CN217278463U - Heat sink block structure of COC aging detection equipment - Google Patents
Heat sink block structure of COC aging detection equipment Download PDFInfo
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- CN217278463U CN217278463U CN202220830310.6U CN202220830310U CN217278463U CN 217278463 U CN217278463 U CN 217278463U CN 202220830310 U CN202220830310 U CN 202220830310U CN 217278463 U CN217278463 U CN 217278463U
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- heat dissipation
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- dissipation plate
- main block
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- 230000032683 aging Effects 0.000 title claims abstract description 16
- 238000001514 detection method Methods 0.000 title claims abstract description 13
- 230000017525 heat dissipation Effects 0.000 claims abstract description 45
- 238000010438 heat treatment Methods 0.000 claims abstract description 24
- 230000001012 protector Effects 0.000 claims description 15
- 238000003780 insertion Methods 0.000 claims description 3
- 230000037431 insertion Effects 0.000 claims description 3
- 238000013461 design Methods 0.000 abstract description 3
- 238000012360 testing method Methods 0.000 description 8
- 238000000034 method Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000009529 body temperature measurement Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
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Abstract
The utility model discloses a heat sink block structure of COC aging detection equipment, which is applied to a PCB (printed Circuit Board), and comprises a main block arranged on the top surface of the PCB, wherein the top surface of the main block is provided with a bearing surface for mounting a chip carrier, and the bottom surface is provided with a heating surface for attaching and mounting a heating device; the heat dissipation plate is arranged below the PCB, and the bottom surface of the heat dissipation plate is provided with a heat dissipation surface for mounting a heat dissipation device; the connecting block is arranged between the main block and the heat dissipation plate and penetrates through the PCB; the main block, the heat dissipation plate and the connecting block are fixed into a whole, the main block and the heat dissipation plate are clamped on the PCB in a matching mode and fixed, and the area of the heat dissipation plate is larger than that of the main block. The utility model discloses a heat sink block structure of split type design, top owner piece bear chip carrier and install the heating device, and the radiating block of below then is used for installing the radiating device, connects through the connecting block that passes the PCB board between the two, consequently can break through the restriction of PCB board size, and the radiating block can be designed great, effectively improves the radiating efficiency, can satisfy long-time ageing detection demand.
Description
Technical Field
The utility model relates to a chip testing technical field, concretely relates to COC ageing testing equipment's heat sink block structure.
Background
Wafer testing is the final guarantee of wafer quality. In the integrated circuit industry chain, chip testing plays a crucial role, and in order to ensure normal use of a chip, 100% of the chips must pass the testing, and only finished chips which pass the testing can be applied to terminal electronic products.
At present, a chip is strictly subjected to aging detection after being manufactured, and the chip aging detection is an electrical stress test method for accelerating electrical faults of devices by adopting voltage and high temperature. The burn-in process essentially simulates the overall life of the chip because the electrical stimulus applied during the burn-in process reflects the worst case for the chip to operate. The heat sink block is used for bearing a chip carrier in a chip aging test, and heat generated by the chip in work is conducted out through the heat sink block, so that the working temperature control of the chip is realized. The existing heat sink block adopts a single square plate-shaped structure and is installed by penetrating through a PCB, a chip carrier is installed on the top surface of the heat sink block, a heat dissipation unit is installed on the bottom surface of the heat sink block, a heating unit is embedded inside the heat sink block, and the temperature of the heat sink block is controlled by the heat dissipation unit and the heating unit to realize the control of the working temperature of the chip. However, due to the size limitation of the PCB and the need of arranging other integrated circuits and components on the PCB, the size of the heat sink block embedded and fixed through the PCB is limited, which results in poor heat dissipation efficiency of the bottom heat dissipation unit and failure to meet the requirement of long-time aging detection.
Therefore, it is necessary to develop a new heat sink block structure for detecting chip aging.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a COC aging testing equipment's heat sink block structure to solve exist among the prior art because the size restriction of PCB board, and still need set up other integrated circuit and part on the PCB board, consequently the embedding passes the fixed heat sink block size of PCB board and is limited, and the radiating efficiency that leads to bottom surface radiating element is relatively poor, can't satisfy the demand of long-time ageing detection.
