CN218215268U - Ceramic case structure of brazing - Google Patents
Ceramic case structure of brazing Download PDFInfo
- Publication number
- CN218215268U CN218215268U CN202222095840.3U CN202222095840U CN218215268U CN 218215268 U CN218215268 U CN 218215268U CN 202222095840 U CN202222095840 U CN 202222095840U CN 218215268 U CN218215268 U CN 218215268U
- Authority
- CN
- China
- Prior art keywords
- frame
- brazing
- ceramic
- ceramic base
- base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Ceramic Products (AREA)
Abstract
The utility model discloses a ceramic package structure of brazing relates to the electron encapsulation field, including frame, ceramic base, bottom plate. In the structure of the utility model, the edge of the frame contacting with the frame solder is provided with the fillet, so that in the process of fixing the frame with the ceramic base by brazing, the melted frame solder can extend along with the fillet to be coated at the bottom of the frame, thereby effectively reducing the brazing stress; because the length and the width of the ceramic base are larger than those of the frame, a certain distance is reserved between the outer edge of the frame and the outer edge of the ceramic base in the process of fixing the frame and the ceramic base through brazing, so that the bad problem of offset can be avoided; simultaneously, can pile up at the frame and ceramic substrate's edge after the frame solder melts and form the portion of piling up, the portion of piling up cladding plays the supporting role at the fillet surface to the frame simultaneously, and the area of brazing this moment is bigger than the area of brazing of ordinary structure, can improve the cohesion of the face of brazing, makes the structure of brazing more stable.
Description
Technical Field
The utility model relates to an electronic packaging technology field, concretely relates to ceramic package structure of brazing.
Background
The ceramic has the advantages of corrosion resistance, stable chemical property and the like, and is widely applied to the field of electronic packaging. Since the ceramic itself has insulation, the products required for electronic packaging generally need to have a conductive function in order to combine the electronic chip with the ceramic. Therefore, it is necessary to make a metallization pattern on the ceramic for brazing the ceramic and the metal to form a ceramic case and then for electronic packaging.
As shown in fig. 1-4, the conventional ceramic package structure generally includes a ceramic 2', a frame 1', a frame solder 11', and the like, where the frame 1' is soldered to the ceramic 2' by the frame solder 11', and due to problems such as soldering stress, product structural stress, and the like, the ceramic package, especially at corners of the frame 1', is prone to cracking, shifting, and other defects, resulting in package product failure.
In view of this, the present inventors have made extensive conceptions for various defects and inconveniences caused by the incomplete improvement of the ceramic case design, and have actively studied, improved and tried to develop and design the present invention.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a ceramic package structure of brazing, stable in structure is difficult for fracture, skew.
In order to achieve the above purpose, the utility model discloses a solution is:
a ceramic shell brazing structure comprises a frame, frame welding flux is arranged at the bottom of the frame, and a fillet is arranged at an edge of the frame, which is in contact with the frame welding flux;
the ceramic base is arranged at the bottom of the frame, the frame is brazed with the ceramic base through frame solder, the length and the width of the ceramic base are larger than those of the frame, and the frame solder is melted and then stacked at the corners of the frame and the ceramic base to form a stacking part;
the base plate is provided with base plate welding flux and is brazed with the ceramic base through the base plate welding flux.
Furthermore, the radius of the fillet is 0.02-0.05 mm.
Further, the length and the width of the frame are at least 0.05mm smaller than those of the ceramic base.
Furthermore, a cavity for accommodating a product is arranged on the ceramic base.
Furthermore, the upper surface and the lower surface of the ceramic base are both provided with metallization patterns.
Furthermore, the ceramic shell further comprises a bipolar plate, the bipolar plate is provided with an electrode and a polar plate solder, the ceramic base is provided with two connecting holes corresponding to the electrodes on the bipolar plate, the bipolar plate is brazed with the ceramic base through the polar plate solder, and the height of the electrode is larger than the thickness of the ceramic base after brazing.
After the scheme is adopted, the edge of the frame in contact with the frame welding flux is provided with the fillet, so that in the process of fixing the frame and the ceramic base through brazing, the molten frame welding flux can extend along the fillet to be coated at the bottom of the frame, and the brazing stress can be effectively reduced; because the length and the width of the ceramic base are larger than those of the frame, a certain distance is reserved between the outer edge of the frame and the outer edge of the ceramic base in the process of fixing the frame and the ceramic base through brazing, so that the bad problem of offset can be avoided; simultaneously, because be equipped with the fillet on the frame, the frame be less than ceramic base length and width, consequently can pile up the formation portion of piling up in frame and ceramic base's edge after the frame solder melts, the cladding of the portion of piling up is on the fillet surface, plays the supporting role to the frame simultaneously, and the area of brazing this moment is bigger than the area of brazing of ordinary structure, can improve the cohesion of the face of brazing, makes the structure of brazing more stable.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
FIG. 1 is a schematic diagram of a prior art brazed product having poor cracking;
FIG. 2 is an enlarged view of a portion A of FIG. 1;
FIG. 3 is a schematic illustration of a prior art post-braze product misalignment;
FIG. 4 is a partial enlarged view of FIG. 3 at B;
FIG. 5 is an exploded view of a preferred embodiment of the present invention;
FIG. 6 is a schematic structural diagram of a preferred embodiment of the present invention;
FIG. 7 is an enlarged view of a portion of FIG. 6 at C;
FIG. 8 is a schematic view of solder containment after brazing in accordance with a preferred embodiment of the present invention;
fig. 9 is a partially enlarged view of fig. 8 at D.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention clearer, the technical solutions of the present invention will be described in detail below.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention. In the description of the present invention, "a plurality" means two or more unless otherwise specified.
As shown in fig. 5-9, the brazing structure for ceramic shell of the present invention comprises a frame 1, a frame solder 11 is disposed at the bottom of the frame 1, and a fillet 12 is disposed at the edge of the frame 1 contacting the frame solder 11; the ceramic base 2 is arranged at the bottom of the frame 1, the frame 1 is brazed with the ceramic base 2 through frame welding materials 11, and the length and the width of the ceramic base 2 are larger than those of the frame 1; after the frame solder 11 is melted, stacking at the corners of the frame 1 and the ceramic base 2 to form a stacking part 21; the base plate 3 is provided with a base plate solder 31, and the base plate 3 is brazed with the ceramic base 2 through the base plate solder 31.
The utility model discloses a structure is when production, brazes ceramic substrate 2 on bottom plate 3 through bottom plate solder 31, brazes frame 1 on ceramic substrate 2 through frame solder 11 again.
The key point of the utility model is that the edge of the frame 1 contacting with the frame solder 11 is provided with the fillet 12, so that in the process of fixing the frame 1 and the ceramic base 2 by brazing, the melted frame solder 11 can extend along with the fillet 12 and then coat the bottom of the frame 1, thereby effectively reducing the brazing stress; because the length and the width of the ceramic base 2 are larger than those of the frame 1, a certain distance is reserved between the outer edge of the frame 1 and the outer edge of the ceramic base 2 in the process of fixing the frame 1 and the ceramic base 2 through brazing, so that the bad problem of offset can be avoided; simultaneously, because be equipped with fillet 12 on the frame 1, the length and width of frame 1 is less than ceramic base 2's length and width, consequently can pile up formation pile up portion 21 in frame 1 and ceramic base 2's edge after frame solder 11 melts, pile up portion 21 cladding on fillet 12 surface, play the supporting role to frame 1 simultaneously, the area of brazing this moment is bigger than the area of brazing of ordinary structure, can improve the cohesion of the face of brazing, makes the structure of brazing more stable.
The radius of the fillet 12 is 0.02-0.05 mm. The radius of the fillet 12 is too small, the melted frame solder 11 is difficult to coat the bottom of the frame 1, and the radius of the fillet 12 is too large, so that the melted frame solder 11 is not easy to attach to the side edge of the bottom of the frame 1.
The length and width of the frame 1 are respectively less than the length and width of the ceramic base 2 by at least 0.05mm. The distance between the outer edge of the frame 1 and the outer edge of the ceramic base 2 is at least 0.05mm, so that the phenomenon that the stacking part 21 formed by stacking the melted frame welding flux 11 at the corners of the frame 1 and the ceramic base 2 is too thin can be avoided, and the stability of a brazing structure can be further ensured.
The ceramic base 2 is provided with a cavity 22 for accommodating a product. Products requiring electronic packaging may be placed in cavities 22 that are designed to be open.
The upper surface and the lower surface of the ceramic base 2 are provided with metallized patterns 23. The metallization pattern is used for ceramic to metal brazing.
The ceramic shell further comprises a bipolar plate 4, the bipolar plate 4 is provided with an electrode 41 and a polar plate solder 42, two connecting holes 24 are formed in the ceramic base 2 corresponding to the electrode 41 on the bipolar plate 4, the bipolar plate 4 is brazed with the ceramic base 2 through the polar plate solder 42, and the height of the brazed electrode 41 is larger than the thickness of the ceramic base 2. During production, after the electrode 41 on the polar plate passes through the connecting hole 24 on the ceramic base 2, the polar plate 4 and the ceramic base 2 are fixed by brazing, at this time, the height of the electrode 41 is greater than the thickness of the ceramic base 2, one end of the electrode 41 is higher than the surface of the ceramic base 2, and the electrode 41 is connected with a packaging product through gold wire bonding, so that the circuit conduction can be realized.
The principle and the implementation mode of the present invention are explained by applying specific examples in the present specification, and the above descriptions of the examples are only used to help understanding the method and the core idea of the present invention; meanwhile, for those skilled in the art, the idea of the present invention may be changed in the specific embodiments and the application range. In summary, the content of the present specification should not be construed as a limitation of the present invention.
Claims (6)
1. A ceramic case brazing structure is characterized in that: the frame welding flux is arranged at the bottom of the frame, and a fillet is arranged at the edge of the frame, which is in contact with the frame welding flux;
the ceramic base is arranged at the bottom of the frame, the frame is brazed with the ceramic base through frame welding flux, the length and the width of the ceramic base are larger than those of the frame, and the frame welding flux is melted and then is stacked at the corners of the frame and the ceramic base to form a stacking part;
the base plate is provided with base plate welding flux and is brazed with the ceramic base through the base plate welding flux.
2. The ceramic case brazing structure according to claim 1, wherein: the radius of the fillet is 0.02-0.05 mm.
3. The ceramic case brazing structure according to claim 1, wherein: the length and width of the frame are at least 0.05mm smaller than the length and width of the ceramic base.
4. The ceramic case brazing structure according to claim 1, wherein: and a cavity for accommodating a product is arranged on the ceramic base.
5. The ceramic case brazing structure according to claim 4, wherein: the upper surface and the lower surface of the ceramic base are both provided with metalized patterns.
6. The ceramic case brazing structure according to claim 5, wherein: the ceramic base is provided with two connecting holes corresponding to the electrodes on the two polar plates, the two polar plates are brazed with the ceramic base through the polar plate solders, and the height of the electrodes is larger than the thickness of the ceramic base after brazing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222095840.3U CN218215268U (en) | 2022-08-10 | 2022-08-10 | Ceramic case structure of brazing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222095840.3U CN218215268U (en) | 2022-08-10 | 2022-08-10 | Ceramic case structure of brazing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218215268U true CN218215268U (en) | 2023-01-03 |
Family
ID=84654964
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222095840.3U Active CN218215268U (en) | 2022-08-10 | 2022-08-10 | Ceramic case structure of brazing |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218215268U (en) |
-
2022
- 2022-08-10 CN CN202222095840.3U patent/CN218215268U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN109859948B (en) | Ceramic electronic component | |
| JP2000068414A (en) | Manufacture of lead-less package | |
| CN218215268U (en) | Ceramic case structure of brazing | |
| JP2015159204A (en) | ceramic package | |
| JP3620260B2 (en) | Electronic components | |
| JP2007234749A (en) | Manufacturing method of chip-shape solid electrolytic capacitor | |
| JP2008130946A (en) | Multiple patterning ceramic substrate, and ceramic wiring substrate and method of manufacturing the same | |
| WO2021097614A1 (en) | Integrated miniature welding plate structure and manufacturing process therefor | |
| US8618722B2 (en) | Piezoelectric resonator plate and manufacturing method for piezoelectric resonator plate | |
| JPH01319993A (en) | Connecting method for printed circuit board | |
| CN212517158U (en) | Welding tool for multilayer stacked soldering lug process of power module | |
| JP3923063B2 (en) | Package for semiconductor device and manufacturing method thereof | |
| CN210778574U (en) | DBC structure suitable for high-voltage power device module packaging | |
| CN218887491U (en) | Pluggable PIN type high-precision load sheet | |
| CN218004827U (en) | Novel ceramic multilayer packaging structure | |
| CN212628649U (en) | Welding disc copper sheet grooving structure for preventing small-package tombstone effect | |
| JP4511214B2 (en) | Electronic component storage package and electronic device | |
| JPH09172102A (en) | Packaging ceramic lid for electronic parts and manufacturing method | |
| CN217740979U (en) | Gold tin bonding pad structure | |
| CN219227953U (en) | Packaging structure | |
| CN216217792U (en) | Printing ink channel structure of ceramic circuit board | |
| CN220254459U (en) | Photovoltaic module | |
| CN117374014B (en) | Packaging base and preparation method thereof | |
| CN216749608U (en) | Paster capacitor | |
| JPS61214548A (en) | Tape carrier |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |