CN114171437A - Cooling device of semiconductor process chamber and semiconductor process chamber - Google Patents
Cooling device of semiconductor process chamber and semiconductor process chamber Download PDFInfo
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- CN114171437A CN114171437A CN202111451406.8A CN202111451406A CN114171437A CN 114171437 A CN114171437 A CN 114171437A CN 202111451406 A CN202111451406 A CN 202111451406A CN 114171437 A CN114171437 A CN 114171437A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
Abstract
The invention provides a cooling device of a semiconductor process chamber and the semiconductor process chamber, wherein the cooling device is used for cooling the top wall of a cavity, a fixing plate is connected with the cavity and arranged opposite to the top wall of the cavity to form an accommodating space for installing cooling pipelines, and a plurality of through holes which are connected with air inlets of the plurality of cooling pipelines in a one-to-one correspondence manner are arranged; the top wall of the cavity of the blocking component is divided into a middle cooling area and an edge cooling area, the accommodating space is divided into a middle cooling space and an edge cooling space, and a plurality of cooling pipelines are arranged in the edge cooling space at intervals; one end of the cooling pipeline is connected with the fixing plate and is provided with a main pipeline extending along the radial direction of the top wall of the cavity, and the pipe wall of the main pipeline is provided with an air outlet which faces the top wall of the cavity and has an interval with the top wall of the cavity. The cooling device of the semiconductor process chamber and the semiconductor process chamber provided by the invention can improve the cooling effect of the semiconductor process chamber, thereby reducing the influence on heat source reflection of the semiconductor process chamber and prolonging the service life of the semiconductor process chamber.
Description
Technical Field
The invention relates to the technical field of semiconductor equipment, in particular to a cooling device of a process chamber and the process chamber.
Background
In a Chemical Vapor Deposition (CVD) process, the temperature in a process chamber can reach about 1100 ℃, and therefore, the process chamber needs to be made of quartz to provide a temperature environment required by the process, and gold is plated on the outer surface of transparent quartz to reflect a heat source into the process chamber by means of the gold plating layer, so that the heat source reflectivity is increased, and the temperature in the process chamber can be maintained in a temperature range required by the process, and metal fixing structures such as a rack and a transmission structure outside the process chamber are difficult to bear the high temperature, so that the outside of the process chamber needs to be cooled.
As shown in fig. 8, a conventional cooling method for the outside of the process chamber is to provide a cooling device 6 on the top of the process chamber, wherein the cooling device 6 conveys cold air from two opposite sides of the top of the process chamber to the middle, and the top of the process chamber is further provided with a cofferdam 7, and the cold air flows from the edge of the cofferdam 7 to the arc top of the cofferdam 7 along the arc line of the cofferdam 7 (as shown by the arrow in fig. 8), so as to cool the outer edge of the top of the process chamber. However, the cold air can flow oppositely from two sides to the middle, and because the flowing distance is long and the area is large, when the cold air flows to the middle of the process chamber, the temperature of the cold air is increased, and the air speed is reduced, so that the cooling effect of the cold air on the middle of the process chamber is weakened, the external cooling of the process chamber is not uniform, and, since the edges of cofferdam 7 have corners where the cold wind flows with low wind velocity (as shown by area P in fig. 8), the cold wind has a poor cooling effect on the corner areas, and, because the wind speed of the cold air in the arc top area (shown as an area Q in fig. 8) of the cofferdam 7 is low, and the cold air is blocked by the arc-shaped cofferdam 7, the wind direction of the cold air reaching the arc top area changes, so that the cold air may not reach the arc top area of the cofferdam 7, and the cooling effect of forming a 'dead zone' in the corner area and the arc top area of the cofferdam 7 is poor. In practical application, the gold plating layer of the process chamber is cracked or even falls off due to uneven cooling outside the process chamber, the gold plating layer of the corner area and the arc top area of the cofferdam 7 is easy to fall off due to poor cooling effect of the corner area and the arc top area of the cofferdam 7, and the gold plating layer in the middle of the process chamber falls off firstly due to poor cooling effect in the middle of the process chamber, so that the heat source reflection effect and the service life of the process chamber are affected.
Disclosure of Invention
The invention aims to at least solve one of the technical problems in the prior art, and provides a cooling device of a semiconductor process chamber and the semiconductor process chamber, which can improve the cooling effect of the semiconductor process chamber, thereby reducing the influence on the heat source reflection of the semiconductor process chamber and prolonging the service life of the semiconductor process chamber.
In order to achieve the object of the present invention, a cooling apparatus for a semiconductor process chamber is provided, which is disposed on a chamber top wall of the semiconductor process chamber and is used for cooling the chamber top wall, and comprises a fixing plate and a plurality of cooling pipes, wherein:
the fixing plate is connected with the cavity, is arranged opposite to the top wall of the cavity and is matched with the top wall of the cavity to form an accommodating space for installing the cooling pipeline;
the cooling device further comprises a blocking assembly, the blocking assembly divides the top wall of the cavity into an intermediate cooling area and an edge cooling area, the accommodating space is divided into an intermediate cooling space and an edge cooling space corresponding to the top wall of the cavity, and the plurality of cooling pipelines are arranged in the edge cooling space at intervals and used for blowing cooling gas to the top wall of the cavity;
one end of the cooling pipeline is connected with the fixing plate, a plurality of through holes are formed in the fixing plate, and the air inlets of the cooling pipelines are correspondingly connected with the through holes one by one; the cooling pipeline is provided with the edge trunk line that the radial direction of cavity roof extends, the orientation has been seted up to the pipe wall of trunk line the air outlet of cavity roof, the air outlet with the interval has between the cavity roof.
Optionally, the cooling pipeline further includes an air inlet pipeline, one end of the air inlet pipeline is an air inlet of the cooling pipeline, and the air inlet pipeline extends along the vertical direction of the top wall of the cavity and is connected with one end of the main pipeline; the joint of the gas inlet pipeline and the main pipeline is provided with a bending section for uniform flow of the cooling gas.
Optionally, the plurality of cooling pipes includes a plurality of first cooling pipes and a plurality of second cooling pipes, wherein:
the air outlet of the first cooling pipeline is parallel to the top wall of the cavity, and the air outlet of the second cooling pipeline forms an included angle with the top wall of the cavity.
Optionally, the first cooling pipelines are arranged in the middle position of the edge cooling space, the plurality of second cooling pipelines are symmetrically arranged at intervals on two sides of the first cooling pipelines, and the air outlets of the second cooling pipelines are arranged in a direction deviating from the direction of the first cooling pipelines.
Optionally, the blocking assembly comprises two arc-shaped blocking plates, and the two arc-shaped blocking plates and the edge of the top wall of the cavity form an edge cooling area; the first cooling pipeline and the second cooling pipeline are arranged in the edge cooling space at intervals along the arc directions of the two arc-shaped baffle plates and are connected with the fixing plate.
Optionally, an included angle between the air outlet of the second cooling pipeline and the top wall of the cavity is 50-70 °.
Optionally, the position of the opening of the air outlet on the pipe wall of the main pipe is the position from the position of the main pipe opposite to the arc-shaped blocking plate to the tail end of the main pipe.
Optionally, an orthographic projection of the cooling airflow of the second cooling pipeline on the top wall of the cavity is parallel to a tangent of the arc-shaped blocking plate.
Optionally, a plurality of air outlet channels are arranged in the channel of the cooling pipeline, one end of each air outlet channel extends to the air inlet of the cooling pipeline and is communicated with the through hole, the other end of each air outlet channel extends to the air outlet of the cooling pipeline, and the plurality of air outlet channels are used for uniformly flowing the cooling gas.
Optionally, a plurality of through holes are correspondingly provided with air inlet flanges one by one, the air inlet flanges are used for being communicated with an air source of the cooling gas, and a flow adjusting device is arranged at the upstream of each air inlet flange and used for correspondingly adjusting the flow of the cooling gas introduced into each cooling pipeline.
The invention also provides a semiconductor process chamber which comprises a cavity body and the cooling device provided by the invention, wherein the cooling device is arranged on the top wall of the cavity body and is used for cooling the top wall of the cavity body.
The invention has the following beneficial effects:
the cooling device for the semiconductor process chamber provided by the invention has the advantages that the plurality of cooling pipelines are arranged at intervals in the edge cooling space of the accommodating space formed by the matching of the fixed plate and the top wall of the cavity body, cooling gas can be blown to the edge cooling area of the top wall of the cavity body at intervals by the aid of the plurality of cooling pipelines, so that the temperature rise and the flow rate reduction caused by the relative flow of the cooling gas from two opposite sides of the top wall of the cavity body to the middle can be avoided, the area which can not be reached by the cooling gas can be avoided in the edge cooling area, the temperature and the flow rate of the cooling gas at each part of the edge cooling area of the top wall of the cavity body are similar, the cooling gas can reach each part of the edge cooling area, the uniformity of the top wall of the cooling gas cooling cavity body can be further improved, the cooling effect on the semiconductor process chamber is improved, and the probability of cracks and even falling of a gold-plated layer on the outer surface of the cavity body is reduced, further reducing the influence on the heat source reflection of the semiconductor process chamber and prolonging the service life of the semiconductor process chamber.
According to the semiconductor process chamber, the cooling device of the semiconductor process chamber is arranged on the top wall of the cavity, and the top wall of the cavity can be cooled by the cooling device of the semiconductor process chamber, so that the cooling effect of the semiconductor process chamber can be improved, the influence on heat source reflection of the semiconductor process chamber is reduced, and the service life of the semiconductor process chamber is prolonged.
Drawings
Fig. 1 is a schematic perspective view of a cooling apparatus of a semiconductor process chamber and the semiconductor process chamber according to an embodiment of the present invention;
FIG. 2 is a schematic front view of a cooling apparatus for a semiconductor processing chamber and a semiconductor processing chamber according to an embodiment of the present invention;
FIG. 3 is a schematic top view of the cross-sectional structure of FIG. 2 along the line A-A;
FIG. 4 is a schematic structural view of an intercooler unit according to an embodiment of the present invention;
FIG. 5 is a schematic cross-sectional view taken along the line C-C of FIG. 4;
FIG. 6 is a schematic structural diagram of an edge cooling unit according to an embodiment of the present invention;
FIG. 7 is a schematic cross-sectional view taken along line B-B of FIG. 6;
FIG. 8 is a schematic top view of a cooling apparatus for a semiconductor processing chamber and a semiconductor processing chamber according to the prior art;
description of reference numerals:
1-a cavity; 2, fixing a plate; 21-a through hole; 3-a cooling pipeline; 31-a first cooling circuit;
32-a second cooling circuit; 33-a main conduit; 34-an air inlet duct; 35-an air outlet channel; 4-a barrier assembly; 41-arc barrier plate; 5-an air inlet flange; 6-a cooling device; 7-cofferdam.
Detailed Description
In order to make those skilled in the art better understand the technical solution of the present invention, the cooling apparatus of a semiconductor process chamber and the semiconductor process chamber provided by the present invention will be described in detail below with reference to the accompanying drawings.
As shown in fig. 1 to fig. 3, an embodiment of the present invention provides a cooling apparatus for a semiconductor process chamber, which is disposed on a top wall of a chamber body 1 of the semiconductor process chamber and is used for cooling the top wall of the chamber body 1, the cooling apparatus includes a fixing plate 2 and a plurality of cooling pipes 3, wherein: the fixed plate 2 is connected with the cavity 1, the fixed plate 2 is arranged opposite to the top wall of the cavity 1, and the fixed plate and the top wall of the cavity are matched to form an accommodating space for installing a cooling pipeline 3; the cooling device further comprises a blocking component 4, the blocking component 4 divides the top wall of the cavity 1 into an intermediate cooling area and an edge cooling area, the accommodating space and the cooling area of the top wall of the cavity 1 are correspondingly divided into an intermediate cooling space and an edge cooling space, and the plurality of cooling pipelines 3 are arranged in the edge cooling space at intervals and used for blowing cooling gas to the top wall of the cavity 1; one end of the cooling pipeline 3 is connected with the fixing plate 2, a plurality of through holes 21 are formed in the fixing plate 2, and the air inlets of the cooling pipelines 3 are correspondingly connected with the through holes 21 one by one; cooling line 3 is provided with trunk line 33 that extends along the radial direction of cavity 1 roof, and the air outlet towards cavity 1 roof is seted up to trunk line 33's pipe wall, has the interval between air outlet and the cavity 1 roof.
The cooling device for the semiconductor process chamber provided by the embodiment of the invention has the advantages that the plurality of cooling pipelines 3 are arranged at intervals in the edge cooling space of the accommodating space formed by the matching of the fixed plate 2 and the top wall of the cavity 1, and the cooling gas can be blown to the edge cooling area of the top wall of the cavity 1 at intervals by the plurality of cooling pipelines 3, so that the temperature rise and the flow rate reduction caused by the relative flow of the cooling gas from two opposite sides of the top wall of the cavity 1 to the middle can be avoided, the area which cannot be reached by the cooling gas in the edge cooling area can be avoided, the temperature and the flow rate of the cooling gas at each part of the edge cooling area of the top wall of the cavity 1 are similar, the cooling gas can reach each part of the edge cooling area, the uniformity of the top wall of the cavity 1 can be cooled by the cooling gas, the cooling effect on the semiconductor process chamber is improved, and the probability of cracks and even falling of the gold plating layer on the outer surface of the cavity 1 is reduced, further reducing the influence on the heat source reflection of the semiconductor process chamber and prolonging the service life of the semiconductor process chamber.
