CN113862643A

CN113862643A - Atomic layer deposition device and flow uniformizing mechanism thereof

Info

Publication number: CN113862643A
Application number: CN202111097818.6A
Authority: CN
Inventors: 李翔; 袁红霞; 韩萍; 邹嘉宸; 左敏; 胡磊; 黎微明
Original assignee: Jiangsu Leadmicro Nano Technology Co Ltd
Current assignee: Jiangsu Leadmicro Nano Technology Co Ltd
Priority date: 2021-09-18
Filing date: 2021-09-18
Publication date: 2021-12-31

Abstract

The application discloses an atomic layer deposition device and a flow equalizing mechanism thereof, wherein the flow equalizing mechanism comprises a plurality of flow equalizing plates which are arranged in a stacked mode, a first opening is formed between every two adjacent flow equalizing plates, and the first opening is used for allowing air flow to flow in; each flow equalizing plate is provided with a first through hole which is communicated in the stacking direction, the first through holes form an accommodating space, the airflow can be deposited on the surface of a product to be coated in the accommodating space after flowing in through the first openings, and the flow equalizing plates and the product to be coated are positioned on the same plane. The atomic layer deposition device comprises a reaction cavity and the flow homogenizing mechanism, wherein the flow homogenizing mechanism is positioned in the reaction cavity. The application provides an atomic layer deposition device and even mechanism that flows thereof can improve the coating film homogeneity of treating the coating film product and reduce other reactions production of non-atomic layer deposition coating film.

Description

Atomic layer deposition device and flow uniformizing mechanism thereof

Technical Field

The application relates to the technical field of vacuum coating, in particular to an atomic layer deposition device and a uniform flow mechanism thereof.

Background

The Atomic Layer Deposition (ALD) technique is a thin film deposition technique based on surface chemical vapor reaction. The method is characterized in that more than two chemical gas precursors are separately introduced into a reaction cavity, so that each precursor respectively generates fully saturated surface chemical reaction on the surface of a substrate, and gas-phase reaction products and unreacted gas after the saturated surface reaction are purged completely, so that substances can be plated on the surface of the substrate in a monatomic film mode, and the thickness and uniformity of a deposited film are accurately controlled within the thickness range of an atomic layer. Unlike conventional thin film Deposition techniques, such as Physical Vapor Deposition (PVD), Chemical Vapor Deposition (Chemical Vapor Deposition), etc., ALD can form high quality, pinhole-free, conformal thin films on non-planar complex and three-dimensional structures. Atomic Layer Deposition (ALD) technology, one of the most advanced thin film deposition technologies, has been widely applied in advanced manufacturing industries of microelectronics, displays, MEMS, sensors, photovoltaic cells, and the like. For a semiconductor device, a thin film material prepared by atomic layer deposition, such as a high-dielectric-constant material of hafnium oxide, zirconium oxide and the like, can be used as a gate dielectric layer, so that the size of the device is reduced, the power consumption is reduced, and the performance of the device is improved.

However, in the long-term research and development process of the present application, the inventors found that when the ALD coating apparatus is used to coat the wafer, the uniformity of the wafer coating cannot meet the standard, that is, the film thickness of each part on the wafer surface cannot meet the design requirement.

Disclosure of Invention

The technical problem that this application mainly solved provides an atomic layer deposition device and even mechanism that flows thereof, can improve the coating film homogeneity of treating the coating film product and reduce other reactions production of non-atomic layer deposition coating film.

In order to solve the technical problem, the application adopts a technical scheme that: the flow equalizing mechanism of the atomic layer deposition device comprises a plurality of flow equalizing plates which are arranged in a stacked mode, wherein a first opening is formed between every two adjacent flow equalizing plates and is used for allowing gas to flow in; each flow equalizing plate is provided with a first through hole which is communicated in the stacking direction, the first through holes form an accommodating space, the airflow can be deposited on the surface of a product to be coated in the accommodating space after flowing in through the first openings, and the flow equalizing plates and the product to be coated are positioned on the same plane.

Further, the flow homogenizing plate comprises:

the plate body comprises a first side, a second side and a third side, wherein the first side and the second side are oppositely arranged, and the third side is positioned between the first side and the second side;

the extension part is arranged in a non-parallel mode with the plate body, and at least part of the first side and at least part of the second side are provided with the extension parts respectively; the adjacent flow equalizing plates are spaced by the extending part, and the first opening is formed between the third sides of the adjacent flow equalizing plates.

Furthermore, the third sides of the adjacent flow equalizing plates form an incident side, and the incident side is arranged opposite to the spraying plate at intervals; and the distances between each point on the incident flow side and the spray plate at the corresponding position are equal.

