CN116411342A - Partition type spray header device for balanced heat dissipation - Google Patents

Partition type spray header device for balanced heat dissipation Download PDF

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Publication number
CN116411342A
CN116411342A CN202111673940.3A CN202111673940A CN116411342A CN 116411342 A CN116411342 A CN 116411342A CN 202111673940 A CN202111673940 A CN 202111673940A CN 116411342 A CN116411342 A CN 116411342A
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CN
China
Prior art keywords
air
cavity
air outlet
ring
homogenizing
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Pending
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CN202111673940.3A
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Chinese (zh)
Inventor
蒲勇
赵鹏
卢勇
施建新
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Core Semiconductor Technology Suzhou Co ltd
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Core Semiconductor Technology Suzhou Co ltd
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Priority to CN202111673940.3A priority Critical patent/CN116411342A/en
Publication of CN116411342A publication Critical patent/CN116411342A/en
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
    • C30B25/02—Epitaxial-layer growth
    • C30B25/14—Feed and outlet means for the gases; Modifying the flow of the reactive gases
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
    • C30B29/10—Inorganic compounds or compositions
    • C30B29/36—Carbides
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
    • C30B29/10—Inorganic compounds or compositions
    • C30B29/40—AIIIBV compounds wherein A is B, Al, Ga, In or Tl and B is N, P, As, Sb or Bi
    • C30B29/403—AIII-nitrides
    • C30B29/406—Gallium nitride

Abstract

The application discloses a partition type spray header device with balanced heat dissipation. The shower head device includes: the shell, the last board of giving vent to anger of configuration in the shell, the one side of going up the board of giving vent to anger is facing to the board of giving vent to anger down, it has the public even gas board of going up to go up the board of giving vent to anger down to get away from the board side of giving vent to anger, go up and be equipped with a plurality of even gas holes on the public even gas board, go up public even gas board and the partial inner wall of shell and constitute public air cavity, go up the board of giving vent to anger down and constitute public air cavity down between the board, the board of giving vent to anger down has the cooling runner that equidistant set up, and the height of two adjacent cooling runners is different, and the cooling runner highly reduces gradually from the centre to both sides. Through such design, when guaranteeing the gaseous homogeneity that flows towards the reaction chamber, realize that the heat dissipation capacity of unit area equals, design the very even cooling runner of cooling, improve the reliability of shower head.

Description

Partition type spray header device for balanced heat dissipation
Technical Field
The application relates to the technical field of film material growth, in particular to a partition type spray header device for balanced heat dissipation.
Background
The equipment for preparing the semiconductor film material such as gallium nitride, silicon carbide or other materials is high-tech equipment integrating gas transportation, gas mixing, vacuum, high temperature, rotation and other technologies. The reaction gas flows over the surface of the substrate (i.e., substrate) heated to the reaction temperature and chemically reacts to form a single crystal thin film. In order to ensure the uniformity of the temperature and the airflow field of the substrate, the air inlet device needs to uniformly introduce the reaction gas into the reaction cavity, the bottom side of the reaction cavity is close to the top of the reaction cavity, the temperature of the reaction cavity is higher when the equipment operates, upward radiation reaches the lower part of the spray header, a cooling flow channel is usually arranged at the lower part of the spray header, the cooling flow channel is processed into a shape with equal section at present, and when in actual use, water flows of water channels are more, water flows of water channels are less, so that the cooling effect of the spray header is different, and the temperature uniformity is poor.
Therefore, there is a need to improve existing showerheads.
Disclosure of Invention
To overcome the above drawbacks, the object of the present application is: the partition type spray header device is compact in structure and uniform in cooling.
In order to achieve the above purpose, the present application adopts the following technical scheme:
the utility model provides a partition type shower head device of balanced heat dissipation which characterized in that includes:
a shell, an upper air outlet plate is arranged in the shell,
one side of the upper air outlet plate faces the lower air outlet plate,
an upper common air homogenizing plate is arranged on the side of the upper air outlet plate, which is far away from the lower air outlet plate, a plurality of air homogenizing holes are arranged on the upper common air homogenizing plate, an upper common air cavity is formed by the upper common air homogenizing plate and part of the inner wall of the shell,
a lower public air cavity is formed between the upper air outlet plate and the lower air outlet plate,
the lower air outlet plate is provided with cooling flow channels which are arranged at equal intervals, the heights of two adjacent cooling flow channels are different, and the heights of the cooling flow channels are gradually reduced from the middle to the two sides. Through such design, when guaranteeing the gaseous homogeneity that flows towards the reaction chamber, realize the heat dissipation volume of unit area and equal, the very even cooling runner of cooling. The temperature difference fluctuation is within + -3 ℃ when the temperature of the substrate is within a temperature range of 600 to 1680 ℃.
Preferably, the space between the upper common air homogenizing plate and the upper air outlet plate comprises:
a plurality of isolation rings for isolating a plurality of air inlet cavities, wherein the air inlet cavities sequentially comprise a circular inner ring air inlet cavity, at least one middle ring air inlet cavity and an outer ring air inlet cavity from inside to outside,
the areas of the upper air outlet plate, which are matched with the inner ring air inlet cavity, the middle ring air inlet cavity and the outer ring air inlet cavity, are provided with first air outlet holes which are connected with second air outlet holes of the lower air outlet plate through matched first air outlet pipes,
the cooling flow passage is positioned between two adjacent second air outlet holes.
Preferably, the partition type spray header device for balanced heat dissipation is characterized in that the height of the cooling flow channel gradually decreases from the center to the two sides.
Preferably, the cooling flow passage is at least partially inverted U-shaped or arched in cross-section.
Preferably, the partition type spray header device for balanced heat dissipation is characterized in that,
the second air outlet hole is internally embedded with a second air outlet pipe, and the first air outlet pipe extends downwards and is embedded into the second air outlet pipe.
Preferably, the partition type spray header device for balanced heat dissipation is characterized in that,
a middle ring air homogenizing ring is arranged in the middle ring air inlet cavity and is arranged on the upper public air homogenizing plate,
the outer ring air inlet cavity is internally provided with an outer ring air homogenizing ring, the outer ring air homogenizing ring and the middle ring air homogenizing ring are arranged on the same side, and the middle ring air homogenizing ring and the outer ring air homogenizing ring are respectively connected with a matched air inlet pipe.
Preferably, the partition type spray header device for balanced heat dissipation is characterized in that,
the outer side of the upper common air cavity is provided with a peripheral purging cavity.
Preferably, the partition type spray header device for balanced heat dissipation is characterized in that,
comprising the following steps: the lower common air homogenizing cavity is positioned at the outer sides of the upper common air cavity and the outer ring air inlet cavity, and the lower common air homogenizing cavity is positioned at the inner side of the peripheral purging cavity.
Preferably, the partition type spray header device for balanced heat dissipation is characterized in that the lower common air homogenizing cavity is communicated with the lower common air cavity through a perforation on the upper air outlet plate.
Preferably, the partition type spray header device for balanced heat dissipation is characterized by further comprising a heat insulation plate, wherein the heat insulation plate is arranged on the side, far away from the lower public air cavity, of the lower air outlet plate.
Advantageous effects
According to the partition type spray header device, the structure is optimized to improve the cooling uniformity of the spray header, so that the temperature of a gas outlet is uniform. The zoned spray header device has good cooling effect, so that the temperature uniformity of the substrate is very good, and the temperature difference fluctuation is within +/-3 ℃ in the temperature range of 600-1680 ℃, so that the thickness and doping uniformity are further improved.
Drawings
The accompanying drawings are included to provide an understanding of the technical aspects of the present disclosure, and are incorporated in and constitute a part of this specification, illustrate the technical aspects of the present disclosure and together with the embodiments of the disclosure, not to limit the technical aspects of the present disclosure. The shapes and sizes of the various components in the drawings are not to scale, and are intended to be illustrative only of the present application.
FIG. 1 is a schematic cross-sectional view of a zoned showerhead apparatus according to one embodiment of the present application;
FIG. 2 is an enlarged partial schematic view of FIG. 1 a;
FIG. 3 is a schematic view of the heat shield of FIG. 1;
FIG. 4 is a schematic cross-sectional view of a partitioned showerhead assembly according to another embodiment of the present application;
figure 5 is a schematic diagram of a cooling water path perspective of a partitioned showerhead assembly according to one embodiment of the present application,
figure 6 is a top cross-sectional view of a showerhead waterway of the partitioned showerhead assembly of figure 5,
figure 7 is a schematic view of the cooling flow path arrangement of figure 5,
fig. 8 is a schematic diagram of a cooling flow path length calculation of a partitioned showerhead apparatus of an embodiment of the present application.
Detailed Description
The above-described aspects are further described below in conjunction with specific embodiments. It should be understood that these examples are illustrative of the present application and are not limiting the scope of the present application. The implementation conditions employed in the examples may be further adjusted as in the case of the specific manufacturer, and the implementation conditions not specified are typically those in routine experiments.
The application provides a give vent to anger evenly and have balanced radiating subregion type shower head device, it includes: the shell is internally provided with an upper air outlet plate, one side of the upper air outlet plate faces the lower air outlet plate, the side, far away from the lower air outlet plate, of the upper air outlet plate faces the upper common air homogenizing plate, a plurality of air homogenizing holes are formed in the upper common air homogenizing plate, an upper common air cavity is formed between the upper air outlet plate and the lower air outlet plate, cooling flow channels are formed in the lower air outlet plate at intervals, and the heights of two adjacent cooling flow channels are different. Through the design to the cooling runner of subregion type shower head device, realize that the heat dissipation capacity of unit area equals, the cooling is very even. Therefore, the problem that the spray header is thermally deformed is avoided, meanwhile, the deposition of the lower part of the spray header is less, the spray header is required to be cleaned after continuously running for more than 200 cycles, and the utilization rate of equipment is greatly improved. Preferably, the partitioned shower head device includes: a housing, the housing comprising: the upper public air cavity comprises n partitioned air inlet cavities, a lower public air cavity, a lower public air homogenizing cavity, a peripheral purging cavity and pipelines which are connected with the cavities in a matching way; the number of the partitioned air inlet cavities depends on the size of the spray header and the required uniformity index, and the larger the diameter, the higher the required uniformity, the more the number of the air inlet cavities n.
The present application describes a partitioned showerhead assembly with balanced heat dissipation in conjunction with fig. 1-4 and taking 3 air inlet chambers as an example.
A partitioned showerhead apparatus 200 comprising: a housing 210, an upper air outlet plate 230 is disposed in the housing 210,
one side of the upper gas outlet plate 230 faces the lower gas outlet plate 220, one side of the upper gas outlet plate 230, which is far from the lower gas outlet plate 220, is provided with an upper common gas distribution plate 211a,
an upper common air chamber 211 is formed between the upper common air distribution plate 211a and the inner wall 210a of the housing 210, the ceiling of which is connected to an upper common air pipe (not shown),
a lower common air chamber 211b is formed between the upper air outlet plate 230 and the lower air outlet plate 220,
