wiping tool according to claim 1, wherein a retaining ring (3) is further arranged on the upper surface of the body (1), and the retaining ring (3) is attached to the side wall of the chip wafer (10).

3. The wiping tool according to claim 1 or 2, characterized in that a protection pad (4) corresponding to the welding portion (40) is further arranged on the upper surface of the body (1), and the welding portion (40) is not in physical contact with the protection pad (4).

4. The wiping tool according to claim 2, characterized in that one or more notches (5) are formed in the upper end of the retainer ring (3) to expose the side wall of the chip wafer (10).

5. The wiping tool according to claim 4, characterized in that the gasket (2) is multiple, and the multiple gaskets (2) are attached to the edge of the active surface of the chip wafer (10).

6. Wiping tooling according to claim 5, characterized in that the washers (2) are all arc-shaped.

7. The wiping tool according to claim 5, characterized in that adjacent washers (2) are arranged at intervals, and the gap (5) is arranged between the adjacent washers (2).

8. Wiping tool according to claim 2, characterized in that the upper end of the retaining ring (3) extends beyond the passive face of the chip wafer (10).

9. The wiping tool according to claim 1, characterized in that the first channel (11) comprises a middle channel (11 a) and a branch channel (11 b), the middle channel (11 a) is arranged in the middle of the body (1) and is communicated with the second channel (21) through the branch channel (11 b).