CN216414654U

CN216414654U - PCB with antistatic function

Info

Publication number: CN216414654U
Application number: CN202122656685.3U
Authority: CN
Inventors: 徐韵琳
Original assignee: Wuhan Jingce Electronic Group Co Ltd; Wuhan Jingli Electronic Technology Co Ltd
Current assignee: Wuhan Jingce Electronic Group Co Ltd; Wuhan Jingli Electronic Technology Co Ltd
Priority date: 2021-11-02
Filing date: 2021-11-02
Publication date: 2022-04-29
Anticipated expiration: 2031-11-02

Abstract

The utility model discloses a PCB with an anti-static function. It includes the base plate, sets up connector and internal circuit on the base plate, first horizon and second ground plane are laid respectively to connector and internal circuit below, and first horizon and second ground plane are separated, the connector passes through first order ESD part and is connected with first ground plane, and first ground plane passes through second level ESD part and is connected with second ground plane, be equipped with first RC circuit between first order ESD part and the first ground plane. The utility model arranges the multi-stage ESD component between the external connector and the internal circuit, which can effectively and thoroughly protect the elements in the PCB from being interfered and damaged by ESD.

Description

PCB with antistatic function

Technical Field

The utility model belongs to the technical field of electrostatic protection, and particularly relates to a PCB with an anti-static function.

Background

Pcb (printed Circuit board), the name of which is printed Circuit board, is a support for electronic components and is a carrier for electrical connection of electronic components. It is called a "printed" circuit board because it is made using electronic printing. After the electronic equipment adopts the printed board, because of the consistency of the printed boards of the same type, the error of manual wiring is avoided, the automatic insertion or mounting, the automatic tin soldering and the automatic detection of electronic components can be realized, the quality of the electronic equipment is ensured, the labor productivity is improved, the cost is reduced, and the maintenance is convenient.

The technical problems existing in the development process of the PCB are solved, and once the PCB fails in the use process, the PCB is mostly related to static electricity; static electricity is ubiquitous and for some tiny electronic components, the entire production line will face breakdown as long as it is broken down. Static electricity has the following adverse effects on electronic components: 1. dust is adsorbed by static electricity, and the insulation resistance of components is reduced, so that the service life of the components is shortened; 2. electrostatic discharge or current generation heat is a potential damage to components; 3. the electromagnetic field generated by electrostatic discharge has large amplitude and extremely wide frequency spectrum, and causes interference and even damage to electronic devices; 4. electrostatic discharge damage, so that components are damaged and cannot work normally; it follows that the damage caused by static electricity cannot be measured.

At present, signals coming out of an external interface (connector) of a PCB product are connected with an Electro-Static discharge (ESD) protection device, and the ESD protection device is used for performing electrostatic protection on a PCB; however, even if the ESD device is used, a good electrostatic protection effect still cannot be achieved, damage of a large ESD to an element on the PCB cannot be completely solved, and in practice, a failure condition of the PCB may still occur probabilistically.

SUMMERY OF THE UTILITY MODEL

The present invention is directed to solve the above-mentioned drawbacks of the prior art, and provides a PCB with an anti-static function, which can effectively and thoroughly protect the components in the PCB from being damaged by ESD.

The technical scheme adopted by the utility model is as follows: the utility model provides a PCB board with antistatic function, includes the base plate, sets up connector and internal circuit on the base plate, first horizon and second ground plane are laid respectively to connector and internal circuit below, and first horizon and second ground plane are separated, the connector passes through first order ESD part and is connected with first ground plane, and first ground plane passes through second order ESD part and is connected with second ground plane, be equipped with first RC circuit between first order ESD part and the first ground plane.

Furthermore, a conducting layer is laid below the first-stage ESD component, the grounding end of the first-stage ESD component is connected with the conducting layer, one end of the first RC circuit is connected with the conducting layer, and the other end of the first RC circuit is connected with the first ground plane.

Further, the first ground plane, the second ground plane and the conductive layer are all copper foils.

Further, the first-stage ESD component is CDDFN10-0524P

Further, the second stage ESD component is CDDFN 10-0524P.

And the third-stage ESD component is positioned above the first ground plane, one end of the third-stage ESD component is connected with the first-stage ESD component, and the other end of the third-stage ESD component is connected with the first ground plane.

Further, the third stage ESD component is P40-G.

Further, the first RC circuit includes a resistor and a capacitor connected in parallel.

And furthermore, the grounding device also comprises a second RC circuit and a grounding hole, wherein one end of the second RC circuit is connected with the first ground plane, and the other end of the second RC circuit is connected with the grounding hole.

Further, the second RC circuit includes a resistor and a capacitor connected in parallel.

The utility model has the beneficial effects that:

the utility model arranges the multi-stage ESD component between the external connector and the internal circuit, which can effectively and thoroughly protect the elements in the PCB from being interfered and damaged by ESD. Further, the multi-stage ESD component comprises two stages of 0524 protection and one stage of P40-G protection, 0524 can provide ESD, EFT and surge protection for high level, and the two stages of 0524 can isolate static electricity at the front end of the second stage 0524, so that the static electricity running into the board is less, and the influence on the circuits and elements in the board is less; P40-G is a high-speed bi-directional protection element that prevents fault shorts, ac power cross-induction, and lightning surges caused thereby. In addition, the utility model combines the two ESD devices for use, so that the PCB can be more effectively protected by static electricity.

According to the utility model, the conducting layer is independently laid below the first-stage ESD component and is connected with the first ground plane through the first RC circuit, so that most of static electricity introduced into the board is initially absorbed, and static electricity is effectively prevented from entering a jamming signal in the second ground plane; meanwhile, the first ground plane is connected with the screw grounding hole in the shell through the second RC circuit, so that charges can be discharged to the outside shell on the ground, and further damage to the PCB due to external discharge is effectively avoided.

According to the utility model, the multi-stage ESD-prevention component is arranged at the position corresponding to the first ground plane, and the structure can reduce the occupied area of components on the premise of meeting the wiring sequence and design requirements, so that the size of the PCB is reduced, and the trend of miniaturization of the PCB is met.

Drawings

Fig. 1 is a schematic plan view of the present invention.

In the figure: 1-a substrate; 2-a connector; 3-internal circuitry; 4-a first ground plane; 5-a second ground plane; 6-a conductive layer; 7-first stage ESD components; 8-second stage ESD components; 9-a third level ESD component; 10-a first RC circuit; 11-a second RC circuit; 12-ground hole.

Detailed Description

The following further describes embodiments of the present invention with reference to the drawings. It should be noted that the description of the embodiments is provided to help understanding of the present invention, but the present invention is not limited thereto. In addition, the technical features involved in the embodiments of the present invention described below may be combined with each other as long as they do not conflict with each other.

As shown in fig. 1, the present invention provides a PCB with anti-static function, which includes a substrate 1, a connector 2 and an internal circuit 3 disposed on the substrate 1, wherein a first ground plane 4 and a second ground plane 5 are respectively disposed below the connector 2 and the internal circuit 3, the first ground plane 4 is separated from the second ground plane 5, the connector 2 is connected to the first ground plane 4 through a first-stage ESD component 7, the first ground plane 4 is connected to the second ground plane 5 through a second-stage ESD component 8, and a first RC circuit 10 is disposed between the first-stage ESD component 7 and the first ground plane 4.

In the above scheme, a conducting layer 6 is laid below the first-stage ESD component 7, the ground terminal of the first-stage ESD component 7 is connected to the conducting layer 6, one end of the first RC circuit 10 is connected to the conducting layer 6, and the other end of the first RC circuit 10 is connected to the first ground plane 4, that is, the conducting layer 6 is connected to the first ground plane 4 through two pairs of RC through holes. The first ground plane 4, the second ground plane 5 and the conductive layer 6 are all copper foils.

In the scheme, the first-stage ESD part 7 and the second-stage ESD part 8 are both CDDFN10-0524P, and each stage of ESD part can contain a plurality of CDDFN10-0524P

In the above scheme, the ESD protection device further includes a third-stage ESD component 9, where the third-stage ESD component 9 is located above the first ground plane 4, and one end of the third-stage ESD component 9 is connected to the first-stage ESD component 7, and the other end is connected to the first ground plane 4. The third stage ESD component 9 is P40-G.

0524P of the first stage ESD part 7 and the second stage ESD part 8 are mainly used for providing ESD for high level, and EFT and surge protection speed data ports meet requirements; the P40 device of the tertiary ESD component 9 is a high-speed bidirectional protection element intended to prevent fault shorts, ac mains cross-induction and lightning surges caused thereby. In the embodiment, the two ESD devices are used in a matching way, so that the PCB is more effectively subjected to electrostatic protection.

In the above scheme, the antenna further comprises a second RC circuit 11 and a ground hole 12, wherein one end of the second RC circuit 11 is connected to the first ground plane 4, and the other end of the second RC circuit 11 is connected to the ground hole 12. The first RC-circuit 10 and the second RC-circuit 11 each comprise a resistor and a capacitor in parallel.

When static electricity is applied to a plug-in unit, the static electricity can be connected onto a PCB in series through the plug-in unit, the static electricity is discharged onto a conducting layer 6 on the back surface of 0524 through a GND pin of 0524 of a first-stage ESD component 7 on the PCB, the conducting layer on the back surface is discharged onto a first ground plane 4 of the GND layer through a resistor and a capacitor of a first RC circuit 10, the static electricity on the first ground plane 4 is discharged onto a second ground plane through a P40 of a third-stage ESD component 9 and a 0524 of a second-stage ESD component 8, and the static electricity effect is reduced; on the other hand, the first ground plane 4 is discharged to the chassis ground (i.e., the large ground plane) through the resistance and capacitance of the second RC circuit 11, thereby more effectively preventing electrostatic crosstalk into the interfering signal in the second ground plane.

The above description is only an embodiment of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention are included in the scope of the present invention. Those not described in detail in this specification are within the skill of the art.

Claims

1. The utility model provides a PCB board with antistatic function, includes base plate (1), sets up connector (2) and internal circuit (3) on the base plate, first horizon (4) and second ground plane (5) are laid respectively to connector (2) and internal circuit (3) below, and first horizon (4) and second ground plane (5) are separated its characterized in that: the socket connector (2) is connected with a first ground plane (4) through a first-stage ESD component (7), the first ground plane (4) is connected with a second ground plane (5) through a second-stage ESD component (8), and a first RC circuit (10) is arranged between the first-stage ESD component (7) and the first ground plane (4).

2. The PCB board with the antistatic function as claimed in claim 1, wherein: conducting layer (6) have been laid to first order ESD part (7) below, conducting layer (6) are connected to the earthing terminal of first order ESD part (7), conducting layer (6) are connected to the one end of first RC circuit (10), and first ground plane (4) is connected to first RC circuit (10) other end.

3. The PCB board with the antistatic function as claimed in claim 2, wherein: the first ground plane (4), the second ground plane (5) and the conducting layer (6) are all copper foils.

4. The PCB board with the antistatic function as claimed in claim 1, wherein: the first stage ESD component (7) is CDDFN 10-0524P.

5. The PCB board with the antistatic function as claimed in claim 1, wherein: the second stage ESD component (8) is CDDFN 10-0524P.

6. The PCB board with the antistatic function as claimed in claim 1, wherein: the ESD protection circuit further comprises a third-stage ESD component (9), wherein the third-stage ESD component (9) is located above the first ground plane (4), one end of the third-stage ESD component (9) is connected with the first-stage ESD component (7), and the other end of the third-stage ESD component is connected with the first ground plane (4).

7. The PCB board with the antistatic function as claimed in claim 6, wherein: the third-stage ESD component (9) is P40-G.

8. The PCB board with the antistatic function as claimed in claim 1, wherein: the first RC circuit (10) comprises a resistor and a capacitor in parallel.

9. The PCB board with the antistatic function as claimed in claim 1, wherein: the ground connection structure is characterized by further comprising a second RC circuit (11) and a ground hole (12), one end of the second RC circuit (11) is connected with the first ground plane (4), and the other end of the second RC circuit (11) is connected with the ground hole (12).

10. The PCB board with antistatic function according to claim 9, wherein: the second RC-circuit (11) comprises a resistor and a capacitor in parallel.