CN218068048U - Chip mounting structure of To encapsulation chip aging detection drawer - Google Patents
Chip mounting structure of To encapsulation chip aging detection drawer Download PDFInfo
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- CN218068048U CN218068048U CN202220853570.5U CN202220853570U CN218068048U CN 218068048 U CN218068048 U CN 218068048U CN 202220853570 U CN202220853570 U CN 202220853570U CN 218068048 U CN218068048 U CN 218068048U
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- 238000001514 detection method Methods 0.000 title claims abstract description 48
- 230000032683 aging Effects 0.000 title claims abstract description 17
- 238000005538 encapsulation Methods 0.000 title claims description 6
- 210000004907 gland Anatomy 0.000 claims abstract description 11
- 238000009413 insulation Methods 0.000 claims abstract description 11
- 230000006835 compression Effects 0.000 claims abstract description 7
- 238000007906 compression Methods 0.000 claims abstract description 7
- 238000007689 inspection Methods 0.000 claims abstract description 4
- 230000001681 protective effect Effects 0.000 claims description 9
- 238000012360 testing method Methods 0.000 claims description 9
- 230000001012 protector Effects 0.000 claims description 6
- 238000010586 diagram Methods 0.000 description 5
- LAXBNTIAOJWAOP-UHFFFAOYSA-N 2-chlorobiphenyl Chemical compound ClC1=CC=CC=C1C1=CC=CC=C1 LAXBNTIAOJWAOP-UHFFFAOYSA-N 0.000 description 4
- 101710149812 Pyruvate carboxylase 1 Proteins 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000004806 packaging method and process Methods 0.000 description 3
- 238000009434 installation Methods 0.000 description 2
- 238000012544 monitoring process Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
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Abstract
The utility model discloses a chip mounting structure of a To-packaged chip aging detection drawer, which comprises a PCB board, wherein the PCB board is provided with a plurality of detection stations, and each detection station is provided with a plurality of detection holes for inserting chip pins; the heat sink block is fixed on the PCB and is provided with a through hole for inserting a chip pin, the chip is arranged on the top surface of the heat sink block, and the chip pin is sequentially inserted into the through hole and the detection hole to realize electric connection; the pressing plate is arranged on the heat sinking block and is provided with limiting holes which correspond to the detection stations one by one; and the heat insulation gland is fixed on the top surface of the compression plate and covers the compression plate. The utility model discloses the chip mounting is on hot heavy piece, and the chip pin inserts the inspection hole on through-hole and the PCB board on the hot heavy piece in proper order, and the pressure strip is fixed with the chip card fastening simultaneously, and thermal-insulated gland then compresses tightly the chip, and the chip receives horizontal and vertical spacing, has effectively guaranteed the fixed stability of chip, avoids appearing contact failure phenomenon, guarantees the normal clear of ageing detection.
Description
Technical Field
The utility model relates To a chip testing technical field, concretely relates To encapsulation chip aging testing drawer's chip mounting structure.
Background
Wafer testing is the final guarantee of wafer quality. In the integrated circuit industry chain, chip testing plays a crucial role, and in order to ensure normal use of a chip, 100% of the chips must pass the testing, and only finished chips which pass the testing can be applied to terminal electronic products. At present, a chip is strictly subjected to aging detection after being manufactured, and the chip aging detection is an electrical stress test method for accelerating electrical faults of devices by adopting voltage and high temperature. The burn-in process essentially simulates the overall life of the chip because the electrical stimulus applied during the burn-in process reflects the worst case for the chip to operate.
The To packaging chip adopts a mode of arranging pins on a single side To package the chip, and when the To packaging chip is subjected To aging detection, stable connection of the pins and the PCB needs To be ensured. The existing aging detection platform has poor fixation stability To the To packaging chip and is easy To have poor contact.
Therefore, it is necessary To develop a chip mounting structure of the To-package chip aging detection drawer capable of effectively ensuring stable connection of the chip.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is To provide a To encapsulation chip aging testing drawer's chip mounting structure To the aging testing platform who exists among the solution prior art is relatively poor To encapsulation chip's fixed stability, easily takes place contact failure phenomenon.
In order to realize the purpose, the technical scheme of the utility model is that:
a chip mounting structure of a To package chip aging detection drawer comprises:
the detection device comprises a PCB, a chip and a detection device, wherein the PCB is provided with a plurality of detection stations, and each detection station is provided with a plurality of detection holes for inserting chip pins;
the heat sink block is fixed on the PCB, through holes which are in one-to-one correspondence with the detection holes and used for inserting chip pins are formed in the heat sink block, the chip is installed on the top surface of the heat sink block, and the chip pins are sequentially inserted into the through holes and electrically connected with the detection holes;
the pressing plate is arranged on the heat sinking block, limiting holes which correspond to the detection stations one by one are formed in the pressing plate, and the limiting holes are used for clamping limiting chips;
and the heat insulation gland is fixed on the top surface of the compression plate and covers the compression plate.
Compared with the prior art, the beneficial effects of the utility model are that:
the utility model discloses the chip mounting is on hot heavy piece, and the chip pin inserts the inspection hole on through-hole and the PCB board on the hot heavy piece in proper order, and the pressure strip is fixed with the chip card fastening simultaneously, and thermal-insulated gland then compresses tightly the chip, and the chip receives horizontal and vertical spacing, has effectively guaranteed the fixed stability of chip, avoids appearing contact failure phenomenon, guarantees the normal clear of ageing detection.
Furthermore, heat conduction blocks are arranged on two sides of the bottom surface of the heat sink block, a hollow-out portion matched with the heat conduction blocks is arranged on the PCB, and the heat conduction blocks are transmitted into the hollow-out portion and extend to the lower portion of the PCB.
Through adopting above-mentioned scheme, temperature conduction to PCB board below when the heat conduction piece will detect effectively dispels the heat, operating temperature when guaranteeing to detect.
Furthermore, the PCB is provided with a plurality of pin guide blocks which correspond to the detection stations one to one, the pin guide blocks are provided with guide holes for inserting chip pins, the bottom surfaces of the pin guide blocks are provided with guide pipes communicated with the guide holes, the guide pipes are inserted into the detection holes, the bottom surfaces of the heat sinking blocks are provided with sunken parts matched with the pin guide blocks, and the pin guide blocks are embedded into the sunken parts.
By adopting the scheme, the pin guide block is arranged on the PCB and used for guiding the chip pins when the chip pins are inserted, so that the chip is prevented from shifting during installation, and the connection stability is improved.
Furthermore, protective covers positioned at two ends of the heat sink block are further arranged on the PCB.
Furthermore, the protective cover is towards a groove corresponding to the position of the heat sink block is formed in one side face of the heat sink block, and a heat protector connected with the PCB is arranged in the groove.
Through adopting above-mentioned scheme, thermal protector is covered by the protective cover to effectively guarantee its temperature monitoring accuracy.
Furthermore, the heat sinking block, the pressing plate and the heat insulation pressing cover are fixed into a whole through bolts.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments or the prior art descriptions will be briefly described below. Throughout the drawings, like elements or portions are generally identified by like reference numerals. In the drawings, elements or portions are not necessarily drawn to scale.
Fig. 1 is a schematic perspective view of an embodiment of the present invention.
Fig. 2 is another perspective structure diagram of the embodiment of the present invention.
Fig. 3 is a schematic structural view of the embodiment of the present invention after the heat insulation gland is removed.
Fig. 4 is a schematic structural diagram of a heat sink block according to an embodiment of the present invention.
Fig. 5 is a schematic structural diagram of a PCB board according to an embodiment of the present invention.
Fig. 6 is a schematic structural diagram of a pin guide block according to an embodiment of the present invention.
Fig. 7 is a schematic structural diagram of a protective cover according to an embodiment of the present invention.
Shown in the figure:
1. a PCB board; 101. detecting a station; 102. a detection hole; 103. a hollowed-out portion;
2. heat sinking the block; 201. a through hole; 202. a heat conducting block; 203. a recessed portion;
3. a compression plate; 301. a limiting hole;
4. a heat insulation gland;
5. a pin guide block; 501. a guide hole; 502. a conduit;
6. a protective cover; 601. a groove;
7. a thermal protector;
8. and (4) bolts.
Detailed Description
Embodiments of the present invention will be described in detail below with reference to the accompanying drawings. The following examples are only used to illustrate the technical solutions of the present invention more clearly, and therefore are only used as examples, and the protection scope of the present invention is not limited thereby.
It is to be noted that unless otherwise specified, technical or scientific terms used herein shall have the ordinary meaning as understood by those skilled in the art to which the present invention belongs.
In the description of the present application, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", and the like, are used in the orientations and positional relationships indicated in the drawings, which are based on the orientation or positional relationship shown in the drawings, and are intended only for the convenience of description of the present invention and for simplicity of description, and are not intended to indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the present invention.
Furthermore, the terms "first", "second", etc. are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. In the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.
In this application, unless expressly stated or limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly and encompass, for example, both fixed and removable connections or integral parts thereof; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.
In this application, unless expressly stated or limited otherwise, a first feature is "on" or "under" a second feature such that the first and second features are in direct contact, or the first and second features are in indirect contact via an intermediary. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.
As shown in fig. 1 To 7, the chip mounting structure of the To package chip aging detection drawer provided by the present embodiment includes a PCB board 1, a heat sink 2, a pressure plate 3 and a heat insulation cover 4.
The PCB 1 is provided with a plurality of detection stations 101, and each detection station 101 is provided with a plurality of detection holes 102 for inserting chip pins;
the heat sink block 2 is fixed on the PCB board 1, the heat sink block 2 is provided with through holes 201 which correspond to the detection holes 102 one by one and are used for inserting chip pins, the chip is arranged on the top surface of the heat sink block 2, and the chip pins are sequentially inserted into the through holes 201 and the detection holes 102 to realize electric connection;
the pressing plate 3 is arranged on the heat sinking block 2, the pressing plate 3 is provided with limiting holes 301 which correspond to the plurality of detection stations 101 one by one, and the limiting holes 301 are used for clamping limiting chips;
the heat insulation gland 4 is fixed on the top surface of the pressure plate 3, and the heat insulation gland 4 covers the pressure plate 3.
The heat sinking block 2, the pressing plate 3 and the heat insulation gland 4 are fixed into a whole through bolts 8.
The two sides of the bottom surface of the heat sinking block 2 are provided with heat conducting blocks 202, the PCB board 1 is provided with a hollow part 103 matched with the heat conducting blocks 202, and the heat conducting blocks 202 are transmitted into the hollow part 103 and extend to the lower part of the PCB board 1.
The heat conduction block 202 conducts the temperature to the lower part of the PCB board 1 during detection, effectively dissipates heat, and ensures the working temperature during detection.
The PCB board 1 is provided with pin guide blocks 5 which are in one-to-one correspondence with a plurality of detection stations 101, the pin guide blocks 5 are provided with guide holes 501 for chip pins to be inserted, the bottom surfaces of the pin guide blocks 5 are provided with guide pipes 502 communicated with the guide holes 501, the guide pipes 502 are inserted into the detection holes 102, the bottom surfaces of the heat sinking blocks 2 are provided with concave parts 203 matched with the pin guide blocks 5, and the pin guide blocks 5 are embedded into the concave parts 203.
The pin guide block 5 is arranged on the PCB 1 and used for guiding the chip pins when the chip pins are inserted, so that the chip is prevented from shifting during installation, and the connection stability is improved.
The PCB board 1 is further mounted with protective covers 6 at both ends of the heat sink block 2.
One side of the protective cover 6 facing the heat sinking block 2 is provided with a groove 601 corresponding to the position of the heat sinking block 2, and a heat protector 7 connected with the PCB 1 is arranged in the groove 601.
The thermal protector 7 is covered by the protective cover 6, thereby effectively ensuring the temperature monitoring accuracy thereof.
The chip of the embodiment is installed on the heat sink block 2, the pins of the chip are sequentially inserted into the through holes 201 on the heat sink block 2 and the detection holes 102 on the PCB 1, meanwhile, the chip card is fastened and fixed by the pressing plate 3, the heat insulation gland 4 compresses the chip tightly, the chip is limited horizontally and vertically, the fixing stability of the chip is effectively guaranteed, the phenomenon of poor contact is avoided, and the normal operation of aging detection is guaranteed.
In the specification of the present invention, a large number of specific details are explained. It is understood, however, that embodiments of the invention may be practiced without these specific details. In some instances, well-known methods, structures and techniques have not been shown in detail in order not to obscure an understanding of this description.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Moreover, various embodiments or examples and features of various embodiments or examples described in this specification can be combined and combined by one skilled in the art without being mutually inconsistent.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; such modifications and substitutions do not substantially depart from the scope of the embodiments of the present invention, and are intended to be covered by the claims and the specification.
Claims (6)
1. A chip mounting structure of To encapsulation chip aging testing drawer, its characterized in that includes:
the detection device comprises a PCB, a chip and a detection device, wherein the PCB is provided with a plurality of detection stations, and each detection station is provided with a plurality of detection holes for inserting chip pins;
the heat sink block is fixed on the PCB and provided with through holes which correspond to the detection holes one by one and are used for inserting chip pins, the chip is arranged on the top surface of the heat sink block, and the chip pins are sequentially inserted into the through holes and electrically connected with the detection holes;
the pressing plate is arranged on the heat sinking block, limiting holes which correspond to the detection stations one by one are formed in the pressing plate, and the limiting holes are used for clamping limiting chips;
and the heat insulation gland is fixed on the top surface of the compression plate and covers the compression plate.
2. The chip mounting structure according to claim 1, wherein heat-conducting blocks are disposed on two sides of a bottom surface of the heat sink block, the PCB has a hollow portion matching with the heat-conducting blocks, and the heat-conducting blocks are introduced into the hollow portion and extend to a position below the PCB.
3. The chip mounting structure according to claim 1, wherein the PCB board has a plurality of pin guide blocks corresponding to the plurality of inspection stations, the pin guide blocks have guide holes for inserting chip pins, the bottom surface of the pin guide block has a guide tube connected to the guide holes, the guide tube is inserted into the inspection holes, the bottom surface of the heat sink block has a recess matching with the pin guide block, and the pin guide block is inserted into the recess.
4. The chip mounting structure according to claim 1, wherein protective covers are further mounted on the PCB at both ends of the heat sink block.
5. The chip mounting structure according to claim 4, wherein the protecting cover has a recess corresponding to the heat sink block at a side thereof facing the heat sink block, and a thermal protector is disposed in the recess and connected to the PCB.
6. The chip mounting structure according to any one of claims 1 to 5, wherein the heat sink block, the pressure plate, and the heat insulating cover are fixed as one body by bolts.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220853570.5U CN218068048U (en) | 2022-04-11 | 2022-04-11 | Chip mounting structure of To encapsulation chip aging detection drawer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220853570.5U CN218068048U (en) | 2022-04-11 | 2022-04-11 | Chip mounting structure of To encapsulation chip aging detection drawer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218068048U true CN218068048U (en) | 2022-12-16 |
Family
ID=84417458
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220853570.5U Active CN218068048U (en) | 2022-04-11 | 2022-04-11 | Chip mounting structure of To encapsulation chip aging detection drawer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218068048U (en) |
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2022
- 2022-04-11 CN CN202220853570.5U patent/CN218068048U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20231219 Address after: Room 717, building 3, 111 Xiangke Road, China (Shanghai) pilot Free Trade Zone, Pudong New Area, Shanghai, 200120 Patentee after: Shanghai filai Testing Technology Co.,Ltd. Address before: Room 310-7, No. 1019, Donghai Road, Zhongguancun Science and Technology Park, Binhai New Area, Tianjin 300450 Patentee before: TIANJIN FEILAI TECHNOLOGY Co.,Ltd. |
|
| TR01 | Transfer of patent right |