CN218103650U - Printed circuit board and electronic product - Google Patents
Printed circuit board and electronic product Download PDFInfo
- Publication number
- CN218103650U CN218103650U CN202222451271.1U CN202222451271U CN218103650U CN 218103650 U CN218103650 U CN 218103650U CN 202222451271 U CN202222451271 U CN 202222451271U CN 218103650 U CN218103650 U CN 218103650U
- Authority
- CN
- China
- Prior art keywords
- circuit board
- printed circuit
- pad
- grounding
- pads
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 229910000679 solder Inorganic materials 0.000 claims abstract description 40
- 239000000758 substrate Substances 0.000 claims abstract description 25
- 238000005476 soldering Methods 0.000 claims description 15
- 238000005192 partition Methods 0.000 claims description 7
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 abstract description 17
- 229910000831 Steel Inorganic materials 0.000 abstract description 14
- 239000010959 steel Substances 0.000 abstract description 14
- 238000009412 basement excavation Methods 0.000 abstract 1
- 238000003466 welding Methods 0.000 description 20
- 239000006071 cream Substances 0.000 description 14
- 238000005538 encapsulation Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000004806 packaging method and process Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
Images
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The utility model discloses a printed circuit board and an electronic product, which comprises a substrate, a plurality of pads, a solder mask and a supporting part, wherein the substrate is provided with a pad layout area; the plurality of pads comprise grounding pads, and the grounding pads are arranged on the substrate and are positioned in the pad arrangement area; the solder mask layer is arranged in a region of the substrate outside the pad arrangement region, so that a plurality of concave grooves are formed on the solder mask layer, each pad is exposed at the bottom of the corresponding concave groove, and the plurality of concave grooves comprise first concave grooves corresponding to the grounding pads; one end of the supporting part is arranged at the bottom of the first concave groove, and the other end of the supporting part extends to the opening edge which protrudes outwards from the notch of the first concave groove. The supporting part is arranged to correspond to the supporting points formed on the grounding bonding pad, so that when the solder paste of the printed circuit board is printed, the supporting part can support the part, corresponding to the grounding bonding pad, of the steel screen plate, so that the phenomenon that the solder paste in the first concave groove is less in tin excavation and the thickness of the solder paste is lower than that of the solder mask layer is avoided, and the grounding bonding pad is prevented from being welded with the component with the bonding pad in an empty mode.
Description
Technical Field
The utility model relates to a printed circuit board technical field, concretely relates to printed circuit board and electronic product.
Background
The component is generally fixed on the printed circuit board by welding, and the component with the pad, especially the component which is packaged by using QFP (Plastic Quad Flat Package) and SOP (Small Out-Line Package) and has the pad, is provided with the pad which is arranged in an inward concave manner, and because the pad of the printed circuit board is also arranged in an inward concave manner, in order to prevent the empty welding phenomenon after the component is welded with the printed circuit board, at present, when the printed circuit board is printed, the part on a steel net corresponding to the pad of the printed circuit board is thickened, so that the pad of the printed circuit board has enough soldering paste, but the soldering paste of a precise functional pin in the direction parallel to a scraper of a printing machine can be printed, so that the soldering paste does not meet the soldering requirement, and the welding quality is further influenced.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a printed circuit board and electronic product aims at solving the QFP of taking the pad, SOP encapsulation components and parts and printed circuit board welding, easily appears the problem of empty solder joint phenomenon.
In order to achieve the above object, the present invention provides a printed circuit board, including:
a substrate formed with a pad layout region;
the plurality of bonding pads comprise grounding bonding pads, and the grounding bonding pads are arranged on the substrate and are positioned in the bonding pad arrangement area;
the solder mask is arranged in a region of the substrate outside the pad arrangement region, so that a plurality of concave grooves are formed on the solder mask, each pad is exposed at the bottom of the corresponding concave groove, and the plurality of concave grooves comprise first concave grooves corresponding to the grounding pads; and the number of the first and second groups,
and one end of the supporting part is arranged at the bottom of the first concave groove, and the other end of the supporting part extends to the opening edge which protrudes outwards from the notch of the first concave groove.
Optionally, the supporting portion includes a supporting frame, and the supporting frame is disposed in the first concave groove and protrudes from a notch of the first concave groove.
Optionally, a plurality of accommodating unit slots are formed on the supporting frame for accommodating solder paste respectively.
