CN217587685U

CN217587685U - Optical communication module with heat radiation structure

Info

Publication number: CN217587685U
Application number: CN202221208184.7U
Authority: CN
Inventors: 陈荣才; 邵清强
Original assignee: Shenzhen Baotian Precision Technology Co ltd
Current assignee: Shenzhen Baotian Precision Technology Co ltd
Priority date: 2022-05-19
Filing date: 2022-05-19
Publication date: 2022-10-14
Anticipated expiration: 2032-05-19

Abstract

The utility model belongs to the technical field of the optical communication and specifically relates to an optical communication module with heat radiation structure, including optical communication module casing and heat abstractor, heat abstractor with be equipped with between the optical communication module casing a plurality of be used for with the heat conduction of optical communication module casing extremely heat radiation structure on the heat abstractor. The application provides a pair of optical communication module with heat radiation structure, it can be in time with the produced heat conduction of optical communication module and the effluvium, has improved optical communication module's radiating efficiency and life.

Description

Optical communication module with heat radiation structure

[ technical field ] A

The utility model belongs to the technical field of the optical communication and specifically relates to an optical communication module with heat radiation structure.

[ background ] A method for producing a semiconductor device

With the development of new services and application modes such as cloud computing, mobile internet, video and the like, the development and progress of the optical communication technology become increasingly important. In the optical communication technology, a tool for realizing the mutual conversion of photoelectric signals in the optical communication module is one of key devices in optical communication equipment, and along with the development requirement of the optical communication technology, the transmission rate of the optical communication module is also continuously improved, along with higher integration level and higher power density of the optical communication module, the heat productivity of the optical communication module is increased, and the heat cannot be timely dissipated, so that the heat dissipation efficiency and the service life of the optical communication module are influenced.

[ Utility model ] content

An object of the utility model is to provide an optical communication module with heat radiation structure, it can in time be with the produced heat conduction of optical communication module and effluvium, has improved optical communication module's radiating efficiency and life.

The application is realized by the following technical scheme: the utility model provides an optical communication module with heat radiation structure, includes optical communication module casing and heat abstractor, heat abstractor with be equipped with a plurality ofly between the optical communication module casing and be used for with the heat conduction of optical communication module casing reaches heat radiation structure on the heat abstractor.

According to the optical communication module with the heat dissipation structure, the shell of the optical communication module comprises the plurality of components, and the heat dissipation structure is arranged corresponding to the positions of the components to conduct heat generated by the components.

The optical communication module with the heat dissipation structure comprises the heat dissipation part, the optical communication module shell is provided with the groove, the heat dissipation part comprises the heat dissipation bottom plate, and when the heat dissipation part is installed on the optical communication module shell, the heat dissipation bottom plate is embedded into the groove, so that the plane at the lower end of the heat dissipation bottom plate is equal to or lower than the edge of the groove.

The optical communication module with the heat dissipation structure comprises the first heat dissipation block, wherein one side of the first heat dissipation block is embedded into the optical communication module shell, and the other side of the first heat dissipation block is in contact with the heat dissipation bottom plate so as to conduct heat to the heat dissipation bottom plate.

The optical communication module with the heat dissipation structure as described above, the heat dissipation device further includes a heat dissipation block mounted on the heat dissipation base plate, and the heat dissipation block contacts with the heat dissipation base plate to conduct heat to the heat dissipation block.

The optical communication module with the heat dissipation structure comprises a heat dissipation channel penetrating through the heat dissipation block, and the first heat dissipation block is arranged corresponding to the head end of the heat dissipation channel.

The optical communication module with the heat dissipation structure further comprises a second heat dissipation block and a third heat dissipation block, wherein the first heat dissipation block, the second heat dissipation block and the third heat dissipation block are sequentially arranged along the length direction of the heat dissipation channel.

In the optical communication module with the heat dissipation structure, the contact areas of the first heat dissipation block, the second heat dissipation block and the third heat dissipation block with the housing of the optical communication module are sequentially reduced.

According to the optical communication module with the heat dissipation structure, the heat dissipation block comprises the heat dissipation channels with different widths, and the width of the heat dissipation channel in the middle section of the heat dissipation block is larger than the width of the heat dissipation channels at two ends of the heat dissipation block.

In the optical communication module with the heat dissipation structure, two sides of the housing of the optical communication module, which face one side of the heat dissipation block, are provided with fixing edges protruding out of the housing of the optical communication module, and two sides of the heat dissipation block abut against the fixing edges to realize fixing.

Compared with the prior art, the method has the following advantages:

the utility model discloses an optical communication module with heat radiation structure, including optical communication module casing and heat abstractor, heat abstractor with be equipped with between the optical communication module casing a plurality of be used for with the heat conduction of optical communication module casing extremely heat radiation structure on the heat abstractor, it can in time be with the produced heat conduction of optical communication module and effluvium, has improved optical communication module's radiating efficiency and life.