Further, in a direction perpendicular to the first side to the second side, the plate body comprises a first sub-plate body and a second sub-plate body which are arranged at intervals; the second sub-board body is positioned at the downstream of the first sub-board body in the airflow direction; the upstream end of the first sub-plate body is the third side, and the shape of the downstream end of the first sub-plate body and the shape of the upstream end of the second sub-plate body are both matched with the shape of the product to be coated.

Furthermore, each flow homogenizing plate is provided with a plurality of fixing holes, and the plurality of fixing holes on adjacent flow homogenizing plates are in one-to-one correspondence; the flow homogenizing mechanism further comprises a plurality of fixing shafts, the extending direction of the fixing shafts is parallel to the stacking direction, and the fixing shafts penetrate through fixing holes of all the flow homogenizing plates at corresponding positions.

Further, the thickness of the uniform flow plate is equal to that of the product to be coated.

In order to solve the above technical problem, another technical solution adopted by the present application is: provided is an atomic layer deposition apparatus including:

a reaction chamber;

the flow uniforming mechanism according to any one of the above embodiments, wherein the flow uniforming mechanism is located in the reaction chamber.

Further, the uniform flow mechanism comprises an incident flow side; the atomic layer deposition device also comprises a spraying plate, the spraying plate is opposite to the incident flow side and is arranged at intervals, and the spraying plate is used for injecting gas into the reaction cavity; the shower plate includes:

at least one main pipeline;

the extension direction of the branch pipeline is intersected with that of the main pipeline, the branch pipeline is communicated with the main pipeline, the diameter of the branch pipeline is smaller than or equal to that of the main pipeline, and the length of the branch pipeline is smaller than that of the main pipeline;

and the spraying holes are arranged on the branch pipelines and face the incident flow side.

Further, the spray plate comprises two main pipelines, and each main pipeline is connected with a plurality of branch pipelines; wherein different main pipelines are used for injecting different gases into the reaction cavity; the main pipeline is perpendicular to the branch pipelines.

Furthermore, the air outlet surface where the air outlet of the spraying hole is located is provided with a plurality of concave parts and convex parts, the outlet of the spraying hole is located in the concave parts and/or the convex parts, and the concave parts and the convex parts correspond to different gases; the radius of the spraying hole is gradually increased in the direction from the branch pipeline to the incident flow side.

Further, the atomic layer deposition apparatus further includes:

the multi-azimuth multi-zone heater is arranged outside the reaction cavity and is used for respectively controlling the temperatures of different positions of the reaction cavity so as to respectively heat the different positions of the reaction cavity to the respective required temperatures;

the placing part is arranged in the accommodating space and is used for placing the product to be coated;

and the power part is fixedly connected with the placing part and used for driving the placing part to rotate, and a rotating shaft of the placing part is vertical to the uniform flow plate.

Different from the prior art, the beneficial effects of the application are that:

the atomic layer deposition device and the flow equalizing mechanism thereof that this application embodiment provided, the range upon range of is provided with a plurality of flow equalizing plates, and flow equalizing plate and waiting to coat film product and be located the coplanar, can make the air current evenly distributed between the flow equalizing plate. Each flow equalizing plate is provided with a first through hole which is communicated in the stacking direction, and the first through holes form an accommodating space, so that a plurality of products to be coated can be accommodated for coating. A first opening is arranged between the adjacent flow equalizing plates and used for allowing air flow to flow in, and the air flow can be deposited on the surface of a product to be coated in the accommodating space after flowing in through the first opening. The atomic layer deposition device and the uniform flow mechanism thereof can also reduce other reactions of the non-atomic layer deposition coating film.

The uniform flow mechanism has uniform flow effect on the air flow, for example, uniform effect on the speed and direction of the air flow, so that the uniformity of the film coating can be improved, and the film thickness of each part of the surface of a product to be coated can meet the requirement. The uniform flow plate can change the cross section shape of the process surface in the reaction cavity and the distribution of the contact surface of the uniform flow plate and the incoming flow, so that the uniform flow plate better meets the requirement of uniform flow field. On the surface of the product to be coated, the flow equalizing plate can keep the pneumatic resistance between the spraying surface and the airflow discharging surface to the maximum extent, the change is consistent, the interference of the shape of the product to be coated and the shape of the inner wall of the reaction cavity on the airflow flow is overcome, and therefore a uniform flow field is obtained on the surface of the product to be coated.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts. Wherein:

fig. 1 is a schematic structural diagram of a uniform flow mechanism of an atomic layer deposition apparatus according to an embodiment;

fig. 2 is a schematic structural diagram of a first sub-board body according to the present embodiment;

fig. 3 is a schematic structural diagram of a second sub-board body according to the present embodiment;

fig. 4 is a schematic structural diagram of a first atomic layer deposition apparatus according to the present embodiment;

fig. 5 is a schematic structural view of a first shower plate provided in the present embodiment;

