CN217895794U - Semiconductor processing equipment and cooling device thereof - Google Patents

Abstract

The embodiment of the application provides semiconductor process equipment and a cooling device thereof. The exhaust assembly of the cooling device comprises at least one exhaust box, wherein the exhaust box is provided with a connecting end communicated with an air inlet part in the length direction, and is provided with a first side plate and a second side plate which are oppositely arranged in the width direction, the connecting end is provided with a plurality of air inlets which are sequentially arranged along the width direction of the exhaust box, and the first side plate is provided with a plurality of air outlets which are sequentially arranged along the length direction of the exhaust box; a plurality of flow guide channels are arranged in the exhaust box in parallel along the width direction of the exhaust box, and one end of each flow guide channel is communicated with the air inlet; a plurality of water conservancy diversion way extend along the length direction of exhaust box and predetermine length, and the arc is buckled towards first curb plate to the other end of water conservancy diversion way to with the gas outlet intercommunication, and the cross sectional area that ventilates of a plurality of gas outlets sets gradually along the length direction of exhaust box. The embodiment of the application can improve the cooling efficiency and uniformity of the process chamber.

Description

Semiconductor processing equipment and cooling device thereof

Technical Field

The application relates to the technical field of semiconductor processing, in particular to semiconductor process equipment and a cooling device thereof.

Background

Currently, silicon epitaxy is the growth of one or more layers of silicon single crystal films on polished wafers by chemical vapor deposition at high temperature, and by controlling the growth conditions, epitaxial layers of different resistivities, thicknesses and types are obtained, mainly for the manufacture of various integrated circuits and discrete devices. When the silicon epitaxial equipment executes the process, the reaction temperature can reach more than 1100 ℃, the process chamber is welded by using a quartz material with a gold-plated layer on the surface, and the gold-plated layer is used for reflecting scattered infrared heating light back to the process chamber, so that the temperature in the process chamber is maintained in a required temperature range. Therefore, the cooling technology for the external temperature of the process chamber is very critical, and the process chamber has a large size, so that the process chamber needs to be cooled in a partitioned manner, for example, the central high-temperature area of the process chamber is cooled by water, and the areas with lower temperatures at the front end and the rear end of the process chamber are cooled by air, so that the temperature stress of the gold plating layer is reduced, and the service life of the gold plating layer is prolonged.

A multi-piece silicon epitaxial apparatus in the prior art is shown in fig. 6, and includes a process chamber 201, a total air intake box 202, a long exhaust box 203, and a short exhaust box 204, wherein the total air intake box 202 is located at the top of the process chamber 201, and two sides of an end portion of the total air intake box 202 are respectively connected with the long exhaust box 203 and the short exhaust box 204. The main air inlet box 202 divides the cooling air and guides the divided cooling air to the left and right sides of the process chamber 201, the long exhaust box 203 is used for cooling the front end of the process chamber 201, and the short exhaust box 204 is used for cooling the rear end of the process chamber 201. However, due to the structural design defects of the air flow channels in the long exhaust box 203 and the short exhaust box 204, the total amount of air flow in unit time is small, and the air flow channels are in right-angle turning, so that the flow velocity is reduced, the cooling effect is affected, and the air flow field is not uniform, so that the temperature gradient is generated on the surface of the process chamber 201, and the gold-plated layer on the surface of the process chamber 201 is easy to fall off. Based on the above defects, the process yield of the process chamber 201 is seriously affected, and the maintenance and application costs of the process chamber 201 are greatly increased.

SUMMERY OF THE UTILITY MODEL

The application provides semiconductor process equipment and a cooling device thereof aiming at the defects of the prior art, and aims to solve the technical problems of low yield of a process chamber and high maintenance and application cost caused by uneven cooling of the process chamber by the cooling device in the prior art.

In a first aspect, an embodiment of the present application provides a cooling apparatus for a semiconductor processing apparatus, for cooling a process chamber in the semiconductor processing apparatus, including: an air intake component and an exhaust component; the air inlet component is communicated with the exhaust component and is used for introducing cooling gas into the exhaust component; the exhaust assembly comprises at least one exhaust box, the exhaust box is provided with a connecting end communicated with the air inlet component in the length direction, and is provided with a first side plate and a second side plate which are oppositely arranged in the width direction, the connecting end is provided with a plurality of air inlets which are sequentially arranged along the width direction of the exhaust box, and the first side plate is provided with a plurality of air outlets which are sequentially arranged along the length direction of the exhaust box; the exhaust box is internally provided with a plurality of flow guide channels, the flow guide channels are arranged in parallel along the width direction of the exhaust box, and one end of each flow guide channel is communicated with the air inlet; the air exhaust box is characterized in that the guide channels extend for a preset length along the length direction of the air exhaust box, the other ends of the guide channels bend towards the first side plate in an arc shape to be communicated with the air outlet, and the ventilation cross-sectional areas of the air outlet are sequentially and incrementally arranged along the length direction of the air exhaust box.