Optionally, the supporting frame includes a supporting frame and a plurality of partition plates disposed in the supporting frame, and the plurality of partition plates are disposed in a staggered manner to form a plurality of accommodating unit slots.
Optionally, the support portion has a green oil support section and a white oil support section stacked in sequence in a direction from the bottom wall of the first recessed groove toward the notch thereof.
Optionally, the height of the green oil supporting section is H, and H is more than or equal to 15um and less than or equal to 30um; and/or the presence of a gas in the gas,
the height of the white oil supporting section is H, and H is more than or equal to 8um and less than or equal to 10um.
Optionally, the supporting portion has an abutting end protruding outward from a mouth edge of the notch of the first recessed groove, and the abutting end is provided with a welding layer for welding and fixing the abutting end and a pad on the element to be welded.
Optionally, the thickness of the welding layer is S, and S is more than or equal to 0.158mm and less than or equal to 0.16mm.
The utility model discloses still provide an electronic product, electronic product includes printed circuit board, printed circuit board includes:
a substrate formed with a pad layout region;
the plurality of bonding pads comprise grounding bonding pads, and the grounding bonding pads are arranged on the substrate and are positioned in the bonding pad arrangement area;
the solder mask is arranged in a region of the substrate outside the pad arrangement region, so that a plurality of concave grooves are formed on the solder mask, each pad is exposed at the bottom of the corresponding concave groove, and the plurality of concave grooves comprise first concave grooves corresponding to the grounding pads; and the number of the first and second groups,
and one end of the supporting part is arranged at the bottom of the first concave groove, and the other end of the supporting part extends to the opening edge which protrudes outwards from the notch of the first concave groove.
Optionally, the electronic product includes one or more of a television, a tablet, and a mobile phone.
In the technical scheme of the utility model, the printed circuit board comprises a substrate, a plurality of pads, a solder mask layer and a supporting part, wherein the substrate is provided with a pad layout area; the plurality of pads comprise grounding pads, and the grounding pads are arranged on the substrate and are positioned in the pad arrangement area; the solder mask is arranged in a region of the substrate outside the pad arrangement region, so that a plurality of concave grooves are formed on the solder mask, each pad is exposed at the bottom of the corresponding concave groove, and the concave grooves comprise first concave grooves corresponding to the grounding pads; one end of the supporting part is arranged at the bottom of the first concave groove, and the other end of the supporting part extends to the opening edge which protrudes outwards from the notch of the first concave groove. Through setting up the supporting part is in order to correspond form the strong point on the ground connection pad, so, when printed circuit board carries out the tin cream printing, the supporting part can support on the steel mesh board with the part that the ground connection pad corresponds, consequently, the tin cream that the inslot was established to first concave can not appear "digging" few tin and the phenomenon that tin cream thickness is less than the solder mask and reduces, prevents to appear empty welding between ground connection pad and the QFP of taking the pad, the SOP encapsulation components and parts, and on the steel mesh board with the thickness of the part that the ground connection pad corresponds, for the steel mesh thickness difference that the pin pad corresponds can be controlled at 0.03 ~ 0.05mm, reduces the steel mesh board that the ground connection pad corresponds part is right the influence of pin pad tin cream printing improves printed circuit board's tin cream printing quality.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments or the prior art descriptions will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
Fig. 1 is a schematic structural diagram of an embodiment of a printed circuit board provided by the present invention;
FIG. 2 is a cross-sectional view of a printed circuit board mated with a steel mesh plate;
FIG. 3 is a schematic diagram of a printed circuit board after solder paste printing.
The reference numbers indicate:
the objects, features and advantages of the present invention will be further described with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
It should be noted that, if directional indications (such as up, down, left, right, front, and back … …) are involved in the embodiment of the present invention, the directional indications are only used to explain the relative position relationship between the components, the motion situation, etc. in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indications are changed accordingly.
In addition, if there is a description relating to "first", "second", etc. in the embodiments of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, the meaning of "and/or" appearing throughout includes three juxtapositions, exemplified by "A and/or B" including either A or B or both A and B. In addition, the technical solutions in the embodiments may be combined with each other, but it must be based on the realization of those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should not be considered to exist, and is not within the protection scope of the present invention.
The component is generally fixed on the printed circuit board by welding, and the component with the pad, especially the component packaged by QFP (Plastic Quad Flat Package) and SOP (Small Out-Line Package) and having the pad, is provided with the pad in a concave position, because the pad of the printed circuit board is also provided with the concave position, in order to prevent the empty soldering phenomenon after the component is welded with the printed circuit board, at present, when the printed circuit board is printed, the part corresponding to the pad of the printed circuit board on the steel net is thickened, so that the pad of the printed circuit board has enough soldering paste, but the soldering paste printing of the precise functional pin in the direction parallel to the scraper of the printing machine can lead the soldering paste printing down quality, so that the soldering paste can not meet the soldering requirement, and the soldering quality is further influenced.
In view of this, the utility model provides a printed circuit board, through setting up the supporting part is in order to correspond form the strong point on the ground connection pad, so when printed circuit board carries out the solder paste printing, the supporting part can support on the steel mesh board with the part that the ground connection pad corresponds, consequently, the solder paste of first concave inslot of establishing can not appear "digging" less tin and solder paste thickness is less than the phenomenon that the solder mask reduces, prevents to appear empty welding between ground connection pad and the QFP of taking the pad, the SOP encapsulation components and parts. As shown in fig. 1 to 3, an embodiment of a printed circuit board is provided for the present invention.
As shown in fig. 1 to 3, the printed circuit board 100 provided by the present invention includes a substrate 1, a plurality of pads, a solder mask layer 3 and a support portion 4, wherein the substrate 1 is formed with a pad layout region; the pads comprise a grounding pad 2, and the grounding pad 2 is arranged on the substrate 1 and is positioned in the pad arrangement area; the solder mask layer 3 is arranged in a region of the substrate 1 outside the pad arrangement region, so that a plurality of concave grooves are formed in the solder mask layer 3, each pad is exposed at the bottom of the corresponding concave groove, and the plurality of concave grooves comprise first concave grooves 31 corresponding to the grounding pads 2; one end of the supporting portion 4 is disposed at the bottom of the first concave groove 31, and the other end extends to the edge of the notch protruding outward from the first concave groove 31.
It should be noted that the plurality of pads include one ground pad 2 and pin pads 5 arranged at regular intervals along the circumferential direction of the ground pad 2, and the one ground pad 2 and the plurality of pin pads 5 together form a pad on the printed circuit board 100 for soldering a component.
In the technical scheme of the utility model, the printed circuit board 100 includes a substrate 1, a plurality of pads, a solder mask layer 3 and a support part 4, the substrate 1 is formed with a pad layout area; the pads comprise a grounding pad 2, and the grounding pad 2 is arranged on the substrate 1 and is positioned in the pad arrangement area; the solder mask layer 3 is arranged in a region of the substrate 1 outside the pad arrangement region, so that a plurality of concave grooves are formed in the solder mask layer 3, each pad is exposed at the bottom of the corresponding concave groove, and the plurality of concave grooves comprise first concave grooves 31 corresponding to the grounding pads 2; one end of the supporting portion 4 is disposed at the bottom of the first concave groove 31, and the other end extends to the edge of the notch protruding outward from the first concave groove 31. Through setting up supporting part 4 is in order to correspond form the strong point on the ground connection pad 2, so, when printed circuit board 100 carries out the tin cream printing, supporting part 4 can support on the steel mesh board 200 with the part that ground connection pad 2 corresponds, consequently, the tin cream in the first concave groove 31 of establishing can not appear "digging" less tin and the phenomenon that tin cream thickness is less than solder mask 3 and reduces, prevents to appear empty welding between ground connection pad 2 and the QFP of taking the pad, the SOP encapsulation components and parts, and steel mesh board 200 go up with the thickness of the part that ground connection pad 2 corresponds, for the steel mesh thickness difference that pin pad 5 corresponds can be controlled at 0.03 ~ 0.05mm, reduces ground connection pad 2 corresponds partial steel mesh board 200 to the influence of pin pad 5 tin cream printing, improves printed circuit board 100's tin cream printing quality.
In this embodiment, as shown in fig. 1 and 2, the supporting portion 4 includes a supporting frame 411, and the supporting frame 411 is disposed in the first recessed groove 31, and the supporting frame 41 protrudes from the notch of the first recessed groove 31. The supporting frame 411 is partially protruded out of the notch of the first concave groove 31, the thickness of the part of the steel screen plate 200 corresponding to the grounding pad 2 is set according to the solder paste printing requirement, so that after the solder paste printing, the solder paste part in the first concave groove 31 is protruded to be contacted with the pad of the QFP and SOP packaging component with the pad, and thus, the empty soldering between the grounding pad 2 and the QFP and SOP packaging component with the pad is prevented.
