TW202328491A - Cooling device for a semiconductor process chamber and semiconductor process chamber - Google Patents

Abstract

A cooling device for a semiconductor process chamber and a semiconductor process chamber. The cooling device is arranged on the top wall of the cavity of the semiconductor process chamber and is used to cool the top wall of the cavity. The cooling device includes a fixed plate, a plurality of cooling pipes and a barrier component. The fixing plate is relatively arranged above the top wall of the cavity, and the fixing plate, the top wall of the cavity and the side wall of the cavity form a receiving space; The blocking element is arranged between the fixing plate and the top wall of the cavity, and the containing space is divided into an intermediate cooling space and two edge cooling spaces respectively located on both sides thereof; A plurality of cooling pipes are spaced at different positions in each edge cooling space; The fixing plate is provided with a plurality of through holes, and the air inlets of the plurality of cooling pipelines are connected with the plurality of through holes one by one; The air outlet of the cooling pipe is used to blow cooling gas into the edge cooling space.

Description

Cooling device for semiconductor process chamber and semiconductor process chamber

The present invention relates to the technical field of semiconductor equipment, in particular to a cooling device for a process chamber and the process chamber.

In the chemical vapor deposition (Chemical Vapor Deposition, referred to as CVD) process, the temperature in the process chamber can reach about 1100 ° C. Therefore, the process chamber needs to be made of quartz material to provide the required temperature environment for the process, and in a transparent The outer surface of the quartz is plated with gold to reflect the heat source into the process chamber with the help of the gold-plated layer, increase the reflectivity of the heat source, and ensure that the temperature in the process chamber can be maintained within the temperature range required by the process. The racks and transmission structures outside the process chamber, etc. It is difficult for metal fixtures to withstand such high temperatures, therefore, the outside of the process chamber needs to be cooled.

As shown in Figure 8, an existing way of cooling the outside of the process chamber is to install a cooling device 6 on the top of the process chamber, and the cooling device 6 sends cold air from the opposite sides of the top of the process chamber to the middle, and , the top of the process chamber will also be provided with a cofferdam 7, and the cold air will flow from the edge of the cofferdam 7 along the arc of the cofferdam 7 to the top of the arc of the cofferdam 7 (as shown by the arrow in Figure 8), and the process chamber Cool the top outer edge. However, this will cause the cold air to flow relatively from both sides to the middle, and because the flowing distance is longer and the area is larger, when the cold air flows to the middle of the process chamber, the temperature of the cold air has increased and the wind speed has decreased, resulting in The cooling effect of the cold wind on the middle of the process chamber is weakened, resulting in uneven cooling of the outside of the process chamber, and because the edge of the cofferdam 7 has a corner, the wind speed of the cold wind is low in the corner area (as shown in area P in Figure 8 ) It is not easy to flow, resulting in poor cooling effect of the cold wind on the corner area, and because the wind speed of the cold wind in the arc top area of the cofferdam 7 (as shown in area Q in Figure 8) is low, and the cold wind is blocked by the arc cofferdam 7 , when the cold wind reaches the arc top area, the wind direction will change, resulting in the cold wind may not reach the arc top area of the cofferdam 7, resulting in a "dead zone" formed in the corner area and arc top area of the cofferdam 7, and the cooling effect is poor. In practical application, due to the uneven external cooling of the process chamber, the gold-plated layer of the process chamber will crack or even fall off, and because the cooling effect of the corner area and the arc top area of the cofferdam 7 is poor, the cofferdam 7 The gold-plated layer in the corner area and arc top area will fall off more easily, and because the cooling effect in the middle of the process chamber is poor, the gold-plated layer in the middle of the process chamber will fall off first, affecting the heat source reflection effect and service life of the process chamber.

The present invention aims to solve at least one of the technical problems existing in the prior art, and proposes a cooling device for a semiconductor process chamber and a semiconductor process chamber, which can improve the cooling effect of the semiconductor process chamber, thereby reducing the size of the semiconductor process chamber. The reflection of the heat source is affected, and the service life of the semiconductor process chamber is improved.

In order to realize the purpose of the present invention, a cooling device for a semiconductor process chamber is provided, which is arranged on the top wall of the cavity of the semiconductor process chamber for cooling the top wall of the cavity. The cooling device includes a fixing plate, a plurality of A cooling pipeline and a blocking assembly, wherein: the fixing plate is relatively arranged above the top wall of the cavity, and the fixing plate, the top wall of the cavity and the side wall of the cavity are enclosed to form an accommodation space; the blocking element is set on the top wall of the cavity between the fixing plate and the top wall of the cavity, and divide the accommodating space into an intermediate cooling space and two edge cooling spaces respectively located on both sides; a plurality of the cooling pipelines are arranged at intervals in each edge cooling space At different positions in the interior; the fixed plate is provided with a plurality of through holes, and the air inlets of the plurality of cooling pipes are connected to the through holes one by one; the air outlets of the cooling pipes are used for cooling to the edge Cooling gas is blown into the space.