a plurality of air inlet cavities are arranged between the upper common air distribution plate 211a and the upper air outlet plate 230, the air inlet cavities are provided with an inner ring air inlet cavity 212, a middle ring air inlet cavity 213 and an outer ring air inlet cavity 215 from inside to outside, and the inner ring air inlet cavity 212, the middle ring air inlet cavity 213 and the outer ring air inlet cavity 215 are isolated by a isolating ring 214. In the present embodiment, the inner ring air intake chamber 212 is circular, and the middle ring air intake chamber 213 and the outer ring air intake chamber 215 are annular.
A peripheral purge chamber 219 is disposed outside the upper common air chamber and the outer ring air inlet chamber 215 (the total height of the upper common air chamber and the outer ring air inlet chamber 215 is the same or substantially the same as the height of the peripheral purge chamber 219 in the axial direction of the partitioned showerhead apparatus). Preferably, the outer sides of the upper common air chamber and the outer ring air inlet chamber 215 are further provided with a lower common air homogenizing chamber 218, and the common air homogenizing chamber 218 is positioned at the inner side of the peripheral purge chamber 219.
The inner ring air intake chamber 212 is connected to an inner ring air intake pipe 212a,
a middle ring air distribution ring 213b (also referred to as a middle ring air distribution groove 213 b) is disposed in the middle ring air inlet chamber 213, and the middle ring air distribution ring 213b is connected to the middle ring air inlet pipe 213a, and preferably, the middle ring air distribution ring is disposed on the upper common air distribution plate 211 a. An outer ring air homogenizing ring 215b (also referred to as an outer ring air homogenizing groove 215 b) is arranged on the outer ring air inlet cavity 215, and the outer ring air homogenizing ring 215b is connected with the outer ring air inlet pipe 215a. The uniformity of the inflow gas is further improved by the design of the middle ring gas equalizing ring 213b and the outer ring gas equalizing ring 215b. The middle ring air equalizing ring 213b is disposed on the same side as the outer ring air equalizing ring 215b. In other embodiments, the middle ring air balancing ring 213b and the outer ring air balancing ring 215b may be omitted.
In this embodiment, the upper common air distribution plate 211a has air distribution holes. Similarly, air holes are also arranged on the middle ring air homogenizing ring and the outer ring air homogenizing ring. The annular lower common air homogenizing cavity 218 is adjacent to the outer side of the outer ring air inlet cavity 215, the lower common air homogenizing cavity 218 (upper part) is connected with the lower common air pipe 218a, annular air homogenizing holes 218b (i.e. perforations) are uniformly distributed at the lower part, the air homogenizing holes 218b are communicated with the lower common air cavity 211b at the lower part, the outer side adjacent to the lower common air homogenizing cavity 218 is a peripheral purging cavity 219, the peripheral purging cavity 219 is connected with a peripheral air inlet pipe 219a, and the air outlet at the lower part of the peripheral purging cavity 219 is communicated with the hole 241 of the heat insulation plate 240, so that the purging gas enters the reaction cavity through the hole 241. Preferably, an air outlet pipe 219c is arranged at the lower part of the peripheral purging cavity 219, one side, close to the peripheral purging cavity 219, of the air outlet pipe 219c is provided with an air inlet 219b, the other side is connected with a uniform pressure pipe 219d, the uniform pressure pipe 219d is connected with a diffusion pipe 219e, and purge gas which does not participate in the reaction flows into the reaction cavity after being communicated with a hole 241 of the heat insulation plate 240 through the diffusion pipe 219 e.
The upper air outlet plate 230 matched with the lower sides of the inner ring air inlet cavity 212, the middle ring air inlet cavity 213 and the outer ring air inlet cavity 215 is provided with a plurality of first air outlet holes 231, the first air outlet holes 231 are internally provided with first air outlet pipes 222 in a matched mode, the lower air outlet plate 220 arranged on the lower side of the lower public cavity is provided with second air outlet holes 221a, and the first air outlet pipes 222 extend downwards and pass through the air outlet holes 221a to reach the bottom of the spray header and enter the reaction cavity (not shown) after passing through the holes 241. In one embodiment, the second air outlet pipe 221 is embedded in the air outlet hole 222a, and the first air outlet pipe 222 extends downward and goes deep into the second air outlet pipe 221. A heat shield 240 is provided under the lower gas outlet plate 220 to prevent the high temperature of a heater (not shown) from being directly radiated to the showerhead. When the partition type spray header device operates, reaction gas (carrier gas or protective gas, short for gas) flows into an upper public air cavity through an upper public air pipe 211a1, passes through an outer ring air inlet cavity, a middle ring air inlet cavity and an inner ring air inlet cavity, and then enters the reaction cavity through a heat insulation plate. The gas flows into the reaction cavity after passing through the inner ring air inlet cavity and the inner ring air inlet cavity, evenly flows into the small air outlet pipe and then flows into the reaction cavity after passing through the heat insulation plate. The middle-ring air inlet pipe flows into the middle-ring air inlet cavity after passing through the middle-ring air homogenizing ring, flows into the reaction cavity after passing through the small air outlet pipe after passing through the heat insulation plate after passing through the air homogenizing ring. The flow path of the gas flowing through the outer ring gas inlet pipe refers to the flow path of the inner ring gas inlet cavity. The gas flows into the peripheral purging cavity through the peripheral purging pipe, flows into the heat insulation plate through the annular air homogenizing holes and flows into the reaction cavity.
When the partition type spray header device (also called a spray header) is used for silicon carbide epitaxial equipment, the bottom side of the partition type spray header device is closely adjacent to the top of a reaction cavity, the temperature of the reaction cavity is higher when the equipment is in operation, a large amount of heat is radiated upwards to reach the lower part of the spray header, and an air outlet plate on the lower layer of the spray header is required to be cooled (such as water cooling) for heat dissipation. The lower layer plate is provided with the cooling flow channels, the cooling flow channels are positioned in the middle of every two exhaust holes, two ends of each cooling flow channel are converged through the water inlet channel 216 and the water return channel 217 and then are respectively connected with the matched water inlet pipe 216a and the water return pipe 217a, and the heat dissipation capacity of unit area is equal through structural optimization of the cooling flow channels.
The cooling flow path described above is described next in connection with figures 5-8 and with reference to figure 1,
cooling flow channels 223 are provided in the air outlet plate 220 at intervals. Preferably, the cooling flow channel 223 is located between every two exhaust holes 221a (for example, at the middle position between every two exhaust holes 221 a) or the cooling flow channel 223 is located between every two exhaust holes 221a and outside the outermost exhaust hole 221a, and two ends of the cooling flow channel 223 are respectively connected with the water return pipe 217a and the water inlet pipe 216 respectively and the water return pipe 217 respectively after converging, so as to realize cooling. A waterway separator 216b is disposed in the water inlet channel 216. In the present embodiment, the adjacent two cooling flow passages 223 are different in height. Therefore, the problems that the traditional cooling flow channel is usually processed into a shape with an equal section, water flows in some places are more and water flows in some places are less in actual use, so that the cooling effect of the spray header is different and the temperature consistency is poor are overcome. When the partition type spray header device of the cooling flow passage is used for silicon carbide epitaxial equipment, when the temperature of a tray in a reaction cavity is within a temperature range of 600-1680 ℃, the temperature uniformity of the lower surface of the spray header reaches +/-3 ℃ (some occasions even +/-1.5 ℃), so that the thickness and doping uniformity are further improved.
For this reason, in one embodiment, the height h of the cooling flow channels 223 is gradually reduced from inside to outside (i.e., the height is gradually reduced from the middle to the two sides, see fig. 7, and the height of the middle 2 cooling flow channels is gradually reduced to the two sides if the cooling flow channels are even numbers, and the height of the middle cooling flow channels is gradually reduced to the two sides if the cooling flow channels are odd numbers), so as to design a cooling flow channel with very uniform cooling (see fig. 5-8). The design ensures that the heat dissipation capacity of a unit area is kept equal, and meanwhile, the temperature rise of each cooling flow channel is equal (the uniformity of the spraying device is improved).
The following block diagrams fig. 5, 7 and 8 describe the design of the cooling flow channel according to the embodiment of the present application. The relationship among the length (L), the flow velocity (V) and the sectional area S of the cooling flow passage is: l=k·s·v, K being a fixed constant. Let the radius of the circle through which the cooling flow channels pass be r, the number of the cooling flow channels be n, and the cooling flow channel spacing be equal, the cooling flow channel spacing be r/n. In the case of odd n, the cooling flow channel from the center to one side edge is marked as p in turn 1， p 2 … pn (p when n is odd number) 1 In the middle and symmetrical on two sides), the length of the corresponding cooling flow channel is L in turn 1 ＝2·√(r2-(r/n)2)；L 2 ＝2·√(r2-(2r/n)2)；…Ln＝2·√
(r 2- (r.cndot. (n-1)/n) 2). The cooling of each area of the spray head cooled by the cooling device is the same (approximately the same), and the temperature uniformity is good. The problem that the spray header can generate thermal deformation is avoided, the deposition of the lower part of the spray header is less, the spray header needs to be cleaned after continuously running for more than 200 cycles, and the utilization rate is greatly improved.
The cooling channels in the above embodiments are sometimes referred to as cooling channels.
The foregoing embodiments are provided to illustrate the technical concept and features of the present application and are intended to enable those skilled in the art to understand the contents of the present application and implement the same according to the contents, and are not intended to limit the scope of the present application. All such equivalent changes and modifications as come within the spirit of the disclosure are desired to be protected.

