TWM600306U - Multi-channel gas ejector with cascade cooling rooms - Google Patents

Abstract

This creation is a multi-channel gas ejector with tandem cooling chambers. It includes a spray shell with multiple cooling chambers around it. At least one overflow opening is provided on the top of the side wall of each cooling chamber to communicate with adjacent ones. In the cooling chamber, each cooling chamber is further provided with a plurality of exhaust pipes, and the opening of the exhaust pipe is exposed outside the spray casing. This creation allows each exhaust pipe to be immersed in the coolant to achieve the effect of overall exhaust pipe temperature control, and the exhaust pipe protrudes from the bottom of the multi-channel gas injector of the tandem cooling chamber with a susceptor The concave structure can effectively remove dust and deposits on the edge of the wafer and improve the product manufacturing yield.

Description

Multi-channel gas ejector with series cooling chamber

This creation is related to a wafer plating technology, especially a multi-channel gas injector with a series cooling chamber.

With the development of semiconductor technology, semiconductor process technology has also become more mature, so that electronic devices composed of more semiconductors can be made more sophisticated and more functional.

The semiconductor technology process will go through yellow light, etching, diffusion and then enter the formation of thin films. In the thin film deposition process of semiconductor wafers, the wafers are set in a vacuum reaction chamber to inject the reacted gas onto the wafers horizontally by a gas injector, so as to utilize the physical or chemical reaction caused by heating, thereby Deposit a thin film on it.

In the deposition process, in order to prevent the gas injector from being affected by high temperature when heating the wafer, in the past, a water-cooling device was installed on the outer edge of the gas injection tube of the gas injector to reduce the temperature of the gas injector. However, the water-cooling equipment in this way can only cover the outermost jet pipe, and cannot effectively cool the jet pipe in the inner layer of the gas injector, resulting in poor overall temperature control effect.

In addition, the current ejector design makes the gas source gas to be sprayed around 360 degrees in a horizontal manner, so it is easy to have a dead angle when depositing thin films. For example, the upper edge of the wafer side is the front end that contacts the gas. It is particularly easy to accumulate reactants, and dust is easy to accumulate over time. And this zone is the gas upstream zone of the film forming zone. Once dust is generated, the dust It is easily blown to the surface of the entire wafer with the airflow, causing the wafer to form dust particle defects, which affects the process yield.

In view of this, this creation aims at the lack of the above-mentioned conventional technology and proposes a multi-channel gas ejector with a series cooling chamber to effectively overcome the above-mentioned problems.

The main purpose of this creation is to provide a multi-channel gas injector with a series cooling chamber, which can make each exhaust pipe immerse in the cooling liquid to achieve the effect of overall exhaust pipe temperature control.

Another purpose of this creation is to provide a multi-channel gas injector with a series cooling chamber, which has a common exhaust pipe that can be used as a purge runner or a clean etching runner, and the common exhaust pipe protrudes from the series The bottom of the multi-channel gas ejector in the cooling chamber is matched with the recessed structure of the susceptor, which can effectively remove dust and deposits on the edge of the wafer and improve the product manufacturing yield.

Another purpose of this creation is to provide a multi-channel gas ejector with a series cooling chamber, which can make cooling water flow only in a single direction through the arrangement of partitions, avoiding the reflux of cooling water, and greatly improving the cooling performance effect.

In order to achieve the above-mentioned purpose, this invention provides a multi-channel gas ejector with serial cooling chambers, which includes a spray shell with multiple cooling chambers around the inner ring, and at least one overflow is provided on the top of the side wall of each cooling chamber An opening is used to communicate with adjacent cooling chambers, and a plurality of exhaust pipes are respectively arranged in each cooling chamber, and the opening of each exhaust pipe is exposed outside the spray casing.

In this embodiment, the spray shell may be a stepped spray shell, so that the length of the side wall of each cooling chamber gradually increases from the inside to the outside.