Optionally, each of the cooling pipelines includes a main pipe arranged parallel to a direction extending from the center of the top wall of the cavity to the edge, and the pipe wall of the main pipe is provided with the air outlet.

Optionally, the air outlet is strip-shaped, and the two ends of the air outlet in the length direction respectively extend to positions close to the two ends of the main duct.

Optionally, each of the cooling pipelines also includes an air intake pipe, one end of the air intake pipe is used as an air inlet of the cooling pipeline, the other end of the air intake pipe is connected to one end of the main pipe, and the main pipe The other end of the pipe is a blocked end; a bent pipe section is arranged at the joint between the inlet pipe and the main pipe.

Optionally, each channel of the cooling pipeline is provided with a plurality of mutually isolated air outlet channels, and one end of the plurality of air outlet channels extends to the air inlet of the cooling pipeline, and is connected to the corresponding The through holes communicate, and the other ends of the plurality of air outlet channels extend to the air outlet of the cooling pipeline.

Optionally, each of the plurality of cooling lines in the edge cooling space includes a first cooling line and a plurality of second cooling lines, wherein:

The first cooling pipeline is arranged in the middle of the edge cooling space, and the air outlet direction of the first cooling pipeline is vertical to the top wall of the cavity;

A plurality of the second cooling pipelines are symmetrically arranged on both sides of the first cooling pipeline, the air outlet direction of the second cooling pipeline has an included angle with the top wall of the cavity, and the second cooling pipeline The air outlet direction of the air outlet is obliquely set away from the first cooling pipeline.

Optionally, the air outlet direction of the air outlet of the second cooling pipeline is parallel to the tangent of the circumference.

Optionally, the included angle between the plane where the air outlet of the second cooling pipeline is located and the top wall of the cavity is 50°-70°.

Optionally, a plurality of the through holes are provided with inlet flanges one by one, and the inlet flanges are used to communicate with the gas source of the cooling gas, and each inlet flange is provided with a flow adjustment upstream A device is used for correspondingly adjusting the flow rate of the cooling gas passing into each of the cooling pipelines.

The present invention also provides a semiconductor processing chamber, including a cavity and the cooling device provided by the present invention, wherein the cavity has a cavity top wall and four side walls, wherein a part of the two oppositely disposed side walls comes from the cavity The top surface of the body wall is convex.

The present invention has the following beneficial effects:

The cooling device of the semiconductor process chamber provided by the present invention divides the accommodation space enclosed by the fixed plate, the top wall of the cavity and the side wall of the cavity into an intermediate cooling space by arranging a barrier element between the fixed plate and the top wall of the cavity and the edge cooling space on both sides, and a plurality of cooling pipelines are arranged at intervals at different positions in the edge cooling space, and the cooling gas can be blown into the edge cooling space by means of multiple cooling pipelines, that is, in the edge cooling space Blowing air at different positions inside the cavity at the same time, compared with the way in which the cooling gas flows from the opposite sides of the top wall of the cavity to the middle in the prior art, it can make the cooling gas reach all parts of the edge cooling space, and shorten the gas flow at the same time. The flow distance can avoid the increase of gas temperature and the decrease of flow rate due to too long distance, so as to avoid the area in the edge cooling space where the cooling gas cannot reach, so that the temperature and flow rate of the cooling gas in the edge cooling space are similar, and then can be improved. The cooling gas cools the uniformity of different positions of the top wall of the cavity, improves the cooling effect on the semiconductor process chamber, reduces the probability of cracks or even falling off of the gold-plated layer on the outer surface of the cavity, and thus reduces the impact of heat source reflection in the semiconductor process chamber, improving Service life of semiconductor process chambers.

In the semiconductor process chamber provided by the present invention, by setting the cooling device of the semiconductor process chamber provided by the present invention on the cavity top wall, the cavity top wall can be cooled by the cooling device of the semiconductor process chamber provided by the present invention , so that the cooling effect of the semiconductor process chamber can be improved, thereby reducing the influence of heat source reflection in the semiconductor process chamber, and improving the service life of the semiconductor process chamber.

The following disclosure provides many different embodiments, or examples, of different means for implementing the disclosure. Specific examples of components and configurations are described below to simplify the present disclosure. Of course, these are examples only and are not intended to be limiting. For example, in the following description a first member is formed over or on a second member may include embodiments in which the first member and the second member are formed in direct contact, and may also include embodiments in which additional members An embodiment may be formed between the first member and the second member so that the first member and the second member may not be in direct contact. Additionally, the present disclosure may repeat reference numerals and/or letters in various instances. This repetition is for simplicity and clarity and does not in itself indicate a relationship between the various embodiments and/or configurations discussed.

In addition, for ease of description, spatially relative terms such as "below", "below", "under", "above", "upper" and the like may be used herein to describe the relationship between one element or member and another(s) The relationship between elements or components, as illustrated in the figure. Spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and thus the spatially relative descriptors used herein should be interpreted similarly.

