CN218447964U - Thermoelectric separation's UV LED module light source device - Google Patents
Thermoelectric separation's UV LED module light source device Download PDFInfo
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- CN218447964U CN218447964U CN202221953512.6U CN202221953512U CN218447964U CN 218447964 U CN218447964 U CN 218447964U CN 202221953512 U CN202221953512 U CN 202221953512U CN 218447964 U CN218447964 U CN 218447964U
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Abstract
The utility model discloses technical scheme discloses a UV LED module light source device of thermoelectric separation, including the heat dissipation layer and set up the heat conduction insulating layer on the heat dissipation layer, both sides are equipped with first negative pole pad and second negative pole pad respectively on the heat conduction insulating layer, and are equipped with anodal pad in the middle of first negative pole pad and the second negative pole pad, and anodal pad both sides are equipped with two at least solid crystalline regions, all are equipped with ultraviolet emitting diode on the solid crystalline region, and the ultraviolet emitting diode both ends are passed through the negative pole pin and are connected with first negative pole pad and second negative pole pad respectively. The utility model discloses technical scheme radiating effect is good, can thermoelectric separation and effectively reduce the temperature of ultraviolet emitting diode PN junction to be favorable to improving luminous efficacy, promoting the light-emitting ability and improving product life, and be favorable to the simple structure of assembly and the high-power module light source device of thermoelectric separation type UV LED that can modularization design many times.
Description
Technical Field
The utility model discloses technical scheme relates to photocuring catalysis field, in particular to UV LED module light source device of thermoelectric separation.
Background
The radiation spectrum waveband range of Ultraviolet (UV) is 100-420nm, wherein the wavelength of long-wave Ultraviolet (UVA) is usually between 320-420nm, the penetration capability is strong, and the light beam energy carried by the UVA is matched with the chemical bond energy of most substances, so that photochemical reaction is easily initiated, and therefore, the light-cured adhesive is usually cured by the irradiation of the long-wave Ultraviolet (UVA); the ultraviolet light curing technology utilizes the photosensitivity of a photoinitiator, and when the ultraviolet light irradiates, the photoinitiator in the coating is excited and decomposed, so that the light curing glue is cured.
At present, most light-emitting module light source devices of ultraviolet light curing on the market have insufficient luminous intensity, the uniformity of light spots on an irradiated surface is unsatisfactory, the structure is complex, the LED device is inconvenient to install, the heat power consumption density of the LED device is high, the heat response is sensitive, the heat dissipation effect is insufficient, the PN junction temperature of the ultraviolet light-emitting diode is abnormally too high, the photoelectric parameter of the ultraviolet light-emitting diode is further influenced to be invalid, the light-emitting efficiency is reduced, even the irreversible catastrophic failure of the light source device is caused, and the service life of the light source device is influenced.
SUMMERY OF THE UTILITY MODEL
The utility model discloses technical scheme aims at solving one of the technical problem in the correlation technique to a certain extent at least. Therefore, the utility model provides a main aim at provides a radiating effect is good, can thermoelectric separation and effectively reduce the temperature of ultraviolet emitting diode PN junction to be favorable to improving luminous efficacy, promoting light-emitting capability and improving product life, and be favorable to the simple structure of assembly and the high-power module light source device of thermoelectric separation type UV LED that can modularization design many times.
In order to achieve the above object, the technical solution of the present invention provides a UV LED module light source device with thermoelectric separation, which comprises a heat dissipation layer and a heat conductive insulation layer disposed on the heat dissipation layer,
a first cathode bonding pad and a second cathode bonding pad are respectively arranged on the two sides of the heat-conducting insulating layer, an anode bonding pad is arranged between the first cathode bonding pad and the second cathode bonding pad,
at least two die bonding areas are arranged on two sides of the anode bonding pad,
and ultraviolet light-emitting diodes are arranged on the die bonding areas, and two ends of each ultraviolet light-emitting diode are respectively connected with the first negative electrode bonding pad and the second negative electrode bonding pad through negative electrode pins.
In one embodiment, the heat dissipation layer is a high-thermal-conductivity copper substrate with a certain thickness, a heat transmission heat dissipation channel is formed, the height of the heat dissipation layer in the thickness direction is larger than 2mm, the surface area of a cross section perpendicular to the thickness direction is smaller than 800mm & lt 2 & gt, and the bottom surface of the heat conduction insulating layer is fixedly bonded to the upper end face of the heat dissipation layer.
