CN218488093U

CN218488093U - Apparatus for processing substrate

Info

Publication number: CN218488093U
Application number: CN202222210243.0U
Authority: CN
Inventors: 崔世宪
Original assignee: Samsung Display Co Ltd
Current assignee: Samsung Display Co Ltd
Priority date: 2021-11-01
Filing date: 2022-08-22
Publication date: 2023-02-17
Anticipated expiration: 2032-08-22
Also published as: KR20230063992A; CN116061079A

Abstract

An apparatus for processing a substrate includes: a body member positioned adjacent to a side surface of the substrate and rotated; a rotating member coupled to the body member and transmitting a rotational force to the body member; and a peripheral abrasive member coupled to the body member and including a plurality of first peripheral abrasive members and a plurality of second peripheral abrasive members, wherein the second peripheral abrasive member has a roughness different from a roughness of the first peripheral abrasive member. The first peripheral grinding members and the second peripheral grinding members are alternately arranged to be spaced apart from each other in a rotational direction of the body member. A first length of each of the first peripheral abrasive members in a direction from a center of the body member toward an edge of the body member is different from a second length of each of the second peripheral abrasive members in a direction from the center of the body member toward the edge of the body member.

Description

Apparatus for processing substrate

Technical Field

Embodiments generally provide an apparatus for processing a substrate. More particularly, embodiments relate to an apparatus for processing a substrate, wherein the apparatus is used to polish the substrate.

Background

The flat panel display device is a flat and thin display device among display devices, and includes a liquid crystal display device, an organic light emitting display device, an inorganic light emitting display device, a quantum dot display device, and the like. The flat panel display device may include a display panel that displays an image. In general, a display panel may be formed by bonding upper and lower substrates on which elements necessary for an image display region are disposed to form a mother panel, and then cutting the mother panel to a size of a desired cell. In this case, the cutting process of the mother panel may be composed of a process of forming the cut groove using a cutting wheel and a process of striking the cut groove using a crusher or the like. Through the cutting process, the display panel may be divided into desired sizes.

When a display panel having a desired size is divided in a cutting process, horizontal cracks or vertical cracks may occur on a cut surface. In addition, defects such as plastic deformation may occur in the portion where the cutting groove is formed. In order to eliminate these defects, a method of grinding a cut surface with a grinding stone is used. In addition, the grinding stone may be used for a display device having a curved edge.

SUMMERY OF THE UTILITY MODEL

Embodiments provide an apparatus for processing a substrate for improving polishing quality.

An apparatus for processing a substrate according to an embodiment of the present invention may include a body member positioned adjacent to a side surface of the substrate and rotatable, a rotation member coupled to the body member and transmitting a rotational force to the body member, and a peripheral grinding member coupled to the body member and including a plurality of first peripheral grinding members and a plurality of second peripheral grinding members, wherein the second peripheral grinding members have a roughness different from a roughness of the first peripheral grinding members. The first peripheral abrasive member and the second peripheral abrasive member may be alternately arranged to be spaced apart from each other in a rotational direction of the body member. A first length of each of the first peripheral abrasive members in a direction from a center of the body member toward an edge of the body member may be different from a second length of each of the second peripheral abrasive members in a direction from the center of the body member toward the edge of the body member.

In an embodiment, the first peripheral abrasive members may face each other and the second peripheral abrasive members may face each other.

In an embodiment, each of the first peripheral grinding members may include a grinding stone for finish machining with a fine roughness, and each of the second peripheral grinding members may include a grinding stone for rough machining with a relatively coarse roughness.

In an embodiment, the first length may be greater than the second length.

In embodiments, the second length may be about 50% to about 90% of the first length.

In an embodiment, the number of first peripheral abrasive members may be the same as the number of second peripheral abrasive members.

In an embodiment, the shape of each of the first peripheral abrasive members and the shape of each of the second peripheral abrasive members may be the same when viewed from the front.

In an embodiment, each of the first peripheral abrasive members may have a partial shape of a ring and each of the second peripheral abrasive members may have a partial shape of a ring when viewed from the front.