In order to realize the purpose, the technical scheme of the utility model is that:
a heat sink block structure of COC aging detection equipment is applied to a PCB and comprises:
the main block is arranged on the top surface of the PCB, the top surface of the main block is provided with a bearing surface for mounting a chip carrier, and the bottom surface of the main block is provided with a heating surface for attaching and mounting a heating device;
the heat dissipation plate is arranged below the PCB, and the bottom surface of the heat dissipation plate is provided with a heat dissipation surface for mounting a heat dissipation device;
the connecting block is arranged between the main block and the heat dissipation plate and penetrates through the PCB;
the PCB comprises a PCB board, a main block, a heat dissipation plate and a connecting block, wherein the main block, the heat dissipation plate and the connecting block are fixed into a whole, the main block and the heat dissipation plate are clamped on the PCB board in a matching mode and are fixed, and the area of the heat dissipation plate is larger than that of the main block.
Compared with the prior art, the beneficial effects of the utility model are that:
the utility model discloses a heat sink block structure of split type design, top owner piece bear chip carrier and installation heating device, and the radiating block of below then is used for installing the radiating device, connects through the connecting block that passes the PCB board between the two, consequently can break through the restriction of PCB board size, and the radiating block can be designable great, effectively improves the radiating efficiency, can satisfy long-time ageing detection demand.
On the basis of the technical scheme, the utility model discloses can also do as follows the improvement:
furthermore, a pair of connecting blocks is symmetrically arranged on two sides of the bottom surface of the main block.
By adopting the scheme, the connection stability of the main block and the heat dissipation plate is improved.
Furthermore, the edge of the heat dissipation plate is also provided with a fixing hole for fixing the PCB.
Through adopting above-mentioned scheme, improve the fixed stability of heating panel.
Furthermore, the heating surface is provided with an embedded groove, and the embedded groove is used for embedding and installing the temperature sensor.
Furthermore, the main block is further connected with a thermal protector, the heat dissipation plate is provided with an opening for accommodating the thermal protector, and the thermal protector is connected with the main block through a heat conduction line.
Furthermore, a pair of mounting grooves is formed in the heating surface, the bottoms of the mounting grooves extend to the middle of the main block, and two ends of the thermal protector are connected to the bottoms of the corresponding mounting grooves through the heat conducting wires respectively.
By adopting the scheme, the temperature measurement accuracy of the thermal protector is improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments or the technical solutions in the prior art will be briefly described below. Throughout the drawings, like elements or portions are generally identified by like reference numerals. In the drawings, elements or portions are not necessarily drawn to scale.
Fig. 1 is a schematic structural diagram of an embodiment of the present invention.
Fig. 2 is a schematic bottom structure diagram of the main block according to the embodiment of the present invention.
Fig. 3 is a schematic structural diagram of an operating state of the embodiment of the present invention.
Shown in the figure:
1. a master block; 101. a bearing surface; 102. heating the surface; 103. mounting grooves; 104. a groove is embedded;
2. a heat dissipation plate; 201. a heat dissipating surface; 202. opening a hole; 203. a fixing hole;
3. connecting blocks;
4. a thermal protector; 401. a thermally conductive wire;
5. a temperature sensor;
6. and (7) a PCB board.
Detailed Description
Embodiments of the present invention will be described in detail below with reference to the accompanying drawings. The following examples are only for illustrating the technical solutions of the present invention more clearly, and therefore are only examples, and the protection scope of the present invention is not limited thereby.
It is to be noted that unless otherwise specified, technical or scientific terms used herein shall have the ordinary meaning as understood by those skilled in the art to which the present invention belongs.
In this application, unless expressly stated or limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can include, for example, fixed connections, removable connections, or integral parts; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.
In this application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through intervening media. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.
As shown in fig. 1 to 3, the heat sink block structure of a COC degradation detection apparatus provided in this embodiment is applied to a PCB, and includes a main block 1, a heat dissipation plate 2 and a connection block 3.
The main block 1 is arranged on the top surface of the PCB, the top surface of the main block 1 is provided with a bearing surface 101 for mounting a chip carrier, and the bottom surface is provided with a heating surface 102 for attaching and mounting a heating device;
the heat dissipation plate 2 is arranged below the PCB, and the bottom surface of the heat dissipation plate 2 is provided with a heat dissipation surface 201 for mounting a heat dissipation device;
the connecting block 3 is arranged between the main block 1 and the heat dissipation plate 2, and the connecting block 3 penetrates through the PCB;
main block 1, heating panel 2 and connecting block 3 are fixed as an organic whole, and main block 1 and heating panel 2 cooperation centre gripping are fixed on the PCB board, and heating panel 2 area is greater than main block 1 area.
A pair of connecting blocks 3 are symmetrically arranged on two sides of the bottom surface of the main block 1, so that the connection stability of the main block 1 and the heat dissipation plate 2 is improved.
The edge of the heat dissipation plate 2 is also provided with a fixing hole 203 for fixing with a PCB, so that the fixing stability of the heat dissipation plate 2 is improved.
The heating surface 102 is opened with an insertion groove 104, and the insertion groove 104 is used for inserting and mounting the temperature sensor 5.
The main block 1 is further connected with a thermal protector 4, the heat dissipation plate 2 is provided with an opening 202 for accommodating the thermal protector 4, and the thermal protector 4 is connected with the main block 1 through a heat conduction line 401.
This embodiment adopts the heat sink block structure of split type design, and top owner piece 1 bears the chip carrier and installs the heating device, and the radiating block of below then is used for installing the radiating device, connects through the connecting block 3 that passes the PCB board between the two, consequently can break through the big or small restriction of PCB board, and the radiating block can be designed great, effectively improves the radiating efficiency, can satisfy long-time ageing detection demand.
In the specification of the present invention, a large number of specific details are explained. It is understood, however, that embodiments of the invention may be practiced without these specific details. In some instances, well-known methods, structures and techniques have not been shown in detail in order not to obscure an understanding of this description.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Moreover, various embodiments or examples and features of various embodiments or examples described in this specification can be combined and combined by one skilled in the art without being mutually inconsistent.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; such modifications and substitutions do not substantially depart from the scope of the embodiments of the present invention, and are intended to be covered by the claims and the specification.
Claims (6)
1. A heat sink block structure of COC aging detection equipment is applied to a PCB and comprises:
the main block is arranged on the top surface of the PCB, the top surface of the main block is provided with a bearing surface for mounting a chip carrier, and the bottom surface of the main block is provided with a heating surface for attaching and mounting a heating device;
the heat dissipation plate is arranged below the PCB, and the bottom surface of the heat dissipation plate is provided with a heat dissipation surface for mounting a heat dissipation device;
the connecting block is arranged between the main block and the heat dissipation plate and penetrates through the PCB;
the PCB comprises a PCB board, a main block, a heat dissipation plate and a connecting block, wherein the main block, the heat dissipation plate and the connecting block are fixed into a whole, the main block and the heat dissipation plate are clamped on the PCB board in a matching mode and are fixed, and the area of the heat dissipation plate is larger than that of the main block.
2. The heat sink block structure as claimed in claim 1, wherein a pair of the connection blocks is symmetrically disposed on both sides of the bottom surface of the main block.
3. A heat sink block structure as claimed in claim 1, wherein fixing holes for fixing with the PCB are further provided at edges of the heat dissipation plate.
4. The heat sink block structure of claim 1, wherein the heating surface is formed with an insertion slot for inserting and mounting the temperature sensor.
5. The heat sink block structure of claim 1, wherein the main block is further connected to a thermal protector, the heat sink plate is formed with an opening for receiving the thermal protector, and the thermal protector is connected to the main block by a thermal conductive wire.
6. The heat sink block structure as claimed in claim 5, wherein the heating surface has a pair of mounting grooves, the bottom of the mounting grooves extends to the middle of the main block, and two ends of the thermal protector are connected to the bottom of the mounting grooves through the thermal wires.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220830310.6U CN217278463U (en) | 2022-04-06 | 2022-04-06 | Heat sink block structure of COC aging detection equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220830310.6U CN217278463U (en) | 2022-04-06 | 2022-04-06 | Heat sink block structure of COC aging detection equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217278463U true CN217278463U (en) | 2022-08-23 |
Family
ID=82874191
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220830310.6U Active CN217278463U (en) | 2022-04-06 | 2022-04-06 | Heat sink block structure of COC aging detection equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217278463U (en) |
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2022
- 2022-04-06 CN CN202220830310.6U patent/CN217278463U/en active Active
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| TR01 | Transfer of patent right |
Effective date of registration: 20231219 Address after: Room 717, building 3, 111 Xiangke Road, China (Shanghai) pilot Free Trade Zone, Pudong New Area, Shanghai, 200120 Patentee after: Shanghai filai Testing Technology Co.,Ltd. Address before: Room 310-7, No. 1019, Donghai Road, Zhongguancun Science and Technology Park, Binhai New Area, Tianjin 300450 Patentee before: TIANJIN FEILAI TECHNOLOGY Co.,Ltd. |