FIG. 6 is a screenshot of plane E-E of FIG. 5;

fig. 7 is a schematic view of an air inlet structure of a shower plate provided in the present embodiment;

fig. 8 is a schematic view of another shower plate air intake structure provided in the present embodiment;

fig. 9 is a schematic structural view of a second shower plate provided in the present embodiment;

FIG. 10 is a sectional view of the F-F surface of FIG. 9;

fig. 11 is a schematic view of a first shower plate air outlet structure provided in this embodiment;

fig. 12 is a schematic view of a second shower plate gas outlet structure provided in this embodiment;

fig. 13 is a schematic view of an air outlet structure of a third spray plate provided in this embodiment;

fig. 14 is a schematic view of a fourth shower plate gas outlet structure provided in this embodiment;

fig. 15 is a schematic structural view of a spray hole provided in the present embodiment;

fig. 16 is a schematic structural view of a third shower plate provided in the present embodiment;

fig. 17 is a schematic structural view of a fourth shower plate provided in the present embodiment;

fig. 18 is a schematic structural view of a second atomic layer deposition apparatus according to the present embodiment;

FIG. 19 is a schematic structural view of a first pumping spacer according to the present embodiment;

FIG. 20 is a schematic structural view of a second pumping spacer provided in the present embodiment;

FIG. 21 is a schematic view of a third pumping pad provided in the present embodiment;

fig. 22 is a schematic structural view of a third atomic layer deposition apparatus according to the present embodiment;

fig. 23 is a schematic structural view of an upper heater provided in the present embodiment;

fig. 24 is a schematic structural view of a fourth atomic layer deposition apparatus according to this embodiment.

Description of reference numerals:

1. a flow uniformizing mechanism; 101. the upstream side; 102. a flow homogenizing plate; 103. a first opening; 104. a first through hole; 105. a plate body; 106. a first side; 107. a second side; 108. a third side; 109. a fourth side; 110. an extension portion; 111. a fixing hole; 112. a fixed shaft; 113. a first sub-board body; 114. a second sub-board body;

2. a spray plate; 21. a main pipeline; 22. a branch pipeline; 23. spraying holes; 231. an air outlet; 232. a cylindrical section; 233. a circular table section; 24. a gas outlet surface; 241. a recess; 242. a convex portion;

3. a reaction chamber;

4. a placement section; 41. a tray; 42. a bellows; 43. a chuck; 44. a direction adjustment assembly;

5. an air exhaust pipe;

6. an air exhaust gasket; 61. a second through hole;

7. a multi-azimuth multi-zone heater; 71. an upper heater; 72. a bottom heater; 73. a left heater; 74. a right heater; 75. a front heater; 76. a placing section heater;

8. a power member;

9. and (5) products to be coated.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

It will be understood that when an element is referred to as being "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only and do not represent the only embodiments.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

Please refer to fig. 1 to 3. The embodiment of the present application provides a flow equalizing mechanism 1 of an atomic layer deposition apparatus, which includes a plurality of flow equalizing plates 102 arranged in a stacked manner. A first opening 103 is provided between adjacent flow equalizing plates 102 for the inflow of the air flow. Each of the uniform flow plates 102 is provided with a first through hole 104 penetrating in the stacking direction, and the first through hole 104 forms an accommodating space. The airflow can be deposited on the surface of the product 9 to be coated in the accommodating space after flowing in through the first opening 103. The flow equalizing plate 102 and the product 9 to be coated are positioned on the same plane. The product 9 to be coated may be a wafer or other product, which is not limited in this application.

The atomic layer deposition device and the flow equalizing mechanism 1 thereof provided by the embodiment of the application are provided with the plurality of flow equalizing plates 102 in a stacked manner, and the flow equalizing plates 102 and the product 9 to be coated are located on the same plane, so that the air flow among the flow equalizing plates 102 can be uniformly distributed. Each flow equalizing plate 102 is provided with a first through hole 104 which penetrates in the laminating direction, and the first through holes 104 form an accommodating space so as to accommodate a plurality of products to be coated 9 for coating. A first opening 103 is arranged between the adjacent flow equalizing plates 102 for air flow to flow in, and the air flow can be deposited on the surface of the product 9 to be coated in the accommodating space after flowing in through the first opening 103. The atomic layer deposition device and the uniform flow mechanism 1 thereof can also reduce other reactions of non-atomic layer deposition coating.

