CN217881490U - Thickened plastic package lead frame - Google Patents
Thickened plastic package lead frame Download PDFInfo
- Publication number
- CN217881490U CN217881490U CN202220589414.2U CN202220589414U CN217881490U CN 217881490 U CN217881490 U CN 217881490U CN 202220589414 U CN202220589414 U CN 202220589414U CN 217881490 U CN217881490 U CN 217881490U
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- lead frame
- locating piece
- lead
- threaded rod
- plastic package
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Abstract
The utility model relates to a plastic envelope lead frame technical field specifically is a plastic envelope lead frame of thickened type, including a lead frame and No. two lead frames that are located the lead frame back and set up, be connected with the locating piece between a lead frame and No. two lead frames, the internal connection of locating piece has the threaded rod, and the external connection of threaded rod has the nut. This plastic envelope lead frame of thickened type, cooperation between threaded rod and the nut through on the locating piece, can be fixed in between the locating piece with a lead frame and No. two lead frames, simultaneously under the grafting effect of inserted block and inside groove, can avoid a lead frame and No. two lead frames to take place the skew, pour into the heat dissipation simultaneously in the inside groove and glue, thereby can improve the fastness that a lead frame and No. two lead frames are connected, also can play the effect of heat conduction simultaneously, and cooperation between fixed block and locating hole, can be convenient for fix a position lead frame and No. two lead frames through the locating piece.
Description
Technical Field
The utility model relates to a plastic envelope lead frame technical field specifically is a plastic envelope lead frame of thickened type.
Background
The plastic package lead frame is used as a chip carrier of an integrated circuit, is a key structural member for realizing the electrical connection between a leading-out end of an internal circuit of a chip and an external lead by means of bonding materials (gold wires, aluminum wires and copper wires) to form an electrical circuit, plays a role of a bridge connected with an external lead, needs to be used in most semiconductor integrated blocks, and is an important basic material in the electronic information industry.
At present, the existing plastic package lead frame has certain defects when in use, and because the thickness of the common plastic package lead frame is thinner, the situation of breakage is easy to occur when in use, simultaneously, the frame is not firm, and the radiating effect is reduced, so that the plastic package lead frame is not convenient to use.
SUMMERY OF THE UTILITY MODEL
Technical problem to be solved
The utility model provides a not enough to prior art, the utility model provides a plastic envelope lead frame of thickened type has possessed advantages such as the thickness that has improved the lead frame and the fastness of installation is fixed, and it is thinner to have solved current plastic envelope lead frame's thickness, and cracked condition appears easily, also leads to the insecure problem of frame body simultaneously.
(II) technical scheme
For the thickness that realizes above-mentioned improvement lead frame and the fastness purpose of installation fixing, the utility model provides a following technical scheme: the utility model provides a plastic envelope lead frame of thickened type, includes a lead frame and is located No. two lead frames that the lead frame back set up, be connected with the locating piece between a lead frame and No. two lead frames, the internal connection of locating piece has the threaded rod, and the external connection of threaded rod has the nut, built-in hole has been seted up in the front of locating piece, one side of locating piece is connected with the fixed block, has seted up the locating hole on the fixed block.
Furthermore, an inner groove is formed in the back face of the first lead frame, filling holes are formed in the front face of the first lead frame, and an inserting block is fixed to the front face of the second lead frame.
Further, the front of the first lead frame is provided with a radiating fin, the front of the radiating fin is provided with a radiating hole, the front of the radiating fin is provided with a pressing groove, and a chip body is arranged inside the pressing groove.
Furthermore, the front of the first lead frame is provided with a pin line, and the front of the pin line is provided with a fixing hole.
Furthermore, the inside packing of inside groove has the heat dissipation to glue, the filling hole is linked together with the inside groove, the inserted block extends to the inside of inside groove, inserted block and inside groove all are annular rectangle.
Further, the locating piece is the character cut in bas-relief, the one end at the threaded rod back runs through locating piece, a lead frame, no. two lead frames and nut in proper order and extends to the back of nut.
(III) advantageous effects
Compared with the prior art, the technical scheme of the application has the following beneficial effects:
this plastic envelope lead frame of thickened type, cooperation between threaded rod and the nut through on the locating piece, can be fixed in between the locating piece with a lead frame and No. two lead frames, simultaneously under the grafting effect of inserted block and inside groove, can avoid a lead frame and No. two lead frames to take place the skew, pour into the heat dissipation simultaneously in the inside groove and glue, thereby can improve the fastness that a lead frame and No. two lead frames are connected, also can play the effect of heat conduction simultaneously, and cooperation between fixed block and locating hole, can be convenient for fix a position lead frame and No. two lead frames through the locating piece.
Drawings
FIG. 1 is a schematic view of the present invention;
fig. 2 is a bottom partial sectional view of the second lead frame connecting structure of the present invention;
fig. 3 is a front view of a second lead frame connecting structure in the structure of the present invention;
fig. 4 is a rear view of the first lead frame connecting structure of the present invention.
In the figure: the lead frame comprises a 1I lead frame, a 2 plug block, a 3 II lead frame, 4 inner grooves, 5 filling holes, 6 positioning blocks, 7 threaded rods, 8 nuts, 9 fixing blocks, 10 positioning holes, 11 radiating fins, 12 radiating holes, 13 pressing grooves, 14 chip bodies, 15 pin lines, 16 fixing holes, 17 radiating glue and 18 built-in holes.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts all belong to the protection scope of the present invention.
Please refer to fig. 1-4, the plastic envelope lead frame of thickened type in this embodiment, including lead frame 1 and No. two lead frame 3 that are located 1 back swing joint of lead frame, swing joint has locating piece 6 between lead frame 1 and No. two lead frame 3, locating piece 6 is the character cut in bas-relief, lead frame 1 and No. two lead frame 3 all are located the concave surface inside of locating piece 6, the inside threaded connection of locating piece 6 has threaded rod 7, threaded rod 7 and locating piece 6, the equal threaded connection of lead frame 1 and No. two lead frame 3, the outside threaded connection of threaded rod 7 has nut 8, the one end at the back of threaded rod 7 runs through locating piece 6 in proper order, lead frame 1, no. two lead frame 3 and nut 8 and extend to the back of nut 8, the positive one end of threaded rod 7 of built-in hole 18 is located the inside of built-in hole 18 is seted up in the front of locating piece 6, the left side fixedly connected with fixed block 9 of locating piece 6, locating hole 10 has been seted up on the fixed block 9.
In addition, through the cooperation between the above-mentioned subassembly, can go into the inside of locating piece 6 with No. one lead frame 1 and No. two lead frames 3 card through locating piece 6, then through the cooperation of threaded rod 7 and nut 8, can improve the fastness that No. one lead frame 1 and No. two lead frames 3 are connected to under the effect of fixed block 9 and locating hole 10, can be convenient for carry out fixed mounting with locating piece 6.
Wherein, inside groove 4 has been seted up at the back of a lead frame 1, and filling hole 5 has been seted up in the front of a lead frame 1, and the front fixedly connected with inserted block 2 of No. two lead frames 3, the outside of inserted block 2 and the inboard looks adaptation of inside groove 4, the front of inserted block 2 extends to the inside of inside groove 4, and inserted block 2 all is annular rectangle with inside groove 4, and the inside packing of inside groove 4 has heat dissipation glue 17, and filling hole 5 is linked together with inside groove 4.
In addition, through the cooperation between the above-mentioned subassembly, can insert into interior groove 4 through inserted block 2 and carry on spacingly to No. 1 lead frame and No. two lead frames 3 of lead frame, thereby can effectively prevent to take place the skew or make No. 1 lead frame and No. two lead frames 3 misaligned, can inject heat dissipation glue 17 into to interior groove 4 through filling hole 5 simultaneously, consequently can fill the space in inboard 4, also can be with inserted block 2 adhesion in interior groove 4 simultaneously, consequently can effectively improve the fastness of location, can improve the effect of heat conduction simultaneously.
The front surface of the first lead frame 1 is fixedly connected with a radiating fin 11, the front surface of the radiating fin 11 is provided with a radiating hole 12, the radiating hole 12 is circular, the front surface of the radiating fin 11 is provided with a pressing groove 13, a chip body 14 is fixedly arranged inside the pressing groove 13, the front surface of the first lead frame 1 is connected with a pin wire 15, and the front surface of the pin wire 15 is provided with a fixing hole 16.
In addition, by the cooperation between the above components, heat can be discharged by the heat sink 11 and the heat dissipation hole 12, so that internal heat dissipation can be improved, and the lead wire 15 can be positioned in the fixing hole 16, so that the lead wire 15 and the first lead frame 1 can be firmly connected.
The working principle of the above embodiment is as follows:
through coinciding lead frame 1 and No. two lead frame 3, make the inserted block 2 insert in the inside groove 4, consequently can avoid lead frame 1 and No. two lead frame 3 to take place the skew, then insert threaded rod 7 and be connected lead frame 1 and No. two lead frame 3 with locating piece 6, then swivel nut 8, thereby lock the bottom of threaded rod 7, simultaneously can improve the fastening nature that threaded rod 7 and locating piece 6 are connected, consequently can prevent vibrations from resulting in the threaded rod 7 to take place not hard up, and can be effective, improve the fastness of location, then pour into heat dissipation glue 17 into through filling hole 5 into inside groove 4, consequently can glue the inside of inserted block 2 at inside groove 4, consequently can fill up the space in inside groove 4, simultaneously can improve the fastness of connection, simultaneously under the effect of fixed block 9 and locating hole 10, can play and fix a position locating piece 6, fin 11 and louvre 12 can play radiating effect, simultaneously under the effect of fixed orifices 16, can fix a position pin line 15.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrases "comprising a component of' 8230; \8230;" does not exclude the presence of additional identical elements in the process, method, article, or apparatus that comprises the element.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. The utility model provides a plastic envelope lead frame of thickened type, includes No. two lead frame (3) that a lead frame (1) and be located the setting of a lead frame (1) back, its characterized in that: be connected with locating piece (6) between a lead frame (1) and No. two lead frames (3), the internal connection of locating piece (6) has threaded rod (7), and the external connection of threaded rod (7) has nut (8), built-in hole (18) have been seted up in the front of locating piece (6), one side of locating piece (6) is connected with fixed block (9), has seted up locating hole (10) on fixed block (9).
2. The thickened plastic package lead frame according to claim 1, characterized in that: an inner groove (4) is formed in the back face of the first lead frame (1), filling holes (5) are formed in the front face of the first lead frame (1), and an inserting block (2) is fixed on the front face of the second lead frame (3).
3. The thickened plastic package lead frame according to claim 1, characterized in that: the front surface of the first lead frame (1) is provided with a radiating fin (11), the front surface of the radiating fin (11) is provided with a radiating hole (12), the front surface of the radiating fin (11) is provided with a pressing groove (13), and a chip body (14) is arranged inside the pressing groove (13).
4. The thickened plastic package lead frame according to claim 1, characterized in that: the front surface of the first lead frame (1) is provided with a pin wire (15), and the front surface of the pin wire (15) is provided with a fixing hole (16).
5. The thickened plastic package lead frame according to claim 2, wherein: the heat dissipation rubber (17) is filled in the inner groove (4), the filling holes (5) are communicated with the inner groove (4), the inserting blocks (2) extend into the inner part of the inner groove (4), and the inserting blocks (2) and the inner groove (4) are both in annular rectangles.
6. The thickened plastic package lead frame according to claim 1, characterized in that: locating piece (6) are the character cut in bas-relief, the one end at the threaded rod (7) back runs through locating piece (6), lead frame (1), no. two lead frame (3) and nut (8) in proper order and extends to the back of nut (8).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220589414.2U CN217881490U (en) | 2022-03-17 | 2022-03-17 | Thickened plastic package lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220589414.2U CN217881490U (en) | 2022-03-17 | 2022-03-17 | Thickened plastic package lead frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217881490U true CN217881490U (en) | 2022-11-22 |
Family
ID=84085869
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220589414.2U Active CN217881490U (en) | 2022-03-17 | 2022-03-17 | Thickened plastic package lead frame |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217881490U (en) |
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2022
- 2022-03-17 CN CN202220589414.2U patent/CN217881490U/en active Active
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