CN217544093U - ESD protection liquid crystal module and LCM screen - Google Patents

Abstract

The utility model provides an ESD protection liquid crystal module and LCM screen, the ESD protection liquid crystal module comprises a FPC board and a liquid crystal display screen, the liquid crystal display screen comprises a backlight iron frame, and the FPC board is bent and adhered to the back of the backlight iron frame; the FPC board is bent and then a copper leakage connection position is arranged on a first side face, away from the backlight iron frame, of the FPC board, high-temperature adhesive paper is arranged on the first side face, located outside the copper leakage grounding position area, flexible plane conductors are arranged on the high-temperature adhesive paper, and the flexible plane conductors completely cover the copper leakage connection position and extend out of the FPC board to be in contact with the backlight iron frame. Through this application, through rationally add suitable electrostatic discharge structure on indisputable frame in a poor light and FPC board to the ESD that produces in time releases on the LCD module in the LCM screen is realized, has the purpose that can not show potential quality risks such as screen and black screen and take place because of ESD accumulation causes LCD module.

Description

ESD protection liquid crystal module and LCM screen

Technical Field

The utility model belongs to the technical field of the anti ESD of industry control type LCD module, specifically relate to an ESD protection LCD module to and adopt the LCM screen of this ESD protection LCD module.

Background

The cell-phone display module assembly of prior art all is the Incell structure basically, and the area chase is shaded, TP touch-control performance and the radio frequency performance in order to promote the cell-phone, all can paste electrically conductive double faced adhesive tape at the FPC back, guarantee FPC buckle back and be in the same place with the chase hugging closely in a poor light, guarantee FPC and chase and be connected effectively electrically simultaneously, prevent that display module assembly monomer ESD from increasing the risk, the static that realizes liquid crystal module production conducts FPC's earthing terminal release through the chase in a poor light, thereby reduce liquid crystal module's the quality risk that can not show screen and black screen.

The liquid crystal module of the prior art mobile phone usually adopts the structure as shown in fig. 1 to fig. 3, wherein the back surface of the backlight frame 21 and the FPC board 10 are adhered and fixed by the conductive double-sided tape 212, the adhesion surface of the FPC board 10 is provided with the copper leaking position 121, the conductive double-sided tape 212 includes a conductive area 2121 and a non-conductive area 2122, the position of the conductive area 2121 corresponds to the copper leaking position 121 of the FPC board 10, the area of the conductive double-sided tape 212 except the conductive area 2121 is the non-conductive area 2122, so that after the backlight frame 21 and the FPC board 10 are fixed by the conductive tape 212, only the copper leaking position 121 of the FPC board 10 can be conducted with the backlight frame 21 through the conductive area 2121, and the non-copper leaking area of the FPC board 10 is adhered to the non-conductive area 2122. However, in the structural design, when the liquid crystal module of the mobile phone works for a long time, the ESD cannot be released in time and accumulated, so that the quality risks that the display screen and the black screen cannot be displayed in the display module of the mobile phone cannot be thoroughly solved.

Therefore, how to timely release the ESD generated on the liquid crystal module to avoid the potential quality risks of the liquid crystal module, such as the failure of displaying and the black screen, caused by the accumulation of the ESD, is an urgent issue to be solved.

SUMMERY OF THE UTILITY MODEL

In order to solve the technical problem, the utility model provides a ESD protection LCD module and LCM screen through rationally add suitable electrostatic discharge structure on indisputable frame in a poor light and FPC board to the ESD that produces on the LCD module in the realization LCM screen is in time released.

The utility model provides an ESD protection liquid crystal module, which comprises an FPC board and a liquid crystal display screen internally provided with a driving IC board, wherein the driving IC board is exposed at the bottom of the liquid crystal display screen and is connected with the FPC board through a metal plating layer; the liquid crystal display screen comprises a backlight iron frame, the FPC board is bent and adhered to the back of the backlight iron frame; the FPC board is bent to form a copper leakage connection position on a first side face away from the backlight iron frame, high-temperature adhesive paper is arranged on the first side face outside the copper leakage grounding position area, a flexible plane conductor is arranged on the high-temperature adhesive paper, and the flexible plane conductor completely covers the copper leakage connection position and extends out of the FPC board to be in contact with the backlight iron frame.

