CN112423462B - Circuit board - Google Patents
Circuit board Download PDFInfo
- Publication number
- CN112423462B CN112423462B CN201910769606.4A CN201910769606A CN112423462B CN 112423462 B CN112423462 B CN 112423462B CN 201910769606 A CN201910769606 A CN 201910769606A CN 112423462 B CN112423462 B CN 112423462B
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- China
- Prior art keywords
- metal layer
- layer
- circuit board
- electromagnetic shielding
- circuit substrate
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
Abstract
A circuit board comprises a first metal layer, a first electromagnetic shielding layer, a circuit substrate, a second electromagnetic shielding layer and a second metal layer which are sequentially stacked; the circuit board further comprises a conducting structure arranged in the stacking direction, the conducting structure is arranged around the periphery of the circuit board and electrically connected with the first metal layer and the second metal layer, and the conducting structure comprises a first conducting metal and a second conducting metal layer which are arranged in a stacking mode outwards from the outer side face of the circuit board. The circuit board has electrostatic protection performance.
Description
Technical Field
The present invention relates to a circuit board.
Background
Electrostatic discharge refers to the transfer of charge by objects having different electrostatic potentials that come into close proximity or direct contact with each other. Sensitive circuit elements are easily damaged during electrostatic discharge. Especially for printed circuit boards, the conventional printed circuit boards usually use a large number of integrated circuit devices, which have high electrostatic sensitivity, low voltage resistance and weak electrostatic shock resistance, and thus are easily damaged by electrostatic discharge, even further affecting the normal operation of the whole electronic device system. Therefore, it is necessary to protect the pcb from static electricity and discharge the static electricity in time.
The shielding films are usually coated on two surfaces of the printed circuit board to shield the static electricity, however, the static electricity protection effect achieved by the above method cannot completely prevent the circuit board from static electricity interference.
Disclosure of Invention
In view of the above, it is desirable to provide a circuit board with electrostatic protection performance.
A circuit board comprises a first metal layer, a first electromagnetic shielding layer, a circuit substrate, a second electromagnetic shielding layer and a second metal layer which are sequentially stacked; the circuit board further comprises a conducting structure arranged along the stacking direction, the conducting structure is arranged around the periphery of the circuit board and electrically connected with the first metal layer and the second metal layer, and the conducting structure comprises a first conducting metal and a second conducting metal layer which are stacked outwards from the outer side face of the circuit board.
Preferably, the conducting structure covers the first metal layer, the first electromagnetic shielding layer, the circuit substrate, the second electromagnetic shielding layer and the outer side surface of the second metal layer.
Preferably, the conductive structure further extends from an outer side surface of the first metal layer toward a surface of the first metal layer away from the circuit substrate, and extends from an outer side surface of the second metal layer toward a surface of the second metal layer away from the circuit substrate.
Preferably, the first conductive metal layer is bonded to the outer side surfaces of the first metal layer, the first electromagnetic shielding layer, the circuit substrate, the second electromagnetic shielding layer and the second metal layer; the second conductive metal layer is arranged on one side of the first conductive metal layer, which is deviated from the first metal layer, the first electromagnetic shielding layer, the circuit substrate, the second electromagnetic shielding layer and the second metal layer.
Preferably, the first conductive metal layer extends from an outer side surface of the first metal layer toward a surface of the first metal layer facing away from the circuit substrate, and extends from an outer side surface of the second metal layer toward a surface of the second metal layer facing away from the circuit substrate.
Preferably, the second conductive metal layer extends from the first conductive metal layer toward a surface of the first metal layer facing away from the circuit substrate and a surface of the second metal layer facing away from the circuit substrate.
Preferably, the circuit board further comprises a first dielectric layer and a first adhesive layer which are stacked, and a second dielectric layer and a second adhesive layer which are stacked; one side of the first dielectric layer, which is far away from the first adhesive layer, is combined with the first metal layer, one side of the first adhesive layer, which is far away from the first dielectric layer, is combined with the first electromagnetic shielding layer, one side of the second dielectric layer, which is far away from the second adhesive layer, is combined with the second metal layer, and one side of the second adhesive layer, which is far away from the second dielectric layer, is combined with the second electromagnetic shielding layer.
A circuit board comprises a first metal layer, a first electromagnetic shielding layer, a circuit substrate, a second electromagnetic shielding layer and a second metal layer which are sequentially stacked; the circuit board further comprises a conducting structure arranged along the stacking direction and close to the outer side face of the circuit board, wherein the conducting structure penetrates through the circuit board along the stacking direction and is arranged around the periphery of the circuit board so as to be electrically connected with the first metal layer and the second metal layer.
Preferably, the circuit board further comprises a first dielectric layer and a first adhesive layer which are stacked, and a second dielectric layer and a second adhesive layer which are stacked; one side of the first dielectric layer, which is far away from the first adhesive layer, is combined with the first metal layer, one side of the first adhesive layer, which is far away from the first dielectric layer, is combined with the first electromagnetic shielding layer, one side of the second dielectric layer, which is far away from the second adhesive layer, is combined with the second metal layer, and one side of the second adhesive layer, which is far away from the second dielectric layer, is combined with the second electromagnetic shielding layer.
Preferably, the circuit substrate further includes at least one connection terminal, and the circuit board further includes at least one opening from which the connection terminal is exposed.
According to the circuit board, the first metal layer is arranged on the outer side of the first electromagnetic shielding layer, the second metal layer is arranged on the outer side of the second electromagnetic shielding layer, the conducting structure is arranged along the stacking direction, the conducting structure is arranged around the periphery of the circuit board and electrically connected with the first metal layer and the second metal layer, so that part of static electricity is led away by the first metal layer, the second metal layer and the conducting structure and is released in a grounding mode, and static protection of the circuit board can be strengthened from all directions on the basis that the electric performance of a product is not influenced. Meanwhile, the first metal layer, the second metal layer and the conducting structure also have a magnetic field shielding effect, and external signals are prevented from being interfered from multiple directions, so that high-frequency and high-speed signal transmission is facilitated. Secondly, because the moisture absorption rate of the metal is very low, the first metal layer, the second metal layer and the conduction structure are matched, so that the performance failure of the circuit board caused by moisture absorption can be avoided, and the service life of the circuit board is prolonged. And, the outside of first electromagnetic shield layer sets up first metal level the outside of second electromagnetic shield layer sets up the second metal level to along the conduction structure that range upon range of direction set up, the conduction structure winds the periphery of circuit board sets up, can also pass through first electromagnetic shield layer with the second electromagnetic shield layer blocks the magnetic field that produces when first metal level the second metal level reaches conduction structure draws static away. In addition, the circuit board of the scheme does not influence the wiring of the circuit substrate while enhancing the electrostatic protection.
Drawings
Fig. 1 is a schematic cross-sectional view of a circuit board according to a first embodiment of the present invention.
Fig. 2 is a schematic cross-sectional view of a circuit board according to a second embodiment of the present invention.
Fig. 3 is a schematic cross-sectional view of a circuit board according to a third embodiment of the present invention.
Fig. 4 is a schematic cross-sectional view of a circuit board according to a fourth embodiment of the present invention.
Fig. 5 is a schematic cross-sectional view of a circuit board of a fifth embodiment provided by the present invention.
Fig. 6 is a plan view of the circuit board of the first embodiment of the present invention shown in fig. 1.
Fig. 7 is a plan view of a circuit board of the third embodiment of the present invention shown in fig. 3.
Description of the main elements
| Circuit board | 100 |
| A |
10 |
| First |
20 |
| |
30 |
| Second |
40 |
| |
50 |
| |
60 |
| Connecting |
301 |
| Opening of the |
101 |
| Gold- |
302 |
| |
303 |
| Surface of | 102、501 |
| A first conductive metal layer | 61 |
| A second conductive metal layer | 63 |
| A first |
70 |
| The first adhesive layer | 80 |
| A second |
75 |
| Second |
85 |
The following detailed description will further illustrate the invention in conjunction with the above-described figures.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.
Some embodiments of the invention are described in detail below with reference to the accompanying drawings. The embodiments described below and the features of the embodiments can be combined with each other without conflict.
