CN218200943U - COC double-suction-nozzle chip conveying mechanism - Google Patents
COC double-suction-nozzle chip conveying mechanism Download PDFInfo
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- CN218200943U CN218200943U CN202222357382.6U CN202222357382U CN218200943U CN 218200943 U CN218200943 U CN 218200943U CN 202222357382 U CN202222357382 U CN 202222357382U CN 218200943 U CN218200943 U CN 218200943U
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Abstract
The invention discloses a COC double-suction-nozzle chip conveying mechanism which comprises a vertical plate, wherein an installation plate is fixed on the vertical plate, a first linear slide rail and a second linear slide rail are installed on the installation plate, a first suction nozzle base and a second suction nozzle base are respectively arranged on the first linear slide rail and the second linear slide rail in a sliding mode, and a first suction nozzle and a second suction nozzle are respectively fixed on the first suction nozzle base and the second suction nozzle base; the first suction nozzle or the second suction nozzle comprises a suction nozzle frame fixed on a first suction nozzle base or a second suction nozzle base, a suction nozzle slide way capable of being matched with the suction nozzle to slide up and down is arranged at the front end of the suction nozzle frame, the tail end of the suction nozzle is fixed on a suction nozzle slide block, the suction nozzle slide block is arranged on the suction nozzle frame in a sliding mode up and down, an elastic mechanism is arranged between the suction nozzle slide block and the suction nozzle frame, and under a normal state, the elastic mechanism enables a port of the suction nozzle to have downward pressure. The invention has the advantages of synchronously carrying out finished product blanking and chip conveying and avoiding the excessive pressure of the suction nozzle port on the surface of the chip.
Description
Technical Field
The invention relates to the field of chip processing, in particular to a COC double-nozzle chip conveying mechanism capable of preventing a nozzle port from being excessively pressed on the surface of a chip.
Background
At present, with the rapid development of the optical communication industry, the integration level of chips is made higher and higher by a laser chip manufacturer, a COC eutectic machine is generally needed in the production and processing of COC chips, a conveying mechanism is needed to absorb a cushion block from a blue film and convey the cushion block to an eutectic table top during product processing, the cushion block is put down in a vacuum-broken manner, the chip is absorbed from the blue film by a chip conveying mechanism and conveyed to a COC correction table for correction, then the chip on the COC correction table is absorbed and conveyed to the position above a COC eutectic table module by a COC chip welding conveying mechanism, the cushion block is aligned to be pressed down, a discharging suction nozzle is responsible for absorbing the chip welded by the COC eutectic table and conveyed to a jade case of a COC jade case discharging mechanism to be put down, at least 4 conveying mechanisms are needed in the process, and the design of processing equipment can be influenced by the conveying mechanisms; meanwhile, the phenomenon that the nozzle port is excessively pressed on the surface of the chip to cause low yield of the finished product can occur during chip conveying and finished product conveying.
Disclosure of Invention
In order to overcome the defects of the prior art, the invention aims to provide a COC double-nozzle chip conveying mechanism to solve the problems that the conventional conveying mechanism is too much and nozzle ports are sometimes pressed on the surface of a chip excessively.
The purpose of the invention is realized by adopting the following technical scheme:
a COC double-suction-nozzle chip conveying mechanism comprises a vertical plate, wherein a mounting plate is fixed on the vertical plate, a first linear slide rail and a second linear slide rail are mounted on the mounting plate, a first suction nozzle base and a second suction nozzle base are respectively arranged on the first linear slide rail and the second linear slide rail in a sliding mode, and a first suction nozzle and a second suction nozzle are respectively fixed on the first suction nozzle base and the second suction nozzle base; the first suction nozzle or the second suction nozzle comprises a suction nozzle frame fixed on a first suction nozzle base or a second suction nozzle base, a suction nozzle slide way capable of being matched with the suction nozzle to slide up and down is arranged at the front end of the suction nozzle frame, the tail end of the suction nozzle is fixed on a suction nozzle slide block, the suction nozzle slide block is arranged on the suction nozzle frame in a sliding mode up and down, an elastic mechanism is arranged between the suction nozzle slide block and the suction nozzle frame, and under a normal state, the elastic mechanism enables a port of the suction nozzle to have downward pressure.