In one embodiment, the first negative electrode bonding pad and the second negative electrode bonding pad are respectively arranged in a bilateral axial symmetry mode by taking a middle shaft in the width direction of the heat dissipation layer as a symmetry axis, and the cross sections of the first negative electrode bonding pad and the second negative electrode bonding pad are both in an L-shaped structure.
In one embodiment, the positive electrode pad is T-shaped in cross section.
In one embodiment, the first negative electrode bonding pad, the second negative electrode bonding pad and the positive electrode bonding pad are provided with an insulation groove between each other.
In one embodiment, the heat dissipation layer is provided with a mounting hole and a connecting hole.
The utility model discloses technical scheme's beneficial effect as follows:
the utility model discloses the UV LED module light source device of thermoelectric separation that technical scheme provided, the heat dissipation layer is for having the high heat conduction copper base plate on certain thickness, the heat conduction insulating layer is located between two intermediate layers on heat dissipation layer and circuit layer, the heat of formation insulation separation and heat conduction is dredged the passageway, the heat dissipation layer is used for dispelling the heat with heat diffusion conduction to the device outside, the circuit layer is used as and is connected the electricity each other between many high-power ultraviolet emitting diode, and be connected with the outside circular telegram of device, such structure makes and can separate the layering distribution each other between heat dissipation layer and the circuit layer, the mutual influence of thermoelectricity has greatly been reduced, the thermoelectric separation of light source device has been realized, effectively reduce the temperature of ultraviolet emitting diode PN junction, the reliability and the life of device have been improved. The thermoelectric separation copper substrate has a simple structure, is convenient to assemble, realizes modular multiple design of the arranged connecting holes, improves the practicability of the product, and enlarges the application and application range of the product.
Drawings
In order to clearly illustrate the embodiments of the present invention or the technical solutions of the present invention in the prior art, the drawings used in the embodiments or the technical solutions of the present invention will be briefly described below, it should be obvious that the drawings in the following description are only some embodiments of the technical solutions of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
Fig. 1 is the schematic view of the overall structure of the first and second negative electrode pads, the ultraviolet light emitting diode and each component in the technical solution of the present invention.
Fig. 2 is the utility model discloses heat dissipation layer back and mounting hole, connecting hole among the technical scheme set up the schematic diagram.
Fig. 3 is a schematic view of the arrangement of the box dam in another embodiment of the present invention.
[ list of reference numerals for main parts/components ]
| Reference numerals | Name(s) | Reference numerals | Name(s) |
| 1 | Heat dissipation layer | 4 | |
| 2 | |
5 | |
| 20 | |
6 | Connecting |
| 21 | |
7 | Mounting hole |
| 3 | |
8 | Heat-conducting insulating layer |
| 30 | Ultraviolet light emitting diode | 9 | Enclosure dam |
Detailed Description
In order to make the utility model discloses technical scheme's purpose, utility model technical scheme's advantage are more clearly understood, will combine below the utility model discloses the attached drawing in the technical scheme embodiment is right utility model technical scheme in the technical scheme embodiment clearly, describe completely. It is obvious that the described embodiments are only some embodiments of the technical solution of the present invention, not all embodiments.
Based on the embodiment in the technical scheme of the utility model, all other embodiments that ordinary skilled person in the art obtained under the prerequisite of not making creative work all belong to the scope of the utility model technical scheme protection.
It should be noted that all the directional indicators (for example, up, down, left, right, front, back, 8230 \8230;) in the embodiments of the present invention are only used to explain the relative position relationship between the components, the motion situation, etc. in a specific state (as shown in the attached drawings), and if the specific posture is changed, the directional indicator is changed accordingly.
The description as to "first", "second", etc. in the technical solutions of the present invention is only for descriptive purposes and is not to be understood as indicating or implying its relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the feature.
In the description of the present invention, "plurality" means at least two, e.g., two, three, etc., unless explicitly specified otherwise.
In the technical solution of the present invention, unless explicitly stated or limited otherwise, the terms "connected" and "fixed" should be understood in a broad sense, for example, "fixed" may be a fixed connection, or may be a detachable connection, or may be integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be interconnected within two elements or in a relationship where two elements interact with each other unless otherwise specifically limited. The specific meaning of the above terms in the technical solution of the present invention can be understood by those of ordinary skill in the art according to specific situations.
