CN218333771U

CN218333771U - Encapsulation triode that heat dispersion is high

Info

Publication number: CN218333771U
Application number: CN202222395227.3U
Authority: CN
Inventors: 郭嘉洪; 郭嘉创; 郭嘉智
Original assignee: Yipeixin City Shenzhen Electronic Technology Co ltd
Current assignee: Yipeixin City Shenzhen Electronic Technology Co ltd
Priority date: 2022-09-08
Filing date: 2022-09-08
Publication date: 2023-01-17
Anticipated expiration: 2032-09-08

Abstract

The utility model belongs to the technical field of the triode, a encapsulation triode that heat dispersion is high is disclosed, including the encapsulation main part, the pin subassembly is installed to the bottom of encapsulation main part, and the back of encapsulation main part installs the installation film, the table wall symmetry of installation film is installed and is used for and encapsulates the clamp splice of main part area of contact, the both sides department that installation film table wall is located the encapsulation main part all installs the extension fin, the diapire of installation film and the diapire of extension fin are located the coplanar, the utility model discloses set up the installation film, and the clamp splice that is used for fixed sealing the main part position has all been installed to the both sides of installation film, and the both sides department that the installation film is located the clamp splice has all set up the extension fin, and the diapire of extension fin and the diapire of installation film are located the coplanar, during the use, increase heat conduction effect with the help of clamp splice and exhibition fin, improve heat dispersion of heat dispersion subassembly with the help of quick heat conduction effect.

Description

Encapsulation triode that heat dispersion is high

Technical Field

The utility model belongs to the technical field of the triode, concretely relates to encapsulation triode that heat dispersion is high.

Background

The triode is a semiconductor device for controlling current, mainly plays a role of amplifying a weak signal into an electric signal with a larger amplitude, and is structurally characterized in that two PN junctions which are very close to each other are manufactured on a semiconductor substrate, the whole semiconductor is divided into three parts by means of the two PN junctions, and the PNP and NPN are wrapped in the arrangement mode of the two PN junctions.

Because the triode can produce certain heat when using, consequently in order to avoid the triode overheated, can install it on heat radiation structure through the heat conduction material, but current mounting structure's heat conduction effect is relatively poor to reduced heat radiation structure's effective heat dispersion, and the pin is because needs satisfy the welding demand, can carry out certain range bending usually, and before welding circuit, the stitch that can buckle probably receives to lead to after the extrusion to buckle excessively, thereby the condition that can't satisfy the welding demand appears.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a encapsulation triode that heat dispersion is high to solve the relatively poor and stitch problem of buckling easily before the welding of heat conduction effect of current triode mounting structure.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a encapsulation triode that heat dispersion is high, includes the encapsulation main part, the pin subassembly is installed to the bottom of encapsulation main part, and the back of encapsulation main part installs the installation film, the table wall symmetry of installation film is installed and is used for and encapsulates the clamp splice of main part area of contact, installation film table wall is located the both sides department of encapsulation main part and all installs the extension fin, the diapire of installation film and the diapire of extension fin are located the coplanar.

Preferably, a packaging opening is formed in the surface wall of the packaging main body, and a mounting hole is formed in the mounting base plate.

Preferably, the pin assembly includes a first pin, a second pin and a third pin, and the second pin is located between the first pin and the third pin.

Preferably, one end of the packaging body, which is located at the pin assembly, is provided with a protective shell, and the protective shell can wrap the pin assembly.

Preferably, one end of the protective shell close to the packaging main body is provided with two clamping pieces, and the clamping pieces are fixedly connected with the protective shell.

Preferably, the clamping pieces are made of a tough material, and the packaging main body is clamped between the two clamping pieces, so that the protective shell can be connected with the packaging main body in a clamping manner.

Compared with the prior art, the utility model, following beneficial effect has:

(1) The utility model discloses the installation film has been set up, and the clamp splice that is used for fixed sealing the main part position has all been installed to the both sides of installation film, the both sides department that the installation film is located the clamp splice has all set up the extension fin, and the diapire of extension fin and installation film is located the coplanar, during the use, increase with the help of the clamp splice area of contact of encapsulation main part, thereby improve the heat conduction effect of installation film to the encapsulation main part, and the extension fin then increases and radiator unit's area of contact, with this area of contact of increase installation film to radiator unit, improve radiator unit's heat dispersion with the help of quick heat conduction effect.

(2) The utility model discloses set up the protecting crust, and the tip of protecting crust has set up the holding piece of symmetry, during the use, embolia the protecting crust from the bottom of encapsulation main part for the pin is located the inside of protective housing, fixes the protective sheath in the bottom of encapsulation main part with the help of the holding piece at last, protects the pin through the protective sheath, avoids impaired before the pin welding.

Drawings

Fig. 1 is a schematic structural view of the present invention;

FIG. 2 is a front view of a mounting plate of the present invention;

FIG. 3 is a top view of a mounting plate of the present invention;

FIG. 4 is a side view of the protective shell of the present invention;

in the figure: 1. mounting holes; 2. installing a bottom plate; 3. a package body; 4. an expansion flap; 5. a clamping block; 6. a protective shell; 7. a first pin; 8. a second pin; 9. a third pin; 10. a clamping piece; 11. and (6) packaging the opening.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts all belong to the protection scope of the present invention.

Referring to fig. 1 to 3, the package structure includes a package body 3, a pin assembly is mounted at the bottom of the package body 3, a mounting base plate 2 is mounted at the back of the package body 3, clamping blocks 5 for contacting the package body 3 are symmetrically mounted on the surface wall of the mounting base plate 2, extension fins 4 are mounted on the surface wall of the mounting base plate 2 at two sides of the package body 3, and the bottom wall of the mounting base plate 2 and the bottom wall of the extension fins 4 are located on the same plane.

Through the technical scheme;

clamp splice 5, extension fin 4 and installation film 2 formula structure as an organic whole, and all adopt the heat conduction material, during the use, increase installation film 2 and packaging main part 3 area of contact with the help of clamp splice 5 and improve the heat conduction effect, and installation film 2 has improved under the effect of extension fin 4 with heat radiation structure's area of contact, the heat conduction effect has been improved equally, thereby packaging main part 3 to heat radiation structure's heat conduction effect has been improved, and then heat radiation structure's heat dispersion is improved, avoid because installation film 2 heat conduction effect is relatively poor and can't exert heat radiation structure's heat dispersion.

Referring to fig. 1 and 4, a protective shell 6 is disposed at one end of the package body 3 located at the pin assembly, the protective shell 6 can wrap the pin assembly, two clamping pieces 10 are disposed at one end of the protective shell 6 close to the package body 3, the clamping pieces 10 are fixedly connected to the protective shell 6, the clamping pieces 10 are made of a flexible material, and the package body 3 is clamped between the two clamping pieces 10, so that the protective shell 6 can be connected to the package body 3 in a clamping manner.

Through the technical scheme;

protective housing 6 is the cavity form, can cover first pin 7, second pin 8 and third pin 9 together, and after the triode was made and is accomplished, inserts protective housing 6 from 3 pin ends of encapsulation main part, plays the clamping effect to encapsulation main part 3 until two holding pieces 10, with the help of the fixed protective housing 6 of clamping effect, protects the pin through protective housing 6 at last, avoids the pin to receive destruction before the welding.

Referring to fig. 1 and 2, a package opening 11 is formed in a surface wall of the package body 3, a mounting hole 1 is formed in the mounting base plate 2, the lead assembly includes a first lead 7, a second lead 8 and a third lead 9, the second lead 8 is located between the first lead 7 and the third lead 9, the package body 3 can be packaged by plastic, and is used for packaging semiconductor materials, and the first lead 7, the second lead 8 and the third lead 9 respectively contact an emitter, a base and a collector.

The utility model discloses a theory of operation and use flow: use the utility model discloses the time, install encapsulation main part 3 and be located the position between two clamp splice 5 at installation film 2 table wall, then use mounting structure to fix it on radiator unit from mounting hole 1 department, because clamp splice 5 has increased and encapsulation main part 3's area of contact, consequently, the heat conduction effect to encapsulation main part 3 has been improved, and extension fin 4 has increased and radiator unit's area of contact, can be quick with the heat transfer on the encapsulation main part 3 to radiator unit dispels the heat, with this heat dispersion that improves the triode, embolia protecting sheathing 6 from encapsulation main part 3's pin end, make its parcel first pin 7, second pin 8 and third pin 9, fix the bottom at encapsulation main part 3 with the help of the centre gripping piece 10 centre gripping at last, protect the pin with the help of protecting sheathing 6, avoid the pin to receive destruction before the welding.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a encapsulation triode that heat dispersion is high which characterized in that: the packaging structure comprises a packaging main body (3), wherein a pin component is installed at the bottom of the packaging main body (3), and an installation bottom plate (2) is installed at the back of the packaging main body (3);

the surface wall of the installation bottom plate (2) is symmetrically provided with clamping blocks (5) used for being in contact with the packaging main body (3);

the surface wall of the installation bottom sheet (2) is provided with expansion fins (4) at the two sides of the packaging main body (3);

the bottom wall of the installation bottom sheet (2) and the bottom wall of the expansion wing sheet (4) are positioned on the same plane.

2. The packaged triode with high heat dissipation performance according to claim 1, wherein: the surface wall of the packaging main body (3) is provided with a packaging opening (11), and the mounting bottom sheet (2) is internally provided with a mounting hole (1).

3. The packaged triode of claim 2, wherein the packaged triode comprises: the pin assembly comprises a first pin (7), a second pin (8) and a third pin (9), and the second pin (8) is located between the first pin (7) and the third pin (9).

4. The packaged triode of claim 3, wherein the transistor comprises: one end, located at the pin assembly, of the packaging main body (3) is provided with a protective shell (6), and the protective shell (6) can wrap the pin assembly.

5. The packaged triode of claim 4, wherein the transistor comprises: one end of the protective shell (6) close to the packaging main body (3) is provided with two clamping pieces (10), and the clamping pieces (10) are fixedly connected with the protective shell (6).

6. The packaged triode of claim 5, wherein the heat dissipation performance of the packaged triode is as follows: the clamping pieces (10) are made of flexible materials, and the packaging main body (3) is clamped between the two clamping pieces (10) so that the protective shell (6) can be connected with the packaging main body (3) in a clamping mode.