Specifically, the fixing plate 2 is connected with the cavity 1 of the semiconductor process chamber, and the fixing plate 2 is arranged opposite to the top wall of the cavity 1, so that the fixing plate 2 and the top wall of the cavity 1 can be matched to form a containing space for installing the cooling pipeline 3 therebetween, that is, the cooling pipeline 3 can be installed in the containing space between the fixing plate 2 and the top wall of the cavity 1 which are arranged oppositely, and thus the installation of the cooling device and the semiconductor process chamber is realized. Dividing the top wall of the cavity 1 into an intermediate cooling area and an edge cooling area by the blocking component 4, so that the accommodating space between the fixing plate 2 and the top wall of the cavity 1 can be divided into an intermediate cooling space and an edge cooling space, wherein the edge cooling area refers to an area close to the edge of the top wall of the cavity 1 relative to the intermediate cooling area, and the edge cooling space refers to an area close to the edge of the accommodating space relative to the intermediate cooling space, and by arranging a plurality of cooling pipelines 3 in the edge cooling space at intervals, cooling gas can be blown to the edge cooling area of the top wall of the cavity 1 by the plurality of cooling pipelines 3, and the cooling gas is distributed at intervals in the edge cooling area of the top wall of the cavity 1, so that temperature rise and flow speed reduction caused by relative flow of the cooling gas from two opposite sides of the top wall of the cavity 1 to the middle can be avoided, and an area which can not be reached by the cooling gas can be avoided in the edge cooling area, so that the temperature and flow rate of the cooling gas are similar at all places of the edge cooling area of the top wall of the chamber body 1 and the cooling gas can reach all places of the edge cooling area. In addition, in practical applications, since the coil for heating the chamber 1 is disposed in the middle cooling area of the top wall of the chamber 1, and the inner area of the chamber 1 corresponding to the middle cooling area is the process area, the temperature of the middle cooling area is higher than that of the edge cooling area of the top wall of the chamber 1, and therefore, the middle cooling area of the top wall of the chamber 1 may be provided with a water cooling device to cool the middle cooling area of the top wall of the chamber 1.
One end of the cooling pipeline 3 is connected with the fixed plate 2, the fixed plate 2 is provided with a plurality of through holes 21, air inlets of the plurality of cooling pipelines 3 are correspondingly connected with the plurality of through holes 21 one by one, cooling gas can be conveyed to the plurality of cooling pipelines 3 through the plurality of through holes 21 one by one, namely, the cooling gas can sequentially pass through the plurality of through holes 21 and the air inlets of the plurality of cooling pipelines 3 which are correspondingly connected with the plurality of through holes 21 one by one to enter the plurality of cooling pipelines 3, the cooling pipeline 3 is provided with a main pipeline 33 which extends along the radial direction of the top wall of the cavity 1, an air outlet facing the top wall of the cavity 1 is arranged on the pipe wall of the main pipeline 33, and a distance is arranged between the air outlet and the top wall of the cavity 1, so that the cooling gas entering the cooling pipeline 3 can be diffused in the main pipeline 33, and the diffused cooling gas can be blown to the top wall of the cavity 1 through the air outlet arranged on the pipe wall of the main pipeline 33, therefore, the area of the cooling gas blown to the top wall of the cavity 1 through the air outlet can be increased, and the cooling effect of the semiconductor process chamber can be improved.
As shown in fig. 4-7, in a preferred embodiment of the present invention, the cooling pipeline 3 may further include an air inlet pipe 34, one end of the air inlet pipe 34 is an air inlet of the cooling pipeline 3, and the air inlet pipe 34 extends along a vertical direction of a top wall of the cavity and is connected to one end of the main pipe 33; the connection part of the air inlet pipeline 34 and the main pipeline 33 is arranged as a bending section for uniformly flowing cooling gas.
Be the air intake of cooling pipe 3 through the one end that makes inlet duct 34, and make inlet duct 34 extend along the vertical direction of cavity 1 roof, and be connected with the one end of trunk line 33, can make the cooling gas advance into inlet duct 34 through-hole 21 on the fixed plate 2, again get into trunk line 33 through inlet duct 34, that is to say, the cooling gas loops through-hole 21 and inlet duct 34 and gets into inlet duct 34 for the one end of cooling pipe 3's air intake, behind inlet duct 34, the one end that is connected from inlet duct 34 and trunk line 33 gets into trunk line 33. Set up to the section of bending through the junction with admission line 34 and trunk line 33, can make the flow direction of cooling gas when admission line 34 gets into trunk line 33 change, avoid cooling gas to directly get into trunk line 33 along vertical direction, thereby can make the inflow to trunk line 33 that cooling gas can be even, then make cooling gas can be even blow to 1 roof of cavity through the air outlet, realize the effect of even flow cooling gas, and then can improve the cooling effect of semiconductor process cavity.
As shown in fig. 3 to 7, in a preferred embodiment of the present invention, the plurality of cooling lines 3 may include a plurality of first cooling lines 31 and a plurality of second cooling lines 32, wherein: the air outlet of the first cooling pipeline 31 is parallel to the top wall of the cavity 1, and the air outlet of the second cooling pipeline 32 forms an included angle with the top wall of the cavity 1.
By designing the air outlet of the first cooling pipeline 31 to be parallel to the top wall of the cavity 1, when the first cooling pipeline 31 blows the cooling air to the top wall of the cavity 1, the cooling air can be vertically contacted with the top wall of the cavity 1, so that the cooling air can flow to the two side edges after being contacted with the top wall of the cavity 1, and by designing the air outlet of the second cooling pipeline 32 to have an included angle (as shown by an included angle α in fig. 6) with the top wall of the cavity 1, when the second cooling pipeline 32 blows the cooling air to the top wall of the cavity 1, the cooling air can flow to the edge with an inclination having an included angle with the top wall of the cavity 1, and the cooling air can be contacted with the inclination having an included angle with the top wall of the cavity 1, so that the cooling air can flow to the edge after being contacted with the top wall of the cavity 1.
As shown in fig. 3, the first cooling pipeline 31 is arranged at the middle position in the edge cooling space (as shown in the region N in fig. 3), the plurality of second cooling pipelines 32 are symmetrically arranged at intervals at two sides of the first cooling pipeline 3 (as shown in the region M in fig. 3), and the air outlets of the second cooling pipelines 32 are arranged in a direction away from the first cooling pipeline 31.
That is, the first cooling pipes 31 are arranged at the middle position in the edge cooling space, the second cooling pipes 32 are arranged at both sides of the first cooling pipes 31, the edge of the edge cooling space is close to the first cooling pipes 31, and the second cooling pipes 32 at both sides of the first cooling pipes 31 are symmetrically arranged at intervals, by arranging the first cooling pipes 31 at the middle position in the edge cooling space, the cooling gas can be blown to the middle position in the edge cooling space by the first cooling pipes 31, and the cooling gas can flow to both side edges after contacting the middle position in the edge cooling space of the ceiling wall of the chamber 1, by arranging the second cooling pipes 32 at both sides of the first cooling pipes 3 symmetrically at intervals, the cooling gas can be blown to both side edges of the middle position in the edge cooling space by the second cooling pipes 32, and the cooling gas can flow to the two side edges after contacting with the two side edges of the middle position in the edge cooling space of the top wall of the cavity 1, so that the cooling pipelines 3 are arranged in the edge cooling space at intervals by virtue of the first cooling pipeline 31 and the second cooling pipeline 32, and the cooling gas is blown to the edge cooling area of the top wall of the cavity 1 at intervals. Through the direction setting that deviates from first cooling pipeline 31 with the air outlet of second cooling pipeline 32, can make the second cooling pipeline 32 blow the cooling gas to cavity 1 roof can be to the edge that deviates from the direction of first cooling pipeline 31 flow, and, the second cooling pipeline 32 blows the cooling gas to cavity 1 roof after contacting with cavity 1 roof, can flow to the edge that deviates from the direction of first cooling pipeline 31, avoid the second cooling pipeline 32 to blow the cooling gas to cavity 1 roof to cause the influence to the flow of the cooling gas that first cooling pipeline 31 blown to cavity 1 roof, with the cooling stability that can improve cooling device, thereby can improve the cooling effect of semiconductor process chamber.
Optionally, the angle between the air outlet of the second cooling pipeline 32 and the top wall of the cavity 1 may be 50 ° to 70 °.
Optionally, the angle between the air outlet of the second cooling pipeline 32 and the top wall of the cavity 1 may be 60 °.
As shown in fig. 2 and 3, in a preferred embodiment of the present invention, the blocking assembly 4 may comprise two arc-shaped blocking plates 41, wherein the two arc-shaped blocking plates 41 and the edge of the top wall of the chamber 1 are edge cooling areas; the first cooling pipeline 31 and the second cooling pipeline 32 are arranged in the edge cooling space at intervals along the arc direction of the two arc-shaped baffle plates 41 and are connected with the fixing plate 2.
That is, the top wall of the cavity 1 is divided into an intermediate cooling area and an edge cooling area by two arc-shaped group partition plates, so that the accommodating space between the fixing plate 2 and the top wall of the cavity 1 is correspondingly divided into an intermediate cooling space and an edge cooling space, wherein the edge cooling area is the area between the two arc-shaped partition plates 41 and the edge of the top wall of the cavity 1, for example, as shown in fig. 2 and 3, the inner arcs of the two arc-shaped partition plates 41 may be arranged oppositely to form a structure similar to a cofferdam, at this time, the area between the inner arcs of the two arc-shaped partition plates 41 is the intermediate cooling area of the top wall of the cavity 1, the corresponding intermediate cooling space is the accommodating space, and the area between the outer arcs of the two arc-shaped partition plates 41 and the edge of the top wall of the cavity 1 is the edge cooling area of the top wall of the cavity 1, and the corresponding edge cooling space is the accommodating space. The first cooling line 31 and the second cooling line 3 are mounted on the cavity 1 through the fixed plate 2 by connecting the first cooling line 31 and the second cooling line 32 to the fixed plate 2. By arranging the first cooling line 31 and the second cooling line 32 in the edge cooling space at intervals along the arc direction of the two arc-shaped baffle plates 41, the cooling gas blown by the first cooling line 31 and the second cooling line 32 to the top wall of the cavity 1 can flow from the arc top area of the arc-shaped baffle plate 41 to the edge along the arc direction of the arc-shaped baffle plate 41 to form a vortex-like flow (as shown by the arrow in fig. 3).