Preferably, the resilient means causes the nozzle port to be pressed downwardly by less than 50g.
Preferably, the elastic mechanism enables the downward pressure of the suction nozzle port to be 20-30g.
As a preferable mode, two mini bearings are respectively arranged on the upper side and the lower side of the suction nozzle slide way, and the tail part of the suction nozzle slide block is arranged in the slide groove of the suction nozzle frame in a sliding mode through one mini bearing.
Preferably, the first and second suction nozzles are arranged in mirror image.
As a preferable mode, the first nozzle base and the second nozzle base are respectively fixed with a first rack and a second rack, and the first rack and the second rack are respectively driven by a first motor and a second motor to slide up and down.
As a preferred mode, the first motor and the second motor are fixed on a motor mounting plate, and the motor mounting plate is fixed on a vertical plate.
Preferably, the first nozzle base and the second nozzle base are respectively fixed with a first nozzle and a second nozzle by a first nozzle mounting block and a second nozzle mounting block.
As a preferable mode, the vertical plate is installed on the Y-axis linear motor module through the suction nozzle extension plate.
Preferably, the first motor and the second motor are both stepper motors.
Compared with the prior art, the invention has the beneficial effects that:
according to the invention, one of the first suction nozzle and the second suction nozzle is moved to the upper part of the chip through XYZ axes and is tightly attached to the surface of the chip, and the vacuum tube connected to the tail end of the suction nozzle is controlled by the electromagnetic valve, so that when the vacuum tube is communicated with negative pressure, the port of the suction nozzle generates negative pressure suction force to suck the chip, and when the vacuum tube is communicated with positive pressure, the chip is put down by breaking vacuum; one of the first suction nozzle and the second suction nozzle is responsible for sucking chips on a blue film of the COC blue film feeding mechanism and then conveying the chips to a COC eutectic platform for welding, and the other suction nozzle is responsible for sucking the chips welded by the COC eutectic platform and conveying the chips to a jade case of the COC jade case feeding mechanism for putting down; the seamless connection of chip feeding and blanking is formed, and the operation efficiency is greatly improved. One end of the elastic mechanism of the suction nozzle is fixed on the suction nozzle sliding block, and the other end of the elastic mechanism of the suction nozzle is fixed on the suction nozzle frame, so that when the suction nozzle presses down to suck the chip and is stressed, the chip moves upwards under the action of the reaction force along the Z-axis, and the downward small pulling force of the elastic mechanism ensures that the suction nozzle is tightly attached to the chip but can not crush the surface of the chip.
Drawings
FIG. 1 is a schematic view of an overall structure of an embodiment of a COC double-nozzle chip conveying mechanism of the present invention;
FIG. 2 is an exploded view of an embodiment of the COC double nozzle chip carrying mechanism of the present invention;
fig. 3 is an exploded view of a nozzle of an embodiment of the COC double-nozzle chip carrying mechanism of the present invention.
Detailed Description
To facilitate an understanding of the invention, the invention will now be described more fully hereinafter with reference to the accompanying drawings. Preferred embodiments of the present invention are shown in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
A COC double-nozzle chip conveying mechanism, as shown in fig. 1 to 3, includes a vertical plate 9, a mounting plate 5 is fixed on the vertical plate 9, a first linear slide rail 4a and a second linear slide rail 4b are mounted on the mounting plate 5, a first nozzle base 3a and a second nozzle base 3b are respectively slidably disposed on the first linear slide rail 4a and the second linear slide rail 4b, and a first nozzle 1a and a second nozzle 1b are respectively fixed on the first nozzle base 3a and the second nozzle base 3 b; the first suction nozzle 1a or the second suction nozzle 1b comprises a suction nozzle frame 103 fixed on the first suction nozzle base 3a or the second suction nozzle base 3b, a suction nozzle slide 109 capable of matching with a suction nozzle 111 to slide up and down is arranged at the front end of the suction nozzle frame 103, the tail end of the suction nozzle 111 is fixed on a suction nozzle slide block 106, the suction nozzle slide block 106 is arranged on the suction nozzle frame 103 in a sliding manner up and down, an elastic mechanism is arranged between the suction nozzle slide block 106 and the suction nozzle frame 103, and under a normal state, the elastic mechanism enables a port of the suction nozzle 111 to have downward pressure.
One of a first suction nozzle 1a and a second suction nozzle 1b of the conveying mechanism moves to the position above a chip through XYZ axes and is tightly attached to the surface of the chip, and a port of the suction nozzle generates negative pressure suction to suck the chip when a vacuum tube connected to the tail end of the suction nozzle is communicated with negative pressure through control of an electromagnetic valve, and breaks vacuum to put down the chip when the vacuum tube is communicated with positive pressure; one of the first suction nozzle 1a and the second suction nozzle 1b is responsible for sucking chips on a blue film of a COC blue film feeding mechanism and then conveying the chips to a COC eutectic table for welding, and the other one of the first suction nozzle 1a and the second suction nozzle 1b is responsible for sucking the chips welded by the COC eutectic table and conveying the chips to a jade case of a COC jade case blanking mechanism for putting down; the seamless connection of chip feeding and blanking is formed, and the operation efficiency is greatly improved. The elastic mechanism of the suction nozzle is a tension spring (not shown in the figure) in the embodiment, a spring pull tab 108 is fixed on one side of the suction nozzle frame 103, one end of the tension spring is fixed in the bar-shaped groove 107 of the suction nozzle slide block 106, the other end of the tension spring is fixed on a drag hook of the spring pull tab 108, the suction nozzle 111 is not fixed on the suction nozzle frame 103, so when the suction nozzle 111 presses down to suck a chip and is stressed, the suction nozzle 111 moves upwards under the reaction force along the Z-axis direction, and the downward slight tension of the tension spring ensures that the suction nozzle 111 is tightly attached to the chip but does not crush the surface of the chip. Generally, the pressure is less than 50g, and in order to ensure that the chip is not damaged, the pressure is more suitable to be 20-30 g; when the force with which the nozzle port is pressed against the chip is larger than this force, the nozzle holder 103 brings the nozzle upward.
In an embodiment of a COC dual nozzle chip carrying mechanism, please refer to fig. 3, two mini bearings 110 are respectively disposed on an upper side and a lower side of a nozzle slide 109, a tail portion of the nozzle slide 106 is slidably disposed in a chute of the nozzle frame 103 through a mini bearing 101, for processing convenience, the chute is disposed on a limiting block 102 fixed to the nozzle frame 103, the nozzle frame 103 is further provided with a nozzle positioning push piece 104 corresponding to the nozzle slide 109, the nozzle positioning push piece 104 is provided with a waist-shaped hole, and is adjusted and fixed on the nozzle frame 103 through a screw 105 to adjust a depth of the nozzle positioning push piece extending into the nozzle slide 109, so that the COC dual nozzle chip carrying mechanism can be applied to nozzles with different diameters.
In an embodiment of a COC dual nozzle chip carrying mechanism, referring to fig. 1 and 2, a first nozzle 1a and a second nozzle 1b are arranged in a mirror image.
In an embodiment of a COC dual nozzle chip carrying mechanism, referring to fig. 1 and 2, a first rack 4a and a second rack 4b are fixed to a first nozzle base 3a and a second nozzle base 3b, respectively, and the first rack 4a and the second rack 4b are driven by a gear on a first stepping motor 7a and a gear on a second stepping motor 7b to slide up and down, respectively.
In an embodiment of a COC double nozzle chip carrying mechanism, referring to fig. 1 and 2, a first stepping motor 7a and a second stepping motor 7b are fixed to a motor mounting plate 8 fixed to a vertical plate.
In an embodiment of a COC dual nozzle chip carrying mechanism, referring to fig. 1 and 2, a first nozzle 1a and a second nozzle 1b are fixed to a first nozzle base 3a and a second nozzle base 3b by a first nozzle mounting block 2a and a second nozzle mounting block 2b, respectively.
In an embodiment of a COC dual nozzle chip carrying mechanism, referring to fig. 1 and 2, a vertical plate 9 is mounted on a Y-axis linear motor module 11 through a nozzle extension plate 10. The Y-axis linear motor module 11 drives the sliding block to move back and forth along the Y axis, and drives the suction nozzle extension plate 10 fixed on the sliding table to extend outwards.
The above description is only an embodiment of the present invention, and is not intended to limit the scope of the present invention, and all equivalent structures or equivalent processes performed by the present invention or directly or indirectly applied to other related technical fields are included in the scope of the present invention.
Claims (10)
1. A COC double-suction-nozzle chip conveying mechanism is characterized by comprising a vertical plate, wherein an installation plate is fixed on the vertical plate, a first linear slide rail and a second linear slide rail are installed on the installation plate, a first suction nozzle base and a second suction nozzle base are respectively arranged on the first linear slide rail and the second linear slide rail in a sliding mode, and a first suction nozzle and a second suction nozzle are respectively fixed on the first suction nozzle base and the second suction nozzle base; the first suction nozzle or the second suction nozzle comprises a suction nozzle frame fixed on a first suction nozzle base or a second suction nozzle base, a suction nozzle slide way capable of being matched with the suction nozzle to slide up and down is arranged at the front end of the suction nozzle frame, the tail end of the suction nozzle is fixed on a suction nozzle slide block, the suction nozzle slide block is arranged on the suction nozzle frame in a sliding mode up and down, an elastic mechanism is arranged between the suction nozzle slide block and the suction nozzle frame, and in a normal state, the elastic mechanism enables a port of the suction nozzle to have downward pressure.
2. The COC dual nozzle chip carrier mechanism of claim 1, wherein the resilient mechanism provides a nozzle port downward pressure of less than 50g.
3. The COC double-nozzle chip carrying mechanism as recited in claim 1, wherein the elastic mechanism enables the downward pressure of the nozzle port to be 20-30g.
4. The COC double-nozzle chip carrying mechanism as claimed in claim 1, wherein two mini-bearings are respectively disposed on the upper and lower sides of the nozzle slide way, and the tail of the nozzle slide block is slidably disposed in the slide groove of the nozzle holder through one mini-bearing.
5. The COC dual nozzle chip carrier mechanism of claim 1, wherein the first and second nozzles are arranged in mirror image.
6. The COC double-nozzle chip carrying mechanism as claimed in claim 1, wherein a first rack and a second rack are fixed to the first nozzle base and the second nozzle base, respectively, and the first rack and the second rack are driven by a first motor and a second motor to slide up and down, respectively.
7. The COC double nozzle chip carrier mechanism of claim 6, wherein the first motor and the second motor are fixed to a motor mounting plate, and the motor mounting plate is fixed to a vertical plate.
8. The COC double-nozzle chip carrying mechanism according to claim 1, wherein a first nozzle and a second nozzle are fixed to the first nozzle base and the second nozzle base by a first nozzle mounting block and a second nozzle mounting block, respectively.
9. The COC double-nozzle chip conveying mechanism according to claim 1, wherein the vertical plate is mounted on the Y-axis linear motor module through a nozzle extension plate.
10. The COC double nozzle chip handling mechanism of claim 6, wherein the first motor and the second motor are both stepper motors.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222357382.6U CN218200943U (en) | 2022-09-05 | 2022-09-05 | COC double-suction-nozzle chip conveying mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222357382.6U CN218200943U (en) | 2022-09-05 | 2022-09-05 | COC double-suction-nozzle chip conveying mechanism |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218200943U true CN218200943U (en) | 2023-01-03 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222357382.6U Active CN218200943U (en) | 2022-09-05 | 2022-09-05 | COC double-suction-nozzle chip conveying mechanism |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218200943U (en) |
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2022
- 2022-09-05 CN CN202222357382.6U patent/CN218200943U/en active Active
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