In addition, the utility model discloses utility model technical scheme between each embodiment can combine each other among the technical scheme, but must be based on the ordinary technical personnel in this field can realize, should consider this kind of utility model technical scheme's combination not exist when utility model technical scheme's combination appears contradicting each other or can't realize, also is not in the protection scope that technical scheme required of the utility model.
The utility model discloses technical scheme's concrete embodiment as follows:
with reference to figures 1-3 of the drawings,
the utility model provides a be applied to powerful UV LED module light source device that sends out of ultraviolet photocuring, this utility model light source device includes heat dissipation layer 1, heat conduction insulation layer 8, solid crystalline region 4, ultraviolet emitting diode 30.
The heat dissipation layer 1 is a high-heat-conductivity copper substrate with a certain thickness, a heat transmission heat dissipation channel is formed, the bottom surface of the heat conduction insulating layer 8 is bonded, contacted and fixed on the upper end surface of the heat dissipation layer 1, the heat conduction insulating layer 8 is used for heat transfer of a contact surface and heat exchange surface insulation and separation, the circuit layer comprises an anode pad 21 layer and a cathode pad 2 and 20, the anode pad 21 layer and the cathode pad 2 and 20 are both in contact, covered and fixed on the top surface of the heat conduction insulating layer 8 and used for electric connection and intercommunication between the inside and the outside of a device, and the crystal fixing region 4 is arranged on the upper end surface of the anode pad 21 layer and used for fixing at least two ultraviolet light emitting diodes 30.
Comprises a heat dissipation layer 1, wherein the heat dissipation layer 1 has a thickness of more than 2mm and a cross-sectional surface area perpendicular to the thickness direction of less than 800mm 2 The high heat conduction copper substrate with the cuboid appearance is integrally formed by red copper metal base materials with the material heat conductivity higher than 300W/(m.K), high material density, strong heat bearing capacity and high mechanical strength, the heat conduction insulating layer 8 is fixedly covered on the upper end surface of the copper substrate of the heat dissipation layer 1 in a contact manner, and further forms a heat interaction surface with the heat dissipation layer 1, the thickness of the heat conduction insulating layer 8 is 60-90 mu m, and the material is made of high heat conduction inorganic insulating materials, so that the effect of insulating and blocking is achieved, the heat dissipation is influenced when the heat conduction insulating layer 8 is too thick, if the heat conduction insulating layer is too thin, short circuit is easily caused, the heat conduction insulating layer 8 simultaneously and rapidly conducts most of heat generated by a heat source of the ultraviolet light emitting diode 30 to the heat interaction surface formed with the heat dissipation layer 1 in a horizontal manner, and then sinks and conducts the heat to the high copper substrate of the whole heat dissipation layer 1 in a vertical conduction manner, so that the heat is rapidly dissipated to the outside of a device, and the device is provided with the advantages thatThe temperature of the PN junction of the ultraviolet light emitting diode is effectively reduced, and the reliability of the device is improved.
The ultraviolet light emitting diodes 30 are at least 2 and the area of a single chip is more than 6mm 2 And a chip with a vertical structure driven by large current and light power not lower than 3W, wherein the ultraviolet light emitting diode 30 is fixed on the surface of the crystal fixing area 4 by adopting crystal fixing silver adhesive, preferably, the crystal fixing silver adhesive with viscosity larger than 15000cPs, thermal conductivity larger than 220W/(m.K), high viscosity, fast thermal conductivity and high electrical conductivity is adopted, after the crystal fixing silver adhesive is baked at high temperature, the bottom anode functional area of the ultraviolet light emitting diode 30 with the vertical structure is welded and firmly fixed on the surface of the crystal fixing area 4 to form a circuit anode interconnection and a heat source direct dredging channel, the crystal fixing area 4 is an area which is arranged on the upper end surface of the anode bonding pad 21 and has the area equivalent to the area of a plurality of ultraviolet light emitting diodes, the anode bonding pad 21 has a cross section of a T-shaped structure which is axially symmetrical by taking an intermediate shaft in the width direction of the copper substrate of the heat dissipation layer 1 as a symmetrical shaft, the partial region of the solid crystal region 4 is arranged between a first cathode pad 2 and a second cathode pad 20, the first cathode pad 2 and the second cathode pad 20 are in contact covering fixation on the top surface of a heat conducting insulating layer 8, and are respectively arranged in a bilateral symmetry distribution mode by taking an intermediate shaft in the width direction of a copper substrate of a heat dissipation layer 1 as a symmetry axis, the cross sections of the first cathode pad 2 and the second cathode pad 20 are in L-shaped structural shapes and are used for cathode electric connection, and the anode pad 21, the first cathode pad 23 and the second cathode pad 20 are in copper foil layer copper clad with thickened clad layers.