Claims (10)

1. The utility model provides a partition type shower head device of balanced heat dissipation which characterized in that includes:
a shell, an upper air outlet plate is arranged in the shell,
one side of the upper air outlet plate faces the lower air outlet plate,
an upper common air homogenizing plate is arranged on the side of the upper air outlet plate, which is far away from the lower air outlet plate, a plurality of air homogenizing holes are arranged on the upper common air homogenizing plate, an upper common air cavity is formed by the upper common air homogenizing plate and part of the inner wall of the shell,
a lower public air cavity is formed between the upper air outlet plate and the lower air outlet plate,
the lower air outlet plate is provided with cooling flow channels which are arranged at equal intervals, the heights of two adjacent cooling flow channels are different, and the heights of the cooling flow channels are gradually reduced from the middle to the two sides.
2. The zoned showerhead apparatus of claim 1 wherein,
the upper common air homogenizing plate and the upper air outlet plate comprise:
a plurality of isolation rings for isolating a plurality of air inlet cavities, wherein the air inlet cavities sequentially comprise a circular inner ring air inlet cavity, at least one middle ring air inlet cavity and an outer ring air inlet cavity from inside to outside,
the areas of the upper air outlet plate, which are matched with the inner ring air inlet cavity, the middle ring air inlet cavity and the outer ring air inlet cavity, are provided with first air outlet holes which are connected with second air outlet holes of the lower air outlet plate through matched first air outlet pipes,
the cooling flow passage is positioned between two adjacent second air outlet holes.
3. The zone showerhead device for balanced heat dissipation according to claim 1 or 2, wherein the height of the cooling flow path is gradually lowered from the center to both sides.
4. The zoned showerhead means for balanced heat dissipation of claim 1 or 2,
the cross section of the cooling flow channel is at least partially in an inverted U shape or an arch shape.
5. The zoned showerhead means for balanced heat dissipation of claim 2,
the second air outlet hole is internally embedded with a second air outlet pipe, and the first air outlet pipe extends downwards and is embedded into the second air outlet pipe.
6. The zoned showerhead means for balanced heat dissipation of claim 2,
a middle ring air homogenizing ring is arranged in the middle ring air inlet cavity and is arranged on the upper public air homogenizing plate,
the outer ring air inlet cavity is internally provided with an outer ring air homogenizing ring, the outer ring air homogenizing ring and the middle ring air homogenizing ring are arranged on the same side, and the middle ring air homogenizing ring and the outer ring air homogenizing ring are respectively connected with a matched air inlet pipe.
7. The zoned showerhead means for balanced heat dissipation of claim 2,
the outer side of the upper common air cavity is provided with a peripheral purging cavity.
8. The zoned showerhead means for balanced heat dissipation of claim 7,
comprising the following steps: the lower common air homogenizing cavity is positioned at the outer sides of the upper common air cavity and the outer ring air inlet cavity, and the lower common air homogenizing cavity is positioned at the inner side of the peripheral purging cavity.
9. The zoned showerhead means for balanced heat dissipation of claim 8, wherein the lower common plenum communicates with the lower common plenum through perforations in the upper gas outlet plate.
10. The zoned showerhead apparatus of claim 1, further comprising a thermal shield disposed on a side of the lower gas outlet plate remote from the lower common gas cavity.
CN202111673940.3A 2021-12-31 2021-12-31 Partition type spray header device for balanced heat dissipation Pending CN116411342A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202111673940.3A CN116411342A (en) 2021-12-31 2021-12-31 Partition type spray header device for balanced heat dissipation

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202111673940.3A CN116411342A (en) 2021-12-31 2021-12-31 Partition type spray header device for balanced heat dissipation

Publications (1)

Publication Number Publication Date
CN116411342A true CN116411342A (en) 2023-07-11

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN202111673940.3A Pending CN116411342A (en) 2021-12-31 2021-12-31 Partition type spray header device for balanced heat dissipation

Country Status (1)

Country Link
CN (1) CN116411342A (en)

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