CN215527206U

CN215527206U - Anti-surge structure, FPC board and LCM liquid crystal display module

Info

Publication number: CN215527206U
Application number: CN202121461784.XU
Authority: CN
Inventors: 贺建文
Original assignee: Fuzhou Lianchuang Electronic Co ltd
Current assignee: Fuzhou Lianchuang Electronic Co ltd
Priority date: 2021-06-29
Filing date: 2021-06-29
Publication date: 2022-01-14
Anticipated expiration: 2031-06-29

Abstract

The utility model provides an anti-surge structure, an FPC (flexible printed circuit) board and an LCM (liquid crystal module) liquid crystal display module, belonging to the technical field of circuit boards; the FPC board comprises a substrate layer, and a circuit layer and a heat dissipation layer which are respectively arranged on two surfaces of the substrate layer; the anti-surge structure is positioned between the substrate layer and the circuit layer, the power signal line is positioned in the circuit layer, and the metal coating is positioned on the circuit layer, so that the power signal line is conducted with the metal coating through the capacitor patch and the anti-surge patch in sequence; dig on the substrate layer and be equipped with the holding recess that holds on the circuit layer, it is equipped with first GND coating to hold the recess surface, so that with the part that holds the recess contact the circuit layer by first GND coating cladding. The utility model effectively prevents the surge phenomenon of the circuit board, ensures that the ESD phenomenon is not generated between the capacitor and the IC, and ensures that the FPC board has the function of strong anti-interference performance because the local part of the LINK signal wire is coated with the GND coating.

Description

Anti-surge structure, FPC board and LCM liquid crystal display module

Technical Field

The utility model belongs to the technical field of circuit boards, and particularly relates to an anti-surge structure, an FPC (flexible printed circuit) board adopting the anti-surge structure and an LCM (liquid crystal display module) adopting the FPC board with the anti-surge structure.

Background

A surge (Electrical supply), also called surge, which as the name implies is the instantaneous occurrence of a peak value exceeding a stable value, i.e. an instantaneous overvoltage exceeding a normal operating voltage, which includes a surge voltage and a surge current; in essence, a surge is a sharp pulse that occurs in only a few millionths of a second. And products containing surge stopping devices can effectively absorb sudden huge energy to protect connected equipment from being damaged. The reasons that surge may be caused are: heavy equipment, short circuits, power switches, or large engines.

At present, a circuit board is used as one of important parts in products such as electronic products, electrical equipment and the like, and the phenomenon of preventing surge on the circuit board has important significance for normal use of the products such as the electronic products, the electrical equipment and the like. However, the circuit board in the existing large sector does not consider the details of the anti-surge phenomenon, even if the details of the anti-surge phenomenon are considered, the anti-surge phenomenon is limited due to the unreasonable layout, and the capacitance and the bonding pad are charged due to the ESD phenomenon generated between the capacitance and the IC. In addition, the LINK cable arranged on the existing circuit board is not good in grounding design, so that the signal is greatly interfered by the outside and various signal tests cannot pass. And at present, the grounding design of the circuit board is not good, so that the LCM liquid crystal display screen connected with the circuit board is easily damaged in an ESD (electro-static discharge) experiment, and the damage of the LCM liquid crystal display screen is caused.

SUMMERY OF THE UTILITY MODEL

In order to solve at least one of the above technical problems, the present invention provides an anti-surge structure, which effectively prevents the occurrence of a surge phenomenon of a circuit board, ensures that no ESD phenomenon occurs between a capacitor and an IC board, and plays a role in protecting the circuit board.

The utility model provides the following technical proposal, an anti-surge structure is arranged on a FPC board for preventing the generation of surge phenomenon; the anti-surge structure comprises a capacitor patch and an anti-surge patch which are adjacently arranged, and a power signal line on the FPC board sequentially contacts the capacitor patch and the anti-surge patch and is conducted with a metal coating on the FPC board.

Compared with the prior art, the utility model has the beneficial effects that: by additionally arranging the anti-surge paster, the power signal wire of the FPC board firstly contacts the capacitor paster and then contacts the anti-surge paster to enter the IC board, the surge phenomenon of the FPC board is prevented, the ESD generated between the capacitor and the IC board is protected, and the circuit board is protected.

Preferably, the surge prevention patch is a TVS diode patch.

Preferably, the capacitor patch and the surge protection patch are arranged close to the metal plating layer on the FPC board.

Preferably, the capacitor patch and the surge-proof patch are both soldered to the FPC board by using a surface mount technology.

The utility model also provides the FPC board adopting the anti-surge structure, which has the function of strong anti-interference performance by locally coating the GND coating on the LINK signal line on the FPC board on the basis of effectively preventing the occurrence of the surge phenomenon of a circuit board and ensuring that the ESD phenomenon is not generated between a capacitor and an IC.

The utility model provides the following technical scheme, a FPC board comprises a substrate layer, and a circuit layer and a heat dissipation layer which are respectively arranged on two surfaces of the substrate layer; preferably, the FPC board further includes the above surge-prevention structure, the capacitor patch and the surge-prevention patch are both located between the substrate layer and the circuit layer, the power signal line is located in the circuit layer, and the metal plating layer is located on the circuit layer, so that the power signal line is conducted with the metal plating layer through the capacitor patch and the surge-prevention patch in sequence.

Compared with the prior art, the utility model has the beneficial effects that: the surge prevention patch is additionally arranged, and a power signal wire of the FPC board firstly contacts the capacitor patch and then enters the IC board after contacting the surge prevention patch, so that the surge phenomenon of the FPC board is prevented.

Preferably, dig on the substrate layer and be equipped with the recess that holds the circuit layer, hold the recess surface and be equipped with first GND coating, so that with the part that holds the recess contact the circuit layer by first GND coating cladding. The technical characteristic design aims at preventing the signals of the FPC from being interfered by the outside and preventing the FPC from interfering other signals.

Preferably, a second GND coating is arranged on the surface of the base material layer on one side of the circuit layer, and the second GND coating is connected with the first GND coating in a seamless mode.

Preferably, the FPC board further includes at least one perforation penetrating through the substrate layer, the circuit layer and the heat dissipation layer, and a heat conduction layer contacting the circuit layer and the heat dissipation layer is provided on an inner wall of the perforation.

Preferably, the structure of the heat dissipation layer is a mesh structure, a strip structure, a wave structure or a honeycomb structure.

The utility model also provides an LCM (liquid crystal display module) adopting the FPC, which has the functions of protecting the LCM connected with the FPC on the basis of preventing surge, ESD (electro-static discharge) and strong anti-interference performance.

The utility model provides a following technical scheme, a LCM liquid crystal display module, including built-in LCM liquid crystal display who has the IC board and foretell FPC board, FPC board with pass through between the IC board the metal coating contact is connected.

Compared with the prior art, the utility model has the beneficial effects that: by wrapping the surface of the FPC board by the GND coating, the LCM liquid crystal display screen connected with the FPC board is prevented from being damaged by ESD experiments, and the effect of protecting the LCM liquid crystal display screen is achieved.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without inventive exercise.

Fig. 1 is a front view of an FPC board according to a first embodiment of the present invention;

fig. 2 is a rear view of an FPC board according to a first embodiment of the present invention;

FIG. 3 is a cross-sectional view taken along line A-A of FIG. 1;

FIG. 4 is an enlarged partial schematic view of the section marked C in FIG. 3;

FIG. 5 is a partially enlarged schematic view of the section B in FIG. 1;

fig. 6 is a front view of an LCM liquid crystal display module according to a second embodiment of the present invention.

Description of reference numerals:

10-FPC board, 11-substrate layer, 111-accommodating groove, 112-first GND coating, 113-second GND coating, 12-circuit layer, 13-heat dissipation layer, 14-surge prevention structure, 141-capacitor patch, 142-surge prevention patch, 15-power signal line, 16-metal plating, 17-perforation and 171-heat conduction layer;

20-LCM liquid crystal display screen.

Detailed Description

Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary and intended to be illustrative of the embodiments of the present invention, and should not be construed as limiting the utility model.

In the description of the embodiments of the present invention, it should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience in describing the embodiments of the present invention and simplifying the description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the embodiments of the present invention, "a plurality" means two or more unless specifically limited otherwise.

In the embodiments of the present invention, unless otherwise explicitly specified or limited, the terms "mounted," "connected," "fixed," and the like are to be construed broadly, e.g., as being fixedly connected, detachably connected, or integrated; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. Specific meanings of the above terms in the embodiments of the present invention can be understood by those of ordinary skill in the art according to specific situations.

The first embodiment is as follows:

as shown in fig. 1, 2, and 3, in a first embodiment of the present invention, an FPC board 10 includes a substrate layer 11, and a circuit layer 12 and a heat dissipation layer 13 respectively provided on both surfaces of the substrate layer 11. In this embodiment, the circuit layer 12 and the heat dissipation layer 13 are respectively adhered to the upper and lower surfaces of the substrate layer 11 by double-sided tapes; specifically, the substrate layer 11 is polyimide, but includes, but is not limited to, polyimide, and the substrate layer of other embodiments may also be any one of polyester, polysulfone, or polytetrafluoroethylene; the double faced adhesive tape is the epoxy glue film, heat dissipation layer 13 is the copper foil layer, this embodiment heat dissipation layer 13 can effectively increase FPC board 10's heat radiating area plays even radiating effect, thereby improves FPC board 10's radiating efficiency.

Further, the structure of the heat dissipation layer 13 is a mesh structure, and the heat dissipation layer 13 with the mesh structure can better improve the heat dissipation effect of the FPC board 10, thereby further improving the service life of the FPC board 10. It should be noted that the heat dissipation layer 13 includes, but is not limited to, a mesh structure, and in other embodiments, the heat dissipation layer may also have a stripe structure, a wave structure, or a honeycomb structure.

As shown in fig. 4, the FPC board 10 further includes at least one perforation 17 penetrating the base material layer 11, the wiring layer 12, and the heat dissipation layer 13; further, the inner wall of the through hole 17 is provided with a heat conduction layer 171 in contact with the circuit layer 12 and the heat dissipation layer 13. Specifically, the circuit layer 12 and the heat dissipation layer 13 on the two sides of the substrate layer 11 can be electrically connected by using the good heat conduction performance of the through hole 17, so as to exert a good heat conduction function, and the heat conduction layer 171 can provide a heat conduction function, so as to achieve a good heat dissipation effect. Preferably, the heat conducting layer 171 is a copper paste conductive ink layer.

Further, the substrate layer 11 is dug with a containing groove 111 for containing the circuit layer, and the surface of the containing groove 111 is provided with a first GND coating 112, so that the circuit layer 12 in contact with the containing groove 111 is coated with the first GND coating 112. In this embodiment, first GND coating 112 adopts surface mounting technology to arrange in hold in the recess 111, line layer 12 holds extremely in holding the recess 111, its with the part of substrate layer 11 contact all passes through the cladding of second GND coating 113, promptly line layer quilt the trilateral cladding of second GND coating 113 avoids line layer 12's signal with signal between the signal of FPC board 10 does not interfere with each other, effectively improves the interference killing feature of FPC board 10.

As shown in fig. 5, the FPC board 10 further includes an anti-surge structure 14, which includes a capacitor patch 141 and an anti-surge patch 142 that are adjacently disposed, and the power signal line 15 on the FPC board 10 sequentially contacts the capacitor patch 141 and the anti-surge patch 142, and is electrically connected to the metal plating 16 on the FPC board 10. Preferably, the surge preventing patch 142 is a TVS diode patch. In this embodiment, the capacitor patch 141 and the surge preventing patch 142 are disposed close to the metal plating 16 on the FPC board 10, the capacitor patch 141 and the surge preventing patch 142 are both located between the substrate layer 11 and the circuit layer 12, the power signal line 15 is located in the circuit layer 12, and the metal plating 16 is located on the circuit layer 12, so that the power signal line 15 is sequentially conducted with the metal plating 16 through the capacitor patch 141 and the surge preventing patch 142. According to the utility model, the surge prevention paster 142 is additionally arranged, and the power signal wire 15 of the FPC board 10 firstly contacts the capacitor paster 141 and then contacts the surge prevention paster 142 to enter the structural design of the IC board, so that the surge phenomenon of the FPC board 10 is prevented.

Further, the capacitor patches 141 and the surge protection patches 142 are both soldered to the FPC board 10 by using the surface mount technology.

In this embodiment, the FPC board 10 passes through the anti-surge structure 14, so that the power signal line 15 of the FPC board 10 first contacts the capacitor patch 141, then contacts the anti-surge patch 142, and enters the IC board of the external device electrically connected to the FPC board 10, thereby preventing the FPC board 10 from generating a surge phenomenon; moreover, the first GND coating 112 is disposed on the surface of the accommodating groove 111, so that the circuit layer 12 contacting with the accommodating groove 111 is covered by the first GND coating 112, and thus signals of the FPC board 10 are not interfered by the outside, and the FPC board 10 does not interfere with other signals, thereby improving the anti-interference capability of the FPC board 10.

It should be noted that the functional coating and the related electronic components of the FPC board 10 mentioned in the present embodiment are regarded as the prior art because they are not related to the utility model protected by the present invention and are not described.

Example two:

as shown in fig. 6, the LCM liquid crystal display module comprises an LCM liquid crystal display 20 with an IC board and the FPC board 10, wherein the FPC board 10 is in contact connection with the IC board through the metal plating layer 16. Further, as shown in fig. 4, a second GND coating layer 113 is disposed on the surface of the substrate layer 11 on the side of the circuit layer 12, and the second GND coating layer 113 is seamlessly connected to the first GND coating layer 112. In this embodiment, the second GND coating 113 is disposed on the surface of the substrate layer by using a surface mount technology, and the first GND coating 112 and the second GND coating 113 are connected seamlessly, so that the surface of the substrate layer 11 on one side of the circuit layer 12 is coated with the GND coating on the surface except for the area of the capacitor patch 141 and the surge-proof patch 142, and the periphery of the FPC board 10 is wrapped by the GND coating to prevent the LCM liquid crystal display 20 connected to the FPC board 10 from being damaged during an ESD experiment, thereby protecting the LCM liquid crystal display 20.

The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the utility model, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included within the scope of the present invention.

Claims

1. The anti-surge structure is characterized by comprising a capacitor patch and an anti-surge patch which are adjacently arranged, wherein a power signal wire on the FPC sequentially contacts the capacitor patch and the anti-surge patch and is conducted with a metal coating on the FPC.

2. The anti-surge structure of claim 1, wherein the anti-surge patch is a TVS diode patch.

3. The surge-prevention structure of claim 1, wherein the capacitive patch and the surge-prevention patch are disposed proximate to a metal plating on the FPC board.

4. The surge protection structure of any one of claims 1 to 3, wherein the capacitor patch and the surge protection patch are both soldered to the FPC board by surface mount technology.

5. An FPC board, comprising a substrate layer, and a circuit layer and a heat dissipation layer respectively arranged on two surfaces of the substrate layer, characterized by comprising the anti-surge structure of claim 4, wherein the capacitor patch and the anti-surge patch are both arranged between the substrate layer and the circuit layer, the power signal line is arranged in the circuit layer, and the metal plating layer is arranged on the circuit layer, so that the power signal line is conducted with the metal plating layer through the capacitor patch and the anti-surge patch in sequence.

6. The FPC board of claim 5, wherein a receiving groove for receiving the wiring layer is dug in the base material layer, and a first GND coating is provided on a surface of the receiving groove so that a portion of the wiring layer in contact with the receiving groove is covered with the first GND coating.

7. The FPC board of claim 6, wherein a second GND coating is disposed on the surface of the substrate layer on one side of the circuit layer, and the second GND coating is seamlessly connected to the first GND coating.

8. The FPC board of claim 5, further comprising at least one perforation passing through the substrate layer, the circuit layer, and the heat dissipation layer, an inner wall of the perforation being provided with a heat conductive layer in contact with the circuit layer and the heat dissipation layer.

9. The FPC board of claim 7, wherein the structure of the heat dissipation layer is a mesh structure, a stripe structure, a wave structure, or a honeycomb structure.

10. An LCM (liquid Crystal Module) liquid crystal display module comprising an LCM liquid crystal display panel with an IC (Integrated Circuit) board, wherein the FPC board is as claimed in any one of claims 5 to 9, and the FPC board is in contact connection with the IC board through the metal plating layer.