Specifically, in the present embodiment, as shown in fig. 1 and 2, the supporting frame 411 is formed with a plurality of receiving unit slots 413 for receiving solder paste, respectively, in the frame 41. Through setting up a plurality ofly hold and establish unit groove 413, have divided into a plurality of units with first concave groove 31 of establishing, so for after the tin cream printing, help guaranteeing each hold and establish that unit groove 413 interior tin cream thickness everywhere is unanimous, and each hold and establish that unit groove 413 interior tin cream thickness is the same, so, guarantee each hold and establish the solder cream in unit groove 413 and take the pad QFP, the SOP of pad and encapsulate the pad contact, prevent to appear empty welding.
More specifically, in the present embodiment, as shown in fig. 1, the supporting frame 411 and the rack 41 include a supporting frame 411 and a plurality of partitions 412 disposed in the supporting frame 411, wherein the partitions 412 are disposed in a staggered manner to form a plurality of accommodating unit slots 413. A plurality of accommodating unit slots 413 are formed in the supporting frame 411 by the plurality of partition plates 412 arranged in a staggered manner.
In the present embodiment, the support portion 4 has a green oil support section 414 and a white oil support section 415 stacked in this order in a direction from the bottom wall of the first recessed groove 31 toward the notch thereof. By dividing the support part 4 into the green oil support section 414 and the white oil support section 415, the processing and manufacturing of the support part 4 can be completed without adding new molded parts, and the production cost of the printed circuit board 100 is reduced.
The specific heights of the green oil supporting section 414 and the white oil supporting section 415 are not limited, and the overall height of the green oil supporting section 414 and the white oil supporting section 415 which are overlapped is larger than the depth of the first concave groove 31. In one embodiment, the height of the green oil supporting section 414 is H, and H is greater than or equal to 15um and less than or equal to 30um; in another embodiment, the height of the white oil support section 415 is H, and H is greater than or equal to 8um and less than or equal to 10um, and in yet another embodiment, the height of the green oil support section 414 is H, and H is greater than or equal to 15um and less than or equal to 30um; the height of the white oil supporting section 415 is H, and H is more than or equal to 8um and less than or equal to 10um. Specifically, in the present embodiment, the height of the green oil supporting section 414 is H, and H is greater than or equal to 15um and less than or equal to 30um; the height of the white oil supporting section 415 is H, and H is more than or equal to 8um and less than or equal to 10um. Through inciting somebody to action the height H of green oil support section 414 sets up to more than or equal to 15um, and less than or equal to 30um, white oil support section 415's height H sets up to more than or equal to 8um, and less than or equal to 10um, so, does not increase under the new condition that produces the shaped part green oil support section 414 with white oil support section 415's manufacturing reduces printed circuit board 100's manufacturing cost.
In this embodiment, the support portion 4 has an abutting end protruding outward from the opening edge of the notch of the first recessed groove 31, and the abutting end is provided with a welding layer for welding and fixing the abutting end to a pad on the component to be welded. When the solder paste is printed, the abutting ends are brushed with the solder paste to form the welding layer, so that the contact area between the bonding pads of the QFP and SOP packaging components and the grounding bonding pad 2 is increased.
Specifically, the thickness of the welding layer is S, and S is more than or equal to 0.158mm and less than or equal to 0.16mm. The thickness S of the welding layer is set to be more than or equal to 0.158mm and less than or equal to 0.16mm so as to be in contact with the welding pad of the QFP and SOP packaging component with the welding pad and ensure the welding quality.
The utility model discloses still provide an electronic product, electronic product includes printed circuit board 100, the concrete structure that printed circuit board 100 includes refers to above-mentioned embodiment, and concrete structure is as shown in fig. 1 to fig. 3. It can be understood that, because the electronic product of the present invention adopts all the technical solutions of all the above embodiments, all the beneficial effects brought by the technical solutions of the above embodiments are at least achieved, which is not repeated herein.
It is understood that the specific form of the electronic product is not limited, and the electronic product may be one or more of a television, a tablet, and a mobile phone.
The above only is the preferred embodiment of the present invention, not so limiting the patent scope of the present invention, all under the concept of the present invention, the equivalent structure transformation made by the contents of the specification and the drawings is utilized, or the direct/indirect application is included in other related technical fields in the patent protection scope of the present invention.