Two sides of the surface of the cathode functional area of the ultraviolet light emitting diode 30 are respectively led out a certain distance of bonding wires from bonding points through the bonding wires welded on the surface of the ultraviolet light emitting diode, and the led-out bonding wires are respectively welded and fixed on the surfaces of the first cathode pad 2 and the second cathode pad 20, so that a plurality of cathode pins 3 of the ultraviolet light emitting diode 30 can be formed, the ultraviolet light emitting diode 30 is respectively connected with the first cathode pad 2 and the second cathode pad 20 through the cathode pins 3 to form circuit cathode connections, and therefore, the ultraviolet light emitting diodes 30 are mutually connected in parallel and are electrified and interconnected together as shown in a circuit structure, meanwhile, high-current driving is carried out, light is emitted in a consistent manner, the light emitting intensity is improved, and the two cathode pads are arranged, so that the risk of failure of one cathode pad, which causes the failure of a device, can be effectively reduced, and the reliability of the device is improved.
Wherein, mounting hole 7 has been seted up on the copper base plate on heat dissipation layer 1 at least 2 respectively arrange in copper base plate both sides and run through in the ascending through-hole of copper base plate thickness side completely, and mounting hole 7 is used for fixing a position fixed mounting device, and connecting hole 6 is linked together with anodal pad 21, and then accessible connecting hole 6 and outside metal post circular telegram turn-on connection realize that the modularization is laid between a plurality of light source devices, and convenient design promotes application adaptability.
Preferably, the heat dissipation layer 1 is a cuboid copper substrate integrally formed by red copper metal base materials with material thermal conductivity higher than 300W/(m.K), high material density and strong heat carrying capacity, the height of the copper substrate in the thickness direction is larger than 2mm, and the cross section surface area perpendicular to the thickness direction is smaller than 800mm 2 And the heat dissipation device is used as a main heat dissipation channel for transferring heat to the outside of the device.
Preferably, the negative electrode pad layer includes a first negative electrode pad 2 and a second negative electrode pad 20, the first negative electrode pad 2 and the second negative electrode pad 20 are respectively disposed in a bilateral symmetry distribution by taking an intermediate shaft in a width direction of the copper substrate as a symmetry axis, and cross sections of the first negative electrode pad 2 and the second negative electrode pad 20 are both L-shaped structural shapes for electrically connecting the negative electrodes.
Preferably, the positive electrode pad 21 layer is a positive electrode pad 21 with a cross section in a T shape and a connected structure with a central axis in the width direction of the copper substrate as a symmetry axis and an axisymmetrical appearance, and a partial area of the positive electrode pad 21 is arranged between the first negative electrode pad 2 and the second negative electrode pad 20, and the positive electrode pad 21 is used for positive electrode electrical connection. The first cathode pad 2, the second cathode pad 20 and the anode pad 21 are provided with an insulation groove 5 between each other, and are further insulated from each other.
Preferably, the positive electrode pad 21 layer and the negative electrode pads 2 and 20 are thickened plated copper clad layers, and further, the surface processing technology is nickel palladium gold, and appropriate surface roughening treatment is performed to improve the reliability of welding fixation.
Preferably, the heat conducting and insulating layer 8 is made of a high heat conducting inorganic insulating material, and has a thickness of 60-90 μm, so as to function as an insulating layer.
Preferably, a plurality of through holes which completely penetrate through the copper substrate in the thickness direction are formed in the copper substrate of the heat dissipation layer 1, each through hole comprises a mounting hole 7 and a connecting hole 6, each mounting hole 7 is used for positioning and fixing a mounting device, each connecting hole 6 is communicated with the positive electrode bonding pad 21 layer, and then the through holes are in power-on conduction connection with external metal columns, modular arrangement among a plurality of light source devices is achieved, design is facilitated, and application adaptability is improved.
Preferably, the wavelength of the plurality of high power ultraviolet light emitting diodes 30 is between 340-420nm of long wave ultraviolet UVA, and the structure of the chip is a vertical structure.
