CN218404395U - Water-cooled disc and thin film deposition equipment - Google Patents
Water-cooled disc and thin film deposition equipment Download PDFInfo
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- CN218404395U CN218404395U CN202222256887.3U CN202222256887U CN218404395U CN 218404395 U CN218404395 U CN 218404395U CN 202222256887 U CN202222256887 U CN 202222256887U CN 218404395 U CN218404395 U CN 218404395U
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- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The application relates to a water-cooling disc and film deposition equipment, this water-cooling disc includes: a water-cooled disc main body; the cooling water channel is arranged in the water cooling disc main body, a water inlet and a water outlet are respectively formed in two ends of the cooling water channel, and the cooling water channel is located on a first plane; the water inlet pipeline and the water outlet pipeline are connected with the water cooling disc body and are respectively communicated with the water inlet and the water outlet, and the included angle between at least one of the water inlet pipeline and the water outlet pipeline and the first plane is larger than zero degree, so that the water cooling effect of the water cooling disc can be improved, the problem that the temperature of the spray head is abnormal in the film deposition process is solved, the film thickness of a product is reduced, and the product yield is improved.
Description
[ technical field ] A
The application relates to the technical field of semiconductors, in particular to a water-cooling disc and film deposition equipment.
[ background ] A method for producing a semiconductor device
In the fabrication of semiconductor devices, it is necessary to form a thin film on a wafer surface through a thin film deposition process (e.g., a plasma enhanced chemical vapor deposition process, PECVD).
However, in the process of depositing a thin film on the surface of a wafer by using the conventional thin film deposition equipment, the problem that the temperature of the shower head is difficult to be effectively adjusted so as to keep the temperature within the process temperature range exists, so that the thickness of the film of a product is abnormal, and the yield of the product is influenced.
[ Utility model ] A method for manufacturing a semiconductor device
An object of this application is to provide a water-cooling dish and film deposition equipment to improve the water-cooling effect of water-cooling dish, and then solve the unusual problem of film deposition in-process shower head temperature.
In order to solve the above problem, the present application provides a water-cooling disc, which includes: a water-cooled disc main body; the cooling water channel is arranged in the water cooling disc main body, a water inlet and a water outlet are respectively formed in two ends of the cooling water channel, and the cooling water channel is located on a first plane; and the water inlet pipeline and the water outlet pipeline are connected with the water cooling disc main body and are respectively communicated with the water inlet and the water outlet, and the included angle between at least one of the water inlet pipeline and the water outlet pipeline and the first plane is greater than zero degree.
Wherein, the water-cooling dish main part is including the upper surface and the lower surface that are located the relative both sides of first plane, and the one end and the water inlet of water inlet pipeline are linked together, and the other end extends to the direction of keeping away from the lower surface of water-cooling dish main part.
One end of the water outlet pipeline is communicated with the water outlet, and the other end of the water outlet pipeline extends in the direction far away from the upper surface of the water-cooling disc main body.
Wherein, the included angle scope of water inlet pipeline and first plane is 45 ~ 75 degrees, and the included angle scope of delivery pipe and first plane is 45 ~ 75 degrees.
Wherein, the cooling water course includes a plurality of reposition of redundant personnel pipelines, and water inlet and delivery port are connected respectively to the both ends of each reposition of redundant personnel pipeline.
Wherein, a plurality of reposition of redundant personnel pipelines are along the direction distribution of keeping away from water inlet and delivery port, and length is the crescent setting.
Wherein, be equipped with the air inlet on at least one reposition of redundant personnel pipeline, and the water-cooling dish still includes: and the air inlet pipeline is connected with the water-cooling disc main body and communicated with the air inlet.
Wherein, the water-cooling dish still includes: and a reaction gas channel penetrating the water-cooled tray body in a direction intersecting the first plane.
In order to solve the problem, the application further provides film deposition equipment which comprises the water-cooling disc and a spray head, wherein the spray head is arranged on one side of the water-cooling disc.
Wherein the thin film deposition apparatus further comprises: and the wafer carrying platform is opposite to the spray header and arranged at intervals.
The beneficial effect of this application is: be different from prior art, the water-cooling disc and film deposition equipment that this application provided, the contained angle of at least one in the water inlet pipeline and the outlet pipe way through making the water-cooling disc and the first plane at cooling water course place is greater than zero degree, can improve the water-cooling effect of water-cooling disc, and then solves the unusual problem of film deposition in-process shower head temperature, has reduced the film thickness of product unusual to the product yield has been improved.
[ description of the drawings ]
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
FIG. 1 is a schematic top view of a water-cooled plate provided by an embodiment of the application;
FIG. 2 is a schematic perspective view of a cooling water channel connected to a water inlet pipe and a water outlet pipe according to an embodiment of the present disclosure;
FIG. 3 is a schematic structural diagram illustrating an included angle between a water inlet pipe and a first plane according to an embodiment of the present application;
fig. 4 is a schematic structural diagram of an included angle between the water outlet pipe and the first plane provided in the embodiment of the present application;
FIG. 5 is a schematic view of another three-dimensional structure of the cooling water channel connected to the water inlet pipe and the water outlet pipe according to the embodiment of the present application
FIG. 6 is a schematic perspective view of a cooling water channel connected to a water inlet pipe and a water outlet pipe according to an embodiment of the present disclosure;
FIG. 7 is another schematic top view of a water-cooled plate provided by an embodiment of the application;
FIG. 8 is a schematic structural diagram of an angle between a water inlet pipe and an air inlet pipe provided by an embodiment of the present application and a first plane;
fig. 9 is a schematic structural diagram of a thin film deposition apparatus according to an embodiment of the present application.
[ detailed description ] embodiments
The present application will be described in further detail with reference to the following drawings and examples. It is to be noted that the following examples are only illustrative of the present application, and do not limit the scope of the present application. Likewise, the following examples are only some examples, not all examples, and all other examples obtained by a person of ordinary skill in the art without making any creative effort fall within the protection scope of the present application.
In addition, directional terms mentioned in the present application, such as [ upper ], [ lower ], [ front ], [ rear ], [ left ], [ right ], [ inner ], [ outer ], [ side ], and the like, refer only to the directions of the attached drawings. Accordingly, the directional terminology is used for purposes of illustration and understanding, and is in no way limiting. In the drawings, elements having similar structures are denoted by the same reference numerals.
Referring to fig. 1, fig. 1 is a schematic top view of a water-cooling tray provided in an embodiment of the present application, and the water-cooling tray 10 includes a water-cooling tray main body 11, and a water inlet pipe 12 and a water outlet pipe 13 connected to the water-cooling tray main body 11. Specifically, as shown in fig. 2, the water cooling tray 10 further includes a cooling water channel 14 disposed in the water cooling tray main body 11, a water inlet 14A and a water outlet 14B are respectively disposed at two ends of the cooling water channel 14, the water inlet pipe 12 and the water outlet pipe 13 are respectively communicated with the water inlet 14A and the water outlet 14B, and the cooling water channel 14 is located on a first plane P, that is, an extending direction of the cooling water channel 14 is parallel to the first plane P. Wherein the first plane P may be parallel to the horizontal direction X and the vertical direction Y, and perpendicular to the vertical direction Z, in one example, the first plane P may be a horizontal plane.
Specifically, when the cooling function of the water cooling tray 10 needs to be used, cooling water W (or other suitable cooling liquid) may be sent from the outside of the water cooling tray 10 to the cooling water channel 14 through the water inlet pipe 12 and the water inlet 14A in sequence by using a water pump, and then the cooling water W in the cooling water channel 14 flows out through the water outlet 14B and the water outlet pipe 13 in sequence.
In this embodiment, as shown in fig. 2, 3 and 4, an included angle a1/a2 between at least one of the inlet pipe 12 and the outlet pipe 13 and the first plane P is greater than zero. For example, the angle a1 between the inlet pipe 12 and the first plane P may be greater than zero, and the angle a2 between the outlet pipe 13 and the first plane P may be equal to zero. For another example, an included angle a2 between the outlet pipe 13 and the first plane P may be greater than zero, and an included angle a1 between the inlet pipe 12 and the first plane P may be equal to zero. For another example, an included angle a1 between the inlet pipe 12 and the first plane P may be greater than zero, and an included angle a2 between the outlet pipe 13 and the first plane P may also be greater than zero.
Moreover, the inventor has found that, compared to some embodiments in which the included angles between the water inlet pipeline and the water outlet pipeline of the water cooling tray and the first plane where the cooling water channel is located are equal to zero, in the present embodiment, the included angle a1/a2 between at least one of the water inlet pipeline 12 and the water outlet pipeline 13 of the water cooling tray 10 and the first plane P where the cooling water channel 14 is located is greater than zero, and under the same operating condition (for example, under the same operating power of the water pump), it is ensured that the cooling water W has a greater flow velocity in the cooling water channel 14, so as to achieve the purpose of improving the cooling capability of the water cooling tray 10.
Specifically, as shown in fig. 3 and 4, the water-cooling tray body 11 includes an upper surface 11A and a lower surface 11B, and the upper surface 11A and the lower surface 11B are located on opposite sides of the first plane P. Also, in one embodiment, as shown in fig. 2 and 3, one end of the water inlet pipe 12 is connected to the water inlet 14A, and the other end thereof may extend away from the lower surface 11B of the water cooling tray body 11, for example, may extend in a straight line away from the lower surface 11B of the water cooling tray body 11.
In another embodiment, as shown in fig. 2 and 4, one end of the water outlet pipe 13 is connected to the water outlet 14B, and the other end may extend away from the upper surface 11A of the water cooling tray body 11, for example, may extend linearly away from the upper surface 11A of the water cooling tray body 11.
In a specific example, one end of the water inlet pipe 12 is communicated with the water inlet 14A, and the other end extends in a straight line in a direction away from the lower surface 11B of the water cooling tray main body 11, and one end of the water outlet pipe 13 is communicated with the water outlet 14B, and the other end extends in a straight line in a direction away from the upper surface 11A of the water cooling tray main body 11.
In some embodiments, the angle a1 between the water inlet pipe 12 and the first plane P may be between 45 degrees and 75 degrees, for example, 45 degrees, 50 degrees, 55 degrees, 60 degrees, 65 degrees, 70 degrees, 75 degrees, and the like. The included angle a2 between the outlet pipe 13 and the first plane P may also be between 45 degrees and 75 degrees, for example, 45 degrees, 50 degrees, 55 degrees, 60 degrees, 65 degrees, 70 degrees, 75 degrees, and the like.
In a possible application scenario, the angle a1 between the inlet pipe 12 and the first plane P and the angle a2 between the outlet pipe 13 and the first plane P may be 60 degrees.
It should be noted that, in this embodiment, by inclining the inlet pipe 12 and the outlet pipe 13 to the upper and lower sides of the first plane P, the cooling water W in the outside flows into the cooling water channel 14 through the inlet pipe 12 at a higher flow rate, and the cooling water W in the cooling water channel 14 flows out of the water-cooling tray 10 through the outlet pipe 13 at a higher flow rate, so that the amount of heat taken away by the cooling water W in a unit time can be increased, and the cooling capacity of the water-cooling tray 10 can be improved.
In some embodiments, as shown in FIG. 5, the cooling water channel 14 may include one or more branch pipes 141/142/143, and both ends of each branch pipe 141/142/143 may be connected to the water inlet 14A and the water outlet 14B, respectively. In the embodiment in which the cooling water passage 14 includes the plurality of branch pipes 141/142/143, the cooling water W reaching the inlet 14A from the outside through the inlet pipe 12 may be divided into a plurality of branch flows, flow into the plurality of branch pipes 141/142/143, and then be collected at the outlet 14B, and flow out of the water tray 10 through the outlet pipe 13.
Specifically, each of the branch pipes 141/142/143 may have an arc shape, and in an embodiment where the cooling water channel 14 includes a plurality of branch pipes 141/142/143, the plurality of branch pipes 141/142/143 may be distributed in a direction away from the water inlet 14A and the water outlet 14B, and the length of each branch pipe is gradually increased. In a specific embodiment, the plurality of branch pipes 141/142/143 may be distributed as uniformly as possible on the first plane P to ensure an excellent cooling function of the water-cooled plate 10.
In a specific example, as shown in fig. 5, the plurality of branch pipes 141/142/143 may include a first branch pipe 141, a second branch pipe 142, and a third branch pipe 143, and the second branch pipe 142 may be located between the first branch pipe 141 and the third branch pipe 143 in a direction away from the water inlet port 14A and the water outlet port 14B. The length of the first branch pipe 141 is greater than the length of the second branch pipe 142, and the length of the second branch pipe 142 is greater than the length of the third branch pipe 143.
In some embodiments, in order to avoid that the cooling water W in the branch pipe 141/142/143 is difficult to rapidly flow toward the water outlet 14B due to the excessively long length of the branch pipe 141/142/143, as shown in fig. 6 and 7, the branch pipe 141/142/143 may be provided with an air inlet 14C. The water cooling tray 10 may further include an inlet duct 15, and the inlet duct 15 may be connected to the water cooling tray body 11 and communicated with the inlet 14C, so that an external gas Q (for example, nitrogen) may be sequentially supplied into the branch ducts 141/142/143 through the inlet duct 15 and the inlet 14C by using a blower, and the cooling water W in the branch ducts 141/142/143 may be guided by the gas Q, thereby increasing a flow rate of the cooling water W in the branch ducts 141/142/143 toward the outlet 14B to improve a cooling capacity of the water cooling tray 10.
Specifically, at least one of the plurality of branch pipes 141/142/143 may be provided with the air inlet 14C. In practical implementation, the air inlet 14C may be provided only in the diversion pipeline 141/142/143 (for example, the first diversion pipeline 141) whose length exceeds a preset threshold.
In addition, when the number of the intake ports 14C is plural, the number of the intake port ducts 15 may be plural, and one intake port duct 15 may be provided for each intake port 14C.
In some embodiments, as shown in fig. 6 and 8, the angle a3 between the air inlet duct 15 and the first plane P may be greater than zero degrees. Specifically, one end of the air inlet duct 15 communicates with the air inlet 14C, and the other end thereof may extend in a direction away from the lower surface 11B of the water cooling tray body 11, for example, may extend linearly in a direction away from the lower surface 11B of the water cooling tray body 11.
In addition, in practical applications, the included angle a3 between the air inlet pipe 15 and the first plane P and the included angle a1 between the water inlet pipe 12 and the first plane P may be equal, for example, may be 60 degrees.
In some embodiments, the air inlet duct 15 may be connected to the upper surface 11A or the side surface of the water-cooled tray body 11. In an embodiment in which the air inlet duct 15 is connected to the upper surface of the water pan body 11, the air inlet duct 15 may be perpendicular to the first plane P.
In some embodiments, the inlet pipe 12 may be connected to the upper surface 11A or a side surface of the water-cooled tray main body 11, and the outlet pipe 13 may be connected to the upper surface 11A or a side surface of the water-cooled tray main body 11.
In a possible application scenario, the water inlet pipe 12 and the water outlet pipe 13 may be connected to a side surface of the water-cooling tray body 11, the air inlet pipe 15 may be connected to an upper surface 11A of the water-cooling tray body 11, and an included angle a1 between the water inlet pipe 12 and the first plane P, an included angle a2 between the water outlet pipe 13 and the first plane P, and an included angle a3 between the air inlet pipe 15 and the first plane P may all be 60 degrees.
In some embodiments, as shown in fig. 7, the water-cooled plate 10 may further include a reaction gas channel 16, and the reaction gas channel 16 may extend through the water-cooled plate body 11 in a direction (e.g., a vertical direction Z) intersecting the first plane P, and may be configured to provide a channel for the reaction gas (e.g., siH4, NH 3) to be transmitted from a side of the water-cooled plate 10 facing away from the shower head to a side of the water-cooled plate 10 facing the shower head when the shower head is cooled by the water-cooled plate 10, so as to facilitate shortening of a transmission path of the reaction gas.
By last knowing, the water-cooling disc in this embodiment, the contained angle through at least one in the water inlet pipeline that makes the water-cooling disc and the outlet pipe and the first plane at cooling water course place is greater than zero degree, can improve the water-cooling effect of water-cooling disc, and then solves the unusual problem of film deposition in-process shower head temperature, has reduced the film thickness of product unusual to the product yield has been improved.
Referring to fig. 9, fig. 9 is a schematic structural diagram of a thin film deposition apparatus according to an embodiment of the present disclosure. As shown in fig. 9, the thin film deposition apparatus includes the water-cooled plate 10 and the shower head 20 of any of the above embodiments, the shower head 20 is disposed on one side of the water-cooled plate 10, and the water-cooled plate 10 is used to cool the shower head 20, so as to control the temperature range of the shower head 20 to be 300 ± 6 ℃ in the thin film deposition process.
As shown in fig. 1 to 8, the water cooling tray 10 may include a water cooling tray body 11, a cooling water channel 14, and a water inlet pipe 12 and a water outlet pipe 13. The cooling water channel 14 is disposed in the water-cooling disc main body 11, two ends of the cooling water channel 14 are respectively provided with a water inlet 14A and a water outlet 14B, and the cooling water channel 14 is located on the first plane P. The water inlet pipeline 12 and the water outlet pipeline 13 are connected with the water cooling disc main body 11 and are respectively communicated with the water inlet 14A and the water outlet 14B, and an included angle between at least one of the water inlet pipeline 12 and the water outlet pipeline 13 and the first plane P is larger than zero degree.
Specifically, the water cooling tray body 11 may include an upper surface 11A and a lower surface 11B located on opposite sides of the first plane P, and one end of the water inlet pipe 12 may be communicated with the water inlet 14A, and the other end may extend away from the lower surface 11B of the water cooling tray body 11. One end of the water outlet pipeline 13 is communicated with the water outlet 14B, and the other end can extend in the direction far away from the upper surface 11A of the water-cooling disc main body 11. The included angle a1 between the water inlet pipe 12 and the first plane P may be 45 to 75 degrees, and the included angle a2 between the water outlet pipe 13 and the first plane P may be 45 to 75 degrees. The cooling water channel 14 may include a plurality of branch pipes 141/142/143, and both ends of each branch pipe 141/142/143 may be connected to the water inlet 14A and the water outlet 14B, respectively. The plurality of branch pipes 141/142/143 may be distributed in a direction away from the water inlet 14A and the water outlet 14B, and have lengths gradually increasing. At least one of the branch pipes 141/142/143 may be provided with an air inlet 14C, and the water-cooled plate 10 may further include an air inlet pipe 15, and the air inlet pipe 15 may be connected to the water-cooled plate body 11 and communicated with the air inlet 14C. The water-cooled plate 10 may further include a reaction gas passage 16, and the reaction gas passage 16 may penetrate the water-cooled plate body 11 in a direction (e.g., a vertical direction Z) intersecting the first plane P.
In some embodiments, the shower head 20 may be in contact with the water-cooled plate 10, for example, an upper surface of the shower head 20 may be in contact with a lower surface 11B of the water-cooled plate 10, so as to ensure sufficient heat exchange between the water-cooled plate 10 and the shower head 20 when the water-cooled plate 10 is used to cool the shower head 20.
In an embodiment, the thin film deposition apparatus may further include a wafer stage 30, and the wafer stage 30 is disposed on a side of the showerhead 20 facing away from the water-cooled plate 10 and is used for carrying a wafer 40 to be deposited. The wafer carrier 30 has a flat upper surface to ensure flatness of the thin film formed by the deposition process.
Specifically, the shower head 20 and the wafer stage 30 may be disposed to face each other with a gap therebetween. In one example, the distance between the showerhead 20 and the wafer stage 30 may be 0.5 to 0.8mm, for example, 0.6530mm.
In some embodiments, the showerhead 20 may include a reaction gas pipe (not shown), and the reaction gas pipe may communicate with the reaction gas channel of the water-cooled plate 10.
It should be noted that the application of the embodiments of the present application is not particularly limited to the application of the thin film deposition apparatus, and in one possible embodiment, the thin film deposition apparatus may be a Plasma Enhanced Chemical Vapor Deposition (PECVD) apparatus.
Therefore, in the film deposition device in the embodiment, the included angle between at least one of the water inlet pipeline and the water outlet pipeline of the water-cooled disc and the first plane where the cooling water channel is located is greater than zero, so that the water cooling effect of the water-cooled disc can be improved, the problem of abnormal temperature of the spray header in the film deposition process is solved, the film thickness abnormality of a product is reduced, and the product yield is improved.
In the foregoing embodiments, the descriptions of the respective embodiments have respective emphasis, and for parts that are not described in detail in a certain embodiment, reference may be made to related descriptions of other embodiments.
The above description is only exemplary of the present application and should not be taken as limiting the present application, as any modification, equivalent replacement, or improvement made within the spirit and principle of the present application should be included in the protection scope of the present application.
Claims (10)
1. A water cooled disc, comprising:
a water-cooled disc main body;
the cooling water channel is arranged in the water cooling disc main body, a water inlet and a water outlet are respectively formed in two ends of the cooling water channel, and the cooling water channel is located on a first plane;
and the water inlet pipeline and the water outlet pipeline are connected with the water cooling disc main body and are respectively communicated with the water inlet and the water outlet, and the included angle between at least one of the water inlet pipeline and the water outlet pipeline and the first plane is greater than zero degree.
2. The water cooled disc of claim 1, wherein the water cooled disc body includes an upper surface and a lower surface on opposite sides of the first plane, the water inlet conduit having one end in communication with the water inlet and another end extending away from the lower surface of the water cooled disc body.
3. The water-cooled disc of claim 2, wherein one end of the water outlet pipe is in communication with the water outlet and the other end extends away from the upper surface of the water-cooled disc body.
4. The water-cooled disc of claim 1, wherein the angle between the water inlet pipe and the first plane is 45-75 degrees, and the angle between the water outlet pipe and the first plane is 45-75 degrees.
5. The water-cooled disc according to claim 1, wherein the cooling water channel comprises a plurality of branch pipes, and both ends of each branch pipe are respectively connected to the water inlet and the water outlet.
6. The water-cooled disc according to claim 5, wherein the plurality of branch pipes are distributed in a direction away from the water inlet and the water outlet, and the lengths of the branch pipes are gradually increased.
7. The water-cooled plate of claim 5, wherein an air inlet is provided on at least one of the flow dividing pipes, and the water-cooled plate further comprises:
and the air inlet pipeline is connected with the water-cooling disc main body and communicated with the air inlet.
8. The water-cooled disc of claim 1, further comprising:
a reactant gas channel extending through the water-cooled tray body in a direction intersecting the first plane.
9. A thin film deposition apparatus comprising the water-cooled tray according to any one of claims 1 to 8, and a shower head provided on one side of the water-cooled tray.
10. The thin film deposition apparatus according to claim 9, further comprising:
and the wafer carrying platform is opposite to the spray header and arranged at intervals.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222256887.3U CN218404395U (en) | 2022-08-26 | 2022-08-26 | Water-cooled disc and thin film deposition equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222256887.3U CN218404395U (en) | 2022-08-26 | 2022-08-26 | Water-cooled disc and thin film deposition equipment |
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| Publication Number | Publication Date |
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| CN218404395U true CN218404395U (en) | 2023-01-31 |
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| CN202222256887.3U Active CN218404395U (en) | 2022-08-26 | 2022-08-26 | Water-cooled disc and thin film deposition equipment |
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- 2022-08-26 CN CN202222256887.3U patent/CN218404395U/en active Active
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