Referring to fig. 1 to 7, a circuit board 100 according to an embodiment of the present invention includes a first metal layer 10, a first electromagnetic shielding layer 20, a circuit substrate 30, a second electromagnetic shielding layer 40, and a second metal layer 50, which are sequentially stacked. The circuit board 100 further includes a conductive structure 60 disposed along the stacking direction, and the conductive structure 60 is disposed around the periphery of the circuit board 100 and electrically connected to the first metal layer 10 and the second metal layer 50.
The surface resistivity of the first metal layer 10 and the surface resistivity of the second metal layer 50 are respectively less than 105Ohm. Preferably, the first metal layer 10 and the second metal layer 50 may be at least one of a copper layer and a silver layer.
The circuit substrate 30 may further include at least one connection terminal 301, and the circuit board 100 may further include at least one opening 101, wherein the connection terminal 301 is exposed from the opening 101 to connect to other electronic components.
In some embodiments, the surface of the connection terminal 301 is further provided with a gold-plated layer 302.
The circuit substrate 30 may further include a ground line 303, and the first metal layer 10 and the second metal layer 50 are electrically connected to the ground line 303 through the conducting structure 60. In some embodiments, the conducting structure 60 is directly connected to the ground line 303. In other embodiments, the conducting structure 60 may be indirectly connected to the grounding line 303, for example, the conducting structure 60 is connected to the grounding line 303 through the first electromagnetic shielding layer 20 and the second electromagnetic shielding layer 40.
In some embodiments, the first metal layer 10, the second metal layer 50 and the conducting structure 60 may also be directly grounded through other paths instead of being grounded through the grounding line 303 of the circuit substrate 30.
The circuit substrate 30 may be a single-layer circuit substrate, a double-layer circuit substrate or a multi-layer circuit substrate. In the present embodiment, the circuit board 30 is a double-layer circuit board.
In this embodiment, the first metal layer 10 covers the entire side of the first electromagnetic shielding layer 20 away from the circuit substrate 30, and the second metal layer 50 covers the entire side of the second electromagnetic shielding layer 40 away from the circuit substrate 30.
In a first embodiment, referring to fig. 1, the conducting structure 60 covers the outer side surfaces of the first metal layer 10, the first electromagnetic shielding layer 20, the circuit substrate 30, the second electromagnetic shielding layer 40 and the second metal layer 50.
The conductive structure 60 includes a first conductive metal layer 61 and a second conductive metal layer 63. The first conductive metal layer 61 is bonded to the outer side surfaces of the first metal layer 10, the first electromagnetic shielding layer 20, the circuit substrate 30, the second electromagnetic shielding layer 40, and the second metal layer 50. The second conductive metal layer 63 is disposed on a side of the first conductive metal layer 61 away from the first metal layer 10, the first electromagnetic shielding layer 20, the circuit substrate 30, the second electromagnetic shielding layer 40, and the second metal layer 50.
Preferably, the conducting structure 60 may further extend from the outer side surface of the first metal layer 10 toward the surface 102 of the first metal layer 10 away from the circuit substrate 30, and extend from the outer side surface of the second metal layer 50 toward the surface 501 of the second metal layer 50 away from the circuit substrate 30, so that the conducting structure 60 covers at least a partial area of the surface 102 and at least a partial area of the surface 501, and thus the conducting structure 60 is not easily peeled off, and reliability of electrical connection is ensured.
Specifically, the first conductive metal layer 61 extends from the outer side surface of the first metal layer 10 toward the surface 102 of the first metal layer 10 away from the circuit substrate 30, and extends from the outer side surface of the second metal layer 50 toward the surface 501 of the second metal layer 50 away from the circuit substrate 30. The second conductive metal layer 63 is disposed on the first conductive metal layer 61.
In the present embodiment, the first conductive metal layer 61 may be a copper electroplating layer, and the second conductive metal layer 63 may be a gold plating layer. In other embodiments, the first conductive metal layer 61 and the second conductive metal layer 63 may also be other conductive materials.
In the second embodiment, please refer to fig. 2, which is different from the first embodiment in that the first conductive metal layer 61 is only disposed on the outer side surfaces of the first metal layer 10, the first electromagnetic shielding layer 20, the circuit substrate 30, the second electromagnetic shielding layer 40 and the second metal layer 50, and the second conductive metal layer 63 extends from the first conductive metal layer 61 toward the surface of the first metal layer 10 away from the circuit substrate 30 and the surface of the second metal layer 50 away from the circuit substrate 30.
In the present embodiment, the second conductive metal layer 63 covers the entire first metal layer 10, the entire first conductive metal layer 61, and the entire second metal layer 50.
In some embodiments, the second conductive metal layer 63 may also cover partial areas in the first metal layer 10, the first conductive metal layer 61, and the second metal layer 50.
In a third embodiment, referring to fig. 3 and fig. 7, the conducting structure 60 penetrates the circuit board 100 along the stacking direction, and the conducting structure 60 is disposed near an outer side surface of the circuit board 100.
Specifically, the conductive structure 60 sequentially penetrates through the first metal layer 10, the first electromagnetic shielding layer 20, the circuit substrate 30, the second electromagnetic shielding layer 40, and the second metal layer 50.
In the present embodiment, the conductive structure 60 may be, but not limited to, a conductive paste, or the like. Preferably, the conductive structure 60 may be a copper paste or a silver paste.
In a fourth embodiment, referring to fig. 4, the circuit board 100 may further include a first dielectric layer 70 and a first adhesive layer 80, which are stacked, wherein a side of the first dielectric layer 70 facing away from the first adhesive layer 80 is combined with the first metal layer 10, and a side of the first adhesive layer 80 facing away from the first dielectric layer 70 is combined with the first electromagnetic shielding layer 20.
The circuit board 100 may further include a second dielectric layer 75 and a second adhesive layer 85, which are stacked, wherein a side of the second dielectric layer 75 facing away from the second adhesive layer 85 is combined with the second metal layer 50, and a side of the second adhesive layer 85 facing away from the second dielectric layer 75 is combined with the second electromagnetic shielding layer 40.
The conductive structure 60 covers the first metal layer 10, the first dielectric layer 70, the first adhesive layer 80, the first electromagnetic shielding layer 20, the circuit board 30, the second electromagnetic shielding layer 40, the second adhesive layer 85, the second dielectric layer 75, and the outer side surface of the second metal layer 50.
In a fifth embodiment, referring to fig. 5, the circuit board 100 may further include a first dielectric layer 70 and a first adhesive layer 80, which are stacked, wherein a side of the first dielectric layer 70 facing away from the first adhesive layer 80 is combined with the first metal layer 10, and a side of the first adhesive layer 80 facing away from the first dielectric layer 70 is combined with the first electromagnetic shielding layer 20. That is, the first metal layer 10 may be bonded to the first electromagnetic shielding layer 20 by pressing a single-sided metal plate.
The circuit board 100 may further include a second dielectric layer 75 and a second adhesive layer 85, which are stacked, wherein a side of the second dielectric layer 75 facing away from the second adhesive layer 85 is combined with the second metal layer 50, and a side of the second adhesive layer 85 facing away from the second dielectric layer 75 is combined with the second electromagnetic shielding layer 40. That is, the second metal layer 50 may be bonded to the second electromagnetic shielding layer 40 by pressing a single-sided metal plate.
The conducting structure 60 penetrates the circuit board 100 along the stacking direction, and the conducting structure 60 is disposed near the outer side surface of the circuit board 100.
Specifically, the conducting structure 60 sequentially penetrates through the first metal layer 10, the first dielectric layer 70, the first adhesive layer 80, the first electromagnetic shielding layer 20, the circuit substrate 30, the second electromagnetic shielding layer 40, the second adhesive layer 85, the second dielectric layer 75, and the second metal layer 50.
