CN217903087U - 复合装置 - Google Patents
复合装置 Download PDFInfo
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- CN217903087U CN217903087U CN202222217703.2U CN202222217703U CN217903087U CN 217903087 U CN217903087 U CN 217903087U CN 202222217703 U CN202222217703 U CN 202222217703U CN 217903087 U CN217903087 U CN 217903087U
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- 239000002131 composite material Substances 0.000 title claims abstract description 17
- 238000012545 processing Methods 0.000 claims abstract description 128
- 239000003292 glue Substances 0.000 claims abstract description 29
- 238000004140 cleaning Methods 0.000 claims abstract description 17
- 238000001514 detection method Methods 0.000 claims abstract description 12
- 230000004907 flux Effects 0.000 claims abstract description 9
- 239000000758 substrate Substances 0.000 claims description 41
- 238000012546 transfer Methods 0.000 claims description 19
- 230000000007 visual effect Effects 0.000 claims description 12
- 150000001875 compounds Chemical class 0.000 claims description 3
- 238000005476 soldering Methods 0.000 claims description 2
- 238000013329 compounding Methods 0.000 claims 8
- 238000000034 method Methods 0.000 abstract description 8
- 238000003466 welding Methods 0.000 abstract description 6
- 238000007598 dipping method Methods 0.000 abstract description 3
- 238000003825 pressing Methods 0.000 description 9
- 238000005303 weighing Methods 0.000 description 6
- 239000013078 crystal Substances 0.000 description 5
- 230000007246 mechanism Effects 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 229920000715 Mucilage Polymers 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
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Abstract
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Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN202222217703.2U CN217903087U (zh) | 2022-08-23 | 2022-08-23 | 复合装置 |
Applications Claiming Priority (1)
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CN202222217703.2U CN217903087U (zh) | 2022-08-23 | 2022-08-23 | 复合装置 |
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CN217903087U true CN217903087U (zh) | 2022-11-25 |
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CN202222217703.2U Active CN217903087U (zh) | 2022-08-23 | 2022-08-23 | 复合装置 |
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CN (1) | CN217903087U (zh) |
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- 2022-08-23 CN CN202222217703.2U patent/CN217903087U/zh active Active
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
GR01 | Patent grant | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right |
Effective date of registration: 20230118 Address after: 1-2 Zhongshan Road, Tucheng District, Xinbei City, Taiwan, China, China Patentee after: Gaoke Jingjie Automation Co.,Ltd. Address before: Taiwan, Taipei, China Patentee before: Yifu Co.,Ltd. |
|
TR01 | Transfer of patent right | ||
CP01 | Change in the name or title of a patent holder |
Address after: 1-2 Zhongshan Road, Tucheng District, Xinbei City, Taiwan, China, China Patentee after: Kulisuofa High Tech Co.,Ltd. Address before: 1-2 Zhongshan Road, Tucheng District, Xinbei City, Taiwan, China, China Patentee before: Gaoke Jingjie Automation Co.,Ltd. |
|
CP01 | Change in the name or title of a patent holder |