CN215440755U

CN215440755U - Semiconductor processing equipment and cooling chamber thereof

Info

Publication number: CN215440755U
Application number: CN202121335431.5U
Authority: CN
Inventors: 刘敬彬
Original assignee: Beijing Naura Microelectronics Equipment Co Ltd
Current assignee: Beijing Naura Microelectronics Equipment Co Ltd
Priority date: 2021-06-16
Filing date: 2021-06-16
Publication date: 2022-01-07
Anticipated expiration: 2031-06-16

Abstract

The embodiment of the application provides a cooling chamber of semiconductor processing equipment. The cooling chamber includes: a transmission port is arranged on the first cavity wall of the cavity structure, and a cooling space communicated with the transmission port is arranged in the cavity structure; the two first cooling structures are respectively formed on two opposite second cavity walls of the cavity structure, and the two second cavity walls are respectively positioned on two sides of the first cavity walls; the second cooling structure is formed on the bottom wall of the cavity structure, and the first cooling structure and the second cooling structure are both used for introducing cooling media to cool the wafer in the cooling space; the cooling air inlet structure is arranged on the bottom wall and is far away from the transmission port, and is used for inputting cooling gas into the cooling space to cool the wafer. The embodiment of the application realizes that the cooling efficiency of the cooling cavity is greatly improved, and the cooling effect of the cooling cavity is more uniform, so that the process efficiency and the process uniformity are greatly improved.

Description

Semiconductor processing equipment and cooling chamber thereof

Technical Field

The application relates to the technical field of semiconductor processing, in particular to semiconductor processing equipment and a cooling cavity thereof.

Background

Currently, a silicon epitaxial apparatus of a semiconductor processing apparatus may mainly include a buffer chamber (Loadlock), a Transfer chamber (Transfer chamber), a process chamber (process chamber), and a cooling chamber. The wafer is processed in the process chamber, the process temperature of the silicon epitaxial equipment is extremely high and can reach 1100-1200 ℃, the wafer needs to be cooled in the process chamber after the process, and the wafer is transferred to the cooling chamber for secondary cooling after the temperature of the wafer is reduced to 600-800 ℃, so that the time occupied by the wafer in the process chamber is reduced. In order to improve the wafer yield per unit space, a multi-chamber silicon epitaxial apparatus with three process chambers hooked with one transfer chamber is generally adopted, but the requirement for cooling the chambers is higher.

The cooling cavity left side among the prior art is connected with the transmission chamber, and cooling cavity right side bottom designs the nitrogen gas hole, sweeps through nitrogen gas and cools down the wafer in the cooling cavity, and the nitrogen gas that the nitrogen gas hole was swept gets into the transmission chamber after cooling the wafer to negative pressure tail discharge through the transmission chamber. However, since the cooling capacity of the nitrogen gas flow is limited, the increase of the flow causes the wafer to shake or move to affect the wafer transfer, which results in low cooling efficiency and high cost, and the entire cooling chamber cannot be uniformly cooled, thereby resulting in low wafer process yield.

SUMMERY OF THE UTILITY MODEL

The application aims at the defects of the prior art and provides semiconductor process equipment and a cooling cavity thereof, which are used for solving the technical problems of low cooling efficiency, higher cost and uneven cooling of the cooling cavity in the prior art.

In a first aspect, an embodiment of the present application provides a cooling chamber of semiconductor processing equipment, for cooling a wafer, including: the cooling structure comprises a cavity structure, a first cooling structure, a second cooling structure and a cooling air inlet structure; a transmission port is formed in the first cavity wall of the cavity structure, a cooling space communicated with the transmission port is formed in the cavity structure, the transmission port is used for transmitting the wafer, and the cooling space is used for accommodating the wafer; the two first cooling structures are respectively formed on two opposite second cavity walls of the cavity structure, and the two second cavity walls are respectively positioned on two sides of the first cavity wall; the second cooling structure is formed on the bottom wall of the cavity structure, and the two first cooling structures and the second cooling structure are used for introducing cooling media to cool the wafer in the cooling space; the cooling gas inlet structure is arranged on the bottom wall and is far away from the transmission port, and is used for inputting cooling gas into the cooling space to cool the wafer.

In an embodiment of the present application, each of the first cooling structure and the second cooling structure includes a fluid passage, an inlet and an outlet, the fluid passage is correspondingly formed in the second cavity wall and the bottom wall, and the inlet and the outlet are correspondingly disposed on the second cavity wall and the bottom wall.