In an embodiment, a separation space through which grinding water passes is formed between each of the first peripheral grinding members and each of the second peripheral grinding members.

In an embodiment, the apparatus for processing a substrate may further include a central polishing member coupled to a center of the body member and having a shape protruding in a direction from the center of the rotation member toward the center of the body member.

In an embodiment, the central abrasive member may have a more protruding shape than the peripheral abrasive member.

In an embodiment, the central abrasive member may include a first central abrasive member coupled to the center of the body member and a second central abrasive member coupled to the first central abrasive member.

In an embodiment, the first central abrasive member may have a rectangular shape and the second central abrasive member may have a semicircular shape when viewed from the side.

An apparatus for processing a substrate according to an embodiment of the present invention may include a body member positioned adjacent to a side surface of the substrate and rotatable, a rotation member coupled to the body member and transmitting a rotational force to the body member, and a peripheral grinding member coupled to the body member and including a plurality of first peripheral grinding members and a plurality of second peripheral grinding members, wherein the second peripheral grinding members have a roughness different from a roughness of the first peripheral grinding members. The first peripheral abrasive member and the second peripheral abrasive member may be alternately arranged to be spaced apart from each other in a rotational direction of the body member. The outer surface of each of the first peripheral abrasive members may coincide with an edge of the body member and the outer surface of each of the second peripheral abrasive members may be spaced apart from the edge of the body member when viewed from the front.

In the apparatus for processing a substrate according to an embodiment of the present invention, the first peripheral polishing member and the second peripheral polishing member having different roughness may be alternately arranged to be spaced apart from each other in the rotation direction of the body member. Further, a first length of each of the first peripheral abrasive members in a direction from a center of the body member toward an edge of the body member may be different from a second length of each of the second peripheral members in a direction from the center of the body member toward the edge of the body member. In particular, the first length may be greater than the second length. Accordingly, damage to the display device can be reduced. In addition, the problem of chipping at the grinding end point can be improved. That is, the polishing quality of the substrate can be improved.

Drawings

The illustrative, non-limiting embodiments will be understood more clearly from the following detailed description, taken in conjunction with the accompanying drawings.

Fig. 1 is a perspective view illustrating an apparatus for processing a substrate, and a support table according to an embodiment.

Fig. 2 is a perspective view illustrating the apparatus for processing a substrate of fig. 1.

Fig. 3 is a side view illustrating the apparatus for processing a substrate of fig. 1.

Fig. 4 is a plan view of the apparatus for processing a substrate of fig. 2, as viewed from the front.

Fig. 5 is a front view illustrating an apparatus for processing a substrate according to another embodiment.

Fig. 6 is a front view illustrating an apparatus for processing a substrate according to still another embodiment.

Fig. 7 and 8 are perspective views illustrating the substrate of fig. 1.

Fig. 9 is a front view illustrating an example of processing a substrate using the apparatus for processing a substrate of fig. 2.

Fig. 10 is a plan view illustrating an example of a substrate processed by the apparatus for processing a substrate of fig. 2.

Detailed Description

Hereinafter, embodiments of the present disclosure will be explained in detail with reference to the accompanying drawings. In the drawings, the same reference numerals are used for the same components, and redundant description of the same components will be omitted.

Referring to fig. 1, an apparatus 100 for processing a substrate according to an embodiment may grind an object by directly contacting the object to be ground. For example, the apparatus 100 for processing a substrate may be provided as a grinder. In an embodiment, the apparatus 100 for processing a substrate may grind a part of the substrate SUB or a window member included in a display device for displaying an image. Each of the substrate SUB and the window member may include glass, sapphire, plastic, or the like. These may be used alone or in combination with each other. However, the present invention is not limited thereto, and each of the substrate SUB and the window member may include different materials.

For example, when the substrate SUB includes an upper substrate and a lower substrate, a single panel may be provided by cutting a mother panel, in which the upper substrate and the lower substrate are bonded, in unit units. In this case, the apparatus 100 for processing a substrate may grind the surface of the cutting region. In addition, the apparatus 100 for processing a substrate may grind the edge of the substrate SUB to have a curved shape.