[ description of the drawings ]

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

Fig. 1 is a schematic structural diagram of an optical communication module according to an embodiment of the present application.

Fig. 2 is an exploded view of an optical communication module according to an embodiment of the present application.

Fig. 3 is a schematic structural diagram of a heat dissipation block according to an embodiment of the present application.

Fig. 4 is a schematic structural view of another angle of the heat dissipation block according to the embodiment of the present application.

Fig. 5 is a side view of the heat slug of an embodiment of the present application.

[ detailed description ] embodiments

In order to make the technical problems, technical solutions and advantageous effects solved by the present application more clearly understood, the present application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.

As shown in fig. 1-5, an embodiment of the present application provides an optical communication module with a heat dissipation structure, including an optical communication module housing 1 and a heat dissipation device 2, a plurality of heat dissipation structures 21 are disposed between the heat dissipation device 2 and the optical communication module housing 1, and are used for conducting heat of the optical communication module housing 1 to the heat dissipation device 2, when the optical communication module works, heat generated by itself or information transmission with a device is easily accumulated on the optical communication module housing 1, and by disposing a plurality of heat dissipation structures 21 between the heat dissipation device 2 and the optical communication module housing 1, the heat generated by the optical communication module can be conducted and dissipated in time, so that heat dissipation efficiency and service life of the optical communication module are improved.

The optical communication module comprises an optical communication module shell 1, wherein the optical communication module shell 1 comprises a plurality of components, the heat dissipation structure 21 corresponds to the positions of the components and is used for conducting heat generated by the components, the heat dissipation structure 21 comprises a first heat dissipation block 23, one side of the first heat dissipation block 23 is embedded into the optical communication module shell 1, the other side of the first heat dissipation block is in contact with a heat dissipation bottom plate 22 so as to conduct the heat to the heat dissipation bottom plate 22, the first heat dissipation block 23 is embedded into the optical communication module shell 1 in an embedded mode, the assembly of the first heat dissipation block is more stable, the first heat dissipation block is not easy to damage and fall off, the first heat dissipation block 23 can be simultaneously in contact conduction and can dissipate the heat with air heat inside the optical communication module, and the heat dissipation efficiency is greatly improved.

The heat dissipation device 2 further comprises a heat dissipation block 24 installed on the heat dissipation base plate 22, the heat dissipation block 24 is in contact with the heat dissipation base plate 22 to conduct heat to the heat dissipation block 24, and the heat dissipation block 22 is arranged to enable heat to be transferred from the optical communication module casing 1 and the first heat dissipation block 23 to the heat dissipation block 24, so that the heat dissipation area is increased, and the heat dissipation efficiency is improved.

The radiating block 24 is provided with a radiating channel 25 penetrating through the radiating block 24, the first radiating block 23 corresponds to the head end of the radiating channel 25, and on the basis of the radiating block 24, the radiating channel 25 is additionally arranged, so that the contact area between the radiating block 24 and the outside is increased, the air heat conduction efficiency between the radiating block and the radiating channel is improved, the first radiating block 23 corresponds to the head end of the radiating channel 25, and heat can be quickly conducted from the radiating channel 25 to the outside.

Heat radiation structure 21 still includes second radiating block 26 and third radiating block 27, first radiating block 23 second radiating block 26 with third radiating block 27 follows radiating channel 25 length direction sets gradually, and first radiating block 23 second radiating block 26 with third radiating block 27 with optical communication module casing 1's area of contact reduces in proper order, and its main components and parts mainly integrate in one end in optical communication module to in the heat transfer radiating process, the heat at its both ends is inconsistent, first radiating block 23 second radiating block 26 with third radiating block 27 with optical communication module casing 1's area of contact reduces in proper order, has reduced the manufacturing cost of casting radiating block when having guaranteed the radiating efficiency.

Including the radiating passage 25 that the width differs on the radiating block 24, and be located radiating block 24 middle section radiating passage 25 width is greater than and is located radiating block 24 both ends radiating passage 25 width, components and parts in the optical communication module generally set up in its inside middle part, and calorific capacity at its middle part is great, and the great radiating passage 25 of width is bigger with external area of contact, and the heat dissipation is better.

The optical communication module comprises a shell 1 and is characterized in that a groove 11 is formed in the shell 1, the heat dissipation device 2 comprises a heat dissipation bottom plate 22, when the heat dissipation device 2 is arranged on the shell 1, the heat dissipation bottom plate 22 is embedded into the groove 11, so that the plane of the lower end of the heat dissipation bottom plate 22 is flush with or lower than the edge of the groove 11, air can smoothly enter a heat dissipation channel 25 from the outside, if the plane of the lower end of the heat dissipation channel 25 is higher than the edge of the groove 11, part of air can be blocked at the lower end of the heat dissipation channel 25, and even micro air flow can be formed, air exchange is influenced, and through arrangement, the plane of the lower end of the heat dissipation channel 25 is flush with or lower than the edge of the groove 11, air can stably enter the heat dissipation channel 25, and air heat conduction is facilitated.

Two sides of the optical communication module housing 1 facing one side of the heat dissipation block 24 are provided with fixing edges 12 protruding from the optical communication module housing 1, and two sides of the heat dissipation block 24 abut against the fixing edges 12 to realize fixing.

In summary, the present application has, but is not limited to, the following beneficial effects:

the utility model discloses an optical communication module with heat radiation structure, including optical communication module casing 1 and heat abstractor 2, heat abstractor 2 with be equipped with between the optical communication module casing 1 a plurality of be used for with the heat conduction of optical communication module casing 1 extremely heat radiation structure 21 on the heat abstractor 2, at the optical communication module during operation, its self or with the produced heat of information transfer between the equipment pile up on optical communication module casing 1 easily, through setting up a plurality of heat radiation structure 21 in heat abstractor 2 with between the optical communication module casing 1, it can in time be with the produced heat conduction of optical communication module and spill, improved optical communication module's radiating efficiency and life.

It should be understood that the terms "first", "second", etc. are used herein to describe various information, but the information should not be limited to these terms, and these terms are only used to distinguish one type of information from another. For example, "first" information may also be referred to as "second" information, and similarly, "second" information may also be referred to as "first" information, without departing from the scope of the present application. Furthermore, the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience in describing the present application and simplifying the description, but do not indicate or imply that the referred devices or elements must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present application.

The foregoing is illustrative of one or more embodiments provided in connection with the detailed description and is not intended to limit the disclosure to the particular forms disclosed. Similar or identical methods, structures, etc. as used herein, or several technical inferences or substitutions made on the concept of the present application should be considered as the scope of the present application.

Claims

1. The optical communication module with the heat dissipation structure is characterized by comprising an optical communication module shell (1) and a heat dissipation device (2), wherein a plurality of heat dissipation structures (21) used for conducting heat of the optical communication module shell (1) to the heat dissipation device (2) are arranged between the heat dissipation device (2) and the optical communication module shell (1).

2. The optical communication module with the heat dissipation structure as recited in claim 1, wherein the optical communication module housing (1) includes a plurality of components, and the heat dissipation structure (21) is disposed corresponding to the positions of the components to conduct heat generated by the components.

3. The optical communication module with the heat dissipation structure according to claim 2, wherein a groove (11) is formed in the optical communication module housing (1), the heat dissipation device (2) includes a heat dissipation bottom plate (22), and when the heat dissipation device (2) is mounted on the optical communication module housing (1), the heat dissipation bottom plate (22) is embedded in the groove (11), so that a plane of a lower end of the heat dissipation bottom plate (22) is flush with an edge of the groove (11) or is lower than the edge of the groove (11).

4. An optical communication module with a heat dissipation structure according to claim 3, wherein the heat dissipation structure (21) comprises a first heat slug (23), and the first heat slug (23) is embedded in the optical communication module housing (1) at one side and contacts the heat dissipation base plate (22) at the other side to conduct heat to the heat dissipation base plate (22).

5. The optical communication module with a heat dissipation structure as recited in claim 4, wherein the heat sink (2) further comprises a heat slug (24) mounted on the heat dissipation base plate (22), the heat slug (24) being in contact with the heat dissipation base plate (22) to conduct heat to the heat slug (24).

6. The optical communication module with a heat dissipation structure as claimed in claim 5, wherein the heat dissipation block (24) includes a heat dissipation channel (25) extending through the heat dissipation block (24), and the first heat dissipation block (23) is disposed corresponding to a head end of the heat dissipation channel (25).

7. The optical communication module with a heat dissipation structure as defined in claim 6, wherein the heat dissipation structure (21) further comprises a second heat dissipation block (26) and a third heat dissipation block (27), and the first heat dissipation block (23), the second heat dissipation block (26) and the third heat dissipation block (27) are sequentially arranged along a length direction of the heat dissipation channel (25).

8. The optical communication module having a heat dissipation structure according to claim 7, wherein the contact areas of the first heat slug (23), the second heat slug (26), and the third heat slug (27) with the optical communication module case (1) are sequentially reduced.

9. The optical communication module with a heat dissipation structure as claimed in claim 6, wherein the heat slug (24) includes heat dissipation channels (25) with different widths, and the width of the heat dissipation channel (25) located at the middle section of the heat slug (24) is greater than the width of the heat dissipation channel (25) located at the two ends of the heat slug (24).

10. The optical communication module with a heat dissipation structure as claimed in claim 5, wherein two sides of the optical communication module housing (1) facing the heat dissipation block (24) are provided with fixing edges (12) protruding from the optical communication module housing (1), and two sides of the heat dissipation block (24) abut against the fixing edges (12) to achieve fixing.