Notwithstanding that the numerical ranges and parameters setting forth the broad scope of the disclosure are approximations, the numerical values set forth in the specific examples are reported as precisely as possible. Any numerical value, however, inherently contains certain errors necessarily resulting from the standard deviation found in their respective testing measurements. Furthermore, as used herein, the term "about" generally means within 10%, 5%, 1%, or 0.5% of a given value or range. Alternatively, the term "about" means within an acceptable standard error of the mean when considered by one of ordinary skill in the art. Except in operating/working examples, or unless expressly specified otherwise, all numerical ranges such as for amounts of materials disclosed herein, durations of time, temperatures, operating conditions, ratios of amounts, and the like, Amounts, values and percentages should be understood as being modified by the term "about" in all instances. Accordingly, unless indicated to the contrary, the numerical parameters set forth in this disclosure and the accompanying claims are approximations that may vary as desired. At a minimum, each numerical parameter should at least be construed in light of the number of reported significant digits and by applying ordinary rounding techniques. Ranges can be expressed herein as from one endpoint to the other or as between two endpoints. All ranges disclosed herein are inclusive of endpoints unless otherwise specified.

As shown in FIGS. 1-3 , an embodiment of the present invention provides a cooling device for a semiconductor process chamber, which is arranged on the cavity top wall 11 of the cavity 1 of the semiconductor process chamber, and is used to cool the cavity top wall 11 Cooling, the cooling device includes a fixed plate 2, a plurality of cooling pipelines 3 and a barrier assembly 4, wherein: the fixed plate 2 is relatively arranged above the top wall 11 of the cavity, optionally, the fixed plate 2 is fixedly connected with the cavity 1, The fixing plate 2 , the top wall 11 of the cavity and the side wall 12 of the cavity 1 encircle to form an accommodating space for installing the cooling pipeline 3 . The barrier element 4 is arranged between the fixed plate 2 and the cavity top wall 11, and divides the above-mentioned accommodating space into an intermediate cooling space 11a and two edge cooling spaces 11b respectively located on both sides thereof, that is, the cavity top wall 11 The intermediate cooling area corresponds to the above-mentioned intermediate cooling space 11a, and the edge cooling areas of the top wall of the cavity located on both sides of the intermediate cooling area correspond to the above-mentioned edge cooling space 11b. Specifically, taking the cavity 1 as a hexahedron as an example, it has a cavity top wall 11, a cavity bottom wall and four side walls 12, as shown in FIG. The top surface of the cavity top wall 11 protrudes to form a protruding portion 121 , and the protruding portion 121 can be surrounded by the fixing plate 2 and the cavity top wall to form the above-mentioned accommodating space. It is easy to understand that the two edge cooling spaces 11b are respectively adjacent to the two protruding portions 121 . In addition, two sides of the edge cooling space 11b corresponding to the other two opposite side walls (ie, the upper side and the lower side of the edge cooling space 11b in FIG. 3 ) are open.

A plurality of cooling pipelines 3 are arranged at intervals at different positions in each edge cooling space 11b. Optionally, one end of the cooling pipeline 3 is connected to the fixing plate 2 . The fixed plate 2 is provided with a plurality of through holes 21, and the air inlets of the plurality of cooling pipelines 3 are connected to the plurality of through holes 21 one by one; the air outlets of the cooling pipelines 3 are used to blow cooling gas into the edge cooling space 11b .

The cooling device of the semiconductor process chamber provided by the embodiment of the present invention encloses the fixed plate 2, the cavity top wall 11 and the side wall 12 of the cavity 1 by setting the barrier element 4 between the fixed plate 2 and the cavity top wall 11 The formed accommodating space is divided into an intermediate cooling space 11a and two edge cooling spaces 11b respectively located on both sides thereof, and a plurality of cooling pipelines 3 are arranged at intervals at different positions in the edge cooling space. The pipeline 3 blows the cooling gas into the edge cooling space 11b, that is, blows air at different positions in the edge cooling space 11b at the same time, which is different from the way in the prior art that the cooling gas flows from the opposite sides of the cavity top wall to the middle. In contrast, the cooling gas can reach all parts of the edge cooling space 11b, while shortening the gas flow distance, avoiding the increase of the gas temperature and the decrease of the flow rate due to the excessive distance, thereby avoiding the problem that the cooling gas cannot reach the edge cooling space 11b. area, so that the temperature and flow rate of the cooling gas in the edge cooling space 11b are similar, and then the uniformity of the cooling gas at different positions of the top wall 11 of the cooling cavity can be improved, the cooling effect on the semiconductor process chamber can be improved, and the outer surface of the cavity can be reduced. The probability of cracks or even falling off of the gold-plated layer can further reduce the influence of heat source reflection in the semiconductor process chamber and improve the service life of the semiconductor process chamber.

Specifically, the fixed plate 2 is connected to the cavity 1 of the semiconductor process chamber, and the fixed plate 2 is arranged opposite to the cavity top wall 11, and the fixed plate 2, the cavity top wall 11 and the side wall 12 of the cavity 1 are enclosed An accommodating space for installing the cooling pipeline 3 is formed, and the cooling pipeline 3 can be installed in the aforesaid accommodating space, so as to realize the installation of the cooling device and the semiconductor process chamber. The above-mentioned accommodating space is divided into an intermediate cooling space 11a and two edge cooling spaces 11b respectively located on both sides thereof by means of a barrier element 4, wherein a plurality of cooling pipelines 3 are arranged at intervals in each edge cooling space 11b At different positions, a plurality of cooling pipelines 3 can be used to blow cooling gas to different positions in the edge cooling space 11b at the same time, so that the cooling gas can reach all parts of the edge cooling space 11b, and the gas flow distance can be shortened at the same time. If the distance is too long, the temperature of the gas will rise and the flow rate will decrease, thereby avoiding the region where the cooling gas cannot reach the edge cooling space 11b, so that the temperature and flow rate of the cooling gas in the edge cooling space 11b are similar, and then the cooling of the cooling gas can be improved. The uniformity of different positions of the cavity top wall 11.

In addition, in practical applications, since the intermediate cooling space 11a is provided with coils for heating the cavity 1, and the inner area of the cavity 1 corresponding to the intermediate cooling space 11a is the process area, the intermediate cooling space 11a is relatively The temperature of the cooling space 11b is high, therefore, a water cooling device may be provided in the intermediate cooling space 11a to cool the intermediate cooling area of the cavity top wall 11 corresponding to the intermediate cooling space 11a.

In some optional embodiments, each cooling pipeline 3 includes a main pipe 33 arranged parallel to the direction extending from the center of the cavity top wall 11 to the edge, and the pipe wall of the main pipe 33 is provided with the above-mentioned air outlet , for purging cooling gas to the edge cooling space 11b. Optionally, the above-mentioned air outlet faces the top wall 11 of the cavity and has a distance from the top wall 11 of the cavity, so as to improve the cooling efficiency of the top wall 11 of the cavity while ensuring normal blowing of the cooling gas. The main pipes 33 in the plurality of cooling pipes 3 are arranged in a divergent shape, for example. Optionally, one end of the cooling pipeline 3 is connected to the fixing plate 2 .

By opening a plurality of through holes 21 on the fixed plate 2, and connecting the air inlets of the plurality of cooling pipelines 3 with the plurality of through holes 21 one by one, the plurality of through holes 21 are used to connect with the air source, and the air source provides The cooling gas can flow into a plurality of cooling pipelines 3 through a plurality of through holes 21 in one-to-one correspondence, that is, the cooling gas can pass through a plurality of through holes 21 and a plurality of through holes 21 connected one to one in sequence. The air inlets of the cooling pipelines 3 enter a plurality of cooling pipelines 3, and the cooling pipelines 3 are provided with a main pipeline 33 arranged along a direction parallel to the direction extending from the center of the cavity top wall 11 to the edge, and in the main pipeline 33 The pipe wall of the pipe is provided with an air outlet, so that the cooling gas entering the cooling pipeline 3 can be diffused in the main pipe 33, and the diffused cooling gas can be blown to the edge for cooling through the air outlet provided on the pipe wall of the main pipe 33. In the space, the area where the cooling gas is blown to the top wall 11 of the chamber through the air outlet can be increased, and the cooling effect of the semiconductor process chamber can be improved. Further optionally, as shown in FIG. 5 , the above-mentioned air outlet is strip-shaped, and the two ends of the air outlet in its length direction respectively extend to positions close to the two ends of the main duct 33, that is, the air outlet is in the main duct. The position of the opening on the pipe wall of the main pipe 33 is from the position where the main pipe 33 is opposite to the arc-shaped barrier plate 41 to the position of the end of the main pipe 33, that is to say, the air outlet is on the pipe wall of the main pipe 33 and the main pipe 33 is close to the arc. One side of the baffle plate 41 opens to the side of the opposite main pipe 33 away from the arc-shaped baffle plate 41 . In this way, the gas passage area of the air outlet can be increased as much as possible, so that the cooling gas can be blown to the cavity top wall of the cavity 1 through the air outlet to maximize the cooling effect of the semiconductor process chamber. .

As shown in FIGS. 4-7 , in a preferred embodiment of the present invention, each cooling pipeline 3 may further include an air intake duct 34 , such as along a vertical line perpendicular to the top wall 11 of the cavity. direction, and one end of the air intake duct 34 is used as the air inlet of the cooling pipeline 3, and the other end of the air intake duct 34 is connected to one end of the main duct 33 (for example, the end near the center of the cavity top wall 11), and the main The other end of the pipe 33 (for example, the end close to the edge of the top wall 11 of the cavity) is a blocked end; the connection between the inlet pipe 34 and the main pipe 33 is provided with a bent pipe section for uniform flow of cooling gas.

By making one end of the air inlet pipe 34 serve as the air inlet of the cooling pipe 3, and be connected with one end of the main pipe 33, the cooling gas can first enter the air inlet pipe 34 through the through hole 21 on the fixed plate 2, and then pass through the inlet pipe 34. The air duct 34 enters the main duct 33, that is to say, the cooling gas enters the air intake duct 34 through the through hole 21 and the air intake duct 34 successively as an end of the air inlet, and then passes through the intake duct 34, from the intake duct 34 and One end where the main pipe 33 is connected enters into the main pipe 33 . By being provided with a bent pipe section at the junction of the intake duct 34 and the main duct 33, the flow direction of the cooling gas when entering the main duct 33 through the intake duct 34 can be changed to avoid cooling due to cooling in the intake duct 34. The gas directly enters the main pipe 33, causing the air flow to turn too much (for example, directly changing from a vertical direction to a horizontal direction), thereby affecting the uniformity of the air flow, that is, by means of bending the pipe section, the cooling gas can evenly flow into the In the main pipe 33, the cooling gas can be evenly blown into the edge cooling space 11b through the air outlet, so as to realize the effect of uniform flow of the cooling gas, thereby improving the cooling effect of the semiconductor process chamber.

As shown in FIGS. 3-7 , in a preferred embodiment of the present invention, the plurality of cooling pipelines 3 in each edge cooling space 11b may include a first cooling pipeline 31 and a plurality of second cooling pipelines 32 , wherein: the first cooling pipeline 31 is arranged in the middle position in the edge cooling space 11b, and the air outlet direction of the air outlet of the first cooling pipeline 31 is set perpendicular to the cavity top wall 11, that is, the first cooling pipeline 31 The plane where the air outlet is located is set parallel to the top wall 11 of the cavity; a plurality of second cooling pipelines 32 are symmetrically arranged on both sides of the first cooling pipeline 31, and the air outlet direction of the second cooling pipeline 32 is in line with the direction of the cavity. The top wall 11 has an included angle, and the air outlet direction of the air outlet of the second cooling pipeline 32 is inclined toward a direction away from the first cooling pipeline 31 .

By setting the air outlet direction of the air outlet of the first cooling pipeline 31 perpendicular to the cavity top wall 11, when the air outlet of the first cooling pipeline 31 blows the cooling gas to the cavity top wall 11, the cooling gas can flow along The vertical direction flows to the cavity top wall 11 and is in contact with it, so that the cooling gas can flow to both sides of the first cooling pipeline 31 after being in contact with the cavity top wall 11, and through the second cooling pipeline 32 The air outlet direction of the air outlet has an included angle with the top wall 11 of the cavity (as shown by the angle α in FIG. 6 ), and the air outlet direction of the air outlet of the second cooling pipeline 32 is inclined away from the first cooling pipeline 31. In this way, when the gas outlet of the second cooling pipeline 32 blows the cooling gas to the cavity top wall 11, the cooling gas can flow obliquely to the edge of the edge cooling space 11b, and the cooling gas can flow in a direction inclined to the cavity top wall 11 The cooling gas flows and contacts the cavity top wall 11, so that the cooling gas can flow toward the edge of the edge cooling space 11b after contacting the cavity top wall 11.

As shown in Figure 3, the first cooling pipeline 31 is arranged in the middle of the edge cooling space 11b (as shown in the area N in Figure 3), and a plurality of second cooling pipelines 32 are symmetrically arranged at intervals in the first cooling Both sides of the pipeline 31 (shown as the area M in FIG. 3 ), and the air outlet direction of the air outlet of the second cooling pipeline 32 is arranged obliquely in a direction away from the first cooling pipeline 31 .

That is to say, the first cooling pipeline 31 is arranged in the middle position in the edge cooling space 11b, and the second cooling pipeline 32 is arranged on both sides of the first cooling pipeline 31, close to the first cooling pipeline 31. The edge of the edge cooling space 11b, and the second cooling pipelines 32 on both sides of the first cooling pipeline 31 are arranged symmetrically and at intervals. By arranging the first cooling pipelines 31 in the middle of the edge cooling space 11b, it is possible to The cooling gas is blown to the middle position in the edge cooling space 11b by means of the first cooling pipeline 31, and the cooling gas can flow to the edges on both sides after contacting the middle position in the edge cooling area of the cavity top wall 11. The second cooling pipeline 32 is symmetrically arranged on both sides of the first cooling pipeline 3 at intervals, and the cooling gas can be blown to the edges on both sides in the edge cooling space 11b by means of the second cooling pipeline 32, and the cooling gas can flow in contact with the cavity The top wall 11 of the body can flow toward the edges of both sides after being in contact, so that the cooling gas can be blown to different positions in the edge cooling space 11b. By setting the air outlet direction of the air outlet of the second cooling pipeline 32 in a direction away from the first cooling pipeline 31, the cooling gas blown out by the second cooling pipeline 32 can be directed away from the first cooling pipeline 31. Flow toward the edge in the edge cooling space 11b, and the cooling gas blown out by the second cooling pipeline 32 can flow in a direction away from the first cooling pipeline 31 after contacting the cavity top wall 11, avoiding the second cooling pipeline The cooling gas blown out of the channel 32 affects the flow of the cooling gas blown out of the first cooling pipeline 31, so as to improve the cooling stability of the cooling device, thereby improving the cooling effect of the semiconductor process chamber.

Optionally, the angle between the plane where the air outlet of the second cooling pipeline 32 is located and the top wall 11 of the cavity may be 50°-70°.

Further optionally, the angle between the plane where the air outlet of the second cooling pipeline 32 is located and the top wall 11 of the cavity may be 60°.

As shown in Fig. 2 and Fig. 3, in a preferred embodiment of the present invention, the barrier element 4 may include two arc-shaped barrier plates 41, and the two arc-shaped barrier plates 41 are distributed on the same circumference, and relative to the Arranged radially symmetrically, the space between each arc-shaped barrier plate 41 and the side wall 12 of the cavity 1 is the above-mentioned edge cooling space 11b; the first cooling pipeline 31 and the plurality of second cooling pipelines 32 are spaced apart along the above-mentioned circumference They are arranged in the edge cooling space 11b and extend along different radial directions of the above-mentioned circumference.

That is to say, through the two arc-shaped barrier plates 41, the above-mentioned accommodating space can be divided into an intermediate cooling space 11a and two edge cooling spaces 11b respectively located on both sides thereof, wherein the edge cooling space 11b is two arc-shaped barriers The space between the plates 41 and the two side walls 12 of the cavity 1, for example, as shown in Figure 2 and Figure 3, the inner arc surfaces of the two arc-shaped barrier plates 41 can be arranged opposite to each other to form a "cofferdam" In this case, the space between the inner arc surfaces of the two arc-shaped baffle plates 41 is the intermediate cooling space 11a, and the outer arc surfaces of the two arc-shaped baffle plates 41 are respectively connected to the two side walls of the cavity 1 The space between 12 is two edge cooling spaces 11b.

By connecting the first cooling pipeline 31 and the plurality of second cooling pipelines 32 to the fixing plate 2 , the first cooling pipeline 31 and the second cooling pipeline 32 can be installed on the cavity 1 through the fixing plate 2 . By arranging the first cooling pipeline 31 and the second cooling pipeline 32 at intervals along the arc direction of the two arc-shaped baffle plates 41 in the edge cooling space 11b, it is possible to make the first cooling pipeline 31 and the second cooling pipeline 32, the cooling gas blown into the edge cooling space 11b can flow along the arc direction of the arc-shaped barrier plate 41 to the edge of the edge cooling space 11b as a whole, forming a flow similar to a vortex (as shown by the arrow in FIG. 3 ).

Such a design is because the inventors of the present invention found that: in the prior art, when the cooling gas flows from the opposite sides to the middle, the flow velocity of the cooling gas flowing to the middle is reduced, which will cause the cooling gas to fail to flow to the arc-shaped baffle plate The arc top position of 41 (that is, the middle position) causes the arc top position of the arc-shaped barrier plate 41 to be unable to be cooled, causing the gold-plated layer in the arc-top area of the arc-shaped barrier plate 41 to crack or even fall off, and, as shown in the figure 3, the two side edges of the arc-shaped baffle plate 41 have a straight line portion, and there is a corner with a relatively large angle between the straight line portion and the arc-shaped portion of the arc-shaped baffle plate 41. When flowing, since the flow direction of the cooling gas will be parallel to the straight line portions of both sides of the arc-shaped baffle plate 41, the cooling gas may accumulate in the corner area, that is, the cooling gas flowing to the corner area is not easy to flow from the corner area. The corner area flows away, causing the flow velocity of the cooling gas in the corner area to be slow, and the cooling effect of the corner area is poor, causing the gold plating layer in the corner area to crack or even fall off.

The cooling device for the semiconductor process chamber provided by the embodiment of the present invention, on the one hand, blows cooling gas to the arc top position of the arc-shaped baffle plate 41 by means of the first cooling pipeline 31, and enables the cooling gas to pass through the arc-shaped baffle plate 41. The top position of the arc flows to the edges of both sides, which can avoid the situation that the cooling gas cannot flow to the top position of the arc-shaped blocking plate 41, thereby avoiding that the top position of the arc-shaped blocking plate 41 cannot be cooled, causing the arc-shaped blocking plate 41 The gold-plated layer at the arc top position cracks or even falls off, which can improve the cooling effect on the semiconductor process chamber and reduce the probability of cracks or even fall-off of the gold-plated layer on the outer surface of the cavity 1, thereby reducing the heat source of the semiconductor process chamber Reflection is affected, improving the service life of semiconductor process chambers. On the other hand, a plurality of second cooling pipelines 32 are used to blow cooling gas to both sides of the arc top position of the arc-shaped baffle plate 41, and make the cooling gas flow to the edge along the arc of the arc-shaped baffle plate 41, so that the cooling gas can be avoided. Deposition occurs in the corner area of the arc-shaped barrier plate 41, thereby improving the cooling effect on the corner area of the arc-shaped barrier plate 41, which in turn can improve the cooling effect on the semiconductor process chamber, and reduce the generation of gold-plated layers on the outer surface of the cavity 1 The probability of cracks or even falling off, thereby reducing the impact of heat source reflection in the semiconductor process chamber, and improving the service life of the semiconductor process chamber.

In a preferred embodiment of the present invention, the air outlet direction of the air outlet of the second cooling pipeline 32 is parallel to the tangent line of the above-mentioned circumference. 41 arc flow.

As shown in Fig. 5 and Fig. 7, in a preferred embodiment of the present invention, the channel of each cooling pipeline 3 is provided with a plurality of mutually isolated air outlet channels 35, and one end of the plurality of air outlet channels 35 extends To the air inlet of the cooling pipeline 3 and communicate with the corresponding through hole 21 , the other ends of the multiple air outlet channels 35 all extend to the air outlet of the cooling pipeline 3 .

Such a design can make the cooling gas enter the cooling pipeline 3 through the air inlet of the cooling pipeline 3, and then enter the plurality of air outlet channels 35 evenly, and then blow through the plurality of air outlet channels 35 from the air outlet to the cavity. body top wall 11, so that the cooling gas blown by the cooling pipeline 3 to the cavity top wall 11 can be evenly distributed on the cavity top wall 11, thereby further improving the uniformity of the cooling gas cooling cavity top wall 11, and then further Improve the cooling effect of the semiconductor process chamber, reduce the probability of cracks or even fall off of the gold-plated layer on the outer surface of the cavity 1, further reduce the impact of heat source reflection in the semiconductor process chamber, and further improve the service life of the semiconductor process chamber.

As shown in Figures 1 and 2, in a preferred embodiment of the present invention, a plurality of through holes 21 can be provided with inlet flanges 5 corresponding to each other, and the inlet flanges 5 are used to communicate with the gas source of the cooling gas , a flow regulating device (not shown in the figure) may be provided upstream of each intake flange 5 for correspondingly adjusting the flow of cooling gas passing into each cooling pipeline 3 .

That is to say, by arranging the inlet flanges 5 one by one on the plurality of through holes 21, and making the inlet flanges 5 communicate with the gas source of the cooling gas, the gas source of the cooling gas can be connected with the fixed plate 2, And the gas source of the cooling gas is communicated with the plurality of through holes 21 through the inlet flanges 5 provided one by one on the plurality of through holes 21, so that when the cooling device is cooling, the cooling gas provided by the gas source of the cooling gas Through the plurality of through holes 21 , the plurality of cooling pipelines 3 connected to the plurality of through holes 21 can be entered in a one-to-one correspondence. By setting a flow regulating device upstream of each inlet flange 5, the flow of cooling gas passing into each cooling pipeline 3 can be adjusted correspondingly by means of the flow regulating device, so that the corresponding chamber of the first cooling pipeline 31 can The area of the top wall 11 of the body and the area of the top wall 11 of the cavity corresponding to the second cooling pipeline 32 are used to adjust the flow rate of the cooling gas entering the first cooling pipeline 31 and the second cooling pipeline 32, and then can Properly dividing and adjusting the flow rates of the cooling gas in the first cooling pipeline 31 and the second cooling pipeline 32 can further improve the utilization rate of the cooling gas.

Optionally, the flow regulating component may include a wind speed regulating valve.

The embodiment of the present invention also provides a semiconductor process chamber, including a cavity 1 and a cooling device as provided in the embodiment of the present invention, wherein the cavity 1 has a cavity top wall 11 and four side walls 12, two of which are oppositely arranged A part of the side wall 12 protrudes from the top surface of the cavity top wall 11 . The cooling device is arranged on the cavity top wall 11 for cooling the cavity top wall 11 .

In the semiconductor process chamber provided by the embodiment of the present invention, by arranging the cooling device of the semiconductor process chamber provided by the embodiment of the present invention on the top wall 11 of the cavity, the cooling device of the semiconductor process chamber provided by the embodiment of the present invention can be used Cooling the top wall 11 of the cavity can improve the cooling effect of the semiconductor process chamber, thereby reducing the influence of heat source reflection in the semiconductor process chamber and improving the service life of the semiconductor process chamber.

In summary, the semiconductor process chamber cooling device and the semiconductor process chamber provided by the present invention can improve the cooling effect on the semiconductor process chamber, thereby reducing the impact of heat source reflection in the semiconductor process chamber and improving the efficiency of the semiconductor process chamber. chamber lifespan.

The foregoing content summarizes the features of several embodiments, so that those skilled in the art can better understand aspects of the present disclosure. Those skilled in the art should appreciate that they can readily use the present disclosure as a basis for designing or modifying other processes and structures for carrying out the same purposes and/or achieving the same advantages of the embodiments described herein. Those skilled in the art should also understand that such equivalent constructions do not depart from the spirit and scope of the present disclosure, and that they can make various changes, substitutions and alterations herein without departing from the spirit and scope of the present disclosure.

1: Cavity 2: Fixed plate 3: Cooling pipeline 4: Barrier components 5: Inlet flange 6: cooling device 7: cofferdam 11a: Intermediate cooling space 11b: Edge Cooling Space 21: Through hole 31: The first cooling pipeline 32: Second cooling pipeline 33: Main pipeline 34: Intake pipe 35: Outlet channel 41: Curved barrier 121: protruding part

Aspects of the present disclosure are best understood from the following detailed description when read with the accompanying drawings. It should be noted that, in accordance with the standard practice in the industry, various components are not drawn to scale. In fact, the dimensions of the various components may be arbitrarily increased or decreased for clarity of discussion. 1 is a schematic diagram of a three-dimensional structure of a cooling device for a semiconductor process chamber and a semiconductor process chamber provided by an embodiment of the present invention; FIG. 2 is a schematic diagram of the front structure of the cooling device of the semiconductor process chamber and the semiconductor process chamber provided by the embodiment of the present invention; Fig. 3 is a top view sectional structure schematic diagram of the A-A direction of Fig. 2; Fig. 4 is a schematic structural diagram of an intermediate cooling component provided by an embodiment of the present invention; Fig. 5 is a schematic cross-sectional structure diagram of the C-C direction of Fig. 4; FIG. 6 is a schematic structural diagram of an edge cooling component provided by an embodiment of the present invention; Fig. 7 is a schematic cross-sectional structural diagram of the B-B direction of Fig. 6; FIG. 8 is a schematic top view of a conventional semiconductor process chamber cooling device and the semiconductor process chamber.

3: Cooling pipeline

4: Barrier components

11a: Intermediate cooling space

11b: Edge Cooling Space

31: The first cooling pipeline

32: Second cooling pipeline

41: Curved barrier

Claims (11)

A cooling device for a semiconductor process chamber, which is arranged on the top wall of the semiconductor process chamber and is used to cool the top wall of the cavity. The cooling device includes a fixed plate, a plurality of cooling pipelines and a barrier assembly ,in: The fixing plate is relatively arranged above the top wall of the cavity, and the fixing plate, the top wall of the cavity and the side walls of the cavity form an accommodating space; The barrier element is arranged between the fixing plate and the top wall of the cavity, and divides the accommodating space into an intermediate cooling space and two edge cooling spaces respectively located on both sides thereof; A plurality of the cooling pipelines are arranged at intervals at different positions in each of the edge cooling spaces; a plurality of through holes are opened on the fixing plate, and the air inlets of the plurality of cooling pipelines are connected with the plurality of through holes one by one. Correspondingly connected; the air outlet of the cooling pipeline is used to blow cooling gas into the edge cooling space. The cooling device according to claim 1, wherein each of the cooling pipelines includes a main pipe arranged parallel to the direction extending from the center of the top wall of the cavity to the edge, and the pipe wall of the main pipe is opened with The vent. The cooling device according to claim 2, wherein the air outlet is strip-shaped, and the two ends of the air outlet in the length direction extend to positions close to the two ends of the main duct respectively. The cooling device as claimed in item 2, wherein each of the cooling pipelines also includes an air inlet pipe, one end of the air inlet pipe is used as an air inlet of the cooling pipeline, and the other end of the air inlet pipe is connected to the One end of the main pipeline is connected, and the other end of the main pipeline is a plugged end; a bent pipe section is arranged at the joint between the air inlet pipeline and the main pipeline. The cooling device according to any one of claim items 1-4, wherein, each of the channels of the cooling pipeline is provided with a plurality of mutually isolated air outlet channels, and one end of the plurality of air outlet channels extends to The air inlet of the cooling pipeline communicates with the corresponding through hole, and the other ends of the plurality of air outlet channels extend to the air outlet of the cooling pipeline. The cooling device as claimed in claim 1, wherein each of the plurality of cooling lines in the edge cooling space includes a first cooling line and a plurality of second cooling lines, wherein: The first cooling pipeline is arranged in the middle of the edge cooling space, and the air outlet direction of the first cooling pipeline is vertical to the top wall of the cavity; A plurality of the second cooling pipelines are symmetrically arranged on both sides of the first cooling pipeline, the air outlet direction of the second cooling pipeline has an included angle with the top wall of the cavity, and the second cooling pipeline The air outlet direction of the air outlet is obliquely set away from the first cooling pipeline. The cooling device according to claim 6, wherein the barrier assembly includes two arc-shaped barrier plates, the two arc-shaped barrier plates are distributed on the same circumference, and are arranged symmetrically relative to the radial direction of the circumference, each of the The space between the arc-shaped baffle plate and the side wall of the cavity is the edge cooling space; the first cooling pipeline and a plurality of the second cooling pipelines are arranged at intervals along the circumference in the edge cooling space, and Different radial extensions along the circumference. The cooling device according to claim 7, wherein the air outlet direction of the air outlet of the second cooling pipeline is parallel to the tangent of the circumference. The cooling device according to claim 6, wherein the angle between the plane where the air outlet of the second cooling pipeline is located and the top wall of the cavity is 50°-70°. The cooling device as claimed in item 1, wherein, a plurality of the through holes are provided with an inlet flange corresponding to each other, and the inlet flange is used to communicate with the gas source of the cooling gas, and each inlet method A flow regulating device is provided upstream of the flanges for correspondingly adjusting the flow of the cooling gas passing into each of the cooling pipelines. A semiconductor process chamber, which includes a cavity and the cooling device according to any one of claims 1-10, wherein the cavity has a cavity top wall and four side walls, two of which are opposite to each other A part of the side wall protrudes from the top surface of the cavity top wall.