Compared with the prior art, the beneficial effects of the utility model are that: the flexible flat conductor is arranged on the high-temperature adhesive paper and completely covers the copper leakage connection position and extends out of the FPC board to be in contact with the backlight iron frame, so that static electricity generated by the liquid crystal display screen is conducted to the FPC board through the flexible flat conductor and is released in a grounding mode through the copper leakage connection position on the FPC board.

Preferably, the backlight iron frame is provided with a non-conductive double-sided adhesive tape and a conductive double-sided adhesive tape, the conductive double-sided adhesive tape is arranged corresponding to a copper leakage position formed on the FPC board, and the area of the copper leakage position is smaller than that of the conductive double-sided adhesive tape.

Preferably, the copper leakage position is located on a second side surface of the FPC board, which faces the backlight iron frame after being bent, and the copper leakage position is located at an edge of the second side surface, so that the area of the copper leakage position can be enlarged by avoiding a circuit built in the FPC board.

Preferably, the second side surface is provided with a copper exposure GND position, and the copper exposure GND position is located at the edge of the second side surface, so that the area of the copper exposure GND position can be enlarged by avoiding the built-in circuit of the FPC board.

Preferably, the first and second air flow paths are arranged in parallel, the non-conductive double faced adhesive tape comprises a strong-viscosity glue layer, a base material layer and a weak-viscosity glue layer which are sequentially arranged from bottom to top; and the strong-viscosity glue layer is attached to the backlight iron frame, and the weak-viscosity glue layer is attached to the FPC board.

Preferably, the upper surface of substrate layer is provided with prevents slow-witted layer, strong viscidity glue layer set up in prevent slow-witted upper surface on layer.

Preferably, the initial adhesion ratio of the strongly and weakly adhesive glue layers is in the range of 2.

Preferably, a double-layer grid copper layer is printed on the bending area of the FPC board; wherein the mesh copper layer is located on the first side.

Preferably, the flexible planar conductor is a conductive cloth.

The utility model discloses a still provide an LCM screen, including foretell protection LCD module.

Compared with the prior art, the beneficial effects of the utility model are that: the method comprises the steps that a copper leakage connection position is arranged on a first side face, away from a backlight iron frame, of a bent FPC board, high-temperature adhesive paper is located on the first side face outside a copper leakage grounding position area, the high-temperature adhesive paper is arranged on the high-temperature adhesive paper through a flexible plane conductor, the flexible plane conductor completely covers the copper leakage connection position and extends out of the FPC board to be in contact with the backlight iron frame, static electricity generated by a liquid crystal display screen is conducted to the FPC board through the flexible plane conductor, and grounding release is carried out through the copper leakage connection position on the FPC board.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for the embodiments or the prior art descriptions will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without inventive labor.

FIG. 1 is a partial schematic diagram of a longitudinal cross-section of a prior art ESD protection liquid crystal module;

FIG. 2 is a schematic structural diagram of an FPC in an ESD protection liquid crystal module according to the prior art;

FIG. 3 is a schematic structural view of the conductive double-sided tape shown in FIG. 1;

fig. 4 is a front view of an ESD protection liquid crystal module according to an embodiment of the present invention;

fig. 5 is a schematic view illustrating the FPC board attached to the backlight bezel after being bent according to an embodiment of the present invention;

fig. 6 is a front view of the FPC board facing away from the backlight bezel before being bent according to an embodiment of the present invention;

FIG. 7 is an enlarged partial schematic view of the section labeled A in FIG. 4;

FIG. 8 is an enlarged partial view of the section B in FIG. 4;

fig. 9 is a schematic structural diagram of a section of a non-conductive double-sided tape according to an embodiment of the present invention.