The uniform flow mechanism 1 has a uniform flow effect on the air flow, for example, uniform effects on the speed and direction of the air flow, so that the uniformity of the film coating can be improved, and the film thickness of each part on the surface of the product 9 to be coated can meet the requirements. The uniform flow plate 102 can change the cross-sectional shape of the process surface in the reaction chamber 3 and the contact surface distribution with the incoming flow, so that the uniform flow field requirement can be better met. On the surface of the product 9 to be coated, the flow equalizing plate 102 can keep the pneumatic resistance between the spraying surface and the airflow discharging surface uniform and consistent to the maximum extent, and overcomes the interference of the shape of the product 9 to be coated and the shape of the inner wall of the reaction chamber 3 on the airflow flow, thereby obtaining a uniform flow field on the surface of the product 9 to be coated.

In addition, the uniform flow mechanism 1 can improve the uniformity of the temperature in the reaction chamber 3 of the atomic layer deposition device. When the flow uniformizing mechanism 1 provided by the embodiment of the application is applied to the reaction chamber 3 with a smaller volume, the flow uniformizing effect is more remarkable.

In this embodiment, as shown in fig. 1, the flow distribution plate 102 may include a plate body 105 and an extension 110. The plate body 105 includes a first side 106 and a second side 107 disposed opposite to each other, and a third side 108 located between the first side 106 and the second side 107. The extension 110 is disposed non-parallel to the plate body 105, and at least a portion of the first side 106 and at least a portion of the second side 107 are respectively provided with the extension 110. The adjacent flow distribution plates 102 are spaced apart by the extension 110, and the first opening 103 is formed between the third sides 108 of the adjacent flow distribution plates 102.

Preferably, the extension 110 is perpendicular to the plate body 105, and the distance between the flow distribution plates 102 is equal to the height of the extension 110.

In this embodiment, a fourth side 109 is further provided between the first side 106 and the second side 107, and the fourth side 109 and the third side 108 are oppositely disposed. The third sides 108 of the adjacent flow equalization plates 102 form the incident flow sides 101, and the incident flow sides 101 are arranged opposite to the spray plates 2 at intervals, so that space is provided for mixing and reacting of the air flow. The fourth sides 109 of the adjacent flow equalizing plates 102 form a back flow side, and a second opening is formed between the fourth sides 109 of the adjacent flow equalizing plates 102, and the second opening faces the pumping hole, and the pumping hole is used for exhausting the excessive gas flow out of the reaction chamber 3 of the atomic layer deposition apparatus.

Preferably, the distances between each point on the incident flow side 101 and the corresponding spray plate 2 are equal, that is, the shape of the incident flow side 101 and the shape of the spray surface of the spray plate 2 are consistent, so that the air flow entering the first opening 103 is more uniform. In a specific embodiment, the surface of shower plate 2 facing incident flow side 101 (i.e., the shower face) is planar, as is incident flow side 101.

In a preferred embodiment, the flow distribution plate 102 is perpendicular to the shower plate 2, and the third side 108 of the flow distribution plate 102 is kept at a predetermined distance from the shower plate 2. The smaller the distance between the first side 106, the second side 107, and the fourth side 109 of the flow equalizing plate 102 and the wall of the reaction chamber 3 of the ald apparatus, the better. The outer profile of the flow distribution plate 102 can be designed according to the structure of the reaction chamber 3 and the shower plate 2.

As shown in fig. 2 and 3, the plate body 105 includes a first sub-plate body 113 and a second sub-plate body 114 which are arranged at intervals in a direction perpendicular to the first side 106 to the second side 107. In the direction of the air flow, the second sub-plate body 114 is located downstream of the first sub-plate body 113. The upstream end of the first sub-plate body 113 is the third side 108. The downstream end of the second sub-board body 114 is a fourth side 109. The shape of the downstream end of the first sub-plate body 113 and the shape of the upstream end of the second sub-plate body 114 are both matched with the shape of the product 9 to be coated, and the downstream end of the first sub-plate body 113 and the upstream end of the second sub-plate body 114 jointly form a first through hole 104. For example, when the product 9 to be coated is circular, the downstream end of the first sub-plate 113 and the upstream end of the second sub-plate 114 are both arc-shaped; when the product 9 to be coated is square, the downstream end of the first sub-plate 113 and the upstream end of the second sub-plate 114 are both square. Of course, the product 9 to be coated may have different shapes, and the downstream end of the first sub-plate body 113 and the upstream end of the second sub-plate body 114 change shapes correspondingly.

In a specific embodiment, the downstream end of the first sub-plate body 113 and the upstream end of the second sub-plate body 114 are both arc-shaped, and are close to and similar to the shape of the product 9 to be coated, and preferably, the downstream end of the first sub-plate body 113 and the upstream end of the second sub-plate body 114 are both semi-circles, and the radius is slightly larger than the radius of the product 9 to be coated.

In other embodiments, the flow distribution plate 102 can be fixed on the wall of the reaction chamber 3 by welding or slot, or the flow distribution plate 102 can be integrated with the reaction chamber 3, and the flow distribution plate 102 and the reaction chamber 3 are integrally formed. Specifically, the first side 106 and the second side 107 of the flow equalizing plate 102 are welded to the wall surface of the reaction chamber 3, or a plurality of grooves are formed in the wall surface of the reaction chamber 3, and the first side 106 and the second side 107 of the flow equalizing plate 102 can be inserted into the grooves to fix the flow equalizing plate 102. The present application is not limited solely to the fixed configuration of the plurality of uniform flow plates 102.

As shown in fig. 1, in the present embodiment, each flow distribution plate 102 may be provided with a plurality of fixing holes 111, and the plurality of fixing holes 111 on adjacent flow distribution plates 102 correspond to each other one by one. The flow uniforming mechanism 1 may further include a plurality of fixed shafts 112, and an extending direction of the fixed shafts 112 is parallel to the stacking direction. The fixing shaft 112 penetrates through the fixing holes 111 of all the flow equalizing plates 102 at the corresponding positions, so that the fixing shaft 112 is utilized to support each flow equalizing plate 102.

In the present embodiment, the flow equalizing plates 102 are parallel to the products to be coated 9, and each product to be coated 9 and the corresponding flow equalizing plate 102 are located on the same plane in the direction perpendicular to the stacking direction. The thickness of the flow equalizing plate 102 is the same as or equal to that of the product 9 to be coated, so that the coating uniformity can be better ensured. The material of the flow distribution plate 102 is a material that does not interfere with the atomic layer deposition reaction, and may be, for example, stainless steel. The material of the uniform flow plate 102 is not limited solely by the present application. The size of the uniform flow plate 102 is related to the size and spatial arrangement of the spray holes 23 and the size and spatial arrangement of the second through holes 61 of the pumping spacer 6, which will be described later.

As shown in fig. 4, the present application also provides an atomic layer deposition apparatus including a reaction chamber 3 and a uniform flow mechanism 1. The flow uniforming mechanism 1 may be the flow uniforming mechanism 1 in any one of the above embodiments, and the flow uniforming mechanism 1 is located in the reaction chamber 3.

In this embodiment, the embodiment of the atomic layer deposition apparatus corresponds to the embodiment of the uniform flow mechanism 1, which can achieve the technical problem solved by the embodiment of the uniform flow mechanism 1, and accordingly achieve the technical effect of the embodiment of the uniform flow mechanism 1, and detailed descriptions of this application are omitted here.

In the present embodiment, the atomic layer deposition apparatus further includes a spraying plate 2, and the spraying plate 2 is disposed opposite to and spaced apart from the incident flow side 101 of the uniform flow mechanism 1, so as to provide a space for mixing and reacting the gas flow. The shower plate 2 is used to inject gas into the reaction chamber 3. The shape of the shower plate 2 is not limited in the present application, and may be, for example, a square, a circle, an ellipse, a triangle, or the like.

In one embodiment, a square shower plate 2 may be used. As shown in fig. 16, the shower plate 2 adopts a lateral structure; as shown in fig. 17, the shower plate 2 adopts a vertical structure. The transverse structure is convenient for adjusting the transverse spacing of the spraying holes 23, the vertical structure is convenient for adjusting the vertical spacing of the spraying holes 23, and the two spraying plates 2 respectively have corresponding advantages according to the condition of a flow field in the reaction cavity 3.

As shown in fig. 5 and 6, the shower plate 2 may include at least one main pipe 21, at least one branch pipe 22, and a plurality of shower holes 23. The extending direction of the branch pipes 22 intersects with the extending direction of the main pipe 21, and the branch pipes 22 communicate with the main pipe 21. The diameter of the branch pipeline 22 is smaller than or equal to the diameter of the main pipeline 21, and the length of the branch pipeline 22 is smaller than that of the main pipeline 21. The spraying holes 23 are arranged on the branch pipelines 22, and the spraying holes 23 face the incident flow side 101 of the uniform flow mechanism 1. The main pipeline 21 has a larger pipe diameter, so that the pressure difference change in the main pipeline 21 can be reduced; the branch pipes 22 are shorter, so that the pressure difference of the gas entering the spraying holes 23 is reduced, and the gas is distributed in the spraying holes 23 more uniformly.

Preferably, the main conduit 21 is perpendicular to the branch conduits 22. As shown in fig. 7, the shower plate 2 includes two main pipes 21, and a plurality of branch pipes 22 are connected to each main pipe 21. Different main lines 21 are used to inject different gases into the reaction chamber 3. The two main pipelines 21 are positioned on two long edges of the spray plate 2, and the branch pipelines 22 communicated with different main pipelines 21 are designed symmetrically or in a cross mode at two ends. In one embodiment, the branch pipes 22 of the two main pipes 21 are distributed across the shower plate 2.

The spray plate 2 provided by the embodiment can effectively improve the distribution of two reaction gases, so that the gas distribution through the spray plate 2 is more uniform, and the uniformity of the surface coating of the product 9 to be coated is improved. Specifically, the spray plate 2 provided by the embodiment enables the air flow in the reaction chamber 3 to achieve the effect of uniform distribution in the horizontal and vertical directions, optimizes the spatial uniformity of the air in the reaction chamber 3, and significantly improves the uniformity between the product 9 to be coated and the product 9 to be coated.

In another embodiment, as shown in fig. 8, the shower plate 2 includes four main pipes 21, wherein each two main pipes 21 form a group. Two main pipelines 21 in the same group are positioned on two long edges of the spray plate 2, and a plurality of branch pipelines 22 with two ends respectively communicated with the two main pipelines 21 are arranged between the two main pipelines 21 in the same group. The two main pipelines 21 are located on different planes, and thus the two branch pipelines 22 are also located on different planes, so that the spray plate 2 has two layers of air inlet planes, and the two layers of air inlet planes are used for injecting different gases into the reaction chamber 3. In this embodiment, the gas is simultaneously supplied from both ends of the branch pipe 22, and the spraying holes 23 are distributed on the two gas supply planes, so that the pressure distribution on the branch pipe 22 and the distribution of the gas in the reaction chamber 3 can be further equalized.

It should be noted that when the shower plate 2 has two air inlet planes, a double layer shower plate 2 may be provided. The spray plate 2 in the embodiment of the present application includes, but is not limited to, a plate-shaped spray plate 2 connected to an external pipe, or a pure pipe welded structure.

In the present embodiment, as shown in fig. 9 and 10, the air outlet surface 24 where the air outlets 231 of the shower holes 23 are located has a plurality of concave portions 241 and convex portions 242, that is, the surface of the shower plate 2 facing the upstream side 101 has a wave-like, saw-like, or city-wall tooth-like wave-trough structure. The air outlet 231 of the shower hole 23 is provided to the concave portion 241 and/or the convex portion 242. The concave portion 241 and the convex portion 242 may correspond to different gases. The structure of the air outlet surface 24 of the spray plate 2 is designed into a wave shape, and the spray plate has a good improvement effect on middle areas which are not easy to sweep and clean, such as a no-flow area, a slow flow area and the like. Meanwhile, the accumulation of the gas source on the surface of the spray plate 2 can be reduced, the pre-reaction area can be increased, and the uniformity is improved. The structure obviously improves the air flow distribution condition of the spray plate 2 near the wall surface, strengthens the purging of the gas near the wall surface, reduces the chemical vapor deposition reaction of the spray plate 2 near the wall surface, reduces the generation of particles and obviously improves the batch process yield.

In one embodiment, as shown in fig. 11, the gas outlets 231 of the two kinds of gas spraying holes 23 are disposed in the concave portion 241, so as to improve the purging in the no-flow region and the slow-flow region. In another embodiment, as shown in fig. 12, the gas outlets 231 of the two kinds of gas spray holes 23 may be both disposed at the convex portion 242.

In one embodiment, as shown in fig. 13, the gas outlets 231 of the spraying holes 23 of one gas are disposed in the convex portion 242, the gas outlets 231 of the spraying holes 23 of the other gas are disposed in the concave portion 241, the gas inlet planes of the two gases are the same plane, and the lengths of the spraying holes 23 of the two gases are different. Therefore, the accumulation of the air source at the vortex can be improved, and the air source which is high in viscosity and not easy to diffuse can be purged more cleanly.

In another embodiment, as shown in fig. 14, the gas outlets 231 of the spraying holes 23 of one gas are disposed in the convex portion 242, the gas outlets 231 of the spraying holes 23 of the other gas are disposed in the concave portion 241, the gas inlet planes of the two gases are different, and the lengths of the spraying holes 23 of the two gases are the same.

In the present embodiment, as shown in fig. 15, the radius of the shower hole 23 gradually increases in the direction from the branch pipe 22 to the incident flow side 101. That is, the spray holes 23 are substantially trumpet-shaped or chamfered, and the expanding angle and the chamfering depth can be adjusted to adjust the air outlet resistance and angle. Of course, the chamfer that sprays hole 23 is not limited to for structures such as circular chamfer, arc chamfer, and this application does not do the restriction to the size, the spatial arrangement that spray 2 holes, does not do special restriction to shape, size and the position of shower hole gas outlet 231 yet, can adjust as required.

More specifically, the spray holes 23 have a cylindrical section 232 and a frustoconical section 233. The cylindrical section 232 is proximate to the branch conduit 22, and the diameter D of the cylindrical section 232 may be 0.5mm, 0.65mm, 0.8mm, 1mm, or 1.2mm, etc. The circular truncated cone 233 is close to the upstream side 101, and its diameter gradually increases in the direction from the branch pipe 22 to the upstream side 101. As shown in fig. 15, the included angle a between two opposite sides of the circular truncated cone 233 in the cross section may be 12 °, 13 °, 14 °, 15 °, or the like. By adjusting the diameter D and the included angle A, the uniformity of the flow field of the gas in the spray plate 2 after entering the reaction chamber 3 can be further ensured, so that the coating uniformity of the product 9 to be coated is improved.

In this embodiment, as shown in fig. 18, the atomic layer deposition apparatus may further include a placement section 4, an evacuation tube 5, and an evacuation pad 6. Different gases flow in from the spray plate 2 and enter the reaction chamber 3, and the ALD coating passivation process is carried out on the surface of the product 9 to be coated.

Specifically, an exhaust gasket 6 is provided between the exhaust tube 5 and the reaction chamber 3. The air-extracting gasket 6 is provided with a second through hole 61 for air to flow out of the reaction chamber 3. The second through hole 61 may have different shapes and sizes, and the second through hole 61 is matched with the back flow side (i.e. the fourth side 109) of the uniform flow mechanism 1, so that the flow field and the flow rate of the gas in the reaction chamber 3 can be adjusted when the pumping tube 5 pumps the gas. As shown in fig. 19, the second through hole 61 is elongated; as shown in fig. 20, the second through hole 61 is circular and small in size, and is located substantially above the pumping spacer 6; as shown in fig. 21, the second through hole 61 is circular and large in size, and is concentric with the outer contour of the pumping pad 6.

In this embodiment, as shown in fig. 22, the ald apparatus may further include a multi-directional multi-zone heater 7 disposed outside the reaction chamber 3 for controlling the temperatures of different positions of the reaction chamber 3, so as to heat the different positions of the reaction chamber 3 to the respective required temperatures.

The multi-azimuth multi-zone heater 7 may include an upper heater 71, a bottom heater 72, a left heater 73, a right heater 74, a front heater 75, and a placing section heater 76, which heat the corresponding positions, respectively. Each heater can be adjusted to be a multi-zone heater with different orientations according to the temperature field distribution of the reaction chamber 3, so that the thermal field distribution of the reaction chamber 3 is uniform.

As shown in fig. 23, it is a schematic structural view of the upper heater 71. Wherein the area of the line B is the first area, and the area of the line C is the second area. Depending on the desired temperature profile of the reaction chamber 3, a plurality of heating zones may be distributed over each heater.

In the present embodiment, as shown in fig. 24, a placing part 4 is provided in the accommodating space of the reaction chamber 3 for placing the product 9 to be coated. The placing part 4 is fixedly connected with a power piece 8. The power part 8 is used for driving the placing part 4 to rotate, so that the problem that the coating of the product 9 to be coated is not uniform in the upstream and downstream of the airflow can be solved, and the uniformity of the coating can be effectively improved. The rotation axis of the placing section 4 is perpendicular to the flow equalizing plate 102.

Specifically, the placing section 4 may include a tray 41, a bellows 42, a chuck 43, and a direction adjustment assembly 44. Wherein the tray 41 is located in the accommodating space of the reaction chamber 3 and is used for placing the product 9 to be coated. A chuck 43 is positioned below the tray 41, and the chuck 43 is connected to the tray 41 at one end and to a direction adjustment assembly 44 at the other end. The bellows 42 is sleeved outside the chuck 43. The direction adjustment assembly 44 can adjust the direction of the tray 41 on the horizontal plane so that it is just inside the accommodation space and does not contact the flow equalization plate 102. The power member 8 may be a rotary motor and is located below the direction regulating assembly 44 of the placing section 4.

The atomic layer deposition device and the uniform flow mechanism 1 thereof can be applied to an atomic layer deposition machine table, are particularly suitable for coating films on 12-inch wafers, and can also be applied to semiconductor chip manufacturing plants. The atomic layer deposition device and the uniform flow mechanism 1 thereof can improve the coating uniformity of the product 9 to be coated, have stable performance and longer service life, and have the advantages of energy conservation and cost reduction.

It should be noted that, in the description of the present specification, the terms "first", "second", and the like are used for descriptive purposes only and for distinguishing similar objects, and no order is present therebetween, and no indication or suggestion of relative importance is to be made. Further, in the description of the present specification, "a plurality" means two or more unless otherwise specified.

The use of the terms "comprising" or "including" to describe combinations of elements, components, or steps herein also contemplates embodiments that consist essentially of such elements, components, or steps. By using the term "may" herein, it is intended to indicate that any of the described attributes that "may" include are optional.

A plurality of elements, components, parts or steps can be provided by a single integrated element, component, part or step. Alternatively, a single integrated element, component, part or step may be divided into separate plural elements, components, parts or steps. The disclosure of "a" or "an" to describe an element, ingredient, component or step is not intended to foreclose other elements, ingredients, components or steps.

The above description is only for the purpose of illustrating embodiments of the present application and is not intended to limit the scope of the present application, and all modifications of equivalent structures and equivalent processes, which are made by the contents of the specification and the drawings of the present application or are directly or indirectly applied to other related technical fields, are also included in the scope of the present application.

Claims

1. The flow equalizing mechanism of the atomic layer deposition device is characterized by comprising a plurality of flow equalizing plates which are arranged in a stacked mode, wherein a first opening is formed between every two adjacent flow equalizing plates and is used for allowing air flow to flow in; each flow equalizing plate is provided with a first through hole which is communicated in the stacking direction, the first through holes form an accommodating space, the airflow can be deposited on the surface of a product to be coated in the accommodating space after flowing in through the first openings, and the flow equalizing plates and the product to be coated are positioned on the same plane.

2. The flow homogenizing mechanism of claim 1, wherein the flow homogenizing plate comprises:

3. The flow homogenizing mechanism of claim 2,

the third sides of the adjacent flow equalizing plates form incident sides which are used for being arranged at intervals relative to the spraying plates; and the distances between each point on the incident flow side and the spray plate at the corresponding position are equal.

4. The flow homogenizing mechanism of claim 2,

in the direction perpendicular to the first side and the second side, the plate body comprises a first sub-plate body and a second sub-plate body which are arranged at intervals; the second sub-board body is positioned at the downstream of the first sub-board body in the airflow direction; the upstream end of the first sub-plate body is the third side, and the shape of the downstream end of the first sub-plate body and the shape of the upstream end of the second sub-plate body are both matched with the shape of the product to be coated.

5. The flow homogenizing mechanism of claim 1,

a plurality of fixing holes are formed in each flow homogenizing plate, and the plurality of fixing holes in adjacent flow homogenizing plates correspond to one another one by one; the flow homogenizing mechanism further comprises a plurality of fixing shafts, the extending direction of the fixing shafts is parallel to the stacking direction, and the fixing shafts penetrate through fixing holes of all the flow homogenizing plates at corresponding positions.

6. The flow distributing mechanism of claim 1, wherein the thickness of the flow distributing plate is equal to the thickness of the product to be coated.

7. An atomic layer deposition apparatus, comprising:

a reaction chamber;

the flow uniforming mechanism of any one of claims 1-6, located within the reaction chamber.

8. The atomic layer deposition apparatus according to claim 7, wherein the flow evening mechanism comprises an incident flow side; the atomic layer deposition device also comprises a spraying plate, the spraying plate is opposite to the incident flow side and is arranged at intervals, and the spraying plate is used for injecting gas into the reaction cavity; the shower plate includes:

at least one main pipeline;

9. The atomic layer deposition apparatus according to claim 8,

the spraying plate comprises two main pipelines, and each main pipeline is connected with a plurality of branch pipelines; wherein different main pipelines are used for injecting different gases into the reaction cavity; the main pipeline is perpendicular to the branch pipelines;

the gas outlet surface where the gas outlet of the spraying hole is located is provided with a plurality of concave parts and convex parts, the outlet of the spraying hole is located in the concave parts and/or the convex parts, and the concave parts and the convex parts correspond to different gases; the radius of the spraying hole is gradually increased in the direction from the branch pipeline to the incident flow side.

10. The atomic layer deposition apparatus according to claim 7, further comprising: