CN218144469U

CN218144469U - A material collecting device for wafer recovery

Info

Publication number: CN218144469U
Application number: CN202222287281.6U
Authority: CN
Inventors: 赵裕兴; 高峰
Original assignee: Suzhou Delphi Laser Co Ltd
Current assignee: Suzhou Delphi Laser Co Ltd
Priority date: 2022-08-30
Filing date: 2022-08-30
Publication date: 2022-12-27
Anticipated expiration: 2032-08-30

Abstract

The utility model relates to a material collecting device for wafer recovery, including base subassembly and first lifting unit, still include the second lifting unit the same with first lifting unit structure, first lifting unit and second lifting unit mirror image distribution set up the both sides position along the X axle direction on the base subassembly. The utility model adopts a double material box structure, one material box is full and automatically withdraws, the second material box enters the material receiving, and the time for taking and placing the material box is enough; through the structural arrangement that the elevating platform includes elevating platform motion board and elevating platform bottom plate to and the cooperation of third guide rail set spare, guiding axle, compression spring and sensor unit, have the function of striking protection warning.

Description

A material collecting device for wafer recovery

Technical Field

The utility model relates to a wafer processing correlation technique field especially relates to a material collecting device for wafer recovery.

Background

The semiconductor chip industry is a very popular industry at present, the state also strongly supports related enterprises and scientific research institutions, and related equipment for semiconductor processing is gradually localized. The chip manufacturing process is complex, the number of working procedures is large, the feeding and the blanking of the wafer are one link, the feeding and the blanking of the existing equipment are basically matched with a single material box and are manually replaced, and if the material box is not replaced timely, the equipment needs to be stopped for waiting, so that the efficiency is reduced.

In view of the above-mentioned defects, the present inventors have made active research and innovation to create a material receiving device for wafer recycling, so that the material receiving device has industrial application value.

SUMMERY OF THE UTILITY MODEL

In order to solve the above technical problem, an object of the present invention is to provide a material receiving device for wafer recycling.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

the receiving device for wafer recovery comprises a base assembly, a first lifting assembly and a second lifting assembly, wherein the second lifting assembly is the same as the first lifting assembly in structure, and the first lifting assembly and the second lifting assembly are arranged on the base assembly in a mirror image distribution mode along the X-axis direction;

the base component comprises a fixed bottom plate, a first guide rail component, a horizontal switching motor and a second guide rail component, wherein the horizontal switching motor is positioned on the fixed bottom plate between the first guide rail component and the second guide rail component, a belt wheel is arranged on the fixed bottom plate on one side of the horizontal switching motor along the positive direction of the Y axis, an output shaft of the horizontal switching motor is connected with the belt wheel through a horizontal switching synchronous belt, the first guide rail component is positioned on the fixed bottom plate on one side of the horizontal switching motor along the negative direction of the X axis, the second guide rail component is positioned on the fixed bottom plate on one side of the horizontal switching motor along the positive direction of the X axis, and the first guide rail component and the second guide rail component are distributed along the direction of the Y axis;

first lifting unit or second lifting unit include the horizontal switching motion board, elevator motor, lift axle and elevating platform, the bottom of horizontal switching motion board is connected with first guide rail set spare or second guide rail set spare, one side of horizontal switching motion board towards the horizontal switching motor is provided with the hold-in range connecting plate, the hold-in range connecting plate is connected with the horizontal switching hold-in range, be provided with elevator motor and lift axle on the horizontal switching motion board, elevator motor's output shaft is connected with the lift axle through lift switching hold-in range wheel set spare, the epaxial connection of lift is provided with the elevating platform, the elevating platform can be along the lift axle at Z axle direction rebound.

As a further improvement of the utility model, the elevating platform is from last to down including elevating platform motion board and elevating platform bottom plate in proper order, the elevating platform bottom plate is connected with the elevating shaft, be provided with the third guide rail set spare that a plurality of distributes along Y axle direction on the elevating platform bottom plate, the elevating platform motion board is connected with the third guide rail set spare, upper junction plate and lower connecting plate have set gradually along Y axle direction on the position between elevating platform motion board and the elevating platform bottom plate, the upper junction plate is connected with the elevating platform motion board, the lower connecting plate is connected with the elevating platform bottom plate, still be provided with the guiding axle along Y axle direction on the position between upper junction plate and the lower connecting plate, the guiding axle passes compression spring's centre bore along Y axle direction, compression spring is pressed between upper junction plate and lower connecting plate.

As a further improvement of the utility model, a sensor unit is arranged between the lifting platform moving plate and the lifting platform bottom plate.

As a further improvement of the utility model, the sensor unit includes the response piece and the sensor of mutually supporting, and the response piece is installed in the bottom of elevating platform moving plate, and the sensor is installed on the elevating platform bottom plate.

As a further improvement, the lifting shaft is also provided with a plurality of fourth guide rail components distributed along the Z-axis direction, and the lifting platform is connected with the fourth guide rail components.

Borrow by above-mentioned scheme, the utility model discloses at least, have following advantage:

the utility model adopts a double material box structure, one material box is full and automatically withdraws, the second material box enters the material receiving, and the time for taking and placing the material box is enough; through the structural arrangement that the elevating platform includes elevating platform motion board and elevating platform bottom plate to and the cooperation of third guide rail set spare, guiding axle, compression spring and sensor unit, have the function of striking protection warning.

The above description is only an outline of the technical solution of the present invention, and in order to make the technical means of the present invention more clearly understood and to be implemented in accordance with the content of the specification, the following detailed description will be given of preferred embodiments of the present invention in conjunction with the accompanying drawings.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention, and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.

Fig. 1 is a schematic structural view of a material receiving device for wafer recycling according to the present invention;

FIG. 2 is a schematic structural view of the base assembly of FIG. 1;

FIG. 3 is a schematic view of the first lift assembly of FIG. 1;

FIG. 4 is a side view of one side of FIG. 3;

fig. 5 isbase:Sub>A sectional view aboutbase:Sub>A-base:Sub>A section in fig. 4.

Wherein the meanings of each reference numeral in the figures are as follows.

1 seat subassembly 2 first lifting unit

3 second lifting component 4 magazine

5 fixed base plate 6 first guide rail assembly

7 horizontal switching motor 8 belt wheel

9 second guide rail assembly 10 horizontal switching motion plate

11 synchronous belt connecting plate 12 lifting motor

13 lifting shaft 14 lifting platform

15 lifting platform moving plate 16 lifting platform bottom plate

17 sensing piece 18 sensor

19 third track Assembly 20 fourth track Assembly

21 upper connecting plate 22 guide shaft

23 compression spring 24 lower connecting plate

Detailed Description

The following detailed description of the embodiments of the present invention is made with reference to the accompanying drawings and examples. The following examples are intended to illustrate the invention, but are not intended to limit the scope of the invention.

In order to make the technical solution of the present invention better understood, the technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. The components of the embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations. Thus, the following detailed description of the embodiments of the present invention, presented in the accompanying drawings, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. Based on the embodiment of the present invention, all other embodiments obtained by those skilled in the art without creative efforts belong to the protection scope of the present invention.

Examples

As shown in figures 1 to 5 of the drawings,

the utility model provides a material collecting device for wafer recovery, includes base subassembly 1 and first lifting unit 2, still includes the second lifting unit 3 the same with 2 structures of first lifting unit, and first lifting unit 2 and 3 mirror image distribution of second lifting unit set up the both sides position along the X axle direction on base subassembly 1.

Base subassembly 1 includes PMKD 5, first guide rail set spare 6, horizontal switching motor 7 and second guide rail set spare 9, horizontal switching motor 7 is located PMKD 5 between first guide rail set spare 6 and the second guide rail set spare 9, horizontal switching motor 7 is provided with band pulley 8 along the PMKD 5 of Y axle positive direction one side, horizontal switching motor 7's output shaft is connected with band pulley 8 through the horizontal switching hold-in range, first guide rail set spare 6 is located horizontal switching motor 7 along the PMKD 5 of X axle negative direction one side, second guide rail set spare 9 is located horizontal switching motor 7 along the PMKD 5 of X axle positive direction one side, and first guide rail set spare 6 and second guide rail set spare 9 all distribute the setting along Y axle direction.

First lifting unit 2 or second lifting unit 3 include horizontal switching motion board 10, elevator motor 12, lift axle 13 and elevating platform 14, the bottom of horizontal switching motion board 10 is connected with first guide rail set 6 or second guide rail set 9, one side that horizontal switching motion board 10 is towards horizontal switching motor 7 is provided with hold-in range connecting plate 11, hold-in range connecting plate 11 is connected with the horizontal switching hold-in range, be provided with elevator motor 12 and lift axle 13 on the horizontal switching motion board 10, the output shaft of elevator motor 12 is connected with lift axle 13 through the lift switching hold-in range subassembly, it is provided with elevating platform 14 to connect on the lift axle 13, elevating platform 14 can move in the Z axle direction along lift axle 13. The lifting shaft 13 is further provided with a plurality of fourth guide rail assemblies 20 distributed along the Z-axis direction, and the lifting platform 14 is connected with the fourth guide rail assemblies 20. The output shaft of the lifting motor 12 drives the lifting shaft 13 to realize lifting motion through a lifting switching synchronous belt wheel, the lifting shaft 13 can be a common screw rod motion mechanism, and the lifting shaft 13 can drive the lifting platform 14 to realize lifting motion synchronously.

The lifting platform 14 sequentially comprises a lifting platform moving plate 15 and a lifting platform bottom plate 16 from top to bottom, the lifting platform bottom plate 16 is connected with a lifting shaft 13, a plurality of third guide rail assemblies 19 distributed along the Y-axis direction are arranged on the lifting platform bottom plate 16, the lifting platform moving plate 15 is connected with the third guide rail assemblies 19, an upper connecting plate 21 and a lower connecting plate 24 are sequentially arranged between the lifting platform moving plate 15 and the lifting platform bottom plate 16 along the Y-axis direction, the upper connecting plate 21 is connected with the lifting platform moving plate 15, the lower connecting plate 24 is connected with the lifting platform bottom plate 16, a guide shaft 22 is further arranged between the upper connecting plate 21 and the lower connecting plate 24 along the Y-axis direction, the guide shaft 22 penetrates through a center hole of a compression spring 23 along the Y-axis direction, and the compression spring 23 is pressed between the upper connecting plate 21 and the lower connecting plate 24.

A sensor unit is arranged between the lifting platform moving plate 15 and the lifting platform bottom plate 16, the sensor unit comprises a sensing piece 17 and a sensor 18 which are matched with each other, the sensing piece 17 is arranged at the bottom of the lifting platform moving plate 15, and the sensor 18 is arranged on the lifting platform bottom plate 16.

The guide rail assemblies are all common linear moving guide rail assemblies with guide rails and sliders matched with each other.

The utility model discloses a theory of operation and working process brief:

the lifting motor 12 drives the lifting shaft 13 through a lifting switching synchronous belt, and moves the lifting platforms 14 on the first lifting component 2 and the second lifting component 3 up and down, so that one lifting platform 14 is at a high position and the other lifting platform 14 is at a low position.

The horizontal switching motor 7 drives the first lifting assembly 2 and the second lifting assembly 3 to move in the horizontal direction through a horizontal switching synchronous belt, so that two positions are exchanged; after the first lifting assembly 2 and the second lifting assembly 3 are in place, the first lifting assembly and the second lifting assembly can respectively move freely in a lifting mode.

Before the horizontal switching, it must be ensured that the lifting platforms 14 of the first lifting assembly 2 and the second lifting assembly 3 are in a high position and the other is in a low position; if the height difference between the two lifting platforms is not enough, the two lifting platforms can be impacted, the lifting platform moving plate 15 slides along the third guide rail assembly 19, the compression spring 23 is compressed, the sensing piece 17 on the lifting platform moving plate 15 moves together, the sensing piece 17 moves into the sensor 18, the sensor 18 sends out an alarm signal, and abnormal conditions exist; the two lifting platforms are separated through manual intervention treatment, the compression spring 23 is restored, the sensing piece 17 is separated from the sensor 18, and the alarm signal is relieved.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, are not to be construed as limiting the present invention. Furthermore, the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly referring to the number of technical features being grined. Thus, a feature defined as "first," "second," etc. may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless otherwise specified.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted", "connected" and "connected" are to be interpreted broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected: either mechanically or electrically: the terms may be directly connected or indirectly connected through an intermediate medium, or may be a communication between two elements.

The above description is only a preferred embodiment of the present invention, and is not intended to limit the present invention, and it should be noted that, for those skilled in the art, a plurality of modifications and variations can be made without departing from the technical principle of the present invention, and these modifications and variations should also be regarded as the protection scope of the present invention.

Claims

1. The receiving device for wafer recovery comprises a base assembly (1) and a first lifting assembly (2), and is characterized by further comprising a second lifting assembly (3) which has the same structure as the first lifting assembly (2), wherein the first lifting assembly (2) and the second lifting assembly (3) are arranged on the base assembly (1) at two sides along the X-axis direction in a mirror image distribution manner;

the base component (1) comprises a fixed base plate (5), a first guide rail component (6), a horizontal switching motor (7) and a second guide rail component (9), wherein the horizontal switching motor (7) is positioned on the fixed base plate (5) between the first guide rail component (6) and the second guide rail component (9), a belt pulley (8) is arranged on the fixed base plate (5) on one side of the positive direction of a Y axis of the horizontal switching motor (7), an output shaft of the horizontal switching motor (7) is connected with the belt pulley (8) through a horizontal switching synchronous belt, the first guide rail component (6) is positioned on the fixed base plate (5) on one side of the horizontal switching motor (7) along the negative direction of the X axis, the second guide rail component (9) is positioned on the fixed base plate (5) on one side of the positive direction of the X axis of the horizontal switching motor (7), and the first guide rail component (6) and the second guide rail component (9) are both distributed along the direction of the Y axis;

first lifting unit (2) or second lifting unit (3) are including horizontal switching motion board (10), elevator motor (12), lift axle (13) and elevating platform (14), the bottom of horizontal switching motion board (10) is connected with first guide rail set spare (6) or second guide rail set spare (9), one side that horizontal switching motion board (10) face horizontal switching motor (7) is provided with hold-in range connecting plate (11), hold-in range connecting plate (11) are connected with the horizontal switching hold-in range, be provided with elevator motor (12) and lift axle (13) on the horizontal switching motion board (10), the output shaft of elevator motor (12) is connected with lift axle (13) through lift switching hold-in range wheel set spare, it is provided with elevating platform (14) to connect on lift axle (13), elevating platform (14) can move in the Z axle orientation along lift axle (13).

2. The material collecting device for wafer recycling as claimed in claim 1, wherein the lifting table (14) comprises a lifting table moving plate (15) and a lifting table bottom plate (16) from top to bottom in sequence, the lifting table bottom plate (16) is connected with the lifting shaft (13), the lifting table bottom plate (16) is provided with a plurality of third guide rail assemblies (19) distributed along the Y-axis direction, the lifting table moving plate (15) is connected with the third guide rail assemblies (19), an upper connecting plate (21) and a lower connecting plate (24) are sequentially arranged along the Y-axis direction at a position between the lifting table moving plate (15) and the lifting table bottom plate (16), the upper connecting plate (21) is connected with the lifting table moving plate (15), the lower connecting plate (24) is connected with the lifting table bottom plate (16), a guide shaft (22) is further arranged along the Y-axis direction at a position between the upper connecting plate (21) and the lower connecting plate (24), the guide shaft (22) penetrates through a central hole of the compression spring (23) along the Y-axis direction, and the compression spring (23) is pressed between the upper connecting plate (24) and the lower connecting plate (24).

3. The receiving device for wafer recycling as claimed in claim 2, wherein a sensor unit is further disposed between the lift table moving plate (15) and the lift table bottom plate (16).

4. A material receiving device for wafer recycling as claimed in claim 3, wherein said sensor unit comprises a sensing piece (17) and a sensor (18) which are mutually matched, said sensing piece (17) is installed at the bottom of the moving plate (15) of the lifting platform, and said sensor (18) is installed on the bottom plate (16) of the lifting platform.

5. The material collecting device for wafer recycling as claimed in claim 1, wherein a plurality of fourth guiding rail assemblies (20) are disposed on the lifting shaft (13) and distributed along the Z-axis direction, and the lifting table (14) is connected to the fourth guiding rail assemblies (20).