The substrate SUB may be placed on the support table 10. For example, the support table 10 may include a pair of support portions for supporting the substrate SUB and a variable mechanism for adjusting a separation distance between the support portions. Vacuum holes may be formed in the support portion to adsorb the substrate SUB. Further, the support table 10 may further include a moving unit for moving the substrate SUB.

The substrate SUB as a target of the apparatus 100 for processing a substrate according to an embodiment of the present invention may be a configuration included in a display device for displaying an image. For example, the display device may include an organic light emitting display device (OLED), a liquid crystal display device (LCD), a field emission display device (FED), and a plasma display device (PDP). The display device may include an electrophoretic display device (EPD), a quantum dot display device, or an inorganic light emitting display device.

Fig. 2 is a perspective view illustrating the apparatus for processing a substrate of fig. 1. Fig. 3 is a side view illustrating the apparatus for processing a substrate of fig. 1. Fig. 4 is a plan view of the apparatus for processing a substrate of fig. 2, as viewed from the front. For example, fig. 3 is a side view of the apparatus 100 for processing a substrate of fig. 2, viewed from the first direction D1. Further, fig. 4 is a plan view of the apparatus 100 for processing a substrate of fig. 2 viewed from the second direction D2.

Referring to fig. 2, 3 and 4, the apparatus 100 for processing a substrate according to an embodiment may include a rotating member 110, a connecting member 120, a body member 130, a peripheral polishing member 140, a central polishing member 150, and a protrusion 160.

The rotary member 110 may be coupled to the body member 130 through the connection member 120 to transmit the rotational force to the body member 130. For example, the rotation member 110 may have a length extending in the second direction D2. When the rotating member 110 rotates based on the rotation axis AX, the peripheral abrasive member 140 and the center abrasive member 150 may rotate. Accordingly, the peripheral abrasive member 140 and the central abrasive member 150 may perform the abrading operation based on the rotational force. For example, the rotation member 110 may have a cylindrical shape. However, the present invention is not limited thereto.

The body member 130 may support the peripheral abrasive member 140 and the central abrasive member 150 together. The body member 130 may be coupled to the peripheral abrasive member 140 and the central abrasive member 150. For example, the body member 130 may have a disk shape. However, the present invention is not limited thereto.

The body member 130 may be about 50mm to about 300mm in diameter. In an embodiment, the diameter of the body member 130 may be about 100mm.

The shape of each of the first peripheral abrasive members 140a may be the same as the shape of each of the second peripheral abrasive members 140b when viewed from the front. In an embodiment, each of the first peripheral abrasive members 140a may have a partial shape of a ring and each of the second peripheral abrasive members 140b has a partial shape of a ring, as viewed from the front. However, the present invention is not limited thereto, and each of the first and second peripheral grinding

members

140a and 140b may have a different shape.

In an embodiment, each of the first peripheral abrasive members 140a may include an abrasive stone for finish machining with a fine roughness, and each of the second peripheral abrasive members 140b may include an abrasive stone for rough machining with a relatively coarse roughness. For example, each of the first peripheral abrasive members 140a may include an 800 mesh diamond wheel, and each of the second peripheral abrasive members 140b may include a 400 mesh diamond wheel. However, the configuration of the present invention is not limited thereto.

In an embodiment, the first peripheral abrasive members 140a and the second peripheral abrasive members 140b may be alternately arranged to be spaced apart from each other in the rotational direction of the body member 130. Here, the rotation direction may refer to a counterclockwise direction with respect to the rotation axis AX. However, the present invention is not limited thereto, and the rotation direction may refer to a clockwise direction with respect to the rotation axis AX.

The first peripheral abrasive members 140a may face each other and the second peripheral abrasive members 140b may face each other when viewed from the front. That is, the first peripheral abrasive members 140a may be spaced apart from each other and the second peripheral abrasive members 140b may be spaced apart from each other when viewed from the front. In other words, each of the first peripheral abrasive members 140a may be positioned between the second peripheral abrasive members 140b.

In an embodiment, the number of first peripheral abrasive members 140a may be the same as the number of second peripheral abrasive members 140b. For example, the number of the first peripheral abrasive members 140a may be two, and the number of the second peripheral abrasive members 140b may be two. However, the present invention is not limited thereto.

As described above, the first and second peripheral

abrasive members

140a and 140b may be arranged to be spaced apart from each other. Specifically, the first and second peripheral

abrasive members

140a and 140b may be arranged to be spaced apart from each other in the rotational direction of the body member 130. In this case, the separation space 141 may be formed between the first and second peripheral grinding

members

140a and 140b. For example, the width of the separation space 141 may be about 1mm or more.

By supplying grinding water to the separation space 141 formed between the first peripheral grinding member 140a and the second peripheral grinding member 140b, frictional heat is recovered and particles are discharged, thereby improving grinding quality. In addition, the grinding water present in the separation space 141 may be discharged to the outside due to a centrifugal force of the apparatus 100 for processing a substrate. That is, the grinding water may pass through the separation space 141.

A first length L1 of each of the first peripheral abrasive members 140a in a direction from the center of the body member 130 toward the edge 23 of the body member 130 may be different from a second length L2 of each of the second peripheral abrasive members 140b in a direction from the center of the body member 130 toward the edge 23 of the body member 130.

The first length L1 may be greater than the second length L2. In embodiments, the second length L2 may be about 50% to about 90% of the first length L1. For example, when the first length L1 is about 9mm, the second length L2 may be about 4.5mm to about 8mm. That is, when the first length L1 is about 9mm, the difference between the first length L1 and the second length L2 may be about 1mm to about 4.5mm.

When the second length L2 is greater than 90% of the first length L1, the polishing of the first peripheral polishing member 140a may not be properly performed. When the second length L2 is less than 50% of the first length L1, the cutting force of the first and second peripheral

abrasive members

140a and 140b may be reduced.

The outer surface 21 of the first peripheral abrasive member 140a may coincide with the edge 23 of the body member 130, and the outer surface 22 of the second peripheral abrasive member 140b may not coincide with the edge 23 of the body member 130, as viewed from the front. That is, the outer surface 21 of the first peripheral abrasive member 140a can be adjacent to the edge 23 of the body member 130, and the outer surface 22 of the second peripheral abrasive member 140b can be spaced apart from the edge 23 of the body member 130.

A first thickness T1 of each of the first peripheral grinding members 140a in the second direction D2 may be equal to a second thickness T2 of each of the second peripheral grinding members 140b in the second direction D2. For example, each of the first thickness T1 and the second thickness T2 may be about 7mm. However, the present invention is not limited thereto.

When a substrate (e.g., the substrate SUB of fig. 1) is polished by the first and second peripheral polishing

members

140a and 140b, the thickness of each of the first and second peripheral polishing

members

140a and 140b may be reduced. For example, the first and second peripheral

abrasive members

140a, 140b may be replaced when the thickness of each of the first and second peripheral

abrasive members

140a, 140b is reduced to about 2mm or less.

The protrusion 160 may be formed at the center of the body member 130. The central abrasive member 150 may be coupled to the protrusion 160.

The central abrasive member 150 may include a first central abrasive member 150a and a second central abrasive member 150b. For example, the first central abrasive member 150a may have a semicircular shape and the second central abrasive member 150b may have a rectangular shape when viewed from the side. However, the present invention is not limited thereto, and each of the first and second

center grinding members

150a and 150b may have various shapes.

In the cross-sectional view, the center grinding member 150 may have a shape protruding in a direction (e.g., the second direction D2) from the center of the rotation member 110 toward the center of the body member 130. In an embodiment, the central abrasive member 150 may have a more protruding shape than the peripheral abrasive member 140 in a cross-sectional view.

However, the present invention is not limited thereto. For example, the first central abrasive member 150a and the second central abrasive member 150b may be coupled to the center of the body member 130. In this case, the protrusion 160 may be omitted. Alternatively, the first central grinding member 150a may be directly coupled to the protrusion 160. In this case, the second central grinding member 150b may be omitted.

