CN218200944U - COC chip welding and conveying mechanism - Google Patents
COC chip welding and conveying mechanism Download PDFInfo
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- CN218200944U CN218200944U CN202222357770.4U CN202222357770U CN218200944U CN 218200944 U CN218200944 U CN 218200944U CN 202222357770 U CN202222357770 U CN 202222357770U CN 218200944 U CN218200944 U CN 218200944U
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- nozzle
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- suction nozzle
- voice coil
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Abstract
The utility model discloses a COC chip welding removes send mechanism, including Y axle linear electric motor module, be fixed with the voice coil motor mounting panel on the Y axle linear electric motor module, voice coil motor mounting panel front end is fixed with Z to the fixed plate, Z is fixed with Z axle voice coil motor on to the fixed plate, Z is to still sliding on the fixed plate and being provided with the suction nozzle fixing base, Z axle voice coil motor's actuating shaft is connected and drive the suction nozzle fixing base and slide from top to bottom along Z to the fixed plate, Z still is provided with an elastic mechanism on to the fixed plate, the one end of elastic mechanism is fixed on Z fixes on the fixed plate the other end on the suction nozzle fixing base, be fixed with the suction nozzle portion on the suction nozzle fixing base, elastic mechanism's restoring force is greater than or equal to Z axle voice coil motor's drive shaft and the gravity of connector. The utility model has the advantages of the chip can not be damaged to the suction nozzle location accuracy.
Description
Technical Field
The utility model relates to a chip processing field especially relates to a COC chip welding transport mechanism that suction nozzle location is accurate can not harm the chip.
Background
At present, with the rapid development of the optical communication industry, the integration level of chips is made higher and higher by laser chip manufacturers, a COC eutectic machine is generally needed in the production and processing of COC chips, when products are processed, because various modules are installed more, a suction nozzle chip carrying mechanism needs to move up and down, a suction nozzle part of the suction nozzle chip carrying mechanism generally drives a speed reducer to ascend or descend through a motor, the structure product is relatively complicated, meanwhile, the structure positioning is not particularly accurate, if a suction nozzle descends, too low pressure causes damage to the chips, and if the suction nozzle descends, the chips can cause inaccurate chip positioning.
SUMMERY OF THE UTILITY MODEL
In order to overcome prior art's not enough, the utility model aims to provide a COC chip welding transport mechanism to solve current suction nozzle and descend too high damage and the suction nozzle that causes the chip of low pressure excessively to put down the chip and cause the unsafe problem of chip location.
The purpose of the utility model is realized by adopting the following technical scheme:
the utility model provides a COC chip welding transport mechanism, includes Y axle linear electric motor module, be fixed with the voice coil motor mounting panel on the Y axle linear electric motor module, voice coil motor mounting panel front end is fixed with Z to the fixed plate, Z is fixed with Z axle voice coil motor on to the fixed plate, Z is still slided on to the fixed plate and is provided with the suction nozzle fixing base, the actuating shaft of Z axle voice coil motor connects and drives the suction nozzle fixing base and slides from top to bottom along Z to the fixed plate, Z still is provided with an elastic mechanism on to the fixed plate, the one end of elastic mechanism is fixed on Z is fixed on the suction nozzle fixing base to the other end on the fixed plate, be fixed with the mouth of inhaling portion on the suction nozzle fixing base, the restoring force of elastic mechanism is greater than or equal to the drive shaft of Z axle voice coil motor and the gravity of connector.
Preferably, the suction nozzle part comprises a suction nozzle frame fixed on a suction nozzle base, a suction nozzle slide way capable of matching with the suction nozzle to slide up and down is arranged at the front end of the suction nozzle frame, the tail end of the suction nozzle is fixed on a suction nozzle slide block, the suction nozzle slide block is arranged on the suction nozzle frame in a sliding mode up and down, an elastic mechanism is arranged between the suction nozzle slide block and the suction nozzle frame, and the elastic mechanism enables the mouth part of the suction nozzle to have downward pressure in a normal state.
Preferably, the elastic mechanism makes the downward pressure of the mouth of the suction nozzle less than 50g.
Preferably, the elastic mechanism makes the downward pressure of the mouth part of the suction nozzle be 20-30g.
As a preferable mode, two mini bearings are respectively arranged on the upper side and the lower side of the suction nozzle slide way, and the tail part of the suction nozzle slide block is arranged in the slide groove of the suction nozzle frame in a sliding mode through one mini bearing.
Preferably, the suction nozzle is a bakelite suction nozzle.
Preferably, a pressure sensing sheet is further disposed below the suction nozzle portion.
Preferably, the elastic mechanism is a tension spring.
As a preferable mode, an inductor is fixed on the Z-direction fixing plate, and an induction sheet matched with the inductor is fixed on the suction nozzle fixing seat.
Compared with the prior art, the beneficial effects of the utility model reside in that:
the utility model uses the Z-axis voice coil motor to directly drive the suction nozzle fixing seat and the suction nozzle part, so that the structure is simple, the positioning precision is high, and the problems that the chip is damaged due to too low pressure when the suction nozzle is lowered and the chip is placed down due to too high pressure and the chip positioning is inaccurate due to too high suction nozzle are avoided; an elastic mechanism is further arranged on the Z-direction fixing plate, and the restoring force of the elastic mechanism is larger than or equal to the gravity of the driving shaft of the Z-axis voice coil motor and the gravity of the connection object of the driving shaft, so that when the Z-axis voice coil motor 7 breaks down or loses power, the restoring force of the elastic mechanism can enable the suction nozzle portion to ascend, and the suction nozzle is prevented from pressing the chip to damage the chip due to the gravity.
Drawings
FIG. 1 is a schematic view of an overall structure of an embodiment of a COC chip welding and conveying mechanism of the present invention;
FIG. 2 is an exploded view of an embodiment of a COC chip bonding and handling mechanism of the present invention;
FIG. 3 is an exploded view of a nozzle of a COC chip bonding and conveying mechanism of the present invention.
Detailed Description
In order to facilitate understanding of the present invention, the present invention will be described more fully hereinafter with reference to the accompanying drawings. Preferred embodiments of the present invention are shown in the drawings. The invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
The utility model provides a COC chip welding transport mechanism, combines to show in fig. 1-3, includes Y axle linear electric motor module 5, be fixed with voice coil motor mounting panel 6 on the Y axle linear electric motor module 5, voice coil motor mounting panel 6 front end is fixed with Z to fixed plate 3, be fixed with Z axle voice coil motor 7 on the Z is to fixed plate 3, Z is still slided and is provided with suction nozzle fixing base 9 on the fixed plate 3, the actuating shaft of Z axle voice coil motor 7 is connected and drive suction nozzle fixing base 9 and slide from top to bottom along Z to fixed plate 3, still be provided with an elastic mechanism 8 on the fixed plate 3 of Z, the one end of elastic mechanism 8 is fixed on Z is to fixed plate 3 and the other end is fixed on suction nozzle fixing base 9, be fixed with nozzle portion 1 on suction nozzle fixing base 9, the restoring force of elastic mechanism 8 is greater than or equal to the gravity of the drive shaft of Z axle voice coil motor 7 and its connector. In the present embodiment, the elastic mechanism 8 is a tension spring.
The chip carrying mechanism directly drives the suction nozzle fixing seat 9 and the suction nozzle part 1 by using the Z-axis voice coil motor 7, so that the structure is simple, the positioning precision is high, and the problems that the chip is damaged due to too high pressure caused by the fact that the suction nozzle is lowered too low and the chip is placed down due to too high pressure and the chip is positioned inaccurately due to the fact that the suction nozzle is lowered too high are avoided; an elastic mechanism 8 is further arranged on the Z-direction fixing plate 3, and the restoring force of the elastic mechanism 8 is larger than or equal to the gravity of the driving shaft of the Z-axis voice coil motor 7 and the connecting objects thereof, so that when the Z-axis voice coil motor 7 breaks down or loses power, the restoring force of the elastic mechanism 8 can enable the suction nozzle part 1 to ascend, and the suction nozzle is prevented from pressing the chip to damage the chip due to the gravity.
In an embodiment of a COC chip soldering and conveying mechanism, referring to fig. 3, a nozzle part 1 includes a nozzle holder 103 fixed on a nozzle base 2, a nozzle slide 109 capable of matching with a nozzle 111 to slide up and down is provided at a front end of the nozzle holder 103, a rear end of the nozzle 111 is fixed on a nozzle slide block 106, the nozzle slide block 106 is arranged on the nozzle holder 103 to slide up and down, an elastic mechanism is provided between the nozzle slide block 106 and the nozzle holder 103, and the elastic mechanism enables an opening of the nozzle 111 to have a downward pressure in a normal state. The elastic mechanism is a tension spring (not shown in the figure) in the embodiment, a spring pull tab 108 is fixed on one side of the suction nozzle frame 103 in the embodiment, one end of the tension spring is fixed in the strip-shaped groove 107 of the suction nozzle slide block 106, the other end of the tension spring is fixed on a drag hook of the spring pull tab 108, the suction nozzle 111 is not fixed on the suction nozzle frame 103, so when the suction nozzle 111 presses down to suck the chip and is stressed, the suction nozzle 111 moves upwards under the reaction force along the Z-axis, and the downward slight tension of the tension spring ensures that the suction nozzle 111 is tightly attached to the chip but does not crush the surface of the chip. Generally, the pressure is less than 50g, and in order to ensure that the chip is not damaged, the pressure is more suitable to be 20-30 g; when the force with which the nozzle opening is pressed against the chip is larger than this force, the nozzle holder 103 brings the nozzle upward.
In an embodiment of a COC chip soldering and conveying mechanism, referring to fig. 3, two mini bearings 110 are respectively disposed on the upper and lower sides of a nozzle slide 109, the tail of a nozzle slide 106 is slidably disposed in a slide slot of a nozzle holder 103 through a mini bearing 101, for the sake of processing convenience, the slide slot is disposed on a stopper 102 fixed to the nozzle holder 103, the nozzle holder 103 is further provided with a nozzle positioning push piece 104 corresponding to the nozzle slide 109, the nozzle positioning push piece 104 is provided with a waist-shaped hole, and is adjusted and fixed on the nozzle holder 103 by a screw 105 to adjust the depth of the nozzle slide 109, so as to be applicable to nozzles with different diameters.
In an embodiment of a COC chip bonding and carrying mechanism, the suction nozzle 111 is made of a bakelite suction nozzle with low hardness in order to prevent the chip surface from being scratched by a metal suction nozzle.
In an embodiment of a COC chip bonding and conveying mechanism, referring to fig. 1 and 2, a pressure sensing piece 10 is further disposed below the suction nozzle portion 1.
In an embodiment of a COC chip soldering and conveying mechanism, please refer to fig. 1 and 2,Z, an inductor 4 is fixed on a fixing plate 3, and an induction sheet 2 matched with the inductor 4 is fixed on a nozzle fixing seat 9.
The above only is the embodiment of the present invention, not limiting the patent scope of the present invention, all the equivalent structures or equivalent processes that are used in the specification and the attached drawings or directly or indirectly applied to other related technical fields are included in the patent protection scope of the present invention.
Claims (9)
1. The utility model provides a COC chip welding transport mechanism, its characterized in that, includes Y axle linear electric motor module, be fixed with the voice coil motor mounting panel on the Y axle linear electric motor module, voice coil motor mounting panel front end is fixed with Z to the fixed plate, Z is fixed with Z axle voice coil motor on to the fixed plate, Z is still slided on to the fixed plate and is provided with the suction nozzle fixing base, the actuating shaft of Z axle voice coil motor is connected and drive suction nozzle fixing base and slide from top to bottom along Z to the fixed plate, Z still is provided with an elastic mechanism on to the fixed plate, the one end of elastic mechanism is fixed on Z is fixed on the suction nozzle fixing base to the other end on the fixed plate, be fixed with the nozzle portion on the suction nozzle fixing base, the restoring force of elastic mechanism is greater than or equal to the drive shaft of Z axle voice coil motor and the gravity of connector.
2. The COC chip bonding and carrying mechanism as claimed in claim 1, wherein the nozzle part comprises a nozzle holder fixed on a nozzle base, a nozzle slide rail is arranged at the front end of the nozzle holder and can be matched with a nozzle to slide up and down, the tail end of the nozzle is fixed on a nozzle slide block, the nozzle slide block is arranged on the nozzle holder in a sliding manner up and down, and an elastic mechanism is arranged between the nozzle slide block and the nozzle holder and enables the nozzle part to have a downward pressure under normal conditions.
3. The COC die bonding handling mechanism of claim 2, wherein the resilient mechanism causes a downward pressure of the nozzle opening to be less than 50g.
4. The COC chip bonding and carrying mechanism of claim 2, wherein the elastic mechanism enables the downward pressure of the nozzle opening to be 20-30g.
5. The COC chip bonding and carrying mechanism of claim 2, wherein two mini-bearings are respectively disposed on the upper and lower sides of the nozzle slide way, and the tail of the nozzle slide block is slidably disposed in the slide slot of the nozzle holder through a mini-bearing.
6. The COC chip bonding handling mechanism of claim 2, wherein the suction nozzle is a bakelite suction nozzle.
7. The COC chip bonding and carrying mechanism of claim 1, wherein a pressure sensing piece is further disposed below the suction nozzle portion.
8. The COC chip bonding handling mechanism of claim 1, wherein the resilient mechanism is a tension spring.
9. The COC chip bonding conveying mechanism of claim 1, wherein an inductor is fixed on the Z-direction fixing plate, and an induction sheet matched with the inductor is fixed on the suction nozzle fixing seat.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222357770.4U CN218200944U (en) | 2022-09-05 | 2022-09-05 | COC chip welding and conveying mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222357770.4U CN218200944U (en) | 2022-09-05 | 2022-09-05 | COC chip welding and conveying mechanism |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218200944U true CN218200944U (en) | 2023-01-03 |
Family
ID=84631488
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222357770.4U Active CN218200944U (en) | 2022-09-05 | 2022-09-05 | COC chip welding and conveying mechanism |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218200944U (en) |
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2022
- 2022-09-05 CN CN202222357770.4U patent/CN218200944U/en active Active
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