CN216849983U

CN216849983U - Packaging structure of double-colored COB

Info

Publication number: CN216849983U
Application number: CN202220509399.6U
Authority: CN
Inventors: 庞灵
Original assignee: Foshan Haoyi Photoelectric Technology Co ltd
Current assignee: Foshan Haoyi Photoelectric Technology Co ltd
Priority date: 2022-03-09
Filing date: 2022-03-09
Publication date: 2022-06-28
Anticipated expiration: 2032-03-09

Abstract

The utility model belongs to the field of chip packaging, in particular to a packaging structure of a double-color COB, which comprises an aluminum substrate, a chip body and a dam body assembly; a group of grooves is formed in the top side of the aluminum substrate; a chip body is fixedly connected in the groove; the groove is a trapezoidal groove; a pair of insulating layers is fixedly connected to the top side of the aluminum substrate; the pair of insulating layers are positioned on two sides of the groove; a copper sheet is fixedly connected to the top side of the insulating layer; the top of the chip body is fixedly connected with a fluorescent glue layer; a temperature equalizing plate is fixedly connected to the bottom side of the aluminum substrate; the dam body assembly is positioned on the top of the aluminum substrate, so that the heat dissipation effect can be improved; through being equipped with the temperature-uniforming plate at aluminium base board bottom side to this can go out the heat transfer of aluminium base board and chip body corresponding position department, with this radiating area that can increase, thereby improve the radiating effect, reduce the temperature of chip body during operation, and then protect the chip.

Description

Packaging structure of double-colored COB

Technical Field

The utility model relates to a chip package field specifically is a packaging structure of double-colored COB.

Background

The COB package is one of chip package technologies, and a chip is directly adhered to a substrate through a fluorescent glue to be packaged and fixed.

The COB packaging technology is widely applied to packaging of LED light sources and mainly comprises an aluminum substrate, copper sheets and bonding wires, wherein a chip is fixed on the aluminum substrate through fluorescent glue, the copper sheets are arranged on two sides of the aluminum substrate, and the copper sheets are electrically connected with the chip through the bonding wires.

However, when the chip is used for a long time, the chip generates heat, the heat can cause the working temperature of the chip to rise, and when the chip is used for a long time, the service life of the chip can be influenced; therefore, a dual-color COB package structure is proposed to solve the above problems.

SUMMERY OF THE UTILITY MODEL

In order to compensate prior art's not enough, when solving the long-term use, the chip can produce the heat, and these heats can lead to chip operating temperature to rise, and when using for a long time, it can influence the life's of chip problem, the utility model provides a double-colored COB's packaging structure.

The utility model provides a technical scheme that its technical problem adopted is: the utility model relates to a double-color COB packaging structure, which comprises an aluminum substrate, a chip body and a dam body assembly; a group of grooves is formed in the top side of the aluminum substrate; a chip body is fixedly connected in the groove; the groove is a trapezoidal groove; a pair of insulating layers is fixedly connected to the top side of the aluminum substrate; the pair of insulating layers are positioned on two sides of the groove; a copper sheet is fixedly connected to the top side of the insulating layer; the top of the chip body is fixedly connected with a fluorescent glue layer; a temperature equalizing plate is fixedly connected to the bottom side of the aluminum substrate; the dam body assembly is positioned on the top of the aluminum substrate, so that the heat dissipation effect can be improved.

Preferably, the dam assembly comprises a box dam; a fixed block is fixedly connected to the top side of the aluminum substrate; an installation groove is formed in the fixed block; the copper sheet penetrates through the mounting groove; a cross rod is fixedly connected to the top end of the fixed block; through holes are formed in the positions, corresponding to the cross rods, of the box dams; the cross rod penetrates through the through hole and is connected with the through hole in a sliding mode; the fluorescent glue layer is positioned between the pair of weirs.

Preferably, a group of fixing hooks is fixedly connected to the inner side wall of the through hole; an elastic ring is fixedly connected to the surface of the cross rod and the position corresponding to the fixed hook; one side of the elastic ring, which is far away from the chip body, is provided with a notch, so that the box dam can be fixed.

Preferably, one end of the through hole close to the fixing column is fixedly connected with a guide groove; the guide groove is designed into a circular truncated cone-shaped structure; the elastic ring is made of rubber materials, so that the box dam can be conveniently installed.

Preferably, a graphene heat conduction layer is fixedly connected to the bottom side of the temperature equalization plate; a heat dissipation plate is fixedly connected to the bottom side of the graphene heat conduction layer; the heat dissipation plate is provided with a group of first heat dissipation grooves; one side of the box dam, which is far away from the fluorescent glue layer, is provided with a group of second heat dissipation grooves, so that the heat dissipation effect can be further improved.

Preferably, the heat dissipation plate is provided with a group of fixing grooves; a pair of copper plates are connected in the fixing grooves in a sliding manner; and a copper pipe is fixedly connected between the pair of copper plates.

Preferably, a pair of support rods is fixedly connected to the bottom side of the heat dissipation plate; the supporting rod is an L-shaped rod; the supporting rod is connected with a baffle in a sliding manner; a through groove is formed in the position, corresponding to the fixing groove, of the baffle; and a copper rod is fixedly connected in the through groove so as to shield the fixed groove.

Preferably, a fixing strip is fixedly connected to one side of the copper plate, which is far away from the copper pipe; the fixing strip is made of rubber; the fixing strip is positioned at the bottom of the copper plate, so that the copper plate can be fixed.

Preferably, a pair of third heat dissipation grooves are symmetrically formed in two sides of the first heat dissipation groove; the section of the third heat dissipation groove is triangular, so that the heat dissipation effect can be further improved.

Preferably, the copper pipe is designed in a spiral structure.

The utility model discloses an useful part lies in:

1. the utility model discloses a be equipped with the temperature equalization board in aluminium base board bottom side to this can go out aluminium base board and the heat transfer of chip body correspondence position department, with this can increase radiating area, thereby improves the radiating effect, reduces the temperature of chip body during operation, and then protects the chip.

2. The utility model discloses a set up graphite alkene heat-conducting layer and heating panel, when using, the samming board can be with heat transfer to graphite alkene heat-conducting layer, then on the heating panel of conduction again, rely on the area of contact that first radiating groove can increase heating panel and air to can improve the radiating effect.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.

FIG. 1 is a schematic diagram of an aluminum substrate according to a first embodiment;

FIG. 2 is an enlarged view of a portion of FIG. 1 at A;

FIG. 3 is an enlarged view of a portion of FIG. 1 at B;

fig. 4 is a schematic structural view of a cross bar according to the first embodiment.

In the figure: 11. an aluminum substrate; 111. a temperature equalizing plate; 12. a groove; 13. a chip body; 14. an insulating layer; 15. a copper sheet; 16. a fluorescent glue layer; 21. a fixed block; 22. a cross bar; 23. a box dam; 31. a fixed hook; 32. an elastic ring; 33. notching; 4. a guide groove; 51. a graphene heat conducting layer; 52. a heat dissipation plate; 53. a first heat sink; 54. a second heat sink; 62. a copper plate; 63. a copper pipe; 71. a baffle plate; 72. a strut; 73. a copper rod; 8. a fixing strip; 9. and a third heat sink.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

Specific examples are given below.

Referring to fig. 1-4, a dual-color COB package structure includes an aluminum substrate 11, a chip body 13, and a dam assembly; a group of grooves 12 are formed in the top side of the aluminum substrate 11; a chip body 13 is fixedly connected in the groove 12; the groove 12 is a trapezoidal groove; a pair of insulating layers 14 is fixedly connected to the top side of the aluminum substrate 11; a pair of the insulating layers 14 are positioned at two sides of the groove 12; a copper sheet 15 is fixedly connected to the top side of the insulating layer 14; the top of the chip body 13 is fixedly connected with a fluorescent glue layer 16; a temperature equalizing plate 111 is fixedly connected to the bottom side of the aluminum substrate 11; the dam body assembly is positioned on the top of the aluminum substrate 11; the dam assembly comprises a box dam 23; a fixed block 21 is fixedly connected to the top side of the aluminum substrate 11; an installation groove is formed in the fixed block 21; the copper sheet 15 penetrates through the mounting groove; a cross rod 22 is fixedly connected to the top end of the fixed block 21; through holes are formed in the positions, corresponding to the cross bars 22, of the box dams 23; the cross rod 22 penetrates through the through hole and is connected with the through hole in a sliding mode; the fluorescent glue layer 16 is positioned between the pair of weirs 23; when the packaging structure is used, the copper sheet 15 is connected with the chip body 13 through a bonding wire, the copper sheet 15 is connected with a circuit, power is supplied to the chip body 13, when the packaging structure is installed, a worker aligns the through hole of the dam 23 with the cross rod 22, then the cross rod 22 penetrates through the through hole, the dam 23 can be positioned, fluorescent glue is injected between the two dams 23, packaging of the chip body 13 is completed, the temperature equalization plate 111 is arranged on the bottom side of the aluminum substrate 11, heat of the corresponding positions of the aluminum substrate 11 and the chip body 13 can be transferred out, the heat dissipation area can be increased, the heat dissipation effect is improved, the working temperature of the chip body 13 is reduced, and the chip is protected.

As an embodiment of the present invention, a set of fixing hooks 31 is fixedly connected to the inner side wall of the through hole; an elastic ring 32 is fixedly connected to the surface of the cross bar 22 at a position corresponding to the fixed hook 31; one side of the elastic ring 32, which is far away from the chip body 13, is provided with a notch 33; one end of the through hole close to the fixed column is fixedly connected with a guide groove 4; the guide groove 4 is designed into a circular truncated cone-shaped structure; the elastic ring 32 is made of rubber; when using, insert horizontal pole 22 in the through-hole, male in-process, the inclined plane of fixed hook 31 can extrude elastic ring 32, make it deform, lack groove 33 and be used for elastic ring 32 deformation, thereby make fixed hook 31 insert in the through-hole, after inserting certain distance, elastic ring 32 extends, then it blocks fixed hook 31, make horizontal pole 22 be difficult for extracting, with this can fix box dam 23, make it be difficult for taking place to drop, through setting up guide way 4, with this can be convenient for insert horizontal pole 22 in the through-hole.

As an embodiment of the present invention, the bottom side of the temperature equalizing plate 111 is fixedly connected with a graphene heat conducting layer 51; a heat dissipation plate 52 is fixedly connected to the bottom side of the graphene heat conduction layer 51; the heat dissipation plate 52 is provided with a group of first heat dissipation grooves 53; a group of second heat dissipation grooves 54 are formed in one side, far away from the fluorescent glue layer 16, of the box dam 23; when using, the temperature equalization board 111 can be with heat transfer to graphite alkene heat-conducting layer 51, then on the heating panel 52 of conduction again, rely on first radiating groove 53 can increase the area of contact of heating panel 52 and air to can improve the radiating effect, through setting up second radiating groove 54, with this area of contact that can increase box dam 23 and air, thereby the heat of being convenient for is gone on the effluvium from box dam 23.

As an embodiment of the present invention, a set of fixing slots is disposed on the heat dissipation plate 52; a pair of copper plates 62 are connected in the fixing grooves in a sliding manner; a copper pipe 63 is fixedly connected between the pair of copper plates 62; a pair of support rods 72 are fixedly connected to the bottom side of the heat dissipation plate 52; the support rod 72 is an L-shaped rod; the supporting rod 72 is connected with a baffle 71 in a sliding way; a through groove is formed in the position, corresponding to the fixing groove, of the baffle 71; a copper rod 73 is fixedly connected in the through groove; a fixing strip 8 is fixedly connected to one side of the copper plate 62 away from the copper pipe 63; the fixing strip 8 is made of rubber; the fixing strip 8 is positioned at the bottom of the copper plate 62; when the copper plate 62 is installed, a worker inserts the copper plate 62 into the fixing groove, then inserts the baffle plate 71 into the support rod 72, the copper plate 62 is fixed from the bottom side by means of the baffle plate 71, so that the installation of the copper pipe 63 is completed, when the copper plate is used, heat is transmitted to the copper plate 62 through the heat dissipation plate 52, then the heat is transmitted to the copper pipe 63, the contact area between the copper pipe 63 and air is increased by means of the copper pipe 63, so that the heat dissipation effect can be improved, the baffle plate 71 is made of copper materials, the copper rod 73 is used for shielding the fixing groove, so that the transportation process is reduced, the radiating pipe is hooked by corners of other parts, by means of the fixing strip 8, by means of friction between the fixing strip 8 and the fixing groove, the copper plate 62 can be simply fixed, and the baffle plate 71 is convenient to assemble.

As an embodiment of the present invention, a pair of third heat dissipation grooves 9 are symmetrically formed on both sides of the first heat dissipation groove 53; the section of the third heat dissipation groove 9 is triangular; when the heat dissipation structure is used, the contact area between the heat dissipation structure and the air can be increased by arranging the third heat dissipation groove 9, so that the heat dissipation effect is improved, and the contact area between the heat dissipation structure and the air can be increased by the spiral structural design of the copper pipe 63; the copper tube 63 is designed to have a spiral structure.

The working principle is that when in use, the copper sheet 15 is connected with the chip body 13 through a bonding wire, the copper sheet 15 is connected with a circuit to supply power to the chip body 13, when in installation, a worker aligns the through hole of the dam 23 with the cross rod 22, then passes the cross rod 22 through the through hole to position the dam 23, then injects fluorescent glue between the two dams 23 to complete the packaging of the chip body 13, the temperature equalizing plate 111 is arranged at the bottom side of the aluminum substrate 11 to transfer heat at the corresponding positions of the aluminum substrate 11 and the chip body 13, so as to increase the heat dissipation area, thereby improving the heat dissipation effect, reducing the temperature of the chip body 13 during work and protecting the chip, when in use, the cross rod 22 is inserted into the through hole, during the insertion process, the inclined surface of the fixing hook 31 extrudes the elastic ring 32, the deformation is carried out, the slot 33 is used for the deformation of the elastic ring 32, so that the fixing hook 31 is inserted into the through hole, after the fixing hook is inserted into a certain distance, the elastic ring 32 extends, then the fixing hook 31 is clamped by the elastic ring, the cross rod 22 is not easy to pull out, the dam 23 can be fixed by the fixing hook, the dam 23 is not easy to fall off, the cross rod 22 can be conveniently inserted into the through hole by arranging the guide groove 4, the temperature equalizing plate 111 can transmit heat to the graphene heat conduction layer 51, then the contact area of the heat dissipation plate 52 and the air can be increased by the first heat dissipation groove 53 on the heat dissipation plate 52 which is conducted again, so that the heat dissipation effect can be improved, the contact area of the dam 23 and the air can be increased by arranging the second heat dissipation groove 54, so that the heat can be conveniently dissipated from the dam 23, when the fixing device is installed, a worker inserts the copper plate 62 into the fixing groove, then inserts the baffle 71 onto the support rod 72, rely on baffle 71 to fix copper 62 from the bottom side, with this installation to copper pipe 63 of accomplishing, when using, the heat passes through heating panel 52 and transmits, to copper 62 on, later transmit again on copper pipe 63, rely on copper pipe 63 increase and the area of contact of air, thereby can improve the radiating effect, baffle 71 is made for the copper product, copper pole 73 is used for sheltering from the fixed slot, with this reduce in the transportation, the cooling tube is caught to the corner of other parts, through setting up fixed strip 8, rely on friction between fixed strip 8 and the fixed slot, with this can simply fix copper 62, thereby be convenient for assemble baffle 71, can increase with air area of contact through setting up third radiating groove 9, thereby improve its radiating effect, through copper pipe 63 heliciform structural design, with this area of contact that can increase with the air.

In the description herein, references to the description of "one embodiment," "an example," "a specific example," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

The foregoing shows and describes the general principles, essential features, and advantages of the invention. It will be understood by those skilled in the art that the present invention is not limited to the above embodiments, and that the foregoing embodiments and descriptions are provided only to illustrate the principles of the present invention without departing from the spirit and scope of the present invention.

Claims

1. The utility model provides a packaging structure of double-colored COB which characterized in that: the dam comprises an aluminum substrate (11), a chip body (13) and a dam body assembly; a group of grooves (12) are formed in the top side of the aluminum substrate (11); a chip body (13) is fixedly connected in the groove (12); the groove (12) is a trapezoidal groove; a pair of insulating layers (14) is fixedly connected to the top side of the aluminum substrate (11); the pair of insulating layers (14) are positioned on two sides of the groove (12); a copper sheet (15) is fixedly connected to the top side of the insulating layer (14); the top of the chip body (13) is fixedly connected with a fluorescent glue layer (16); a temperature-equalizing plate (111) is fixedly connected to the bottom side of the aluminum substrate (11); the dam body assembly is positioned on the top of the aluminum substrate (11).

2. The dual-color COB package structure of claim 1, wherein: the dam assembly comprises a dam (23); a fixed block (21) is fixedly connected to the top side of the aluminum substrate (11); an installation groove is formed in the fixed block (21); the copper sheet (15) penetrates through the mounting groove; a cross rod (22) is fixedly connected to the top end of the fixed block (21); through holes are formed in the positions, corresponding to the cross rods (22), of the box dams (23); the cross rod (22) penetrates through the through hole and is connected with the through hole in a sliding mode; the fluorescent glue layer (16) is positioned between the pair of weirs (23).

3. The two-color COB packaging structure of claim 2, wherein: a group of fixed hooks (31) is fixedly connected to the inner side wall of the through hole; an elastic ring (32) is fixedly connected to the surface of the cross rod (22) at a position corresponding to the fixed hook (31); one side of the elastic ring (32) far away from the chip body (13) is provided with a notch (33).

4. The two-color COB packaging structure of claim 3, wherein: one end of the through hole close to the fixed column is fixedly connected with a guide groove (4); the guide groove (4) is designed into a circular truncated cone-shaped structure; the elastic ring (32) is made of rubber.

5. The packaging structure of a two-color COB according to claim 4, characterized in that: a graphene heat conduction layer (51) is fixedly connected to the bottom side of the temperature equalization plate (111); a heat dissipation plate (52) is fixedly connected to the bottom side of the graphene heat conduction layer (51); the heat dissipation plate (52) is provided with a group of first heat dissipation grooves (53); one side of the box dam (23) far away from the fluorescent glue layer (16) is provided with a group of second heat dissipation grooves (54).

6. The two-color COB packaging structure of claim 5, wherein: the heat dissipation plate (52) is provided with a group of fixing grooves; a pair of copper plates (62) are connected in the fixing grooves in a sliding manner; a copper pipe (63) is fixedly connected between the pair of copper plates (62).

7. The packaging structure of a two-color COB according to claim 6, characterized in that: a pair of supporting rods (72) is fixedly connected to the bottom side of the heat dissipation plate (52); the supporting rod (72) is an L-shaped rod; the supporting rod (72) is connected with a baffle (71) in a sliding way; a through groove is formed in the position, corresponding to the fixing groove, of the baffle (71); and a copper rod (73) is fixedly connected in the through groove.

8. The packaging structure of a two-color COB according to claim 7, characterized in that: a fixing strip (8) is fixedly connected to one side, away from the copper pipe (63), of the copper plate (62); the fixing strip (8) is made of rubber; the fixing strip (8) is positioned at the bottom of the copper plate (62).

9. The packaging structure of a two-color COB according to claim 8, characterized in that: a pair of third radiating grooves (9) are symmetrically formed in two sides of the first radiating groove (53); the section of the third heat dissipation groove (9) is triangular.

10. The packaging structure of a two-color COB according to claim 9, characterized in that: the copper pipe (63) is designed to be of a spiral structure.