Description of reference numerals:

10-FPC board, 11-first side surface, 111, copper leakage connection position, 112-grid copper layer, 12-second side surface, 121-copper leakage position and 122-copper exposure GND position;

20-liquid crystal display screen, 21-backlight iron frame, 211-non-conductive double-sided adhesive tape, 2111-strong-viscosity glue layer, 2112-fool-proof layer, 2113-base material layer, 2114-weak-viscosity glue layer, 212-conductive double-sided adhesive tape, 2121-conductive area, 2122-non-conductive area and 213-fixing film;

30-high temperature gummed paper;

40-flexible planar conductor.

Detailed Description

Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below by referring to the drawings are exemplary and intended to explain the embodiments of the present invention and are not to be construed as limiting the present invention.

In the description of the embodiments of the present invention, it should be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in the orientation or positional relationship indicated in the drawings, which is only for convenience in describing the embodiments of the present invention and simplifying the description, and do not indicate or imply that the device or element so indicated must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the embodiments of the present invention, "a plurality" means two or more unless specifically limited otherwise.

In the embodiments of the present invention, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "fixed" are to be construed broadly, e.g., as fixed or detachable connections or as an integral part; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the embodiments of the present invention can be understood by those of ordinary skill in the art according to specific situations.

Fig. 1 to 3 show an ESD protection backlight module of the prior art, which includes a backlight bezel 21 and an FPC board 10 bent to the back of the backlight bezel 21, wherein the back of the backlight bezel 21 and the FPC board 10 are fixed by a conductive double-sided tape 212. Since the conductive double-sided tape 212 includes the conductive region 2121 and the non-conductive region 2122, the position of the conductive region 2121 corresponds to the copper leakage position 121 of the FPC board 10, and the region of the conductive double-sided tape 212 except the conductive region 2121 is the non-conductive region 2122, so that after the backlight bezel 21 and the FPC board 10 are fixed by the conductive double-sided tape 212, only the copper leakage position 121 of the FPC board 10 can be conducted with the backlight bezel 21 through the conductive region 2121, and the non-copper leakage position region of the FPC board 10 is adhered to the non-conductive region 2121, so as to prevent other lines of the FPC board 10 from being conducted with the backlight bezel 21 through the conductive double-sided tape 212, and static electricity can only be conducted to the FPC board 10 through the backlight bezel 21 to be released to ground, and cannot cross talk to other lines of the FPC board 10, thereby achieving the improvement of the ESD resistance. However, although the ESD protection backlight module in the prior art can improve the ESD resistance of the backlight module, the ESD may not be released in time and may accumulate under long-time operation, so that the above-mentioned electrostatic discharge structure may not completely solve the quality risks of the liquid crystal module, such as failure to display and black screen. This is also the meaning of the present invention.

In an embodiment of the present invention, as shown in fig. 4, an LCM screen including an ESD protection liquid crystal module is provided in this embodiment. It should be noted that, as for other parts of the LCM screen, since the relevance with the technical point to be highlighted by the present invention is not great, they are not identified in the present embodiment.

Further, the ESD protection liquid crystal module includes an FPC board 10 and a liquid crystal display 20 having a driver IC board built therein, where the driver IC board (not shown) is exposed at the bottom of the liquid crystal display 20 and connected to the FPC board 10 through the metal plating layer. The FPC board 10 connected to the driver IC board (not shown) is soldered with the metal plating layer by surface mount technology, and in order to prevent the metal plating layer from rusting and waterproofing, it is preferable to coat thermosetting green oil on the surface thereof. In specific practice, the FPC board 10 includes a substrate layer, and a circuit layer and a heat dissipation layer respectively disposed on two surfaces of the substrate layer, and the metal plating layer is disposed on the circuit layer, so that a power signal line of the FPC board 10 is electrically connected to the metal plating layer. It should be noted that, the heat dissipation layer of the FPC board 10 is preferably a copper foil layer, which can effectively increase the heat dissipation area of the FPC board 10, and play a role of uniform heat dissipation, thereby improving the heat dissipation efficiency of the FPC board 10.

As shown in fig. 5, the liquid crystal display panel 20 includes a backlight frame 21, and the FPC board 10 is bent to be adhered to the back surface of the backlight frame 21. Specifically, as shown in fig. 6, a copper leakage connection position 111 is formed on a first side surface 11 of the FPC board 10 which is bent to be away from the backlight iron frame 21, a high temperature adhesive paper 30 is disposed on the first side surface 11 outside the copper leakage connection position 111 region, a flexible planar conductor 40 is disposed on the high temperature adhesive paper 30, and the flexible planar conductor 40 completely covers the copper leakage connection position 111 and extends out of the FPC board 10 to contact the backlight iron frame 21. Preferably, the flexible planar conductor 40 is a conductive cloth. This embodiment passes through flexible planar conductor 40 sets up on the high temperature adhesive tape 30, just flexible planar conductor 40 covers completely leak copper connects status 111 and extends FPC board 10 with the contact of indisputable frame 21 is shaded for the static that the ESD protection liquid crystal module produced passes through flexible planar conductor 40 conducts to on the FPC board 10, and through leak copper on the FPC board 10 connects status 111 to carry out ground release, realizes on prior art's liquid crystal module electrostatic discharge structure basis, has increased the channel of electrostatic discharge, reduces the accumulation of static promptly, reaches in time will use the ESD release that the liquid crystal module produced, so as to avoid having the purpose that can not show potential quality risks such as screen and black screen and take place because of ESD accumulation causes the liquid crystal module.

Further, an end of the FPC board 10 away from the driver IC board (not shown) is fixed to the backlight bezel 21 via a fixing film 213. In a specific practice, the required bending area of the FPC board 10 is printed with a double-layer mesh copper layer 112. In this embodiment, the mesh copper layer 112 is located on the first side 11.

As shown in fig. 7, a non-conductive double-sided adhesive tape 211 and a conductive double-sided adhesive tape 212 are disposed on the backlight bezel 21, the conductive double-sided adhesive tape 212 is disposed corresponding to the copper leakage position 121 formed on the FPC board 10, and an area of the copper leakage position 121 is smaller than an area of the conductive double-sided adhesive tape 212. In this embodiment, the thickness of the non-conductive double-sided adhesive 211 is 0.05 mm, the bent FPC board 10 is attached to the backlight bezel 21 through the non-conductive double-sided adhesive 211, and the copper leakage site 121 is conducted to the backlight bezel 21 through the conductive double-sided adhesive 212, so that a part of the power signal lines attached to the conductive double-sided adhesive 212 on the FPC board 10 is conducted to the backlight bezel 21, and other power signal lines of the FPC board 10 are not conducted to the backlight bezel 21, so that static electricity can only be conducted to the FPC board 10 through the conductive double-sided adhesive 212 to be released to the ground, and other lines of the FPC board 10 cannot be interfered.

Further, the copper leakage position 121 is located on the second side surface 12 of the FPC board 10, which faces the backlight bezel 21 after bending, and the copper leakage position 121 is located at the edge of the second side surface 12, so that the area of the copper leakage position 121 can be enlarged by avoiding a built-in circuit of the FPC board 10. In specific practice, the copper leakage position 121 can be adjusted according to the circuit layer of the FPC board 10, so that the copper leakage position 121 obtains a larger area, the attachment area of the copper leakage position 121 on the backlight bezel 21 is effectively increased, and the release of static electricity is facilitated.

As shown in fig. 8, the second side surface 12 is provided with a copper exposed GND position 122, and the copper exposed GND position 122 is located at the edge of the second side surface 12, so that the area of the copper exposed GND position 122 can be enlarged by avoiding a built-in circuit of the FPC board 10, and the electrostatic discharge is facilitated.

As shown in fig. 9, the non-conductive double-sided adhesive tape 211 includes a strong-adhesiveness adhesive-water layer 2111, a substrate layer 2113, and a weak-adhesiveness adhesive-water layer 2114, which are sequentially disposed from bottom to top; the strong-viscosity glue layer 2111 is attached to the backlight iron frame 21, the weak-viscosity glue layer 2114 is attached to the FPC board 10, so that the FPC board 10 is prevented from being pulled and damaged when viscosity is too strong, and the strong-viscosity glue can ensure the bonding strength with the backlight iron frame 21. Preferably, the upper surface of substrate layer 2113 is provided with prevents slow-witted layer 2112, strong viscidity glue 2111 layer set up in prevent slow-witted layer 2112's upper surface, owing to be equipped with prevent slow-witted layer 2112 as the discernment, can play the effect of preventing staying. In specific practice, the initial adhesion ratio of the strong adhesive glue layer 2111 to the weak adhesive glue layer 2114 ranges from 2 to 1, which prevents the pull damage to the FPC board 10 by controlling the glue adhesion.

The above description is only exemplary of the present invention and should not be taken as limiting the scope of the present invention, as any modifications, equivalents, improvements and the like made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.

Claims (10)

1. An ESD protection liquid crystal module comprises an FPC board and a liquid crystal display screen with a built-in drive IC board, wherein the drive IC board is exposed at the bottom of the liquid crystal display screen and is connected with the FPC board through a metal coating; the liquid crystal display screen comprises a backlight iron frame, and the FPC board is bent and adhered to the back of the backlight iron frame; the flexible printed circuit board is characterized in that a copper leakage connection position is arranged on a first side surface of the FPC board after bending and away from the backlight iron frame, high-temperature adhesive paper is arranged on the first side surface outside the copper leakage connection position area, a flexible plane conductor is arranged on the high-temperature adhesive paper, and the flexible plane conductor completely covers the copper leakage connection position and extends out of the FPC board to be in contact with the backlight iron frame.

2. The ESD protection liquid crystal module according to claim 1, wherein the backlight bezel is provided with a non-conductive double-sided tape and a conductive double-sided tape, the conductive double-sided tape is disposed corresponding to a copper leakage position formed on the FPC board, and an area of the copper leakage position is smaller than an area of the conductive double-sided tape.

3. The ESD protection liquid crystal module according to claim 2, wherein the copper leakage position is located on a second side surface of the FPC board facing the backlight iron frame after being bent, and the copper leakage position is located at an edge of the second side surface, so that an area of the copper leakage position can be enlarged by avoiding a built-in circuit of the FPC board.

4. The ESD protection liquid crystal module according to claim 3, wherein a copper exposed GND bit is disposed on the second side surface and located at an edge of the second side surface, so that the area of the copper exposed GND bit can be enlarged to avoid a circuit built in the FPC board.

5. The ESD protection liquid crystal module according to claim 2, wherein the non-conductive double-sided adhesive tape comprises a strong-viscosity adhesive tape layer, a substrate layer and a weak-viscosity adhesive tape layer sequentially arranged from bottom to top; and the strong-viscosity glue layer is attached to the backlight iron frame, and the weak-viscosity glue layer is attached to the FPC board.

6. The ESD protection liquid crystal module according to claim 5, wherein the upper surface of the substrate layer is provided with a fool-proof layer, and the high-viscosity glue layer is disposed on the upper surface of the fool-proof layer.

7. The ESD protection liquid crystal module according to claim 5, wherein the initial adhesion ratio of the strong adhesion glue layer to the weak adhesion glue layer is in a range of 2.

8. The ESD protection liquid crystal module according to claim 1, wherein the FPC board is printed with a double-layer grid copper layer in the bending region; wherein the mesh copper layer is located on the first side.

9. The ESD protection liquid crystal module according to any of claims 1-8, wherein the flexible planar conductor is a conductive cloth.

10. An LCM panel comprising the protective liquid crystal module of any one of claims 1 to 9.

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