Each of the first and second central grinding

members

150a and 150b may include a grinding stone for finish machining with a fine roughness or a grinding stone for rough machining with a relatively coarse roughness. For example, the first central grinding member 150a may include grinding stones for rough machining, and the second central grinding member 150b may include grinding stones for finish machining. However, the present invention is not limited thereto, and the first center grinding member 150a may include grinding stones for finish machining, and the second center grinding member 150b may include grinding stones for rough machining.

For example, the first central polishing member 150a may polish a corner of a substrate (e.g., the substrate SUB of fig. 1), and the second central polishing member 150b may polish a side of the substrate SUB. However, the present invention is not limited thereto, and each of the first and second

center grinding members

150a and 150b may grind other regions of the substrate SUB.

Each of the first peripheral polishing member and the second peripheral polishing member of the apparatus for processing a substrate has a ring shape as viewed from the front. The first peripheral abrasive member has a smaller diameter than the second peripheral abrasive member. The first peripheral grinding member is a grinding stone for finish machining with a fine roughness, and the second peripheral grinding member is a grinding stone for rough machining with a relatively rough roughness. In this case, the polishing quality of the substrate polished by the first peripheral polishing member and the second peripheral polishing member of the apparatus for processing a substrate may be deteriorated.

In the apparatus 100 for processing a substrate according to an embodiment of the present invention, the first peripheral polishing member 140a and the second peripheral polishing member 140b having different roughness may be alternately arranged to be spaced apart from each other in the rotation direction of the body member 130. Further, a first length L1 of each of the first peripheral abrasive members 140a in a direction from the center of the body member 130 toward the edge 23 of the body member 130 may be different from a second length L2 of each of the second peripheral abrasive members 140b in a direction from the center of the body member 130 toward the edge 23 of the body member 130. Specifically, the first length L1 may be greater than the second length L2. Accordingly, damage to the display device including the substrate SUB may be reduced. In addition, the problem of chipping occurring at the grinding end point can be improved. That is, the polishing quality of the substrate SUB can be improved.

Fig. 5 is a front view illustrating an apparatus for processing a substrate according to another embodiment. Fig. 6 is a front view illustrating an apparatus for processing a substrate according to still another embodiment.

Referring to fig. 2, 3, 5 and 6, an apparatus 101 for processing a substrate according to another embodiment and an apparatus 102 for processing a substrate according to yet another embodiment may include a rotating member 110, a connecting member 120, a body member 130, a peripheral polishing member 140, a central polishing member 150 and a protrusion 160. However, the

apparatuses

101 and 102 for processing a substrate described with reference to fig. 5 and 6 may be substantially the same as or similar to the apparatus 100 for processing a substrate described with reference to fig. 4, except for the number of peripheral abrasive members 140. Hereinafter, overlapping description will be omitted.

As described above, the peripheral abrasive member 140 may include a plurality of first peripheral abrasive members 140a and a plurality of second peripheral abrasive members 140b. The number of the first peripheral polishing members 140a may be the same as the number of the second peripheral polishing members 140b.

As shown in fig. 5, the number of the first peripheral abrasive members 140a may be about 4, and the number of the second peripheral abrasive members 140b may be about 4. Further, as shown in fig. 6, the number of the first peripheral abrasive members 140a may be about 20, and the number of the second peripheral abrasive members 140b may be about 20. However, the present invention is not limited thereto, and the number of the first peripheral abrasive members 140a and the number of the second peripheral abrasive members 140b may be about 5 or more, about 19 or less, or about 21 or more, respectively.

Fig. 7 and 8 are perspective views illustrating the substrate of fig. 1.

Referring to fig. 7 and 8, as described above, the substrate SUB may be a member included in the display apparatus for displaying an image. For example, the substrate SUB may include glass, sapphire, plastic, or the like. These may be used alone or in combination with each other.

The substrate SUB may include an upper surface US, a lower surface DS facing the upper surface US, and a side surface SD connecting the upper surface US and the lower surface DS. In this case, the substrate SUB shown in fig. 7 may have a rectangular shape in a plan view. However, the present invention is not limited thereto, and the substrate SUB may have a different polygonal shape in a plan view.

For example, the apparatus 100 for processing a substrate shown in fig. 1 may perform a grinding operation such that the edge portion of the substrate SUB has a curved shape. That is, as shown in fig. 8, the apparatus 100 for processing a substrate may polish the cut area CA of the substrate SUB using the peripheral polishing member 140 and the central polishing member 150.

Referring to fig. 7, 8 and 9, the side surface SD of the substrate SUB may be ground by the apparatus 100 for processing a substrate. Specifically, the side surface SD of the substrate SUB may be polished by the peripheral polishing member 140 of the apparatus 100 for processing a substrate. In this case, since the apparatus 100 for processing a substrate rotates in the rotation direction and the substrate SUB moves in the first direction D1, the peripheral polishing member 140 may polish the substrate SUB. At this time, the spray device 200 positioned on the apparatus 100 for processing the substrate may supply the polishing water 201 to the separation space 141 formed between each of the first peripheral polishing members 140a and each of the second peripheral polishing members 140b. The grinding water 201 existing in the separation space 141 may be discharged to the outside due to a centrifugal force of the apparatus 100 for processing a substrate. That is, the grinding water 201 may not be isolated in the separation space 141.

In order to sufficiently polish the side surface SD of the substrate SUB, the apparatus 100 for processing a substrate may be rotated at a high speed, and the substrate SUB may be moved at a low speed. The moving speed of the apparatus 100 for processing a substrate and the substrate SUB may be limited within a certain range in consideration of the polishing efficiency.

When the rotation speed of the apparatus 100 for processing a substrate is less than about 1,000rpm, sufficient polishing cannot be performed on the side surface SD of the substrate SUB. On the other hand, when the rotation speed of the apparatus 100 for processing a substrate exceeds about 20,000rpm, vibration may occur due to a high rotation speed, and uniform polishing may not be achieved. Accordingly, the rotation speed of the apparatus 100 for processing a substrate according to an embodiment of the present invention may have a value between about 1,000rpm and about 20,000rpm.

As the moving speed of the substrate SUB is reduced, sufficient and uniform polishing can be achieved. However, when the moving speed of the substrate SUB is less than about 0.1m/min, it may be difficult to control the polishing process, and the manufacturing yield may be reduced due to a reduction in the processing speed. On the other hand, when the moving speed of the substrate SUB exceeds about 10m/min, sufficient polishing may not be performed, and polishing efficiency may be reduced and defects may occur. Accordingly, the moving speed of the substrate SUB may have a value between about 0.1m/min and about 10 m/min.

As described above, each of the rotation speed of the apparatus 100 for processing a substrate and the moving speed of the substrate SUB may be determined to have an appropriate value in consideration of the polishing efficiency and the processing speed.

When the apparatus 100 for processing a substrate rotates in the rotation direction and the substrate SUB moves in the first direction D1, the side surface SD of the substrate SUB may be polished by the first peripheral polishing member 140 a. Continuously, the second peripheral polishing member 140b may polish the side surface SD of the substrate SUB. That is, the first peripheral polishing member 140a and the second peripheral polishing member 140b may simultaneously polish the side surface SD of the substrate SUB. In this case, an end portion of the side surface SD of the substrate SUB may be polished by the first peripheral polishing member 140 a. That is, the first peripheral polishing member 140a may finish polishing the side surface SD of the substrate SUB.

Here, the first peripheral grinding member 140a may be a grinding stone for finish machining with a fine roughness, and the second peripheral grinding member 140b may be a grinding stone for rough machining with a relatively coarse roughness.

In other words, in the process of polishing the side surface SD of the substrate SUB, the finishing process and the rough machining process may be performed simultaneously. Thus, the end of the side surface SD of the substrate SUB can be finished by finishing. Therefore, the polishing quality of the side surface SD of the substrate SUB can be improved.

In this way, when the peripheral polishing member 140 polishes the side surface SD of the substrate SUB, the side surface SD of the substrate SUB can be polished most efficiently.

However, in fig. 9, the peripheral polishing member 140 polishes the side surface SD of the substrate SUB, but the present invention is not limited thereto. For example, the peripheral polishing member 140 may polish various regions of the substrate SUB (e.g., corners of the substrate SUB).

Further, unlike fig. 9, the cut area CA of the substrate SUB may be polished by the apparatus 100 for processing a substrate. Specifically, the cut area CA of the substrate SUB may be ground by the central grinding member 150 of the apparatus 100 for processing a substrate.

Referring to fig. 10, a substrate SUB polished by the apparatus 100 for processing a substrate shown in fig. 1 may be provided. As shown in fig. 10, the side surface of the substrate SUB may include a curved region RL and a straight region FL.

The present disclosure is applicable to various display devices including a display panel. For example, the present disclosure may be applied to high resolution smart phones, mobile phones, smart tablets, smart watches, tablet PCs, in-car navigation systems, televisions, computer monitors, notebook computers, and the like.

The foregoing is illustrative of embodiments and is not to be construed as limiting thereof. Although a few embodiments have been described, those skilled in the art will readily appreciate that many modifications are possible in the embodiments without materially departing from the novel teachings and advantages of the present inventive concept. Accordingly, all such modifications are intended to be included within the scope of the present inventive concept as defined in the claims. Therefore, it is to be understood that the foregoing is illustrative of various embodiments and is not to be construed as limited to the specific embodiments disclosed, and that modifications to the disclosed embodiments, as well as other embodiments, are intended to be included within the scope of the appended claims.

Claims

1. An apparatus for processing a substrate, comprising:

a body member positioned adjacent to a side surface of the substrate and rotatable;

a rotating member coupled to the body member and transmitting a rotational force to the body member; and

a peripheral abrasive member coupled to the body member and including a first plurality of peripheral abrasive members and a second plurality of peripheral abrasive members,

wherein the first peripheral grinding member and the second peripheral grinding member are alternately arranged to be spaced apart from each other in a rotational direction of the body member, and

wherein a first length of each of the first peripheral grinding members in a direction from a center of the body member toward an edge of the body member is different from a second length of each of the second peripheral grinding members in a direction from the center of the body member toward the edge of the body member.

2. The apparatus according to claim 1, wherein each of the first peripheral grinding members includes a grinding stone for finish machining with a fine roughness, and each of the second peripheral grinding members includes a grinding stone for rough machining with a relatively coarse roughness.

3. The apparatus of claim 2, wherein the first length is greater than the second length.

4. The apparatus according to claim 1, wherein a shape of each of the first peripheral polishing members and a shape of each of the second peripheral polishing members are the same when viewed from a front surface.

5. The apparatus for processing a substrate according to claim 1, further comprising:

a central grinding member coupled to the center of the body member and having a shape protruding in a direction from a center of the rotation member toward the center of the body member.

6. An apparatus for processing a substrate according to claim 5, wherein the central grinding member comprises:

a first central grinding member coupled to the center of the body member; and

a second central grinding member coupled to the first central grinding member.

7. An apparatus for processing a substrate according to claim 6, wherein the first central abrasive member has a rectangular shape and the second central abrasive member has a semicircular shape when viewed from the side.

8. An apparatus for processing a substrate, comprising:

wherein, when viewed from the front, an outer surface of each of the first peripheral abrasive members is coincident with an edge of the body member and an outer surface of each of the second peripheral abrasive members is spaced apart from the edge of the body member.

9. The apparatus for processing a substrate according to claim 8, wherein each of the first peripheral grinding members includes a grinding stone for finish machining with a fine roughness, and each of the second peripheral grinding members includes a grinding stone for rough machining with a relatively coarse roughness.

10. An apparatus for processing a substrate according to claim 8, wherein a shape of each of the first peripheral polishing members and a shape of each of the second peripheral polishing members are the same when viewed from the front surface.