As shown in fig. 3, in another embodiment of the present invention, the dam 9 protruding from the uv led 30 is fixed on the upper end surface of the circuit layer, and at least two openings are formed inside the dam 9, wherein the two complete four sides surround the uv led 30, so as to form a protection cavity, thereby reducing the risk of damage of the uv led 30 due to external mechanical stress.
The utility model discloses technical scheme's theory of operation as follows:
the UV LED module light source device of thermoelectric separation, heat dissipation layer 1 is the high heat conduction copper base plate that has certain thickness, heat conduction insulating layer 8 is located between two intermediate layers on heat dissipation layer 1 and circuit layer, form the heat mediation passageway of insulating separation and heat conduction, heat dissipation layer 1 is used for conducting the heat diffusion to the device outside and dispels the heat, the circuit layer is used as and electrically connects each other between a plurality of high-power ultraviolet emitting diode 30, and with the outside circular telegram of device and be connected, such structure makes and separates the layering distribution each other between heat dissipation layer 1 and the circuit layer, greatly reduced the influence between thermoelectric interaction, the thermoelectric separation of light source device has been realized, effectively reduce the temperature of ultraviolet emitting diode PN junction, the reliability and the life of device have been improved. The thermoelectric separation copper substrate has a simple structure, is convenient to assemble, realizes modular multiple design of the connecting holes 6, improves the practicability of the product, and enlarges the application and application range of the product.
Above only be the utility model discloses technical scheme's preferred embodiment, not consequently the restriction the utility model discloses technical scheme's patent scope all is in the utility model discloses technical scheme's utility model technical scheme designs under, utilizes the utility model discloses the equivalent structure transform that the content of technical scheme description and drawing did, or direct/indirect application all includes in other relevant technical field the utility model discloses technical scheme's patent protection within range.
Claims (6)
1. A thermoelectrically separated UV LED module light source device is characterized in that,
comprises a heat dissipation layer and a heat conduction insulating layer arranged on the heat dissipation layer,
a first cathode bonding pad and a second cathode bonding pad are respectively arranged on the two sides of the heat-conducting insulating layer, a positive bonding pad is arranged between the first cathode bonding pad and the second cathode bonding pad,
at least two die bonding areas are arranged on two sides of the anode bonding pad,
and ultraviolet light-emitting diodes are arranged on the die bonding areas, and two ends of each ultraviolet light-emitting diode are respectively connected with the first negative electrode bonding pad and the second negative electrode bonding pad through negative electrode pins.
2. The device as claimed in claim 1, wherein the heat dissipation layer is a copper substrate with high thermal conductivity and a certain thickness, and forms a heat transmission heat dissipation channel, the height of the heat dissipation layer in the thickness direction is greater than 2mm, the cross-sectional surface area perpendicular to the thickness direction is less than 800mm2, and the bottom surface of the heat conductive insulation layer is bonded and fixed on the upper end surface of the heat dissipation layer.
3. The thermally and electrically separated UV LED module light source device according to claim 1, wherein the first negative electrode pad and the second negative electrode pad are respectively disposed in a bilateral axisymmetric distribution with respect to a middle axis in a width direction of the heat dissipation layer as a symmetry axis, and both the first negative electrode pad and the second negative electrode pad have an L-shaped cross section.
4. The thermally and electrically separated UV LED module light source device of claim 1, wherein said positive electrode pad is T-shaped in cross-section.
5. The thermally and electrically separated UV LED module light source device of claim 1, wherein said first negative bond pad, said second negative bond pad and said positive bond pad are provided with an insulating groove between each other.
6. The thermally and electrically separated UV LED module light source device of claim 1, wherein said heat sink layer has mounting holes and connecting holes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221953512.6U CN218447964U (en) | 2022-07-27 | 2022-07-27 | Thermoelectric separation's UV LED module light source device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221953512.6U CN218447964U (en) | 2022-07-27 | 2022-07-27 | Thermoelectric separation's UV LED module light source device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218447964U true CN218447964U (en) | 2023-02-03 |
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ID=85090768
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221953512.6U Active CN218447964U (en) | 2022-07-27 | 2022-07-27 | Thermoelectric separation's UV LED module light source device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218447964U (en) |
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2022
- 2022-07-27 CN CN202221953512.6U patent/CN218447964U/en active Active
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