CN217825075U - Camera module with heat radiation structure - Google Patents

Abstract

The utility model belongs to the technical field of the module of making a video recording and specifically relates to a module of making a video recording with heat radiation structure, including casing and electronic component, be provided with heat conduction structure in the casing, electronic component install in the casing and with the heat conduction of heat conduction structure contact with its production extremely on the casing. The application provides a pair of module of making a video recording with heat radiation structure, it can dispel the heat fast to the control element on the module of making a video recording, and furthest's assurance is made a video recording the operating mass and the efficiency of module.

Description

Camera module with heat radiation structure

[ technical field ] A

The utility model belongs to the technical field of the module of making a video recording and specifically relates to a module of making a video recording with heat radiation structure.

[ background of the invention ]

At present, with the development of electronic devices, a photographing function becomes an indispensable function of the electronic devices, and taking a smart phone as an example, the market has higher acceptance and higher frequency of use for the mobile phone. The photographing is an indispensable function of the smart phone and is increasingly used in ordinary life. Along with the popularization of the camera module, the market has higher and higher requirements on the photographing quality. And the control element in the module of making a video recording in the course of the work can produce the heat, the heat is untimely to be dispelled, the heat is piled up and is led to the high temperature, it can influence the operating mass of the module of making a video recording greatly.

[ Utility model ] content

An object of the utility model is to provide a module of making a video recording with heat radiation structure, it can dispel the heat fast to the control element on the module of making a video recording, and furthest's assurance is made a video recording the operating mass with rated load and efficiency of module.

The application is realized by the following technical scheme: the camera module with the heat dissipation structure comprises a shell and an electronic element, wherein a heat conduction structure is arranged in the shell, and the electronic element is arranged in the shell and is in contact with the heat conduction structure so as to conduct heat generated by the electronic element to the shell.

The camera module with the heat dissipation structure as described above, the electronic component includes a circuit board, the heat conduction structure includes a heat conduction platform protruding on the housing, and the circuit board is disposed on the heat conduction platform to conduct the heat generated by the circuit board to the housing. .

The camera module with the heat dissipation structure is characterized in that the heat conduction platform is provided with an assembly hole, and the circuit board is arranged on the heat conduction platform and fixedly connected with the heat conduction platform through the assembly hole.

The camera module with the heat dissipation structure comprises a plurality of electronic components, and the heat conduction structure is in contact with the electronic components to conduct heat generated by the electronic components to the shell.

The camera module with the heat dissipation structure is characterized in that the heat conduction structure is arranged on the heat conduction boss on the shell, the electronic element and the bottom of the shell form an assembly cavity, and the heat conduction boss is arranged in the assembly cavity corresponding to the position of the electronic element and contacted with the electronic element so as to conduct heat generated by the electronic element to the shell.

According to the camera module with the heat dissipation structure, the heat conduction layer is arranged between the heat conduction boss and the electronic component.

According to the camera module with the heat dissipation structure, the heat dissipation structure is arranged on the outer side of the shell.

The camera module with the heat dissipation structure comprises the heat dissipation groove arranged on the outer side of the shell, the heat dissipation groove corresponds to the joint of the shell and the heat conduction platform, and the heat dissipation groove faces the inner part of the heat conduction platform and is concave.

According to the camera module with the heat dissipation structure, the heat dissipation grooves are transversely arranged relative to the heat conduction platform, and the cross section of the heat dissipation grooves is narrow at the top and wide at the bottom.

The camera module with the heat dissipation structure comprises the heat dissipation fins arranged on the shell, and the heat dissipation fins are arranged on the other side of the shell corresponding to the position of the heat conduction boss.

Compared with the prior art, the method has the following advantages:

the utility model discloses a module of making a video recording with heat radiation structure, including casing and electronic component, be provided with heat conduction structure in the casing, electronic component install in the casing and with the heat conduction structure contact is in order to conduct its heat that produces extremely on the casing, through being connected electronic component and heat conduction structure contact, make the heat that electronic component produced can shift to on the casing, wherein, the casing is the metal material, utilizes the metal to have good heat conductivility, shifts the heat that electronic component produced, and it can dispel the heat fast to the electronic component on the module of making a video recording, and furthest's assurance is made a video recording the operating mass and the efficiency of module.

[ description of the drawings ]

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

Fig. 1 is a schematic structural diagram of a camera module according to an embodiment of the present application.

Fig. 2 is an exploded view of the camera module according to the embodiment of the present application.

Fig. 3 is a schematic structural diagram of a rear housing according to an embodiment of the present application.

Fig. 4 is a top view of a rear housing of an embodiment of the present application.

Fig. 5 is a side view of a rear housing of an embodiment of the present application.

Fig. 6 isbase:Sub>A sectional viewbase:Sub>A-base:Sub>A of fig. 1.

[ detailed description ] embodiments

In order to make the technical problems, technical solutions and advantageous effects solved by the present application more clear and obvious, the present application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.

As shown in fig. 1-6, an embodiment of the present application provides a camera module with a heat dissipation structure, which includes a housing 1 and an electronic component 2, a heat conduction structure 11 is disposed in the housing 1, the electronic component 2 is mounted in the housing 1 and contacts with the heat conduction structure 11 to conduct heat generated by the electronic component to the housing 1, and the electronic component 2 is in contact with the heat conduction structure 11 to transfer the heat generated by the electronic component 2 to the housing 1, wherein the housing 1 is made of a metal material, and the metal has a good heat conduction performance to transfer the heat generated by the electronic component 2, so that the electronic component 2 on the camera module can be quickly dissipated, and the working quality and efficiency of the camera module are ensured to the maximum.

Electronic component 2 includes circuit board 21, heat conduction structure 11 is located including the protruding heat conduction platform 111 on the casing 1, circuit board 21 is located heat conduction platform 111 is last in order to conduct its heat that produces to on the casing 1, be equipped with pilot hole 112 on the heat conduction platform 111, circuit board 21 is located on the heat conduction platform 111 and pass through pilot hole 112 with heat conduction platform 111 fixed connection, and heat conduction platform 111 set up in circuit board 21's diagonal position, from the angle of its installation, electronic component 2's diagonal angle with heat conduction platform 111 is connected fixedly, and its stability of assembling is higher, from its heat dissipation angle, the heat that electronic component 2 produced can be by its diagonal position is equitable the effluvium, has improved radiating efficiency greatly.

The electronic component 2 comprises a plurality of electronic components 22, the heat conducting structure 11 is in contact with the electronic components 22 to conduct heat generated by the electronic component 22 to the housing 1, the heat conducting structure 11 comprises a heat conducting boss 114 arranged on the housing 1, an assembly cavity 12 is formed between the electronic component 2 and the bottom of the housing 1, the heat conducting boss 114 is arranged in the assembly cavity 12 at a position corresponding to the electronic component 21 and is in contact with the electronic component 22 to conduct heat generated by the electronic component 22 to the housing 1, the heat conducting boss 114 is correspondingly arranged at a position of the electronic component 22 with higher calorific value on the electronic component 2 and is in contact with the heat conducting boss 114, so that the heat generated by the electronic component can be dissipated more quickly, and the assembly cavity 12 can exchange heat with the outside, so that the heat dissipating efficiency of the electronic component is greatly increased; a heat conduction layer 14 is arranged between the heat conduction boss 114 and the electronic component 22, the heat conduction layer 14 is a heat conduction gel with a heat conduction coefficient of 2.5W, and heat can be quickly conducted from the electronic component 22 to the housing 1 through the heat conduction gel.

A heat dissipation structure 14 is arranged on the outer side of the housing 1, the heat dissipation structure 14 includes a heat dissipation groove 15 arranged on the outer side of the housing 1, the heat dissipation groove 15 is arranged corresponding to the joint of the housing 1 and the heat conduction platform 111, the heat dissipation groove 15 is recessed towards the interior of the heat conduction platform 111, the contact area between the housing 1 and the cavity inside the housing is increased by arranging the heat dissipation groove 15, when the electronic element 2 exchanges heat with the cavity, the heat in the cavity can be quickly conducted to the housing 1, and the heat dissipation groove 15 is arranged on the outer side of the housing 1 corresponding to the heat conduction platform 111, and can quickly conduct the heat of the electronic element 2 through contact conduction; the heat dissipation grooves 15 are transversely arranged relative to the mounting table 111, and the cross section of each heat dissipation groove is narrow at the top and wide at the bottom, so that heat can be better dissipated.

The heat dissipation structure 14 includes heat dissipation fins 16 disposed on the housing 1, the heat dissipation fins 16 are disposed on the other side of the housing 1 opposite to the position of the heat conduction bosses 114, when the heat is conducted to the housing 1, the heat dissipation structure can increase the contact area with the outside through the heat dissipation fins 16, thereby greatly increasing the heat dissipation rate; wherein, heat radiation fin 16's upper end with casing 1 bottom is connected, just heat radiation fin 16's cross sectional shape is wide from top to bottom narrow, and it can be faster with partial heat by on the casing 1 conduct to on the heat radiation fin 16, heat radiation fin 16's cross sectional shape is wide from top to bottom narrow, compares in comparatively regular shape piece, and its side is bigger with external area of contact, is favorable to its heat dissipation more.

In addition, the electronic component 2 includes a first electronic component 23 and a second electronic component 24, the first electronic component 23 and the second electronic component 24 are installed in the housing 1 in a layered manner, and the first electronic component 23 and the second electronic component 24 are arranged in a layered manner, so that a gap exists between the first electronic component 23 and the second electronic component 24, which is beneficial to heat exchange with the outside, and thus heat dissipation of the electronic component is faster.

In summary, the present application has the following beneficial effects, but not limited to:

the utility model discloses a module of making a video recording with heat radiation structure, including casing 1 and electronic component 2, be provided with heat conduction structure 11 in the casing 1, electronic component 2 install in the casing 1 and with the heat conduction of heat conduction structure 11 contact with its production extremely on the casing 1, through being connected electronic component 2 and the contact of heat conduction structure 11, make the heat that electronic component 2 produced can shift to on the casing 1, wherein, casing 1 is the metal material, utilizes the metal to have good heat conductivility, shifts the heat that electronic component 2 produced, and it can dispel the heat fast to electronic component 2 on the module of making a video recording, and furthest's assurance is made a video recording the operating mass and the efficiency of module.

It should be understood that the terms "first", "second", etc. are used herein to describe various information, but the information should not be limited to these terms, and these terms are only used to distinguish one type of information from another. For example, "first" information may also be referred to as "second" information, and similarly, "second" information may also be referred to as "first" information, without departing from the scope of the present application. Furthermore, the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, merely for convenience in describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed in a particular orientation, and operate, and thus, should not be construed as limiting the present application.

The foregoing is illustrative of one or more embodiments provided in connection with the detailed description and is not intended to limit the disclosure to the particular forms disclosed. Similar or identical methods, structures, etc. as used herein, or several technical inferences or substitutions made on the concept of the present application should be considered as the scope of the present application.

Claims (6)

1. The camera module with the heat dissipation structure is characterized by comprising a shell (1) and an electronic element (2), wherein a heat conduction structure (11) is arranged in the shell (1), the electronic element (2) is arranged in the shell (1) and is in contact with the heat conduction structure (11) to conduct heat generated by the electronic element to the shell (1), the electronic element (2) comprises a circuit board (21), the heat conduction structure (11) comprises a heat conduction platform (111) which is convexly arranged on the shell (1), the circuit board (21) is arranged on the heat conduction platform (111) to conduct the heat generated by the circuit board to the shell (1), the electronic element (2) comprises a plurality of electronic components (22), the heat conduction structure (11) is in contact with the electronic components (22) to conduct the heat generated by the circuit board to the shell (1), the heat dissipation structure (14) is arranged on the outer side of the shell (1), the heat dissipation structure (14) comprises a heat dissipation groove (15) arranged on the outer side of the shell (1), and the heat dissipation groove (15) corresponds to the heat conduction platform (111) and a connection position of the heat conduction platform (111) is arranged in the heat conduction platform (1).

2. The camera module with the heat dissipation structure according to claim 1, wherein the heat conduction platform (111) is provided with a mounting hole (112), and the circuit board (21) is disposed on the heat conduction platform (111) and is fixedly connected to the heat conduction platform (111) through the mounting hole (112).

3. The camera module with a heat dissipation structure according to claim 1, wherein the heat conduction structure (11) includes a heat conduction boss (114) disposed on the housing (1), an assembly cavity (12) is formed between the electronic component (2) and the bottom of the housing (1), and the heat conduction boss (114) is disposed in the assembly cavity (12) at a position corresponding to the electronic component (22) and is in contact with the electronic component (22) so as to conduct heat generated by the electronic component (22) to the housing (1).

4. The camera module with a heat dissipation structure according to claim 3, wherein a heat conduction layer (13) is disposed between the heat conduction boss (114) and the electronic component (22).

5. The camera module with the heat dissipation structure according to claim 4, wherein the heat dissipation structure (14) comprises heat dissipation fins (16) disposed on the housing (1), and the heat dissipation fins (16) are disposed on the other side of the housing (1) relative to the position of the heat conduction boss (114).

6. The camera module with the heat dissipation structure as recited in claim 1, wherein the heat dissipation groove (15) is arranged laterally with respect to the heat conduction stage (111) and has a cross-sectional shape that is narrow at the top and wide at the bottom.

Images