In an embodiment of the present application, the flow guide channels include a straight section and an arc-shaped bent section, the straight section extends along a length direction of the exhaust box, and one end of the straight section is communicated with the air inlet, and the areas of the ventilation cross sections of the straight sections of the flow guide channels are the same; one end of the arc-shaped bending section is communicated with the other end of the straight-through section, the other end of the arc-shaped bending section is communicated with the gas outlet, and the area of the ventilation cross section of the plurality of gas outlets is gradually increased in the air inlet direction of the cooling gas.

In an embodiment of this application, at least part the water conservancy diversion way still is provided with the flow distribution plate, the one end of flow distribution plate is located and is close to the arc bending section direct section in, the other end is in take place the arc in the arc bending section and buckle, and extend to the gas outlet, be used for right in the water conservancy diversion way cooling gas shunts.

In an embodiment of the present application, a plurality of diversion tunnels are provided with a splitter plate in each of the diversion tunnels except the diversion tunnel closest to the first side plate.

In an embodiment of the present application, the flow dividing plate extends along a length direction of the exhaust box in the through section, and is disposed relatively far away from the first side plate in a width direction of the exhaust box, so as to divide a ventilation section of the through section into two parts in a first preset proportion; and the flow distribution plate can divide the ventilation section of the air outlet into two parts in a second preset proportion.

In an embodiment of the present application, the first predetermined ratio is 1.

In an embodiment of the present application, the exhaust box includes a top plate, a bottom plate, and a baffle plate, and top and bottom edges of the first side plate and the second side plate are respectively connected to side edges of the top plate and the bottom plate; the guide plates are uniformly distributed between the top plate and the bottom plate, are connected with the top plate and the bottom plate, and are used for being matched with the top plate, the bottom plate, the first side plate and the second side plate to form a plurality of guide channels.

In an embodiment of the present application, the baffle includes a straight plate portion and an arc-shaped bent portion, the straight plate portion extends along a length direction of the exhaust box and can form the straight section with the first side plate, and/or the second side plate, and/or the adjacent straight plate portions; the arc-shaped bent part is positioned between the straight plate part and the first side plate and is used for being connected with the first side plate and/or the second side plate and/or the adjacent arc-shaped bent part to form the arc-shaped bent section.

In an embodiment of the present application, the cooling device includes two exhaust assemblies, the two exhaust assemblies are respectively located at two ends of the air inlet part in the length direction, and air outlets of the two exhaust assemblies are oppositely arranged; the exhaust assembly comprises two exhaust boxes, and the two exhaust boxes are respectively positioned on two sides of the width direction of the air inlet part.

In an embodiment of this application, the exhaust subassembly still includes the flow distribution box, the flow distribution box has two exhaust ends of relative setting, respectively with two the link intercommunication setting of exhaust box, the top of flow distribution box have the inlet end with the part intercommunication admits air.

In a second aspect, embodiments of the present application provide a semiconductor processing apparatus comprising a process chamber and a cooling device as provided in the first aspect, the cooling device being disposed at a top of the process chamber for cooling the process chamber.

The technical scheme provided by the embodiment of the application has the following beneficial technical effects:

the exhaust assembly is arranged on the process chamber, and the air inlet component is connected with the exhaust box of the exhaust assembly, so that the process chamber is cooled. Through being provided with a plurality of flow deflectors in the exhaust box, take place the arc and buckle after the flow deflector extends certain length along the length direction of exhaust box, so that flow deflector and the gas outlet that is located on the first curb plate communicate, because flow deflector adopts the arc to buckle, can effectively reduce cooling gas flow resistance in flow deflector, and avoid adopting the vortex that the quarter turn caused among the prior art, thereby can not only improve cooling gas's velocity of flow, and can also promote tolerance by a wide margin, and can also improve the air current field homogeneity of same gas outlet, simultaneously according to the temperature gradient of technology cavity, the size of the sectional area of ventilating of corresponding gas outlet of arranging, thereby improve cooling efficiency and the homogeneity to the technology cavity by a wide margin, and then can not only improve the technology yield of technology cavity, and can also reduce the maintenance and the application cost of technology cavity.

Additional aspects and advantages of the present application will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the present application.