Claims (10)
1. A printed circuit board, comprising:
a substrate formed with a pad layout region;
the plurality of bonding pads comprise grounding bonding pads, and the grounding bonding pads are arranged on the substrate and are positioned in the bonding pad arrangement area;
the solder mask is arranged in a region of the substrate outside the pad arrangement region, so that a plurality of concave grooves are formed on the solder mask, each pad is exposed at the bottom of the corresponding concave groove, and the plurality of concave grooves comprise first concave grooves corresponding to the grounding pads; and the number of the first and second groups,
and one end of the supporting part is arranged at the bottom of the first concave groove, and the other end of the supporting part extends to the opening edge which protrudes outwards from the notch of the first concave groove.
2. The printed circuit board of claim 1, wherein the support portion comprises a support frame disposed in the first recessed slot and protruding from the notch of the first recessed slot.
3. The printed circuit board of claim 2, wherein the support frame is formed with a plurality of receiving unit slots for receiving the solder paste, respectively.
4. The printed circuit board of claim 3, wherein the supporting frame comprises a supporting frame and a plurality of partitions disposed in the supporting frame, the partitions being staggered to form a plurality of receiving unit slots.
5. The printed circuit board of claim 1, wherein the support portion has a green oil support section and a white oil support section which are sequentially stacked in a direction from the bottom wall of the first recessed groove toward the notch thereof.
6. The printed circuit board of claim 5, wherein the green oil support section has a height H, and 15um ≦ H ≦ 30um; and/or the presence of a gas in the gas,
the height of the white oil supporting section is H, and H is more than or equal to 8um and less than or equal to 10um.
7. The printed circuit board of claim 1, wherein the support portion has an abutting end protruding outward from a mouth edge of the notch of the first recessed groove, the abutting end being provided with a soldering layer for soldering the abutting end to a pad on a component to be soldered.
8. The printed circuit board of claim 7, wherein the solder layer has a thickness S, and 0.158mm ≦ S ≦ 0.16mm.
9. An electronic product comprising a printed circuit board according to any one of claims 1 to 8.
10. The electronic product of claim 9, wherein the electronic product comprises one or more of a television, a tablet, and a cell phone.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222451271.1U CN218103650U (en) | 2022-09-15 | 2022-09-15 | Printed circuit board and electronic product |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222451271.1U CN218103650U (en) | 2022-09-15 | 2022-09-15 | Printed circuit board and electronic product |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218103650U true CN218103650U (en) | 2022-12-20 |
Family
ID=84454501
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222451271.1U Active CN218103650U (en) | 2022-09-15 | 2022-09-15 | Printed circuit board and electronic product |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218103650U (en) |
-
2022
- 2022-09-15 CN CN202222451271.1U patent/CN218103650U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP4731021B2 (en) | Semiconductor device manufacturing method and semiconductor device | |
| JPH09172134A (en) | Electronic package assembly and electronic module | |
| US5781415A (en) | Semiconductor package and mounting method | |
| JPS61101067A (en) | Memory module | |
| CN218103650U (en) | Printed circuit board and electronic product | |
| CN212677451U (en) | Assembly printed circuit board and electronic equipment | |
| CN209283623U (en) | A kind of connection frame plate and mobile terminal | |
| US20030235043A1 (en) | Wiring board device | |
| JPH0329389A (en) | Printed circuit board | |
| US6507482B2 (en) | Chip type solid electrolytic capacitor | |
| JP4238426B2 (en) | Printed wiring board | |
| CN217883967U (en) | Printed circuit board | |
| JP2005158360A (en) | Connecting parts between 3-dimensional board, and connecting structure between 3-dimensional board | |
| CN209730231U (en) | A kind of board to board connector | |
| CN211378371U (en) | Wireless communication module chip welding PCB board | |
| CN217983335U (en) | Packaging structure of SMD TDSO14 semiconductor chip | |
| CN219740730U (en) | Bonding pad structure, PCB and electronic equipment | |
| JP2772897B2 (en) | Lead frame and method of manufacturing connection terminal using lead frame | |
| CN217428421U (en) | PCB packaging structure, battery protection board and battery | |
| CN210113742U (en) | Communication module capable of settling welding | |
| CN217740524U (en) | Boss type lining plate module structure | |
| CN212588582U (en) | Prevent PCB plate structure that components and parts dropped | |
| CN219627993U (en) | Package structure of improved bonding pad | |
| CN219718605U (en) | Terminal equipment and circuit board | |
| CN217768365U (en) | Packaging structure of SMD SO12J semiconductor chip |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |