CN217878950U

CN217878950U - AOI automatic detection machine for chip bonding detection

Info

Publication number: CN217878950U
Application number: CN202221332758.1U
Authority: CN
Inventors: 张治强
Original assignee: Guangdong Changxing Semiconductor Technology Co ltd
Current assignee: Guangdong Changxing Semiconductor Technology Co ltd
Priority date: 2022-05-31
Filing date: 2022-05-31
Publication date: 2022-11-22
Anticipated expiration: 2032-05-31

Abstract

The utility model discloses an AOI automated inspection machine for chip nation decides detection, include along the X to the transfer line body of extension, the Y of the transfer line body is equipped with to one side and can follows Y to the portal frame of removal, establishes on the portal frame crossbeam to follow X to the imaging equipment who removes with Z, imaging equipment is connected with a microcomputer and display device electricity. The utility model can meet the automatic feeding requirements of chip bearing substrates with different sizes and specifications by arranging the conveying line body and the adjustable limiting part, and the chip does not need to be taken out from the substrate in the detection process, thereby avoiding the influence of the taking operation on the quality of the chip; through setting up Y to the adjustable controllable portal frame of Z to coordinate, X to and the adjustable controllable imaging device of Z to coordinate, can adjust imaging device's coordinate wantonly in certain extent, realize clear formation of image, cooperation microcomputer and display device can compare the detection fast and show the testing result automatically, and detection efficiency is high, and the erroneous judgement rate is low.

Description

AOI automatic detection machine for chip bonding detection

Technical Field

The utility model relates to a chip detects technical field, in particular to with an AOI automated inspection machine that is used for chip nation to decide to detect.

Background

In the chip packaging production, after the chip is bonded and wire-bonded, it is generally necessary to determine whether the connection between the metal wire and the chip is good, and then perform the subsequent production. At present, in the domestic chip packaging industry, after a chip is bonded and wire-bonded, two detection means of manual visual inspection and jig conduction test are generally available. Wherein, the contact point must be magnified by a microscope or a magnifier firstly and then is visually checked whether the contact point is normal or not, the labor intensity of the detection personnel is high, the efficiency is low, and the detection result is influenced by artificial uncertain factors; the jig is high in conduction testing efficiency and can be used for batch detection, but misoperation in the process of taking and placing the chips by personnel easily causes the defects of the chips, and the conduction test cannot completely detect the false connection defects of the metal wires, so that the detection result is misjudged, and the yield of batch products is influenced.

SUMMERY OF THE UTILITY MODEL

To the problem that exists among the above-mentioned prior art, the utility model provides an AOI automated inspection machine for chip nation decides detection can satisfy the autoloading needs of the chip bearing substrate of different size specifications, and the testing process need not to take out the chip from the base plate, can adjust imaging device's coordinate wantonly in the certain limit, realizes clear formation of image, cooperation microcomputer and display device, can compare the detection fast automatically and show the testing result, and detection efficiency is high, and the erroneous judgement rate is low.

In order to solve the technical problem, the utility model discloses a technical scheme as follows:

an AOI automatic detection machine for chip bonding detection comprises a conveying line body extending along the X direction, wherein a first driving device and two first sliding rails extending along the Y direction are arranged on one side of the conveying line body in the Y direction, a portal frame is arranged on the two first sliding rails in an erected mode, and the portal frame can slide on the first sliding rails under the driving of the first driving device; a beam of the portal frame extends along the X direction, a second driving device and a second plate in transmission connection with the second driving device are arranged on the beam, and the second plate can slide on the beam under the driving of the second driving device; the second plate is provided with a third driving device and a third plate in transmission connection with the third driving device, and the third plate can move along the Z direction under the driving of the third driving device; the third plate is provided with an imaging device which can take pictures of each chip passing through the lower part of the imaging device and transmit the pictures to a microcomputer, and the microcomputer can analyze the pictures one by one and display the detection result on a display device.

As a further elaboration of the above technical solution:

in the above technical solution, the transfer line body is provided with a limiting member, the limiting member can limit a Y-direction coordinate of the substrate, and each substrate is provided with one or more chips.

In the above technical solution, the limiting member includes two onboard rails extending along the X direction and adapted to the substrate, and the substrate is erected on the two onboard rails and can slide along the onboard rails under the driving of an external force.

In the above technical solution, one of the on-board rails is erected on one or more fourth slide rails extending in the Y direction, and is in transmission connection with a fourth driving device, and the fourth driving device can drive one of the on-board rails to move on the fourth slide rail.

In the technical scheme, an adjusting part is arranged between the cross beam of the portal frame and each upright post.

In the above technical scheme, both ends of the cross beam are slidably connected with the upright column, the adjusting piece comprises a plurality of positioning hole grooves which are matched with each other and arranged on the cross beam and each upright column, and the locking piece can sequentially penetrate through the positioning hole grooves on the cross beam and the upright column and fixedly connect the cross beam and the upright column together.