Drawings

The above and/or additional aspects and advantages of the present application will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:

FIG. 1 is a schematic diagram of a cooling apparatus and a process chamber according to an embodiment of the present disclosure;

fig. 2A is a schematic perspective view of an exhaust box according to an embodiment of the present disclosure;

fig. 2B is a schematic cross-sectional structural diagram of an exhaust box according to an embodiment of the present disclosure;

fig. 3A is a schematic perspective view of another exhaust box according to an embodiment of the present application;

FIG. 3B is a schematic cross-sectional view of another exhaust box according to an embodiment of the present disclosure;

fig. 4A is a schematic perspective view illustrating a configuration of an exhaust box and a flow distribution plate according to an embodiment of the present disclosure;

fig. 4B is a schematic cross-sectional perspective view of an exhaust box and a flow distribution plate according to an embodiment of the present disclosure;

fig. 4C is a schematic cross-sectional view of an exhaust box and a flow distribution plate according to an embodiment of the present disclosure;

FIG. 4D is an enlarged, cross-sectional view of a portion of an exhaust box and diverter plate combination according to an embodiment of the present application;

fig. 5A is a schematic perspective view of another exhaust box and a splitter plate according to an embodiment of the present disclosure;

fig. 5B is a schematic cross-sectional perspective view of another exhaust box and splitter plate according to an embodiment of the present disclosure;

FIG. 5C is a schematic cross-sectional view of an alternative exhaust box and splitter plate configuration according to embodiments of the present disclosure;

fig. 6 is a schematic diagram of a configuration of an exhaust box and a process chamber provided in the prior art.

Detailed Description

Reference will now be made in detail to the present application, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar parts or parts having the same or similar functions throughout. In addition, if a detailed description of the known art is not necessary for illustrating the features of the present application, it is omitted. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present application and are not to be construed as limiting the present application.

It will be understood by those within the art that, unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the prior art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

The following describes the technical solution of the present application and how to solve the above technical problems in detail by specific embodiments.

An embodiment of the present application provides a cooling apparatus for a semiconductor processing apparatus, configured to cool a process chamber in the semiconductor processing apparatus, and a schematic structural diagram of the cooling apparatus is shown in fig. 1 to 3B, including: an intake member 1 and an exhaust unit 2; the air inlet component 1 is communicated with the exhaust component 2 and is used for introducing cooling gas into the exhaust component 2; the exhaust assembly 2 comprises at least one exhaust box 21, the exhaust box 21 is provided with a connecting end 22 communicated with the air inlet component 1 in the length direction, and is provided with a first side plate 271 and a second side plate 272 which are oppositely arranged in the width direction, the connecting end 22 is provided with a plurality of air inlets which are sequentially arranged along the width direction of the exhaust box 21, and the first side plate 271 is provided with a plurality of air outlets which are sequentially arranged along the length direction of the exhaust box 21; a plurality of flow guide channels 3 are arranged in the exhaust box 21, the flow guide channels 3 are arranged in parallel along the width direction of the exhaust box 21, and one end of each flow guide channel 3 is communicated with the air inlet; the multiple flow guide channels 3 extend along the length direction of the exhaust box 21 by a preset length, the other ends of the flow guide channels 3 are bent towards the first side plate 271 in an arc shape so as to be communicated with the air outlets, and the air-through sectional areas of the multiple air outlets are sequentially and incrementally arranged along the length direction of the exhaust box 21.

As shown in fig. 1 to 3B, the semiconductor processing equipment may be a multi-wafer silicon epitaxial equipment for performing a chemical vapor deposition process on a wafer, and the cooling device may be disposed at the top of the process chamber 100 as a whole, but the embodiment of the present invention is not limited to a specific type of semiconductor processing equipment, and a person skilled in the art may adjust the configuration according to actual circumstances. The gas inlet component 1 is disposed at the top of the process chamber 100, the gas inlet component 1 may extend along the width direction of the process chamber 100, so that two ends of the gas inlet component 1 are respectively connected to the two exhaust assemblies 2, and the two exhaust assemblies 2 are respectively located at two sides of the length direction of the process chamber 100 and are used for guiding the cooling gas to the top of the process chamber 100 for cooling and heat dissipation. The exhaust assembly 2 includes two exhaust boxes 21, and the two exhaust boxes 21 are respectively located at two sides of the end portion of the gas inlet part 1, that is, the two exhaust boxes 21 are respectively used for cooling the front end and the rear end of the process chamber 100. One end of the exhaust box 21 is a connection end 22, the connection end 22 is fixedly connected with the end of the gas inlet part 1, and the other end of the exhaust box 21 can be extended along the length direction of the process chamber 100. The exhaust box 21 is provided with a first side plate 271 and a second side plate 272 which are oppositely arranged in the width direction of the exhaust box 21, the first side plate 271 and the second side plate 272 are oppositely arranged in the width direction of the process chamber 100, wherein the first side plate 271 is relatively close to one side of the process chamber 100, and a plurality of air outlets which are sequentially arranged in the length direction of the exhaust box 21 are formed in the first side plate 271; the second side 272 is disposed opposite a side away from the process chamber 100. Four flow guide channels 3 are arranged in parallel along the width direction in the exhaust box 21, so that air inlets of the flow guide channels 3 are formed on the connecting end 22, namely, a plurality of air inlets sequentially arranged along the width direction of the exhaust box 21 are formed on the connecting end 22. After a plurality of flow guide 3 extended to predetermine length along the length direction of exhaust box 21, the other end of flow guide 3 took place the arc towards first curb plate 271 and buckles, so that a plurality of flow guide 3 respectively with a plurality of gas outlets intercommunication, this first curb plate 271 is close to one side setting of process chamber 100, so that to the top with cooling gas water conservancy diversion to process chamber 100, the length direction that exhaust box 21 was followed to the gas outlet of a plurality of flow guide 3 can arrange the setting in proper order, and be close to the flow guide 3 of first curb plate 271 relatively, its gas outlet is close to link 22 and sets up, thereby make this application embodiment simple structure easily realize. Further, the ventilation cross-sectional areas of the plurality of air outlets are sequentially and incrementally arranged along the length direction of the exhaust box 21, and a relatively small air outlet can correspond to a region of the process chamber 100 with a high temperature, and a relatively large air outlet can correspond to a region of the process chamber 100 with a low temperature, so that the cooling uniformity of the process chamber 100 can be improved, and the applicability and the application range of the embodiment of the present application can be improved.