In this embodiment, the bottom of each cooling chamber is further provided with a gas drainage plate, which is perpendicular to the openings of the plurality of exhaust pipes to guide the gas discharged from the exhaust pipes, and the gas drainage plate has an overflow space which is connected with the overflow space Cooling room.

In this embodiment, at least one partition is further provided in each cooling chamber to separate the cooling chamber.

In this embodiment, the plurality of exhaust pipes includes a common exhaust pipe arranged in the center of the injection housing, and the common exhaust pipe passes through the injection housing.

In this embodiment, the gas injector with a series cooling chamber further includes an adapter. The adapter includes an input connector and a branch connector. The input connector is provided with a plurality of gas pipes, at least one first fluid pipe, and At least one first drain pipe. A plurality of airflow channels, at least one second liquid infusion pipe, and at least one second liquid discharge pipe are provided on the shunt joint. The plurality of airflow channels are respectively connected with the gas pipe and with a plurality of exhaust pipes to input different gases to the plurality of exhaust pipes; The second liquid infusion pipe is respectively connected with the first liquid pipe and the innermost cooling chamber to input the cooling liquid; the second liquid discharge pipe is respectively connected with the first liquid discharge pipe and the outermost cooling room to discharge the cooling liquid.

In this embodiment, a filter screen is further provided between each gas drainage plate.

In order to have a better understanding and understanding of the structural features of this creation and the effects achieved, I would like to provide a better embodiment diagram and detailed descriptions. The description is as follows.

1: Multi-channel gas injector with series cooling chamber

10: Jet shell

12: Cooling room

12a: The innermost cooling chamber

12b: Outermost cooling chamber

12c: cooling chamber

12d: cooling room

120: overflow opening

120a: overflow opening

120c: overflow opening

122: gas drainage plate

122a: gas drainage plate

122c: gas drainage plate

124: Overflow Space

124a: overflow space

124c: overflow space

14: Exhaust pipe

140: Shared exhaust pipe

142: inner casing

16: partition

18: Filter

20: Adapter

22: Input connector

220: gas pipe

222: The first infusion tube

224: First drain pipe

24: Shunt connector

240: Airflow channel

242: Exhaust opening

244: second infusion tube

246: second drain pipe

30: Crystal seat

32: Wafer recess

34: Wafer

The first picture is a three-dimensional picture of this creation.

The second picture is an exploded view of the components of this creation.

The third picture is a cross-sectional side view of this creation.

The fourth picture is a schematic diagram of the overflow state of this creation.

The fifth figure is a schematic diagram of the top view of the jet shell in the overflow state of the creation.

The sixth figure is a schematic side view of the airflow state of this creation.

The multi-channel gas injector with a series cooling chamber of this invention can be used to connect the film deposition gas output system as a nozzle to spray different gases to deposit thin films on wafers. More importantly, with series The special structure design of the multi-channel gas injector in the cooling chamber can make each exhaust pipe immerse in the coolant to achieve the effect of overall exhaust pipe temperature control.

Please refer to the first to third figures, the multi-channel gas injector 1 with a series cooling chamber includes an injection housing 10 connected to an adapter 20. In this embodiment, the spray casing 10 is a circular spray casing. Of course, the spray casing can also be a square or triangular spray casing, and the shape is not limited. In this embodiment, a plurality of cooling chambers 12 are ringed in the spray housing 10 in a concentric manner, and at least one overflow opening 120 is provided on the top of the side wall of each cooling chamber 12 to communicate with adjacent cooling chambers 12 , So that the cooling liquid contained in the cooling chamber 12 can overflow into the adjacent cooling chamber 12 to achieve the purpose of connecting the cooling chambers 12 in series. The injection housing 10 is further provided with a plurality of exhaust pipes 14 respectively arranged in each cooling chamber 12, and the opening of the exhaust pipe 14 is exposed outside the injection housing 10; through the arrangement of the above structure, when the cooling chamber 12 is filled When the coolant is full, all the exhaust pipes 14 can be immersed in the coolant to achieve the temperature control effect. The adapter 20 provides a multi-channel gas injector 1 with a series cooling chamber to connect the film deposition gas output system (Not shown in the figure) and a water cooling system (not shown in the figure) are connected to provide a multi-channel gas injector 1 with a series cooling chamber to inject deposited gas and cooling liquid.

Please continue to refer to the first to third figures to describe the structure of the spray housing 10 and the adapter 20 in detail. In this embodiment, the injection housing 10 can be a stepped injection housing, so that the length of the side wall of each cooling chamber 12 gradually increases from the outer ring to the inner ring. Similarly, the length of the exhaust pipe 14 in the cooling chamber 12 is also The side wall of the cooling chamber 12 gradually grows. Please refer to the third figure, the bottom of each cooling chamber 12 is further provided with a gas drainage plate 122, the gas drainage plate 122 is vertically connected to the cooling chamber 12, the gas drainage plate 122 has an overflow space 124, the overflow space 124 connected to the cooling chamber 12 , And each gas guide plate 122 is vertically arranged below the opening of the plurality of exhaust pipes 14. Since the jet housing 10 is stepped, the gas guide plate 122 will be located just below the exhaust pipe 14, so that it can be used as a drain The gas discharged from the air pipe 14 allows the gas discharged from the exhaust pipe 14 to be ejected in a horizontal manner. Please refer to the second figure. At least one partition 16 is provided on the side wall of each cooling chamber 12 to divide each cooling chamber 12 into two areas. The partition 16 can prevent the heat exchange liquid from being in the cooling chamber. 12 flows randomly, and interferes with the flow direction of the coolant.

Continue to refer to the first to third figures to describe the structure of the exhaust pipe 14 of the injection housing 10. In this embodiment, the inner diameter of the exhaust pipe 14 is at least four millimeters (mm), and the exhaust pipe 14 can be It is a metal pipe body with fast heat conduction, such as a copper exhaust pipe, and the thickness of the pipe wall of the exhaust pipe 14 is 2.5 mm to 0.5 mm (mm). Since the material of the exhaust pipe 14 conducts heat quickly and is thin in thickness, the temperature conduction is faster, so that the coolant in the cooling chamber 12 can effectively cool the exhaust pipe 14, so that the temperature control effect is better. Please refer to the third figure. In this embodiment, a filter screen 18 is further provided between each gas drainage plate 122. The filter screen 18 can be a metal filter screen to prevent the gas discharged from the exhaust pipe 14 from forming a gas pressure resistance. , At the same time, it can prevent the jetted gas from directly rushing out, causing uneven jetting problem. In this embodiment, the plurality of exhaust pipes 14 includes a common exhaust pipe 140 disposed in the center of the injection housing 10, and the common exhaust pipe 14 penetrates the bottom of the injection housing 10 to serve as a sweeping channel and cleaning etching ( Cleaning Etching) The common channel of the runner.

Please continue from the first to third figures, and then describe the structure of the adapter 20 in detail. The adapter 20 includes an input connector 22 and a branch connector 24. The input joint 22 is provided with a plurality of gas transmission pipes 220, at least one first liquid transmission pipe 222, and at least one first liquid discharge pipe 224. The plurality of gas transmission pipes 220 are connected to the thin film deposition gas output system (not shown), and the first liquid transmission pipe 222 And the first drain pipe 224 is connected to a water cooling system (not shown in the figure). The shunt connector 24 is connected to the input connector 22. The shunt connector 24 is provided with a plurality of airflow channels 240, and each airflow channel 240 is respectively connected to the air pipe 220, and the bottom of each airflow channel 240 is further provided with a plurality of exhaust openings 242 for multiple exhausts. The openings 242 are respectively connected to the exhaust pipe 14 on the jet housing 10 to input different gases to the plurality of exhaust pipes 14. At least one second infusion pipe 244 is further provided on the branch joint 24 to respectively communicate with the first infusion pipe 222 and the innermost The layer cooling chamber 12a is used to input the cooling liquid, and at least one second drain pipe 246 is respectively connected with the first drain pipe 224 and the outermost layer cooling chamber 12b to discharge the cooling liquid.

After describing the multi-channel gas injector 1 with a series cooling chamber, please refer to the fourth and fifth figures together to explain the cooling in the cooling chamber 12 of the multi-channel gas injector 1 of the series cooling chamber. In the overflow state of the liquid, first, the cooling liquid is connected to the first infusion tube 222 of the input connector 22 of the water cooling system (not shown) through the adapter 20, circulates to the second infusion tube 244 of the branch connector 24, and then flows into the innermost layer for cooling In the chamber 12a, since the innermost cooling chamber 12a is blocked by the partition plate 16, the cooling liquid only flows on the half side of the innermost cooling chamber 12a at first, until the cooling liquid enters the gas guide plate 122a connected to the innermost cooling chamber 12a When the overflow space 124a, the coolant will overflow through the overflow space 124a to the other half of the innermost cooling chamber 12a, the innermost After the other half of the cooling chamber 12a overflows, it will overflow through the overflow opening 120a to another cooling chamber 12c. In the same way, because the partition 16 is also provided in the cooling chamber 12c, the cooling liquid only flows on the half side of the cooling chamber 12c at first, until the cooling liquid enters the overflow space 124c of the gas guide plate 122c connected to the cooling chamber 12c. It will overflow to the other half of the cooling chamber 12c through the overflow space 124c. After the other half of the cooling chamber 12c overflows, it will overflow through the overflow opening 120c to the next cooling chamber 12d. The flow method of each layer is the same, so the description will not be repeated.

Finally, when the cooling water overflows the outermost cooling chamber 12b, the cooling water flows back to the water cooling system through the second drain pipe 246 of the branch connector 24 and the first drain pipe 224 of the input connector 22 (not shown) In order to achieve the effect of cooling water circulation. Of course, two sets of transfusion pipes and drain pipes can also be provided, so that more than two sets of series-type cooling chambers are arranged in the spray housing 10, which is not limited here. Moreover, in this embodiment, the arrangement of the partition plate 16 can make the cooling water flow only in a single direction, can prevent the cooling water from flowing back, and can greatly improve the cooling effect.

Next, please refer to Figure 6 to illustrate how the gas is discharged. The multiple gas pipes 220 of the input connector 22 of the adapter 20 are connected to the thin film deposition gas output system (not shown in the figure). In this embodiment, different The gas pipe 220 can be used to connect different gas output devices in the thin film deposition gas output system to output different gases. Then, the gas flows into the air flow channel 240 of the branch joint 24 and then flows out to the exhaust pipe 14 on the jet housing 10 through the plurality of exhaust openings 242 on the air flow channel 240. Since the filter screen 18 is provided between the gas guide plates 122, the gas discharged from the exhaust pipe 14 can be prevented from forming a gas pressure resistance, and at the same time, the ejected gas can be prevented from directly rushing out, causing the problem of uneven ejection. In addition, after the gas is discharged from the exhaust pipe 14, it will contact the gas guide plate 122, so that the gas ejected from the exhaust pipe 14 can be ejected in a horizontal manner.

The plurality of exhaust pipes 14 have a common exhaust pipe 140. The common exhaust pipe 140 can be used as a purge channel or a clean etching channel, and the common exhaust pipe 140 is connected to the film deposition gas output system (not shown) , To introduce etching gas, such as hydrogen chloride or chlorine. Since the common exhaust pipe 140 protrudes from the bottom of the jet housing 10 and the gas drainage plate 122 of the tandem cooling chamber, when the etching gas is exhausted, it is matched with the concave structure of the wafer recess 32 of the susceptor to etch The gas will rise along the edge of the wafer recess 32, so that the gas flow of the etching gas can reach the corners of the wafer 34, which can effectively remove dust and deposits accumulated on the edge of the wafer. In addition, an inner sleeve 142 can be provided in the common exhaust pipe 140. The gas in the inner sleeve 142 can be separated from the gas outside the inner sleeve 142 to prevent the mixing of different gases and chemical reactions.

To sum up, this creation can make each exhaust pipe immerse in the cooling liquid to achieve the effect of overall exhaust pipe temperature control, and through the setting of the partition, the cooling water can only flow in a single direction, which can avoid cooling The water returns to greatly enhance the cooling effect. And the exhaust pipe of this creation has a common exhaust pipe, which can be used as a purge runner or a clean etching runner, and the common exhaust pipe protrudes from the bottom of the multi-channel gas injector of the tandem cooling chamber, and is matched with a susceptor ) The concave structure can effectively remove dust and deposits on the edge of the wafer and improve the product manufacturing yield.

Only the above are only preferred embodiments of this creation, and are not used to limit the scope of implementation of this creation. Therefore, all equivalent changes or modifications made in accordance with the characteristics and spirit of the application scope of this creation shall be included in the scope of patent application of this creation.

1: Multi-channel gas injector with series cooling chamber

10: Jet shell

12: Cooling room

12a: The innermost cooling chamber

12b: Outermost cooling chamber

120: overflow opening

122: gas drainage plate

14: Exhaust pipe

140: Shared exhaust pipe

16: partition

20: Adapter

22: Input connector

220: gas pipe

222: The first infusion tube

224: First drain pipe

24: Shunt connector

240: Airflow channel

242: Exhaust opening

244: second infusion tube

246: second drain pipe

Claims (10)

A multi-channel gas ejector with series cooling chambers includes: an ejection shell, the inner ring of which is provided with a plurality of layers of cooling chambers, and the top of the side wall of each of the cooling chambers is provided with at least one overflow opening to communicate with each other Adjacent cooling chambers; and a plurality of exhaust pipes are arranged in each of the cooling chambers, and the opening of the exhaust pipe is exposed outside the jet casing. The multi-channel gas injector with tandem cooling chambers according to claim 1, wherein the spray shell is a stepped spray shell, so that the length of the side wall of each cooling chamber gradually increases from the outside to the inside. The multi-channel gas ejector with tandem cooling chambers according to claim 1, wherein a gas drainage plate is further provided at the bottom of each cooling chamber, perpendicular to the openings of the exhaust pipes to guide the exhaust pipes The exhausted gas has an overflow space in the gas guide plate, and the overflow space is connected to the cooling chamber. According to claim 3, the multi-channel gas ejector with series-type cooling chambers, wherein each cooling chamber is further provided with at least one partition to separate the cooling chambers. The multi-channel gas injector with tandem cooling chamber according to claim 1, wherein the exhaust pipes include a common exhaust pipe arranged in the center of the injection housing, and the common exhaust pipe passes through the Spray the bottom of the housing. The multi-channel gas injector with a series cooling chamber according to claim 5, wherein an inner sleeve is further provided in the common exhaust pipe. The multi-channel gas injector with tandem cooling chamber as described in claim 1, further including an adapter, which includes: An input connector with a plurality of air pipes, at least one first infusion pipe, and at least one first drain pipe; and a branch connector with a plurality of airflow channels, at least one second infusion pipe, and at least one Two liquid discharge pipes, the gas flow channels are respectively connected to the gas pipes, and the exhaust pipes are respectively connected to input different gases to the exhaust pipes; the second liquid pipe is connected to the first liquid pipe and the most The inner layer of the cooling chamber is used for input of cooling liquid; the second drain pipe is respectively connected with the first drain pipe and the outermost layer of the cooling chamber to discharge the cooling liquid. According to claim 7 of the multi-channel gas injector with a series cooling chamber, wherein the air flow channels are further provided with a plurality of exhaust openings, and the exhaust openings are respectively connected to the exhaust pipes. The multi-channel gas injector with tandem cooling chamber according to claim 1, wherein the inner diameter of the exhaust pipe is at least four millimeters (mm), and the pipe wall of the exhaust pipe can be 2.5 millimeters (mm) To 0.5 millimeters (mm). According to claim 3, the multi-channel gas ejector with serial cooling chambers, wherein a filter screen is further provided between each of the gas guide plates.

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