In the above technical scheme, both ends of the cross beam are in threaded connection with the upright post.

In the above technical solution, the imaging device is a CCD camera.

Compared with the prior art, the beneficial effects of the utility model reside in that: by arranging the conveying line body and the adjustable limiting piece, the automatic feeding requirement of chip bearing substrates of different sizes can be met, the chips do not need to be taken out of the substrates in the detection process, and the influence of taking operation on the quality of the chips can be avoided; through setting up Y to adjustable controllable portal frame of and Z to coordinate, X to and the adjustable controllable imaging device of Z to coordinate, can adjust imaging device's coordinate wantonly in certain extent, realize clear formation of image, cooperation microcomputer and display device can compare the detection fast automatically and show the testing result, and detection efficiency is high, and the erroneous judgement rate is low.

Drawings

Fig. 1 is a schematic front view of the present invention;

fig. 2 is a schematic structural diagram of the detection platform of the present invention.

In the figure: 10. a conveyor line body; 11. a limiting member; 20. a first driving device; 21. a first slide rail; 30. a gantry; 31. a cross beam; 32. a column; 40. a second driving device; 50. a second plate; 60. a third driving device; 70. a third plate; 80. an image forming apparatus; 90. a display device; 100. a substrate; 200. a chip; 1. an on-board track; 2. a fourth drive device; 3. a fourth slide rail; 4. an adjusting member.

Detailed Description

The present invention will be described in further detail with reference to the accompanying drawings.

The embodiments described by referring to the drawings are exemplary and intended to be used for explaining the present application and are not to be construed as limiting the present application. In the description of the present application, it is to be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," and the like are used in an orientation or positional relationship indicated in the drawings for convenience in describing the present application and to simplify the description, and are not intended to indicate or imply that the device or element so referred to must have a particular orientation, be constructed in a particular orientation, and be operated in a particular orientation, and thus are not to be construed as limiting the present application. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise. In this application, unless expressly stated or limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can include, for example, fixed connections, removable connections, or integral connections; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate. In this application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact of the first and second features, or may comprise contact of the first and second features not directly but through another feature in between. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly above and obliquely above the second feature, or simply meaning that the first feature is at a lesser level than the second feature.

As shown in fig. 1-2, an AOI automatic inspection machine for chip bonding inspection includes a conveyor line body 10 extending along an X direction, a first driving device 20 and two first sliding rails 21 extending along the Y direction are disposed on one side of the conveyor line body 10 in the Y direction, a gantry 30 is mounted on the two first sliding rails 21, and the gantry 30 can slide on the first sliding rails 21 under the driving of the first driving device 20; the beam 31 of the portal frame 30 extends along the direction X, and is provided with a second driving device 40 and a second plate 50 in transmission connection with the second driving device 40, and the second plate 50 can slide on the beam 31 under the driving of the second driving device 40; the second plate 50 is provided with a third driving device 60 and a third plate 70 in transmission connection with the third driving device 60, and the third plate 70 can move along the Z direction under the driving of the third driving device 60; the third plate 70 is provided with an imaging device 80, the imaging device 80 can photograph each chip passing thereunder and transmit it to a microcomputer, and the microcomputer can analyze the photographs one by one and display the detection result on a display device 90.

Preferably, the transfer line body 10 is provided with a limiting member 11, the limiting member 11 can limit the Y-direction coordinate of the substrate 100, and each substrate 100 is provided with more than one chip 200.

Preferably, the limiting member 11 includes two board-mounted rails 1 extending along the X direction and adapted to the base plate 100, and the base plate 100 is erected on the two board-mounted rails 1 and can slide along the two board-mounted rails 1 under the driving of an external force.

Preferably, an on-board rail 1 is mounted on more than one fourth slide rail 3 extending along the Y direction, and is in transmission connection with a fourth driving device 2, and the fourth driving device 2 can drive the on-board rail 1 to move on the fourth slide rail 3.

The utility model discloses convey and detect base plate 100 and chip 200 as a whole, the testing process need not to get puts the chip, can avoid the operation of taking to the influence of chip quality. In this embodiment, two board-mounted rails 1 are erected on the conveying line body 10, one of the two board-mounted rails is fixed on the conveying line body 10, and the other one of the two board-mounted rails can move along the Y direction relative to the conveying line body 10, so as to be adapted to substrates of different sizes and specifications, and meet the detection requirements.

Preferably, an adjusting member 4 is disposed between the beam 31 and each of the columns 32 of the gantry 30.

As a preferred scheme, both ends of the cross beam 31 are slidably connected with an upright post 32, the adjusting member comprises a plurality of positioning hole slots which are matched and arranged on the cross beam 31 and each upright post 32, and a locking member can sequentially penetrate through the positioning hole slots on the cross beam 31 and the upright post 32 and fixedly connect the cross beam 31 and the upright post 32 together.