The exhaust assembly is arranged on the process chamber, and the air inlet component is connected with the exhaust box of the exhaust assembly, so that the process chamber is cooled. Through being provided with a plurality of flow deflectors in the exhaust box, the flow deflector takes place the arc and buckles after extending certain length along the length direction of exhaust box, so that flow deflector and the gas outlet intercommunication that is located on the first curb plate, because the flow deflector adopts the arc to buckle, can effectively reduce cooling gas flow resistance in the flow deflector, and avoid the vortex that adopts the right angle turn to cause among the prior art, thereby can not only improve cooling gas's velocity of flow, and can also promote the tolerance by a wide margin, and can also improve the air current field homogeneity of same gas outlet, simultaneously according to the temperature gradient of technology cavity, the size of the sectional area of ventilating of corresponding gas outlet of arranging, thereby improve cooling efficiency and the homogeneity to technology cavity by a wide margin, and then can not only improve the technology yield of technology cavity, and can also reduce the maintenance and the application cost of technology cavity.

In an embodiment of the present application, as shown in fig. 1 to 3B, the flow guide channels 3 include a straight section 31 and an arc-shaped bent section 32, the straight section 31 extends along the length direction of the exhaust box 21, and one end of the straight section 31 is communicated with the air inlet, and the areas of the air passing cross sections of the straight sections 31 of the flow guide channels 3 are the same; one end and the straight-through section 31 other end intercommunication of arc bending section 32, the other end and the gas outlet intercommunication of arc bending section 32, the cross sectional area of ventilating of a plurality of gas outlets increases progressively in proper order along the extending direction of exhaust box 21 from link 22.

As shown in fig. 1 to fig. 3B, for example, four diversion channels 3 are arranged in the width direction of the exhaust box 21, but the embodiment of the present application is not limited thereto, and the arrangement can be adjusted by a person skilled in the art according to actual circumstances. The diversion tunnel 3 may include a through section 31 and an arc-shaped bending section 32 which are integrally formed, the four through sections 31 may equally divide the connection end 22 into four air inlets, that is, one end of the through section 31 is communicated with the air inlets, and the through section 31 is arranged in parallel with the first side plate 271. One end of the arc bending section 32 is connected to the other end of the straight section 31, and the other end extends to the first side plate 271 so as to communicate with the air outlet correspondingly disposed on the flow guide channel 3. Further, since the front and rear ends of the process chamber 100 have different lengths, the exhaust box 21 located at the front end of the process chamber 100 has a relatively long length, as shown in fig. 2A and 4A; the length of the exhaust box 21 at the rear end of the process chamber 100 is relatively short, as shown in fig. 3A and 5A, so as to improve the applicability and the range of applicability of the embodiment of the present disclosure, but the embodiment of the present disclosure is not limited thereto. By adopting the design, the structure of the embodiment of the application is simple and easy to realize, so that the application and maintenance cost is reduced.

Further, the straight sections 31 of the four flow guide channels 3 have the same cross-sectional ventilation area, so as to ensure that the flow rate of the cooling gas of each flow guide channel 3 is substantially the same, thereby improving the cooling uniformity of the process chamber 100. The air outlet of the four flow guiding channels 3 near the connecting end 22 (i.e. near the center of the process chamber 100) has a smaller cross-sectional area, and the air outlet far from the connecting end 22 has a larger cross-sectional area, i.e. the cross-sectional areas of the air outlets of the flow guiding channels 3 increase sequentially from the direction near the connecting end 22 to the direction far from the connecting end 22, specifically, please refer to the direction shown by the black arrow in fig. 2B. In other words, the air flow cross-sectional areas of the air outlets of the plurality of flow guides 3 increase sequentially from the connection end 22 in the extending direction of the exhaust box 21. Specifically, because the process chamber 100 has a greater temperature near the center region, the required cooling gas flow rate and flow is relatively large; conversely, the flow rate and flow of the cooling gas required is relatively small. Because the areas of the ventilation sections of the straight sections 31 of the four flow guide channels 3 are the same, the design ensures that the flow velocity of the air outlets of the flow guide channels 3 close to the central area of the process chamber 100 is larger, the flow rate of the corresponding cooling process chamber 100 in unit area is larger, and the heat exchange capacity is stronger; on the contrary, the position far away from the central area of the process chamber 100 has relatively small flow velocity and flow rate of the cooling gas, and the heat exchange capacity of the unit surface of the corresponding cooling process chamber 100 is weaker than that of the central area, so that the cooling uniformity of the process chamber 100 is improved, the gold-plated layer on the surface of the process chamber 100 is prevented from falling off, the process yield can be improved, and the application and maintenance cost can be reduced.

In an embodiment of the present application, as shown in fig. 1 to 5C in combination, at least a portion of the flow guiding channel 3 is further provided with a flow dividing plate 33, one end of the flow dividing plate 33 is located in the straight section 31 near the arc bending section 32, and the other end of the flow dividing plate is arc-bent in the arc bending section 32 and extends to the air outlet for dividing the cooling air in the flow guiding channel 3. Specifically, the four diversion tunnels 3 are respectively provided with a diversion plate 33, the diversion plates 33 are specifically plate-shaped structures, and one end of each diversion plate 33 is positioned in the straight section 31 and is positioned in the end part of the straight section 31 close to the arc-shaped bending section 32; the other end of the diversion plate 33 extends to the air outlet, and the diversion plate 33 is arranged corresponding to the shape of the arc-shaped bent section 32, so as to divide the diversion channel 3 close to the air outlet into two parts. By adopting the design, the obstruction to the cooling gas in the guide channel 3 can be avoided, and the flow velocity of the cooling gas in the guide channel 3 can be further improved, so that the cooling uniformity of the process chamber 100 can be improved while the cooling rate is improved.

It should be noted that in the embodiment of the present application, the arrangement manner of the diversion plate 33 is not limited, for example, only part of the diversion channels 3 is provided with the diversion plate 33, for example, the diversion plate 33 does not need to be arranged in a certain diversion channel 3 due to a small space of the diversion channel 3 or a relatively low temperature of a region corresponding to the diversion channel 3, and the like, so that the diversion plate 33 may be arranged in part of the diversion channel 3. Therefore, the embodiments of the present application are not limited thereto, and those skilled in the art can adjust the settings according to actual situations.

In an embodiment of the present application, as shown in fig. 1 to fig. 5C, the diversion plates 33 are disposed in the diversion tunnels 3 except the diversion tunnel 3 closest to the first side plate 271 of the diversion tunnels 3. Specifically, the diversion plates 33 are disposed in three diversion tunnels 3 of the four diversion tunnels 3 relatively far from the first side plate 271, that is, the diversion plate 33 is not disposed in the diversion tunnel 3 with the air outlet closest to the connection end 22, and the diversion plates 33 are disposed in the other diversion tunnels 3. The diversion plate 33 is a plate-shaped structure, one end of the diversion plate 33 is located in the straight section 31, the other end extends to the air outlet, and the diversion plate 33 and the arc-shaped bending section 32 are correspondingly arranged in shape so as to divide the diversion channel 3 into two parts near the air outlet. By adopting the design, the gas in the flow guide channel 3 can be prevented from being blocked, and the flow velocity of the cooling gas in the flow guide channel 3 can be further improved, so that the cooling uniformity of the process chamber 100 can be improved while the cooling rate is improved. In addition, the diversion channel 3 near the first side plate 271 in the diversion channels 3 is not provided with the diversion plate 33, so as to avoid that the diversion plate 33 affects the flow velocity of the cooling gas when the space of the diversion channel 3 is small.

In an embodiment of the present application, as shown in fig. 1 to fig. 5C, the diversion plate 33 extends along the length direction of the exhaust box 21 in the through section 31, and is relatively far away from the first side plate 271 in the width direction of the exhaust box 21, so as to divide the ventilation cross section of the through section 31 into two parts with a first preset ratio; and the flow dividing plate 33 can divide the ventilation section of the air outlet into two parts in a second preset proportion. Optionally, the first preset ratio is 1

As shown in fig. 1, 4A to 5C, the diversion plate 33 may start from the through section 31 and extend in the length direction of the exhaust box 21, and the portion of the diversion plate 33 is disposed relatively far from the first side plate 271 in the width direction of the exhaust box 21 for dividing each through section 31 into two portions in a first preset ratio, which may be 1. The flow dividing plate 33 can also divide the air outlet corresponding to the arc-shaped bending section 32 into two parts with a second preset ratio, wherein the second preset ratio is 1. With the above design, since the cooling gas near the arc-shaped bent section 32 of the straight section 31 will gather near the large arc of the arc-shaped bent section 32, the flow distribution plate 33 is relatively far away from the first side plate 271, so that each flow guide 3 is divided into two parts 1, and is discharged from the gas outlet of 1, and the flow distribution plate 33 is started from the straight section 31, and because the flow is stable, the problem of uneven distribution of the fluid at the arc-shaped bent section 32 can be avoided, so that the cooling gas discharged from the gas outlet is uniform as a whole.

In an embodiment of the present application, as shown in fig. 1 to 5C, the exhaust box 21 further includes a top plate 24, a bottom plate 25 and a baffle plate 26, wherein top and bottom edges of the first side plate 271 and the second side plate 272 are respectively connected to side edges of the top plate 24 and the bottom plate 25; the plurality of guide plates 26 are uniformly arranged between the top plate 24 and the bottom plate 25, and are connected with the top plate 24 and the bottom plate 25, and are used for being matched with the top plate 24, the bottom plate 25, the first side plate 271 and the second side plate 272 to form a plurality of guide channels 3.

As shown in fig. 1 to 3B, the top plate 24 and the bottom plate 25 are rectangular-like, the top plate 24 and the bottom plate 25 are stacked and spaced apart, and one side of the top plate and the bottom plate close to the process chamber 100 is a linear structure for matching and connecting with the top edge and the bottom edge of the first side plate 271; and the top plate 24 and the bottom plate 25 are formed in a circular arc shape at a side away from the process chamber 100 and a portion away from the connecting end 22 for cooperating with the second side plate 272. The plurality of flow deflectors 26 are arranged between the top plate 24 and the bottom plate 25 and are connected with the top plate 24 and the bottom plate 25, the shape of the flow deflector 26 can be completely the same as that of the second side plate 272, namely, part of the flow deflector 26 is arranged in parallel with the first side plate 271, and part of the flow deflector 26 is bent in an arc shape and then connected with the first side plate 271, so that the top plate 24, the bottom plate 25, the first side plate 271 and the second side plate 272 are matched to form the exhaust box 21, and a plurality of flow guide channels 3 are formed in the exhaust box 21. The embodiment of the present application is not limited to the specific embodiment of the exhaust box 21, and for example, the components may be fixedly connected by welding or bonding, or the exhaust box 21 may be formed by integrally molding. Therefore, the embodiments of the present application are not limited thereto, and those skilled in the art can adjust the settings according to actual situations. By adopting the design, the structure of the embodiment of the application is simple and easy to realize, so that the application and maintenance cost is further reduced.

In an embodiment of the present application, as shown in fig. 1 to 5C, the baffle 26 includes a straight plate portion 261 and an arc-shaped bent portion 262, the straight plate portion 261 extends along a length direction of the exhaust box 21 and can form a through section 31 with the first side plate 271, and/or the second side plate 272, and/or the adjacent straight plate portions 261; the arc-shaped bent portion 262 is located between the straight portion 261 and the first side plate 271, and is used to form the arc-shaped bent section 32 with the first side plate 271, and/or the second side plate 272, and/or the adjacent arc-shaped bent portion 262. Specifically, the guiding plate 26 is made by an integral forming method, and includes a straight plate portion 261 and an arc-shaped bending portion 262, the straight plate portion 261 is parallel to the first side plate 271, and one end of the arc-shaped bending portion 262 abuts against and is connected to the first side plate 271. Further, the straight portion 261 of the baffle 26 closest to the first side plate 271 and the first side plate 271 form a straight section 31 of the flow guiding channel 3, and the arc bending portion 262 and the first side plate 271 form an arc bending section 32 of the flow guiding channel 3. The straight plate parts 261 of the plurality of guide plates 26 far away from the first side plate 271 and the adjacent straight plate parts 261 can form the straight section 31 of the guide channel 3, and the arc bending parts 262 and the adjacent arc bending parts 262 form the arc bending section 32 of the guide channel 3. And the deflector 26 close to the second side plate 272, the straight plate part 261 of which can form a straight section 31 with the second side plate 272, and the arc-shaped bent part 262 of which forms an arc-shaped bent section 32 with the second side plate 272. With the above design, the structure of the exhaust box 21 can be further simplified, thereby reducing the application and maintenance costs.

In an embodiment of the present application, as shown in fig. 1, the cooling device includes two exhaust assemblies 2, the two exhaust assemblies 2 are respectively located at two ends of the air inlet component 1 in the length direction, and air outlets of the two exhaust assemblies 2 are oppositely arranged; the exhaust assembly 2 includes two exhaust boxes 21, and the two exhaust boxes 21 are respectively located on both sides in the width direction of the intake member 1.

As shown in fig. 1, the whole of the air inlet member 1 is a rectangular parallelepiped structure, the air inlet member 1 extends along the width direction of the process chamber 100, and the length of the air inlet member 1 is greater than the width of the process chamber 100, so that the bottoms of the two ends of the air inlet member 1 can be connected with the two exhaust assemblies 2 respectively. The top center of the air inlet component 1 is provided with a total air inlet 11, and the total air inlet 11 can be connected with an air source through a pipeline, for example, a blower is adopted, but the embodiment of the application is not limited thereto as long as the cooling air can be provided for the total air inlet component 1. By adopting the design, the structure of the embodiment of the application is simple and easy to realize, so that the manufacturing and maintenance cost is further reduced. The two exhaust assemblies 2 are respectively located at two ends of the gas inlet part 1 in the length direction, that is, the two exhaust assemblies 2 are both arranged to extend along the length direction of the process chamber 100, and the gas outlets of the two exhaust assemblies 2 are arranged oppositely, so that the two exhaust assemblies 2 can blow cooling gas to the top of the process chamber 100. Further, each exhaust assembly 2 includes two exhaust boxes 21, the length directions of the two exhaust boxes 21 are both arranged in parallel with the length direction of the process chamber 100, and the connection ends 22 of the two exhaust boxes 21 are both connected with the end of the air inlet part 1, that is, the two exhaust boxes 21 are respectively located at two sides of the air inlet part 1 in the width direction. By adopting the design, the device can be flexibly arranged at the top of the process chamber, so that the applicability and the application range are greatly improved.

In one embodiment of the present application, as shown in fig. 1, the exhaust assembly 2 further includes a diversion box 29, the diversion box 29 has two exhaust ends oppositely disposed and respectively communicated with the connecting ends 22 of the two exhaust boxes 21, and the top of the diversion box 29 has an air inlet end communicated with the end of the air inlet component 1. Specifically, the entire diversion box 29 is a rectangular parallelepiped structure, and both ends of the diversion box 29 are exhaust ends for communicating with the connection ends 22 of the two exhaust boxes 21, respectively. The top of the diversion box 29 is provided with an air inlet end for communicating with the end of the air inlet component 1, and the bottom of the diversion box 29 is provided with a triangular recess in the central position, so that the cooling air can be guided into the exhaust box 21, the cooling air is prevented from forming a vortex in the diversion box 29, the flow rate of the cooling air is increased, the energy consumption is reduced, and the cooling rate is increased. However, the embodiment of the present application does not limit the specific shape of the diversion box 29, and the setting can be adjusted by a person skilled in the art according to practical situations.

Based on the same concept, the embodiment of the application provides semiconductor processing equipment which comprises a process chamber and a cooling device provided in the above embodiments, wherein the cooling device is arranged at the top of the process chamber and used for cooling the process chamber.

By applying the embodiment of the application, at least the following beneficial effects can be realized:

the embodiment of the application is provided with the exhaust assembly through the process chamber, and adopts the air inlet component to be connected with the exhaust box of the exhaust assembly, so that the process chamber is cooled. Through being provided with a plurality of flow deflectors in the exhaust box, the flow deflector takes place the arc and buckles after extending certain length along the length direction of exhaust box, so that flow deflector and the gas outlet intercommunication that is located on the first curb plate, because the flow deflector adopts the arc to buckle, can effectively reduce cooling gas flow resistance in the flow deflector, and avoid the vortex that adopts the right angle turn to cause among the prior art, thereby can not only improve cooling gas's velocity of flow, and can also promote the tolerance by a wide margin, and can also improve the air current field homogeneity of same gas outlet, simultaneously according to the temperature gradient of technology cavity, the size of the sectional area of ventilating of corresponding gas outlet of arranging, thereby improve cooling efficiency and the homogeneity to technology cavity by a wide margin, and then can not only improve the technology yield of technology cavity, and can also reduce the maintenance and the application cost of technology cavity.

It is to be understood that the above embodiments are merely exemplary embodiments that have been employed to illustrate the principles of the present invention, and that the present invention is not limited thereto. It will be apparent to those skilled in the art that various modifications and improvements can be made without departing from the spirit and substance of the invention, and these modifications and improvements are also considered to be within the scope of the invention.

In the description of the present application, it is to be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and therefore, are not to be construed as limiting the present invention.

The terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless otherwise specified.

In the description of the present application, it should be noted that, unless otherwise explicitly stated or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, a fixed connection, a detachable connection, or an integral connection; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood as a specific case by those skilled in the art.

In the description herein, particular features, structures, materials, or characteristics may be combined in any suitable manner in any one or more embodiments or examples.

The foregoing is only a partial embodiment of the present application, and it should be noted that, for those skilled in the art, several modifications and decorations can be made without departing from the principle of the present application, and these modifications and decorations should also be regarded as the protection scope of the present application.

Claims (11)

1. A cooling apparatus of a semiconductor processing apparatus for cooling a process chamber in the semiconductor processing apparatus, comprising: an air intake component and an exhaust component;

the air inlet component is communicated with the exhaust component and is used for introducing cooling gas into the exhaust component;

the exhaust assembly comprises at least one exhaust box, the exhaust box is provided with a connecting end communicated with the air inlet component in the length direction, and is provided with a first side plate and a second side plate which are oppositely arranged in the width direction, the connecting end is provided with a plurality of air inlets which are sequentially arranged along the width direction of the exhaust box, and the first side plate is provided with a plurality of air outlets which are sequentially arranged along the length direction of the exhaust box;

the exhaust box is internally provided with a plurality of flow guide channels, the flow guide channels are arranged in parallel along the width direction of the exhaust box, and one end of each flow guide channel is communicated with the air inlet; the air exhaust box is characterized in that the air guide channels extend for a preset length along the length direction of the air exhaust box, the other ends of the air guide channels face the first side plate to be bent in an arc shape so as to be communicated with the air outlet, and the ventilation cross section areas of the air outlet are sequentially and incrementally arranged along the length direction of the air exhaust box.

2. The cooling apparatus as claimed in claim 1, wherein said flow guide comprises a straight section and an arc-shaped bent section, said straight section is extended along a length direction of said exhaust box and has one end communicated with said air inlet, and said straight sections of said flow guide have the same cross-sectional area; one end of the arc-shaped bending section is communicated with the other end of the straight-through section, the other end of the arc-shaped bending section is communicated with the air outlet, and the ventilation cross-sectional areas of the air outlets are sequentially and incrementally arranged along the extending direction of the exhaust box from the connecting end.

3. The cooling device as claimed in claim 2, wherein at least a portion of the flow guiding channel is further provided with a flow dividing plate, one end of the flow dividing plate is located in the through section near the arc-shaped bending section, and the other end of the flow dividing plate is arc-shaped bent in the arc-shaped bending section and extends to the air outlet for dividing the cooling air in the flow guiding channel.

4. The cooling apparatus as claimed in claim 3, wherein a plurality of flow leaders are provided with a splitter plate in each of the flow leaders except the flow leader closest to the first side plate.

5. A cooling apparatus according to claim 3, wherein said flow dividing plate extends along a length direction of said exhaust box in said through section and is disposed relatively away from said first side plate in a width direction of said exhaust box to divide a vent section of said through section into two parts in a first predetermined ratio; and the flow distribution plate can divide the ventilation section of the air outlet into two parts in a second preset proportion.

6. A cooling device according to claim 5, characterized in that said first preset ratio is 1.

7. The cooling apparatus as claimed in claim 2, wherein the exhaust box comprises a top plate, a bottom plate and a baffle plate, and the top and bottom edges of the first and second side plates are connected to the side edges of the top and bottom plates, respectively; the guide plates are uniformly distributed between the top plate and the bottom plate, are connected with the top plate and the bottom plate, and are used for being matched with the top plate, the bottom plate, the first side plate and the second side plate to form a plurality of guide channels.

8. The cooling apparatus according to claim 7, wherein the baffle plate comprises a straight plate portion and an arc-shaped bent portion, the straight plate portion extends along a length direction of the exhaust box and can form the straight through section with the first side plate, and/or the second side plate, and/or the adjacent straight plate portion; the arc-shaped bent part is positioned between the straight plate part and the first side plate and is used for being connected with the first side plate and/or the second side plate and/or the adjacent arc-shaped bent part to form the arc-shaped bent section.

9. The cooling device according to claim 1, wherein the cooling device comprises two exhaust assemblies, the two exhaust assemblies are respectively positioned at two ends of the length direction of the air inlet component, and air outlets of the two exhaust assemblies are oppositely arranged; the exhaust assembly comprises two exhaust boxes, and the two exhaust boxes are respectively positioned on two sides of the width direction of the air inlet part.

10. The cooling apparatus as claimed in claim 1, wherein the exhaust assembly further comprises a splitter box, the splitter box having two opposite exhaust ends respectively communicating with the connecting ends of the two exhaust boxes, and the top of the splitter box having an inlet end communicating with the inlet component.

11. Semiconductor processing apparatus comprising a process chamber and a cooling device according to any one of claims 1 to 10, the cooling device being arranged at the top of the process chamber for cooling the process chamber.

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