The reason for this is that the inventor of the present invention found that in the prior art, when the cooling gas flows oppositely from two opposite sides to the middle, the flow velocity of the cooling gas flowing to the middle is reduced, which results in that the cooling gas cannot flow to the arc top area of the arc-shaped baffle plate 41, the arc top area of the arc-shaped baffle plate 41 cannot be cooled, and the gold plating layer in the arc top area of the arc-shaped baffle plate 41 cracks or even falls off, and, as shown in fig. 3, the two side edges of the arc-shaped baffle plate 41 have straight line portions, and there is a corner with a large angle between the straight line portion and the arc-shaped portion of the arc-shaped baffle plate 41, when the cooling gas flows oppositely from two opposite sides to the middle, because the flowing direction of the cooling gas is parallel to the straight line portions of the two side edges of the arc-shaped baffle plate 41, the cooling gas may stagnate in the corner area, i.e., the cooling gas flowing to the corner area is not easy to flow away from the corner area, the cooling gas has a slow flow rate in the corner region, the cooling effect in the corner region is poor, and the gold plating layer in the corner region cracks and even falls off.
On the other hand, the cooling device for the semiconductor process chamber provided by the embodiment of the invention can prevent the cooling gas from flowing to the arc top area of the arc-shaped barrier plate 41 by blowing the cooling gas to the arc top area of the arc-shaped barrier plate 41 by virtue of the first cooling pipeline 31 and enabling the cooling gas to flow from the arc top area of the arc-shaped barrier plate 41 to the two side edges, thereby preventing the arc top area of the arc-shaped barrier plate 41 from being cooled to cause the gold-plated layer in the arc top area of the arc-shaped barrier plate 41 to crack or even fall off, improving the cooling effect on the semiconductor process chamber, reducing the probability of cracking or even falling off caused by the gold-plated layer on the outer surface of the cavity 1, further reducing the influence on heat source reflection of the semiconductor process chamber, and prolonging the service life of the semiconductor process chamber. On the other hand, cooling gas is blown to the two sides of the arc top of the arc-shaped separation plate 41 by means of the second cooling pipelines 32, and the cooling gas flows to the edge along the arc line of the arc-shaped separation plate 41, so that the phenomenon that the cooling gas silts up in the corner area of the arc-shaped separation plate 41 can be avoided, the cooling effect on the corner area of the arc-shaped separation plate 41 is improved, the cooling effect on the semiconductor process chamber can be further improved, the probability that the gold-plated layer on the outer surface of the cavity 1 cracks or even falls is reduced, the influence on heat source reflection of the semiconductor process chamber is further reduced, and the service life of the semiconductor process chamber is prolonged.
As shown in fig. 5, in a preferred embodiment of the present invention, the position of the air outlet opening on the pipe wall of the main pipe 33 is from the position of the main pipe 33 opposite to the arc-shaped baffle plate 41 to the position of the end of the main pipe 33.
That is to say, the air outlet is seted up to relative main pipeline 33 and is kept away from one side of arc baffler 41 to one side that main pipeline 33 is close to arc baffler 41 on the pipe wall of main pipeline 33, can make the area maximize of air outlet like this to can make the cooling gas blow the area maximize to cavity 1 roof through the air outlet, and then the cooling effect of the improvement semiconductor process chamber that can maximize.
In a preferred embodiment of the present invention, the orthographic projection of the cooling air flow of the second cooling pipeline 32 on the top wall of the chamber 1 may be parallel to the tangent of the arc-shaped baffle plate 41.
Such a design may enable the cooling gas blown by second cooling line 32 to flow along the arc of arc baffle plate 41.
As shown in fig. 5 and 7, in a preferred embodiment of the present invention, a plurality of air outlet channels 35 may be disposed in the channel of the cooling pipeline 3, one end of each of the plurality of air outlet channels 35 extends to the air inlet of the cooling pipeline 3 and is communicated with the through hole 21, the other end of each of the plurality of air outlet channels 35 extends to the air outlet of the cooling pipeline 3, and the plurality of air outlet channels 35 are used for uniformly flowing the cooling air.
Such design can make cooling gas get into cooling pipeline 3 back at the air intake through cooling pipeline 3, can be even get into a plurality of air-out passageways 35 respectively, blow to 1 roof of cavity from the air outlet respectively through a plurality of air-out passageways 35 again, make cooling pipeline 3 blow to the cooling gas of 1 roof of cavity, evenly distributed on can 1 roof of cavity, thereby can further improve the homogeneity of cooling gas cooling 1 roof of cavity, then can further improve the cooling effect to semiconductor process chamber, reduce the probability that 1 surface gold-plating layer of cavity produced the crackle and even drops, and then further reduce the influence that semiconductor process chamber heat source reflection received, further improve semiconductor process chamber's life.
As shown in fig. 1 and 2, in a preferred embodiment of the present invention, the plurality of through holes 21 may be provided with the inlet flanges 5 in a one-to-one correspondence, the inlet flanges 5 are configured to communicate with a source of cooling gas, and each inlet flange 5 may be provided with a flow rate adjusting device (not shown) upstream thereof for correspondingly adjusting a flow rate of the cooling gas introduced into each cooling pipeline 3.
That is to say, through set up inlet flange 5 on a plurality of through-holes 21 one-to-one to make inlet flange 5 and the gaseous air supply intercommunication of cooling, can make the gaseous air supply of cooling be connected with fixed plate 2, and make the gaseous air supply of cooling pass through inlet flange 5 and a plurality of through-holes 21 intercommunication that the one-to-one set up on a plurality of through-holes 21, thereby when cooling device cools off, make the gaseous cooling that the gaseous air supply of cooling provided can get into a plurality of cooling pipe 3 with a plurality of through-holes 21 one-to-one connection through a plurality of through-holes 21. All set up flow control device through the upper reaches at every air intake flange 5, can correspond the flow of adjusting the cooling gas who lets in every cooling line 3 with the help of flow control device, thereby can be according to the area of the 1 roof of cavity that first cooling line 31 corresponds, and the area of the 1 roof of cavity that second cooling line 32 corresponds, come to adjust the flow of the cooling gas who gets into first cooling line 31 and second cooling line 32, then can carry out appropriate division and regulation to the cooling gas's of first cooling line 31 and second cooling line 32 flow, and then can improve cooling gas's utilization ratio.
Optionally, the flow regulating component may comprise an air speed regulating valve.
The embodiment of the invention also provides a semiconductor process chamber, which comprises a cavity 1 and the cooling device provided by the embodiment of the invention, wherein the cooling device is arranged on the top wall of the cavity 1 and is used for cooling the top wall of the cavity 1.
According to the semiconductor process chamber provided by the embodiment of the invention, the cooling device of the semiconductor process chamber provided by the embodiment of the invention is arranged on the top wall of the cavity 1, and the top wall of the cavity 1 can be cooled by the cooling device of the semiconductor process chamber provided by the embodiment of the invention, so that the cooling effect of the semiconductor process chamber can be improved, the influence on heat source reflection of the semiconductor process chamber is reduced, and the service life of the semiconductor process chamber is prolonged.
In summary, the cooling device for the semiconductor process chamber and the semiconductor process chamber provided by the invention can improve the cooling effect on the semiconductor process chamber, thereby reducing the influence on the heat source reflection of the semiconductor process chamber and prolonging the service life of the semiconductor process chamber.
It is to be understood that the above embodiments are merely exemplary embodiments that have been employed to illustrate the principles of the present invention, and that the present invention is not limited thereto. It will be apparent to those skilled in the art that various modifications and improvements can be made without departing from the spirit and substance of the invention, and these modifications and improvements are also considered to be within the scope of the invention.
Claims (11)
1. A cooling device of a semiconductor process chamber, which is arranged on a top wall of a cavity of the semiconductor process chamber and is used for cooling the top wall of the cavity, and is characterized by comprising a fixing plate and a plurality of cooling pipelines, wherein:
the fixing plate is connected with the cavity, is arranged opposite to the top wall of the cavity and is matched with the top wall of the cavity to form an accommodating space for installing the cooling pipeline;
the cooling device further comprises a blocking assembly, the blocking assembly divides the top wall of the cavity into an intermediate cooling area and an edge cooling area, the accommodating space is divided into an intermediate cooling space and an edge cooling space corresponding to the top wall of the cavity, and the plurality of cooling pipelines are arranged in the edge cooling space at intervals and used for blowing cooling gas to the top wall of the cavity;
one end of the cooling pipeline is connected with the fixing plate, a plurality of through holes are formed in the fixing plate, and the air inlets of the cooling pipelines are correspondingly connected with the through holes one by one; the cooling pipeline is provided with the edge trunk line that the radial direction of cavity roof extends, the orientation has been seted up to the pipe wall of trunk line the air outlet of cavity roof, the air outlet with the interval has between the cavity roof.
2. The cooling device as claimed in claim 1, wherein the cooling pipeline further comprises an air inlet pipeline, one end of the air inlet pipeline is an air inlet of the cooling pipeline, and the air inlet pipeline extends along the vertical direction of the top wall of the cavity and is connected with one end of the main pipeline; the joint of the gas inlet pipeline and the main pipeline is provided with a bending section for uniform flow of the cooling gas.
3. The cooling apparatus according to claim 1, wherein the plurality of cooling lines includes a plurality of first cooling lines and a plurality of second cooling lines, wherein:
the air outlet of the first cooling pipeline is parallel to the top wall of the cavity, and the air outlet of the second cooling pipeline forms an included angle with the top wall of the cavity.
4. The cooling device as claimed in claim 3, wherein the first cooling pipeline is arranged at a middle position in the edge cooling space, the plurality of second cooling pipelines are symmetrically arranged at intervals at two sides of the first cooling pipeline, and the air outlets of the second cooling pipelines are arranged in a direction away from the first cooling pipeline.
5. The cooling apparatus of claim 4, wherein the baffle assembly comprises two arcuate baffle plates that form an edge cooling zone with an edge of the chamber top wall; the first cooling pipeline and the second cooling pipeline are arranged in the edge cooling space at intervals along the arc directions of the two arc-shaped baffle plates and are connected with the fixing plate.
6. The cooling device as claimed in claim 3, wherein the angle between the air outlet of the second cooling pipeline and the top wall of the cavity is 50-70 °.
7. The cooling device as claimed in claim 5, wherein the position of the opening of the air outlet on the pipe wall of the main pipe is from the position of the main pipe opposite to the arc-shaped baffle plate to the position of the tail end of the main pipe.
8. The cooling device as claimed in claim 5, wherein the orthographic projection of the cooling air flow of the second cooling line on the top wall of the chamber is parallel to the tangent of the arc-shaped baffle plate.
9. The cooling device according to claim 1, wherein a plurality of air outlet channels are disposed in the channel of the cooling pipeline, one ends of the air outlet channels extend to the air inlet of the cooling pipeline and are communicated with the through hole, the other ends of the air outlet channels extend to the air outlet of the cooling pipeline, and the air outlet channels are used for uniformly flowing the cooling gas.
10. The cooling device as claimed in claim 1, wherein a plurality of the through holes are correspondingly provided with air inlet flanges one by one, the air inlet flanges are used for being communicated with an air source of the cooling gas, and a flow rate adjusting device is arranged at the upstream of each air inlet flange and is used for correspondingly adjusting the flow rate of the cooling gas introduced into each cooling pipeline.
11. A semiconductor processing chamber comprising a chamber body and a cooling device according to any one of claims 1 to 10, the cooling device being arranged on a top wall of the chamber body for cooling the top wall of the chamber body.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111451406.8A CN114171437A (en) | 2021-12-01 | 2021-12-01 | Cooling device of semiconductor process chamber and semiconductor process chamber |
| PCT/CN2022/134603 WO2023098606A1 (en) | 2021-12-01 | 2022-11-28 | Cooling device for semiconductor process chamber and semiconductor process chamber |
| TW111145465A TW202328491A (en) | 2021-12-01 | 2022-11-28 | Cooling device for a semiconductor process chamber and semiconductor process chamber |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111451406.8A CN114171437A (en) | 2021-12-01 | 2021-12-01 | Cooling device of semiconductor process chamber and semiconductor process chamber |
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| Publication Number | Publication Date |
|---|---|
| CN114171437A true CN114171437A (en) | 2022-03-11 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111451406.8A Pending CN114171437A (en) | 2021-12-01 | 2021-12-01 | Cooling device of semiconductor process chamber and semiconductor process chamber |
Country Status (3)
| Country | Link |
|---|---|
| CN (1) | CN114171437A (en) |
| TW (1) | TW202328491A (en) |
| WO (1) | WO2023098606A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023098606A1 (en) * | 2021-12-01 | 2023-06-08 | 北京北方华创微电子装备有限公司 | Cooling device for semiconductor process chamber and semiconductor process chamber |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2008118483A1 (en) * | 2007-03-27 | 2008-10-02 | Structured Materials Inc. | Showerhead for chemical vapor deposition (cvd) apparatus |
| CN102345112B (en) * | 2011-09-22 | 2013-08-21 | 中微半导体设备(上海)有限公司 | Semiconductor processing device and gas spray head cooling plate thereof |
| CN102492937A (en) * | 2011-12-29 | 2012-06-13 | 中国科学院半导体研究所 | Inlet spray head used for reaction chamber of metal chemical vapor deposition equipment |
| CN105992448B (en) * | 2015-02-02 | 2019-04-23 | 北京北方华创微电子装备有限公司 | Plasma generating device and semiconductor equipment with it |
| JP7055075B2 (en) * | 2018-07-20 | 2022-04-15 | 東京エレクトロン株式会社 | Heat treatment equipment and heat treatment method |
| JP2021068886A (en) * | 2019-10-17 | 2021-04-30 | 東京エレクトロン株式会社 | Substrate processing apparatus, substrate processing method, and storage medium |
| CN111161992B (en) * | 2019-12-27 | 2022-11-25 | 北京北方华创微电子装备有限公司 | Reaction chamber cooling device of semiconductor equipment |
| CN114171437A (en) * | 2021-12-01 | 2022-03-11 | 北京北方华创微电子装备有限公司 | Cooling device of semiconductor process chamber and semiconductor process chamber |
-
2021
- 2021-12-01 CN CN202111451406.8A patent/CN114171437A/en active Pending
-
2022
- 2022-11-28 WO PCT/CN2022/134603 patent/WO2023098606A1/en unknown
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023098606A1 (en) * | 2021-12-01 | 2023-06-08 | 北京北方华创微电子装备有限公司 | Cooling device for semiconductor process chamber and semiconductor process chamber |
Also Published As
| Publication number | Publication date |
|---|---|
| TW202328491A (en) | 2023-07-16 |
| WO2023098606A1 (en) | 2023-06-08 |
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