In the circuit board 100 of the present invention, the first metal layer 10 is disposed on the outer side of the first electromagnetic shielding layer 20, the second metal layer 50 is disposed on the outer side of the second electromagnetic shielding layer 40, and the conducting structure 60 is disposed along the stacking direction, the conducting structure 60 is disposed around the periphery of the circuit board 100 and electrically connects the first metal layer 10 and the second metal layer 50, so that part of static electricity is led away by the first metal layer 10, the second metal layer 50 and the conducting structure 60 and is discharged, and the circuit board 100 can further enhance static protection from various directions without affecting the electrical performance of the product itself. Meanwhile, the first metal layer 10, the second metal layer 50, and the conducting structure 60 also have a magnetic shielding effect, and prevent interference of external signals from multiple directions, thereby facilitating high-frequency and high-speed signal transmission. Secondly, because the moisture absorption rate of the metal is very low, the first metal layer 10, the second metal layer 50 and the conducting structure 60 can be matched to prevent the performance failure of the circuit board 100 caused by moisture absorption, and the service life of the circuit board 100 is prolonged. The first metal layer 10 is disposed outside the first electromagnetic shielding layer 20, the second metal layer 50 is disposed outside the second electromagnetic shielding layer 40, and the conductive structure 60 is disposed along the stacking direction, the conductive structure 60 is disposed around the periphery of the circuit board 100, and a magnetic field generated when static electricity is drawn away from the first metal layer 10, the second metal layer 50, and the conductive structure 60 can be blocked by the first electromagnetic shielding layer 20 and the second electromagnetic shielding layer 40. In addition, the circuit board of the present invention does not affect the wiring of the circuit board 30 while enhancing the electrostatic protection.
Although the present invention has been described with reference to the above preferred embodiments, it should be understood that various changes, substitutions and alterations can be made herein without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (8)
1. A circuit board is characterized by comprising a first metal layer, a first electromagnetic shielding layer, a circuit substrate, a second electromagnetic shielding layer and a second metal layer which are sequentially stacked; the circuit board also comprises a conducting structure arranged along the stacking direction, the conducting structure is arranged around the periphery of the circuit board and is electrically connected with the first metal layer and the second metal layer, the conducting structure comprises a first conducting metal layer and a second conducting metal layer which are stacked outwards from the outer side surface of the circuit board, the circuit board also comprises a first dielectric layer and a first adhesive layer which are stacked, and a second dielectric layer and a second adhesive layer which are stacked; one side of the first dielectric layer, which is far away from the first adhesive layer, is combined with the first metal layer, one side of the first adhesive layer, which is far away from the first dielectric layer, is combined with the first electromagnetic shielding layer, one side of the second dielectric layer, which is far away from the second adhesive layer, is combined with the second metal layer, and one side of the second adhesive layer, which is far away from the second dielectric layer, is combined with the second electromagnetic shielding layer.
2. The circuit board of claim 1, wherein the conductive structure covers outer sides of the first metal layer, the first electromagnetic shielding layer, the circuit substrate, the second electromagnetic shielding layer, and the second metal layer.
3. The circuit board of claim 2, wherein the via structure further extends from an outer side of the first metal layer toward a surface of the first metal layer facing away from the circuit substrate, and from an outer side of the second metal layer toward a surface of the second metal layer facing away from the circuit substrate.
4. The circuit board of claim 2, wherein the first conductive metal layer is bonded to outer sides of the first metal layer, the first electromagnetic shielding layer, the circuit substrate, the second electromagnetic shielding layer, and the second metal layer; the second conductive metal layer is arranged on one side of the first conductive metal layer, which is deviated from the first metal layer, the first electromagnetic shielding layer, the circuit substrate, the second electromagnetic shielding layer and the second metal layer.
5. The circuit board of claim 4, wherein the first conductive metal layer extends from an outer side of the first metal layer toward a surface of the first metal layer facing away from the wiring substrate and extends from an outer side of the second metal layer toward a surface of the second metal layer facing away from the wiring substrate.
6. The circuit board of claim 4, wherein the second conductive metal layer extends from the first conductive metal layer toward a surface of the first metal layer facing away from the circuit substrate and the second metal layer facing away from the circuit substrate.
7. The circuit board of claim 1, wherein the circuit substrate further comprises at least one connection terminal, the circuit board further comprising at least one opening, the connection terminal being exposed from the opening.
8. A circuit board is characterized by comprising a first metal layer, a first electromagnetic shielding layer, a circuit substrate, a second electromagnetic shielding layer and a second metal layer which are sequentially stacked; the circuit board also comprises a conducting structure which is arranged along the stacking direction and close to the outer side surface of the circuit board, the conducting structure penetrates through the circuit board along the stacking direction and is arranged around the periphery of the circuit board to electrically connect the first metal layer and the second metal layer, and the circuit board also comprises a first dielectric layer and a first adhesive layer which are stacked, and a second dielectric layer and a second adhesive layer which are stacked; one side of the first dielectric layer, which is far away from the first adhesive layer, is combined with the first metal layer, one side of the first adhesive layer, which is far away from the first dielectric layer, is combined with the first electromagnetic shielding layer, one side of the second dielectric layer, which is far away from the second adhesive layer, is combined with the second metal layer, and one side of the second adhesive layer, which is far away from the second dielectric layer, is combined with the second electromagnetic shielding layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910769606.4A CN112423462B (en) | 2019-08-20 | 2019-08-20 | Circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910769606.4A CN112423462B (en) | 2019-08-20 | 2019-08-20 | Circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112423462A CN112423462A (en) | 2021-02-26 |
| CN112423462B true CN112423462B (en) | 2022-06-24 |
Family
ID=74779961
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910769606.4A Active CN112423462B (en) | 2019-08-20 | 2019-08-20 | Circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112423462B (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04137798A (en) * | 1990-09-28 | 1992-05-12 | Fujitsu Ltd | Shield structure of flexible printed board |
| JP2001160663A (en) * | 1999-12-02 | 2001-06-12 | Nec Corp | Circuit substrate |
| CN1551717A (en) * | 2003-04-25 | 2004-12-01 | ���µ�����ҵ��ʽ���� | Multilayer printed wiring board and integrated circuit using the same |
| JP2004363347A (en) * | 2003-06-05 | 2004-12-24 | Oki Electric Ind Co Ltd | Multilayer printed circuit board |
| CN204968221U (en) * | 2015-08-25 | 2016-01-13 | 宏启胜精密电子(秦皇岛)有限公司 | Flexible circuit board |
| CN205987702U (en) * | 2016-09-09 | 2017-02-22 | 惠州市雨林科技有限公司 | Wireless shielded line board that charges |
| CN206181537U (en) * | 2016-07-28 | 2017-05-17 | 东莞联桥电子有限公司 | Improvement type non -deformable's high density build -up circuit board |
| CN107535078A (en) * | 2015-05-20 | 2018-01-02 | 株式会社村田制作所 | High-frequency model |
-
2019
- 2019-08-20 CN CN201910769606.4A patent/CN112423462B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04137798A (en) * | 1990-09-28 | 1992-05-12 | Fujitsu Ltd | Shield structure of flexible printed board |
| JP2001160663A (en) * | 1999-12-02 | 2001-06-12 | Nec Corp | Circuit substrate |
| CN1551717A (en) * | 2003-04-25 | 2004-12-01 | ���µ�����ҵ��ʽ���� | Multilayer printed wiring board and integrated circuit using the same |
| JP2004363347A (en) * | 2003-06-05 | 2004-12-24 | Oki Electric Ind Co Ltd | Multilayer printed circuit board |
| CN107535078A (en) * | 2015-05-20 | 2018-01-02 | 株式会社村田制作所 | High-frequency model |
| CN204968221U (en) * | 2015-08-25 | 2016-01-13 | 宏启胜精密电子(秦皇岛)有限公司 | Flexible circuit board |
| CN206181537U (en) * | 2016-07-28 | 2017-05-17 | 东莞联桥电子有限公司 | Improvement type non -deformable's high density build -up circuit board |
| CN205987702U (en) * | 2016-09-09 | 2017-02-22 | 惠州市雨林科技有限公司 | Wireless shielded line board that charges |
Also Published As
| Publication number | Publication date |
|---|---|
| CN112423462A (en) | 2021-02-26 |
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