In one embodiment of the present application, the inlet of the first cooling structure is located on the bottom surface of the bottom wall and is disposed away from the transfer port; the outlet of the first cooling structure is located on a side of the second chamber wall near the top and is disposed near the transfer port.

In an embodiment of the present application, the inlet and the outlet of the second cooling structure are located on the bottom surface of the bottom wall and are distributed on two opposite sides of the bottom wall.

In an embodiment of the present application, the fluid passage includes a main channel and a branch channel; the two main flow channels are arranged in parallel, and the plurality of branch flow channels are uniformly arranged between the two main flow channels at intervals and are communicated with the main flow channels; and inlets and outlets of the first cooling structure and the second cooling structure are respectively communicated with the two main flow passages.

In an embodiment of the present application, heat exchange structures are formed on the inner surfaces of the bottom wall and the second cavity wall, and the heat exchange structures are used for increasing the heat exchange area of the cooling space.

In an embodiment of the present application, the heat exchanging structure includes a wavy surface structure formed on the bottom wall and/or the inner surface of the second cavity wall.

In an embodiment of the present application, the cooling air inlet structure includes an air inlet and a flow equalizer, the air inlet is formed on the bottom wall, and an end of the flow equalizer is installed in the air inlet, and is used for diffusing the cooling air input by the air inlet into the cooling space in a uniform flow manner.

In an embodiment of the present application, an observation window is disposed on a third cavity wall and/or a top wall of the cavity structure, and the third cavity wall is disposed opposite to the first cavity wall.

In an embodiment of the present application, the cooling medium includes a liquid or a gas.

In a second aspect, the present application provides a semiconductor processing apparatus, comprising a transfer chamber, a process chamber, and the cooling chamber provided in the first aspect, wherein the process chamber and the cooling chamber are disposed around the periphery of the transfer chamber, and the transfer port is disposed facing the transfer chamber.

The technical scheme provided by the embodiment of the application has the following beneficial technical effects:

according to the embodiment of the application, the first cooling structure and the second cooling structure are respectively arranged on the second cavity wall and the bottom wall of the cavity structure, and the cooling air inlet structure is arranged on the bottom wall, and the first cooling structure and the second cooling structure can run simultaneously with the cooling air inlet structure, so that the wafer in the cooling space is cooled, the cooling efficiency of the cooling cavity can be greatly improved, the cooling effect of the cooling cavity is more uniform, and the process efficiency and the process uniformity are greatly improved. In addition, by adopting the design, the consumption of the cooling gas can be greatly reduced, and the flow rate of the cooling gas can be reduced to 10-20%, so that the application and maintenance cost of the embodiment of the application is greatly reduced.

Additional aspects and advantages of the present application will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the present application.

Drawings

The foregoing and/or additional aspects and advantages of the present application will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:

fig. 1A is a schematic perspective view of a cooling chamber according to an embodiment of the present disclosure;

fig. 1B is a perspective view of another cooling chamber according to an embodiment of the present disclosure;

FIG. 2A is a schematic cross-sectional view of a second chamber wall according to an embodiment of the present disclosure;

FIG. 2B is a schematic cross-sectional view of another second chamber wall provided in accordance with an embodiment of the present disclosure;

FIG. 2C is a schematic cross-sectional view of a bottom wall according to an embodiment of the present disclosure;

FIG. 3 is an enlarged cross-sectional view of a portion of a second chamber wall according to an embodiment of the present disclosure;

fig. 4 is a schematic structural diagram of a semiconductor processing apparatus according to an embodiment of the present disclosure.

Detailed Description

Reference will now be made in detail to the present application, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar parts or parts having the same or similar functions throughout. In addition, if a detailed description of the known art is not necessary for illustrating the features of the present application, it is omitted. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present application and are not to be construed as limiting the present application.

It will be understood by those within the art that, unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the prior art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

The following describes the technical solutions of the present application and how to solve the above technical problems with specific embodiments.

An embodiment of the present application provides a cooling chamber of semiconductor processing equipment, configured to cool a wafer, where a schematic structural diagram of the cooling chamber is shown in fig. 1A and 1B, and includes: the cooling structure comprises a cavity structure 1, a first cooling structure 2, a second cooling structure 3 and a cooling air inlet structure 4; a transmission port 11 is formed in a first cavity wall 134 of the cavity structure 1, a cooling space 12 communicated with the transmission port 11 is formed in the cavity structure 1, the transmission port 11 is used for transmitting a wafer (not shown in the figure) therethrough, and the cooling space 12 is used for accommodating the wafer; the two first cooling structures 2 are respectively formed on two opposite second cavity walls 131 of the cavity structure 1, and the two second cavity walls 131 are respectively located at two sides of the first cavity wall 134; the second cooling structure 3 is formed on the bottom wall 132 of the cavity structure 1, and the two first cooling structures 2 and the second cooling structure 3 are used for introducing a cooling medium to cool the wafer in the cooling space 12; the cooling gas inlet structure 4 is disposed on the bottom wall 132 and away from the transfer port 11, and is used for inputting cooling gas into the cooling space 12 to cool the wafer.

As shown in fig. 1A and 1B, the cavity structure 1 is a cubic structure made of a metal material, and the cavity structure 1 has a cavity to form a cooling space 12. The first cavity wall 134 of the cavity structure 1 is opened with the transmission port 11, and the first cavity wall 134 may be located at one end of the cavity structure 1, but the embodiment of the present invention is not limited thereto. The transfer port 11 is disposed to communicate with the cooling space 12 and face a transfer chamber (not shown) of the semiconductor process equipment, so that the transfer chamber transfers the wafer into the cooling space 12 through the transfer port 11. The two first cooling structures 2 are respectively disposed on two oppositely disposed second cavity walls 131 of the cavity structure 1, the two second cavity walls 131 are respectively located at the left and right sides of the cavity structure 1 and located at the two sides of the transmission port 11, that is, the two second cavity walls 131 are respectively located at the two sides of the first cavity wall 134. The second cooling structure 3 may be disposed on the bottom wall 132 of the cavity structure 1. The first cooling structure 2 and the second cooling structure 3 are used for introducing a cooling medium to cool the wafer in the cooling space 12. The cooling air intake structure 4 may be disposed on the bottom wall 132, and may be partially located in the cooling space 12 and disposed away from the transfer port 11. The cooling gas inlet 4 may be connected to a cooling gas source (not shown), and since the cooling gas inlet 4 is disposed away from the transfer port 11, the cooling gas may flow through the wafer located in the middle of the cooling space 12 and cool the wafer, and then be transferred into the transfer chamber through the transfer port 11. Optionally, a bearing structure 14 is further disposed at a middle position of the cooling space 12, and the bearing structure 14 may be located between the transfer port 11 and the cooling intake structure 4. Specifically, the two carrying structures 14 are respectively disposed on the two oppositely disposed second cavity walls 131, and the two carrying structures 14 are both provided with a plurality of stacked accommodating grooves for being matched with each other to carry a plurality of wafers, but the embodiment of the present application does not limit the specific structure of the carrying structure 14, and the setting can be adjusted by a person skilled in the art according to actual situations.

It should be noted that the embodiment of the present application is not limited to a specific type of the cooling medium, for example, the cooling medium may be cooling gas or cooling liquid, and the cooling gas may be nitrogen or other inert gas. Therefore, the embodiments of the present application are not limited thereto, and those skilled in the art can adjust the settings according to actual situations.

In an embodiment of the present application, as shown in fig. 1A to fig. 2C, each of the first cooling structure 2 and the second cooling structure 3 includes a fluid passage 51, an inlet 52, and an outlet 53, the fluid passage 51 is correspondingly formed in the second chamber wall 131 and the bottom wall 132, and the inlet 52 and the outlet 53 are correspondingly disposed on the second chamber wall 131 and the bottom wall 132. Specifically, the fluid passage 51 of the first cooling structure 2 may be formed in the second cavity wall 131, and the inlet 52 and the outlet 53 of the first cooling structure 2 are disposed on the surface of the second cavity wall 131. The fluid passage 51 of the second cooling structure 3 is formed in the bottom wall 132, and the inlet 52 and the outlet 53 of the second cooling structure 3 are both disposed on the bottom surface of the bottom wall 132. The first cooling structure 2 and the second cooling structure 3 may be formed when the cavity structure 1 is integrally formed, but the embodiment of the present application is not limited thereto, and those skilled in the art can adjust the arrangement according to actual situations. By adopting the design, the first cooling structure 2 and the second cooling structure 3 are both positioned in the cavity structure 1, so that the heat exchange efficiency of the cooling space 12 can be greatly improved, and the cooling efficiency of the wafer is further improved; and the embodiment of the application has a simple structure and is easy to realize, so that the space occupation is greatly saved.

In one embodiment of the present application, as shown in fig. 1A to 2C, the inlet 52 of the first cooling structure 2 is located on the bottom surface of the bottom wall 132 and is disposed away from the transfer port 11; the outlet 53 of the first cooling structure 2 is located on the side of the second chamber wall 131 close to the top and is located close to the transfer port 11. In particular, the inlet 52 of the first cooling structure 2 may be located on the bottom surface of the bottom wall 132, the inlet 52 of the first cooling structure 2 being in particular located at an end of the cavity structure 1 remote from the transfer port 11 and being arranged in alignment with the second cavity wall 131, i.e. the inlet 52 of the first cooling structure 2 is located remote from the transfer port 11; the outlet 53 of the first cooling structure 2 is disposed at the top of the side surface of the second cavity wall 131 and is disposed near the transmission port 11, that is, the inlet 52 and the outlet 53 of the first cooling structure 2 are respectively disposed at the left and right ends of the second cavity wall 131, and the inlet 52 and the outlet 53 are respectively disposed at the bottom and the top of the second cavity wall 131. With the above design, the cooling medium in the first cooling structure 2 in the two second cavity walls 131 can flow from bottom to top and flow from the direction far away from the transmission port 11 toward the transmission port 11, thereby greatly improving the cooling efficiency and the cooling uniformity.

In an embodiment of the present application, as shown in fig. 1A to fig. 2C, the inlet 52 and the outlet 53 of the second cooling structure 3 are located on the bottom surface of the bottom wall 132 and are distributed on two opposite sides of the bottom wall 132. Specifically, the inlet 52 and the outlet 53 of the second cooling structure 3 are respectively located on the left and right sides of the bottom wall 132, but the present embodiment is not limited thereto, and for example, the inlet 52 and the outlet 53 of the second cooling structure 3 are respectively located on the front and rear sides of the bottom wall 132. By adopting the design, the cooling medium in the second cooling structure 3 can flow from two sides to the middle part, so that the cooling efficiency and the cooling uniformity are greatly improved.

In an embodiment of the present application, as shown in fig. 1A to 2C, the fluid passage 51 includes a main channel 511 and a branch channel 512; the two main runners 511 are arranged in parallel, and the plurality of branch runners 512 are uniformly arranged between the two main runners 511 at intervals and are communicated with the main runners 511; the inlet 52 and the outlet 53 of the first cooling structure 2 and the second cooling structure 3 are respectively communicated with the two main flow passages 511.

As shown in fig. 1A to 2C, the two main flow passages 511 of the first cooling structure 2 may be extended along the length direction of the second cavity wall 131 of the cavity structure 1 and juxtaposed along the height direction; the plurality of branch runners 512 may extend along the height direction of the second cavity wall 131 and are uniformly spaced along the length direction of the second cavity wall 131; the inlet 52 and the outlet 53 of the first cooling structure 2 are respectively located at the end portions of the two main flow channels 511 of the first cooling structure 2, as shown in fig. 2A and 2B. The two main flow passages 511 of the second cooling structure 3 may be arranged to extend in the front-rear direction of the bottom wall 132 of the cavity structure 1, i.e., the up-down direction in fig. 2C, and juxtaposed in the left-right direction of the bottom wall 132, i.e., the left-right direction in fig. 2C; the plurality of branch flow passages 512 of the second cooling structure 3 are all arranged to extend along the left-right direction of the bottom wall 132, and are spaced and uniformly distributed along the front-back direction of the bottom wall 132; the inlet 52 and the outlet 53 of the second cooling structure 3 may be respectively disposed at the middle positions of the two main flow passages 511 of the second cooling structure 3. By adopting the design, the whole uniformity of the cavity structure 1 in the embodiment of the application is better, so that the cooling efficiency is improved, meanwhile, the cooling uniformity can be greatly improved, and further, the process uniformity of wafers is improved.

In an embodiment of the present application, as shown in fig. 1B and fig. 3, the inner surface of the bottom wall 132 and/or the inner surface of the second cavity wall 131 are formed with heat exchanging structures 6, and the heat exchanging structures 6 are used to increase the heat exchanging area of the cooling space 12. Optionally, the heat exchanging structure 6 comprises a wavy surface structure formed on the inner surface of the bottom wall 132 and the second chamber wall 131. Particularly, the inner surfaces of the bottom wall 132 and the second cavity wall 131 of the cavity structure 1 are both provided with the heat exchange structure 6, and the heat exchange structure 6 can increase the heat exchange area in the cooling space 12, so that the cooling efficiency and the cooling uniformity of the wafer are greatly improved. In a specific embodiment, the heat exchange structure 6 may be specifically configured as a wave surface structure, and since the wave surface structure is in arc transition, the inside of the cooling space 12 has no dead angle so as to be easily cleaned, which not only can increase the strength of the cavity structure 1, but also can reduce the distance between the fluid passage 51 and the inner surface of the cavity structure 1, thereby further increasing the heat exchange surface area to enhance the heat exchange effect. However, it should be noted that, the embodiment of the present application does not limit the specific implementation manner of the heat exchange structure 6, as long as the heat exchange structure 6 can increase the heat exchange area of the cavity structure 1. Therefore, the embodiments of the present application are not limited thereto, and those skilled in the art can adjust the settings according to actual situations.

In an embodiment of the present application, as shown in fig. 1A and 1B, the cooling air inlet structure 4 includes an air inlet 41 and a flow equalizer 42, the air inlet 41 is formed on the bottom wall 132, and an end of the flow equalizer 42 is installed in the air inlet 41 for equalizing and diffusing the cooling air input from the air inlet 41 into the cooling space 12. Specifically, the gas inlet 41 may be a hole-shaped structure formed on the bottom wall 132 of the chamber body structure 1, and the gas inlet 41 may be disposed away from the transfer port 11, so that the cooling gas may flow through the wafer located in the middle of the cooling space 12 and then be discharged through the transfer port 11, thereby improving the cooling efficiency. The flow equalizer 42 may be specifically disposed in the cooling space 12 and specifically installed in the air inlet 41, for example, by screwing, but the embodiment of the present application is not limited thereto. The flow equalizer 42 may be a diffuser to make the cooling gas flow into the cooling space 12 uniformly, so as to avoid the cooling gas from blowing only to a certain area of the wafer, thereby further improving the uniformity of the wafer cooling. It should be noted that the embodiment of the present application does not limit the specific type of the flow equalizer 42, as long as the flow equalizer 42 can uniformly feed the cooling gas into the cooling space 12. Therefore, the embodiments of the present application are not limited thereto, and those skilled in the art can adjust the settings according to actual situations.

In an embodiment of the present application, as shown in fig. 1A and 1B, the observation window 7 is disposed on each of the third cavity wall 135 and/or the bottom wall 132 of the cavity structure 1, and the third cavity wall 135 is disposed opposite to the first cavity wall 134. Specifically, the third cavity wall 135 of the cavity structure 1 is disposed opposite to the first cavity wall 134, that is, the two second cavity walls 131 are respectively located at two sides of the first cavity wall 134 and the third cavity wall 135. An observation window 7 is arranged on the third cavity wall 135 of the cavity structure 1, or the top wall 133 of the cavity structure 1 is provided with the observation window 7, and then the observation windows 7 are arranged on the third cavity wall 135 and the top wall 133 of the cavity structure 1, so as to observe the cooling state of the wafer in the cooling space 12 in real time. However, the embodiment of the present application does not limit the specific position and the specific shape of the observation window 7, and those skilled in the art can adjust the setting according to the actual situation.

In one embodiment of the present application, as shown in fig. 1A to 2B, the cooling medium includes a liquid or a gas. The cooling medium can specifically adopt water or nitrogen, so that the application and maintenance cost can be effectively reduced, and the safety of the embodiment of the application can be greatly improved. However, the embodiment of the present application is not limited to a specific type of the cooling medium, and the setting can be adjusted by a person skilled in the art according to the actual situation. In a specific embodiment, the cooling medium is water, the temperature of the water inlet of the first cooling structure 2 is 20 ± 2 ℃, and the temperature of the inner surface of the chamber structure 1 can be kept within 22 ± 1 ℃ under the water inlet pressure of 0.5 ± 0.1 MPA; the cooling gas introduced into the cooling gas inlet structure 4 is nitrogen, and the gas flow inside the cooling space 12 continuously flows under the action of the nitrogen with the flow rate less than 1SLM at the position of the flow equalizer 42, so that the effect of cooling the wafer inside the cooling space at a high speed is achieved.

Based on the same concept, as shown in fig. 4, an embodiment of the present application provides a semiconductor processing apparatus, which includes a transfer chamber 200, a process chamber 300, and a cooling chamber 100 as provided in the above embodiments, wherein the process chamber 300 and the cooling chamber 100 are disposed around the periphery of the transfer chamber 200, and the transfer port is disposed facing the transfer chamber 200. Optionally, the semiconductor processing apparatus further includes a front end chamber 400 for temporarily storing wafers. In an embodiment of the present application, three process chambers 300, two front end chambers 400, and one cooling chamber 100 are disposed around the periphery of the transfer chamber 200, thereby greatly improving the work efficiency. However, the embodiment of the present application does not limit the semiconductor processing equipment to include the number of the various types of chambers, and the setting can be adjusted by those skilled in the art according to the actual situation.

By applying the embodiment of the application, at least the following beneficial effects can be realized:

It will be understood that the above embodiments are merely exemplary embodiments taken to illustrate the principles of the present invention, which is not limited thereto. It will be apparent to those skilled in the art that various modifications and improvements can be made without departing from the spirit and substance of the utility model, and these modifications and improvements are also considered to be within the scope of the utility model.

In the description of the present application, it is to be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience in describing the present invention and simplifying the description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed in a particular orientation, and be operated, and thus, should not be construed as limiting the present invention.

The terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless otherwise specified.

In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

In the description herein, particular features, structures, materials, or characteristics may be combined in any suitable manner in any one or more embodiments or examples.

The foregoing is only a partial embodiment of the present application, and it should be noted that, for those skilled in the art, several modifications and decorations can be made without departing from the principle of the present application, and these modifications and decorations should also be regarded as the protection scope of the present application.

Claims

1. A cooling chamber of semiconductor processing equipment, which is used for cooling a wafer, and is characterized by comprising: the cooling structure comprises a cavity structure, a first cooling structure, a second cooling structure and a cooling air inlet structure;

a transmission port is formed in the first cavity wall of the cavity structure, a cooling space communicated with the transmission port is formed in the cavity structure, the transmission port is used for transmitting the wafer, and the cooling space is used for accommodating the wafer;

the two first cooling structures are respectively formed on two opposite second cavity walls of the cavity structure, and the two second cavity walls are respectively positioned on two sides of the first cavity wall; the second cooling structure is formed on the bottom wall of the cavity structure, and the two first cooling structures and the second cooling structure are used for introducing cooling media to cool the wafer in the cooling space;

the cooling gas inlet structure is arranged on the bottom wall and is far away from the transmission port, and is used for inputting cooling gas into the cooling space to cool the wafer.

2. The cooling chamber of claim 1, wherein the first cooling structure and the second cooling structure each comprise a fluid passageway, an inlet, and an outlet, the fluid passageways being formed in the second chamber wall and the bottom wall, respectively, the inlet and the outlet being disposed on the second chamber wall and the bottom wall, respectively.

3. The cooling chamber of claim 2, wherein the inlet of the first cooling structure is located on a bottom surface of the bottom wall and is disposed away from the transfer port; the outlet of the first cooling structure is located on a side of the second chamber wall near the top and is disposed near the transfer port.

4. The cooling chamber of claim 2, wherein the inlet and the outlet of the second cooling structure are located on the bottom surface of the bottom wall and are distributed on opposite sides of the bottom wall.

5. The cooling chamber of claim 2, wherein the fluid path comprises a main flow channel and a branch flow channel; the two main flow channels are arranged in parallel, and the plurality of branch flow channels are uniformly arranged between the two main flow channels at intervals and are communicated with the main flow channels; and inlets and outlets of the first cooling structure and the second cooling structure are respectively communicated with the two main flow passages.

6. The cooling chamber of claim 1, wherein the inner surfaces of the bottom wall and the second chamber wall are formed with heat exchanging structures for increasing the heat exchanging area of the cooling space.

7. The cooling chamber of claim 6, wherein the heat exchanging structure comprises a corrugated surface structure formed on the bottom wall and/or the inner surface of the second chamber wall.

8. The cooling chamber of any of claims 1 to 7, wherein the cooling gas inlet structure comprises a gas inlet formed on the bottom wall and a flow equalizer having an end portion installed in the gas inlet for equalizing and diffusing the cooling gas inputted from the gas inlet into the cooling space.

9. The cooling chamber of any of claims 1 to 7, wherein a viewing window is provided in a third chamber wall and/or a top wall of the chamber body structure, and wherein the third chamber wall is disposed opposite the first chamber wall.

10. The cooling chamber of semiconductor processing apparatus according to any of claims 1 to 7, wherein the cooling medium comprises a liquid or a gas.

11. A semiconductor processing apparatus comprising a transfer chamber, a process chamber, and a cooling chamber of a semiconductor processing apparatus according to any one of claims 1 to 10, wherein the process chamber and the cooling chamber are disposed around an outer periphery of the transfer chamber, and the transfer port is disposed facing the transfer chamber.