CN218159088U - LGA packaging substrate, fingerprint module and terminal equipment - Google Patents
LGA packaging substrate, fingerprint module and terminal equipment Download PDFInfo
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- CN218159088U CN218159088U CN202222267926.XU CN202222267926U CN218159088U CN 218159088 U CN218159088 U CN 218159088U CN 202222267926 U CN202222267926 U CN 202222267926U CN 218159088 U CN218159088 U CN 218159088U
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Abstract
The application relates to the technical field of ESD protection, in particular to an LGA packaging substrate, a fingerprint module and a terminal device. The LGA packaging substrate comprises a substrate main body, a first metal circuit layer and a second metal circuit layer, wherein the first metal circuit layer and the second metal circuit layer are arranged on the surfaces of two sides of the substrate main body and are electrically connected; when the LGA packaging substrate is used for the fingerprint module, the two metal circuit layers are electrically connected with the circuit board of the fingerprint module to form a conducting circuit. The week side edge on the metal circuit layer of both sides sets up the GND piece respectively to increase the current flux on the metal circuit layer of both sides respectively, thereby improve LGA packaging substrate's anti ESD ability, when the fingerprint module met outside static, static on the LGA packaging substrate can conduct static to the circuit board through the metal circuit layer of both sides fast, in order to release through the circuit board, avoid static to act on the fingerprint chip of fingerprint module, and then promote fingerprint chip's anti ESD ability.
Description
Technical Field
The application relates to the technical field of ESD protection, in particular to an LGA packaging substrate, a fingerprint module and a terminal device.
Background
Along with the wide application of the fingerprint identification technology to electronic equipment, the requirement on the reliability of the fingerprint module is higher and higher, especially the ESD (Electro-Static discharge) capability of the fingerprint module; fingerprint module package fingerprint chip, grid Array package (LGA, land Grid Array) base plate and circuit board usually, static on the fingerprint module need be derived through LGA packaging substrate, circuit board and electronic equipment's mainboard, releases via electronic equipment release at last, but the ESD ability of the LGA packaging substrate of present fingerprint module is weaker, can't derive static in time to lead to the fingerprint module to be higher by the risk that the static was hit, influence the reliability of product.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide an LGA packaging substrate, fingerprint module and terminal equipment to improve LGA packaging substrate's ESD ability to a certain extent.
A first aspect of the present invention provides an LGA package substrate for a fingerprint module, the LGA package substrate including a substrate main body, a first metal circuit layer and a second metal circuit layer;
the first metal circuit layer and the second metal circuit layer are respectively arranged on the two opposite side surfaces of the substrate main body;
the first metal circuit layer is electrically connected with the second metal circuit layer, and the second metal circuit layer is used for being electrically connected with a circuit board of the fingerprint module;
the periphery side edge of the first metal circuit layer is provided with a first GND sheet, and the periphery side edge of the second metal circuit layer is provided with a second GND sheet.
Further, the number of the first GND sheets is multiple, and the first GND sheets are distributed at intervals along the circumferential direction of the first metal line layer.
Further, the number of the second GND sheets is multiple, and the multiple second GND sheets are distributed at intervals in the circumferential direction of the second metal line layer.
Further, the plurality of first GND pieces and the plurality of second GND pieces each extend to the outside of the substrate main body;
and/or the number of the first GND sheets is multiple, the number of the second GND sheets is multiple, and the first GND sheets and the second GND sheets are arranged in a one-to-one correspondence mode.
Furthermore, a metal through hole is formed in the substrate main body, and the first metal circuit layer is electrically connected with the second metal circuit layer through the metal through hole.
Furthermore, the number of the metal through holes is multiple, and the multiple metal through holes are distributed on the substrate main body at intervals.
Furthermore, a plurality of metal bonding pads used for being connected with the circuit board of the fingerprint module are arranged on the second metal circuit layer at intervals.
Further, the width of the first GND sheet is 200 μm or more; and/or the width of the second GND sheet is more than or equal to 200 μm.
A second aspect of the present invention provides a fingerprint module, which includes a circuit board and any of the LGA package substrates described above; the second metal circuit layer of the LGA packaging substrate is electrically connected with the circuit board.
Further, the fingerprint module further comprises a linker; the circuit board is provided with a first grounding pin;
the linker includes a GND line electrically connected with the first ground pin.
The utility model discloses the third aspect provides a terminal equipment, including mainboard and above-mentioned arbitrary fingerprint module, the circuit board of fingerprint module with the mainboard electricity is connected.
Further, the fingerprint module further comprises a linker; the circuit board is provided with a first grounding pin, the linker comprises a GND line, and the GND line is electrically connected with the first grounding pin; the mainboard is provided with a second grounding pin, and the GND line is electrically connected with the second grounding pin.
Compared with the prior art, the beneficial effects of the utility model are that:
the utility model provides a LGA packaging substrate includes base plate main part, first metal circuit layer and second metal circuit layer, and first metal circuit layer and second metal circuit layer set up respectively in the relative both sides surface of base plate main part. First metal wiring layer is connected with second metal wiring layer electricity, and when LGA packaging substrate was used for terminal equipment's fingerprint module, LGA packaging substrate was fixed in on the circuit board of fingerprint module, and second metal wiring layer was connected with the circuit board electricity to make first metal wiring layer, second metal wiring layer and circuit board form and switch on the circuit, when fingerprint module met outside static, static can be along the aforesaid switch on the circuit via circuit board release, in order to avoid static to act on the fingerprint chip of fingerprint module.
All side edges on first metal circuit layer are provided with first GND piece, all side edges on second metal circuit layer are provided with second GND piece, with the electric current flux that increases first metal circuit layer and second metal circuit layer respectively through first GND piece and second GND piece, thereby improve LGA packaging substrate's anti ESD ability, when the fingerprint module runs into outside static, can be fast through first metal circuit layer and second metal circuit layer, switch on static to the circuit board on and via circuit board release effectively, avoid static to act on the fingerprint chip of fingerprint module, and then promote fingerprint chip's anti ESD ability.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments or the prior art descriptions will be briefly described below, it is obvious that the drawings in the following descriptions are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a schematic structural view (upper surface) of an LGA package substrate according to an embodiment of the present invention at a first viewing angle;
fig. 2 is a schematic structural view (lower surface) of an LGA package substrate according to an embodiment of the present invention at a second viewing angle;
fig. 3 is a schematic structural diagram of a fingerprint module according to an embodiment of the present invention.
Reference numerals:
the packaging structure comprises a 1-LGA packaging substrate, 11-a substrate main body, 12-a first metal circuit layer, 13-a first GND sheet, 14-a second metal circuit layer, 15-a second GND sheet, 16-a metal through hole, 2-a fingerprint chip, 3-a circuit board and 31-a linker.
Detailed Description
The technical solution of the present invention will be described clearly and completely with reference to the accompanying drawings, and obviously, the described embodiments are some, but not all embodiments of the present invention.
The components of the embodiments of the present invention, as generally described and illustrated in the figures herein, may be arranged and designed in a wide variety of different configurations. Thus, the following detailed description of the embodiments of the present invention, presented in the accompanying drawings, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention.
Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected" and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
An LGA package substrate, a fingerprint module, and a terminal device according to some embodiments of the present application are described below with reference to fig. 1 to 3.
A first aspect of the present application provides an LGA package substrate 1, as shown in fig. 1 and fig. 2, the LGA package substrate 1 includes a substrate body 11, a first metal circuit layer 12 and a second metal circuit layer 14, the first metal circuit layer 12 and the second metal circuit layer 14 are respectively disposed on two opposite side surfaces of the substrate body 11, for example, the first metal circuit layer 12 is disposed on an upper surface of the substrate body 11, and the second metal circuit layer 14 is disposed on a lower surface of the substrate body 11.
The first metal circuit layer 12 is electrically connected to the second metal circuit layer 14, so that the first metal circuit layer 12 and the second metal circuit layer 14 form a conductive circuit. For example, the substrate main body 11 is provided with a metal via 16 penetrating through the upper and lower surfaces of the substrate main body 11, and the upper and lower ends of the metal via 16 are respectively connected to the first metal circuit layer 12 and the second metal circuit layer 14, so that the first metal circuit layer 12 and the second metal circuit layer 14 form a conductive circuit through the metal via 16.
When the LGA package substrate 1 is used in a fingerprint module of a terminal device, as shown in fig. 3, the fingerprint chip 2 of the fingerprint module is fixed on the upper Surface of the LGA package substrate 1 and electrically connected to the first metal circuit layer 12, the lower Surface of the LGA package substrate 1 is fixed on the circuit board 3 of the fingerprint module, and the second metal circuit layer 14 is electrically connected to the circuit board 3, for example, the LGA package substrate 1 and the circuit board 3 are fixedly connected through an SMT (Surface mount Technology) process and the second metal circuit layer 14 is electrically connected to the circuit board 3; therefore, the first metal circuit layer 12, the second metal circuit layer 14 and the circuit board 3 form a conducting circuit, when the fingerprint chip 2 on the LGA package substrate 1 encounters external static electricity, the static electricity will be conducted to the circuit board 3 along the conducting circuit and finally be discharged (for example, the static electricity will be discharged through the following terminal device), so as to prevent the static electricity from acting on the fingerprint chip 2.
Specifically, the Circuit Board 3 is typically an FPC (Flexible Printed Circuit), and the Circuit Board 3 may also be a PCB (Printed Circuit Board).
The week side edge of first metal wiring layer 12 is provided with first GND (ground ) piece, week side edge of second metal wiring layer 14 is provided with second GND piece 15, through set up the GND piece respectively on first metal wiring layer 12 and second metal wiring layer 14, can increase the current flux of first metal wiring layer 12 and second metal wiring layer 14 respectively, thereby improve LGA packaging substrate 1's anti-ESD ability, when static produces, can be fast through first metal wiring layer 12 and second metal wiring layer 14, switch on static to circuit board 3 effectively, release through terminal equipment at last, avoid static to act on fingerprint chip 2, and then promote fingerprint chip 2's anti-ESD ability.
In one embodiment of the present application, preferably, the number of the first GND pieces 13 on the first metal wiring layer 12 is plural, and the plural first GND pieces 13 are distributed at intervals in the circumferential direction of the first metal wiring layer 12; the current flux of the first metal circuit layer 12 can be increased to a certain extent through the plurality of first GND sheets 13, the current conduction capacity is improved, and the plurality of first GND sheets 13 are distributed along the circumferential interval of the first metal circuit layer 12, so that static electricity on the upper surface of the substrate can be quickly conducted away through the adjacent first GND sheets 13, the fingerprint chip 2 is prevented from being broken down due to static electricity accumulation, and the ESD resistance capacity of the LGA packaging substrate 1 and the fingerprint chip 2 is improved.
In an embodiment of the present application, preferably, the number of the second GND sheets 15 on the second metal circuit layer 14 is also multiple, the multiple second GND sheets 15 are distributed at intervals along the circumferential direction of the second metal circuit layer 14, and the current conducting capability of the second metal circuit layer 14 can also be increased to some extent by the multiple second GND sheets 15 distributed at intervals, so that static electricity on the second metal circuit layer 14 can be quickly led out and released through the adjacent second GND sheets 15, and further the ESD resistance of the LGA package substrate 1 and the fingerprint chip 2 is further improved.
In some preferred embodiments, the width of the first GND sheet 13 is 200 μm or more, so that the first GND sheet 13 has a sufficient current flux to be able to quickly lead away static electricity on the nearby LGA package substrate 1.
In some preferred embodiments, the width of the second GND sheet 15 is 200 μm or more, so that the second GND sheet 15 also has a sufficient current flux to be able to quickly guide away static electricity at the nearby LGA package substrate 1.
In one embodiment of the present application, preferably, the first GND sheet 13 and the second GND sheet 15 both extend to the outside of the substrate main body, and/or when the first GND sheet 13 and the second GND sheet 15 are both plural, the plural first GND sheets 13 and the plural second GND sheets 15 are oppositely disposed in a one-to-one correspondence manner, so that the second GND sheet 15 located below can be shielded by the first GND sheet 13 located above, so as to improve the aesthetic property of the whole LGA package substrate 1.
In an embodiment of the present application, preferably, the substrate main body 11 is provided with a plurality of metal vias 16, the plurality of metal vias 16 are distributed on the substrate main body 11 at intervals, two ends of the plurality of metal vias 16 are respectively connected to the first metal circuit layer 12 and the second metal circuit layer 14, so that the first metal circuit layer 12 forms a conducting circuit with the second metal circuit layer 14 through the plurality of metal vias 16, thereby increasing the current conducting capability between the first metal circuit layer 12 and the second metal circuit layer 14, and the static electricity on the upper surface of the LGA package substrate 1 can be quickly conducted to the second metal circuit layer 14 through the plurality of metal vias 16 by the first metal circuit layer 12, and finally conducted to the main board of the terminal device through the circuit board 3 of the fingerprint module, and the static electricity is released through the terminal device.
In an embodiment of this application, preferably, be provided with a plurality of metal pads on the second metal circuit layer 14, a plurality of metal pads distribute on second metal circuit layer 14 at intervals, when being fixed in LGA packaging substrate 1 on the FPC board 3 of fingerprint module, second metal circuit layer 14 is through on a plurality of metal pad welded connection FPC board 3, thereby when realizing the fixed of LGA packaging substrate 1 and FPC board 3, LGA packaging substrate 1 and the electric connection of FPC board 3 have also been realized, and make second metal circuit layer 14 form the conducting circuit through a plurality of metal pads and FPC board 3, static on LGA packaging substrate 1 can switch on to FPC board 3 through a plurality of metal pads, then the mainboard through the terminal equipment that is linked together with FPC board 3 falls static release.
In a second aspect of the present application, a fingerprint module is provided, as shown in fig. 3, the fingerprint module includes a circuit board 3 and the LGA package substrate 1 of any of the above embodiments, the LGA package substrate 1 is electrically connected to the circuit board 3, and a conducting circuit is formed between the second metal trace layer 14 and the circuit board 3, so that static electricity on the LGA package substrate 1 can be discharged through the circuit board 3.
In this embodiment, the fingerprint module includes the LGA package substrate 1, so the fingerprint module has all the advantages of the LGA package substrate 1, and the description thereof is omitted here.
In this embodiment, preferably, the fingerprint module further includes a linker 31, the linker 31 includes a GND line, a first ground pin is disposed on the circuit board of the fingerprint module, and one end of the GND line is electrically connected to the first ground pin, so that static electricity on the circuit board 3 can be released through the GND line of the linker 31 to prevent the static electricity from accumulating on the fingerprint module and damaging the fingerprint module.
A third aspect of the application provides a terminal device, which includes a motherboard and the fingerprint module of any of the above embodiments, wherein a circuit board 3 of the fingerprint module is electrically connected with the motherboard; preferably, be provided with second ground pin on the mainboard, the one end of GND circuit is connected with the first ground pin electricity of fingerprint module, and the other end then is connected with second ground pin electricity to make fingerprint module and mainboard form the conducting circuit, the static on the fingerprint module can be conducted to the mainboard on, then releases via terminal equipment for example terminal equipment's metal casing.
In this embodiment, the terminal device includes the fingerprint module, and therefore the terminal device has all the beneficial effects of the fingerprint module, which is not repeated herein.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; such modifications or substitutions do not depart from the scope of the invention in its corresponding aspects.
Claims (12)
1. An LGA package substrate is used for a fingerprint module, and comprises a substrate body, a first metal circuit layer and a second metal circuit layer;
the first metal circuit layer and the second metal circuit layer are respectively arranged on the two opposite side surfaces of the substrate main body;
the first metal circuit layer is electrically connected with the second metal circuit layer, and the second metal circuit layer is used for being electrically connected with a circuit board of the fingerprint module;
the periphery side edge of the first metal circuit layer is provided with a first GND sheet, and the periphery side edge of the second metal circuit layer is provided with a second GND sheet.
2. The LGA package substrate of claim 1, wherein the first GND sheet is provided in a plurality, and the first GND sheets are distributed at intervals along the circumferential direction of the first metal wiring layer.
3. The LGA package substrate of claim 1, wherein the number of the second GND sheets is multiple, and the second GND sheets are distributed at intervals along the circumferential direction of the second metal circuit layer.
4. The LGA package substrate of claim 1, wherein the first GND sheet and the second GND sheet both extend to the outside of the substrate body;
and/or the presence of a gas in the atmosphere,
the quantity of first GND piece is a plurality of, the quantity of second GND piece is a plurality of, and is a plurality of first GND piece and a plurality of second GND piece one-to-one sets up.
5. The LGA package substrate of claim 1, wherein the substrate body has a metal via disposed thereon, the first metal trace layer being electrically connected to the second metal trace layer through the metal via.
6. The LGA package substrate according to claim 5, wherein the number of the metal vias is multiple, and the multiple metal vias are distributed on the substrate body at intervals.
7. The LGA package substrate according to claim 1, wherein the second metal circuit layer is provided with a plurality of metal pads at intervals for connecting with a circuit board of the fingerprint module.
8. The LGA package substrate of any one of claims 1 to 7, wherein the width of the first GND sheet is 200 μm or more;
and/or the width of the second GND sheet is more than or equal to 200 μm.
9. A fingerprint module comprising a circuit board and the LGA package substrate of any one of claims 1 to 8;
the second metal circuit layer of the LGA packaging substrate is electrically connected with the circuit board.
10. The fingerprint module of claim 9, wherein the fingerprint module further comprises a linker;
the circuit board is provided with a first grounding pin, the linker comprises a GND line, and the GND line is electrically connected with the first grounding pin.
11. A terminal device, comprising a motherboard and the fingerprint module of claim 9, wherein the circuit board of the fingerprint module is electrically connected to the motherboard.
12. The terminal device of claim 11, wherein the fingerprint module further comprises a linker;
the circuit board is provided with a first grounding pin, the linker comprises a GND line, and the GND line is electrically connected with the first grounding pin;
the mainboard is provided with a second grounding pin, and the GND line is electrically connected with the second grounding pin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222267926.XU CN218159088U (en) | 2022-08-26 | 2022-08-26 | LGA packaging substrate, fingerprint module and terminal equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222267926.XU CN218159088U (en) | 2022-08-26 | 2022-08-26 | LGA packaging substrate, fingerprint module and terminal equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218159088U true CN218159088U (en) | 2022-12-27 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222267926.XU Active CN218159088U (en) | 2022-08-26 | 2022-08-26 | LGA packaging substrate, fingerprint module and terminal equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218159088U (en) |
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2022
- 2022-08-26 CN CN202222267926.XU patent/CN218159088U/en active Active
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Address after: 201-1, 2nd Floor, Building 4, No. 188 Rixin Road, Binhai Science and Technology Park, Binhai New Area, Tianjin, 300450 Patentee after: Tianjin Jihao Technology Co.,Ltd. Address before: 100082 Z, 17th floor, No. 1, Zhongguancun Street, Haidian District, Beijing Patentee before: Beijing Jihao Technology Co.,Ltd. |
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