As another preferable scheme, both end portions of the cross beam 31 are screwed with a pillar 32.

Both snap and screw connections are well documented and are common knowledge to those skilled in the art and will not be described in detail.

Preferably, the imaging device 80 is a CCD camera.

For more clear formation of image, the utility model discloses all set up portal frame 30 and third board 70 as the active structure: the two vertical columns 32 of the gantry 30 can move along the Y direction relative to the conveyor line body 10, and the cross beam 31 is in threaded connection or clamping connection with the two vertical columns 32 and can move along the Z direction relative to the conveyor line body 10; the third plate 70 drives the imaging device 80 to move in the X direction and the Z direction relative to the transfer line body 10 under the driving of the second driving device 40 and the third driving device 60, so as to ensure that the molding device 80 can clearly image the chips 200 with different specifications and sizes and different positions on the transfer line body 10.

The working process of the utility model is as follows:

1. automatic feeding: adjusting the distance between the two board carrying rails 1 by a fourth driving device 2 according to the actual size of the substrate 100; the substrate 100 with the chips 200 is sequentially transferred onto the two on-board rails 1 through the transfer line body 10, and the substrate 100 is pushed to slide on the on-board rails 1.

2. Imaging: the first driving device 20 drives the gantry 30 to slide along the Y direction on one side of the conveyor line body 10, the second driving device 40 drives the second plate 50 to slide along the X direction on the cross beam 31, and the imaging device 80 on the third plate 70 is adjusted to be right above the substrate 100; adjusting pieces 4 on two upright posts 32 of the portal frame, adjusting the height of the cross beam 31 in the Z direction, and driving a third plate 70 to drive a forming device 80 to move in the Z direction by a third driving device 60; the image on the display device 90 is observed and the adjustment member 4 is further finely adjusted or the third drive means 60 is manipulated until the image is clear.

3. And (3) detection: the microcomputer automatically compares the image with the self-stored image to determine whether the product is qualified, and displays the detection result on the display device 90, so that the operator or the automatic mechanism can pick or mark the defective product accordingly.

The above is not intended to limit the technical scope of the present invention, and any modifications, equivalent changes and modifications made to the above embodiments according to the technical spirit of the present invention are all within the scope of the technical solution of the present invention.

Claims

1. An AOI automatic detection machine for chip bonding detection is characterized by comprising a conveyor line body extending along the X direction, wherein a first driving device and two first sliding rails extending along the Y direction are arranged on one side of the conveyor line body in the Y direction, a portal frame is arranged on the two first sliding rails in an erected mode, and the portal frame can slide on the first sliding rails under the driving of the first driving device; a beam of the portal frame extends along the X direction, a second driving device and a second plate in transmission connection with the second driving device are arranged on the beam, and the second plate can slide on the beam under the driving of the second driving device; the second plate is provided with a third driving device and a third plate in transmission connection with the third driving device, and the third plate can move along the Z direction under the driving of the third driving device; the third plate is provided with an imaging device which can take pictures of each chip passing through the lower part of the imaging device and transmit the pictures to a microcomputer, and the microcomputer can analyze the pictures one by one and display the detection result on a display device.

2. The AOI automatic detection machine for chip bonding detection according to claim 1, wherein a limiting member is disposed on the conveyor line body, the limiting member can limit a Y-direction coordinate of a substrate, and each substrate has more than one chip disposed thereon.

3. The AOI automatic detection machine for chip bonding detection according to claim 2, wherein the position limiter comprises two board-mounted rails extending along the X direction and adapted to the substrate, and the substrate is mounted on the two board-mounted rails and can slide along the two board-mounted rails under the driving of an external force.

4. The AOI automatic inspection machine for chip bonding inspection according to claim 3, wherein one of said onboard rails is mounted on one or more fourth slide rails extending along the Y direction and is in driving connection with a fourth driving device, said fourth driving device being capable of driving one of said onboard rails to move on said fourth slide rail.

5. The AOI automatic detection machine for chip bonding detection according to claim 1, wherein an adjusting member is arranged between the cross beam and each upright of the portal frame.

6. The AOI automatic detection machine for chip bonding detection according to claim 5, wherein both ends of the beam are slidably connected to the columns, the adjusting member comprises a plurality of positioning hole slots matching with the beam and each of the columns, and a locking member is capable of sequentially passing through the positioning hole slots of the beam and each of the columns and fixedly connecting the beam and the column.

7. The AOI automatic detection machine for chip bonding detection according to claim 5, wherein two ends of the beam are both connected with one of the columns in a threaded manner.

8. The AOI automatic inspection machine for chip bonding inspection according to any of claims 1-7, wherein the imaging device is a CCD camera.