CN217822731U - Semiconductor packaging finished product jig - Google Patents

Semiconductor packaging finished product jig Download PDF

Info

Publication number
CN217822731U
CN217822731U CN202221764301.8U CN202221764301U CN217822731U CN 217822731 U CN217822731 U CN 217822731U CN 202221764301 U CN202221764301 U CN 202221764301U CN 217822731 U CN217822731 U CN 217822731U
Authority
CN
China
Prior art keywords
finished product
jig
plate
main board
product jig
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202221764301.8U
Other languages
Chinese (zh)
Inventor
涂必胜
李志伟
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shanghai Jungong Automation Technology Co ltd
Original Assignee
Shanghai Jungong Automation Technology Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shanghai Jungong Automation Technology Co ltd filed Critical Shanghai Jungong Automation Technology Co ltd
Priority to CN202221764301.8U priority Critical patent/CN217822731U/en
Application granted granted Critical
Publication of CN217822731U publication Critical patent/CN217822731U/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Manipulator (AREA)

Abstract

The utility model discloses a semiconductor package finished product tool, it includes: one end of the bearing plate is provided with a jig vertical plate, and the other end of the bearing plate is provided with a main plate connecting rib plate; a robot quick-change tool disc and an electromagnetic valve group are mounted on the jig vertical plate; the finished product jig main board is installed on the main board connecting rib plate, the air cylinder is installed on the finished product jig main board, and the electromagnetic valve group is installed on an air path of the air cylinder and used for controlling air supply to the air cylinder; the two sides of the cylinder are respectively connected with a connecting rod, and the cylinder is used for driving the connecting rods to move close to or away from each other; and the connecting rods are respectively provided with a clamping jaw. The utility model discloses can realize getting the automatic operation of putting the process to the tablet, promote the work efficiency of semiconductor package operation.

Description

Semiconductor packaging finished product jig
Technical Field
The utility model relates to a semiconductor package technical field relates to a semiconductor package finished product tool particularly.
Background
The conventional semiconductor packaging technology comprises the following steps: placing the material sheet and the black rubber for plastic packaging of the material sheet into a press, and completing plastic packaging of the material sheet through the press; taking the plastic-encapsulated material sheet out of the press; and (3) putting the plastic-packaged material sheet into a glue removing channel machine, and removing redundant black glue residues on the plastic-packaged material sheet through the glue removing channel machine. In the process, the process of taking and placing the material sheet usually needs manual operation, the automation degree is low, and the overall working efficiency of semiconductor packaging operation is reduced. Therefore, how to develop a jig for finished semiconductor packages, which can realize the automatic operation of the material sheet taking and placing process and improve the work efficiency of semiconductor packaging operation, is a direction that needs to be studied by technicians in the field.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a semiconductor package finished product tool can realize getting the automation mechanized operation of putting the process to the tablet, promotes the work efficiency of semiconductor package operation.
The technical scheme is as follows:
a semiconductor packaging finished product jig comprises: one end of the bearing plate is provided with a jig vertical plate, and the other end of the bearing plate is provided with a main plate connecting rib plate; a robot quick-change tool disc and an electromagnetic valve group are mounted on the jig vertical plate; the finished product jig main board is installed on the main board connecting rib plate, the air cylinder is installed on the finished product jig main board, and the electromagnetic valve group is installed on an air path of the air cylinder and used for controlling air supply to the air cylinder; the two sides of the cylinder are respectively connected with a connecting rod, and the cylinder is used for driving the connecting rods to move close to or away from each other; and the connecting rods are respectively provided with a clamping jaw.
By adopting the technical scheme: the clamping device is formed by the cylinder, the connecting rod and the clamping jaw. During operation, through the quick change tool dish of robot, use the robot of peripheral hardware to move this equipment to the tablet top that needs snatch to solenoid valve group control cylinder makes the clamping jaw closed, snatchs the tablet. Subsequently, the robot drives the equipment to move to the next station through the robot quick-change tool disc, and then the clamping jaw is opened by controlling the cylinder through the electromagnetic valve group, so that the material sheet can be completely released.
Preferably, in the semiconductor package product jig: the finished jig main board is provided with a through hole, a bearing is arranged in the through hole, and the bearing is installed on a board body of the finished jig main board through a fixing block; the bearing is inserted with a finished product jig prepressing shaft perpendicular to the finished product jig mainboard, the shaft body of the finished product jig prepressing shaft is sleeved with a spring, and a finished product jig prepressing plate is fixed at one end, far away from the finished product jig mainboard, of the finished product jig prepressing shaft.
By adopting the technical scheme: in the process that the clamping jaw clamps the material piece, the finished product jig prepressing plate is attached to the clamped material piece, and in the process, the spring on the finished product jig prepressing shaft is compressed to cause the finished product jig prepressing plate to be tightly pressed on the material piece, so that the function of fixing the material piece together with the clamping jaw is achieved.
More preferably, in the semiconductor package product fixture: and a material sheet limiting pin is arranged on one side of the pre-pressing plate of the finished product jig back to the main board of the finished product jig.
By adopting the technical scheme: further spacing tablet with tablet spacer pin guarantees that the tablet is unmovable on the finished product tool.
More preferably, the jig for semiconductor packages further comprises: a detection device comprising a detection sensor and a sensor holder; the sensor bracket is arranged on the finished product jig main board; the detection sensor is assembled on the sensor support and is arranged right opposite to the air cylinder.
By adopting the technical scheme: at the in-process of centre gripping tablet to whether the sensor detects cylinder driven clamping jaw and gains the tablet, guaranteed the work efficiency of this equipment.
More preferably, in the semiconductor package product fixture, the following components: and the finished product jig main board is provided with contour columns, and the contour columns are provided with jig shells.
By adopting the technical scheme: the protection and the dust prevention of the electric circuit are realized by arranging the jig shell.
More preferably, in the semiconductor package product fixture, the following components: the model number of the electromagnetic valve group is SS5J2-60-04US.
By adopting the technical scheme: independent opening and closing of each air cylinder is independently controlled in a single electric control mode based on SS5J2-60-04US.
More preferably, in the jig for semiconductor packages, the jig for semiconductor packages comprises: 2 finished product tool mainboards are symmetrically installed on the mainboard connecting rib plate, and the 2 finished product tool mainboards are located on two sides of the bearing plate.
By adopting the technical scheme: a single finished product tool can snatch in succession and carry 2 tablets, has promoted the work efficiency of this equipment.
Compared with the prior art, the utility model discloses can realize getting the automatic operation of putting the process to the tablet, promote the work efficiency of semiconductor package operation.
Drawings
FIG. 1 is a schematic structural view of example 1; in the figure, a jig shell is omitted, and a connecting line between the electromagnetic valve group and the air cylinder is omitted;
FIG. 2 is a schematic structural view of the main board of the finished jig shown in FIG. 1, in which the contour posts are omitted;
FIG. 3 is a schematic structural view of a fixture housing;
FIG. 4 is a schematic view of the grasping apparatus of FIG. 1;
FIG. 5 is a schematic structural view of the compressing device in FIG. 1;
the names of the components corresponding to the reference numerals are as follows:
1. carrying a plate; 2. a fixture vertical plate; 3. the main board is connected with a rib plate; 4. a robot quick change tool tray; 5. An electromagnetic valve group; 6. a finished product jig main board; 7. a cylinder; 8. a connecting rod; 9. a clamping jaw; 10. a bearing; 11. a fixed block; 12. pre-pressing the shaft by using a finished jig; 13. a spring; 14. pre-pressing a finished jig; 15. A material sheet limiting pin; 16. a detection sensor; 17. a sensor holder; 18. an equal-height column; 19. a jig shell.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Examples 1 are shown in FIGS. 1-5:
a semiconductor packaging finished product jig comprises: a carrier plate 1;
one end of the bearing plate 1 is provided with a jig vertical plate 2, and the other end is provided with a main plate connecting rib plate 3; a robot quick-change tool disc 4 and an electromagnetic valve group 5 are mounted on the fixture vertical plate 2; 2 finished product tool mainboards 6 are symmetrically installed on the mainboard connecting rib plate 3, and the 2 finished product tool mainboards 6 are respectively positioned on two sides of the loading plate 1.
Each finished product tool mainboard 6 is last all to install and to get device, closing device and detection device. Wherein, the clamping device comprises a cylinder 7, a connecting rod 8 and a clamping jaw 9. The model number of the electromagnetic valve group 5 is SS5J2-60-04US. The air supply device is arranged on an air path connected with the air pipe joints of the air cylinders 7 and is used for respectively controlling air supply to the air cylinders 7; two sides of the cylinder 7 are respectively connected with a connecting rod 8, and the cylinder 7 is used for driving the connecting rods 8 to move close to or away from each other; and the connecting rods 8 are respectively provided with a clamping jaw 9. The pressing device comprises a finished product jig prepressing shaft 12, a spring 13 and a finished product jig prepressing plate 14. Specifically, the method comprises the following steps: the finished jig main board 6 is provided with a through hole, a bearing 10 is arranged in the through hole, and the bearing 10 is installed on a board body of the finished jig main board 6 through a fixing block 11; one end of the finished product jig pre-pressing shaft 12 is inserted into the bearing 10 along a direction perpendicular to the finished product jig main board 6, the spring 13 is sleeved on the shaft body of the finished product jig pre-pressing shaft 12, and the finished product jig pre-pressing plate 14 is fixed on the other end of the finished product jig pre-pressing shaft 12. And a material sheet limiting pin is arranged on one side surface of the finished product jig pre-pressing plate 14, which faces away from the finished product jig main board 6. The detection device comprises a detection sensor 16 and a sensor bracket 17; the sensor bracket 17 is arranged on the finished product jig main board 6; the detection sensor 16 is assembled on the sensor support 17, is arranged opposite to the cylinder 7, and is used for detecting whether the clamping jaw 9 driven by the cylinder 7 obtains a material sheet. The finished product jig main board 6 is also provided with an equal-height column 18, and the equal-height column 18 is used for installing a jig shell 19.
In practice, the working process is as follows:
firstly, the equipment is connected with a peripheral robot arm through a robot quick-change tool disc 4, is moved to the position above a material sheet to be grabbed through the robot arm, and is lowered down after rotating for a certain angle. Meanwhile, the electromagnetic valve group 5 controls each cylinder 7 on the finished product jig main board 6 on one side, to be grabbed, of the material sheet to be opened, the material pressing device presses the material sheet at the moment, the electromagnetic valve group 5 controls each cylinder 7 on the side to be closed synchronously, so that the material sheet is grabbed through the clamping jaw 9, and whether the material sheet is in place is detected through the sensor. And then, the robot drives the equipment to reset to the initial position, then the equipment moves to the next position to be grabbed, the equipment descends by a certain angle after rotating reversely, the electromagnetic valve group 5 controls the air cylinder 7 on the finished product jig main board 6 on the other side to be opened, and the steps are repeated, so that the clamping jaw 9 on the finished product jig main board 6 on the other side grabs the material sheet. Then, the robot arm carries the apparatus to the next process. The robot makes this equipment move to the top of connecing the material part towards a rotatory certain angle of orientation, makes one side finished product tool mainboard 6, controls the cylinder 7 of this side to open in step through solenoid valve group 5, makes the tablet that the clamping jaw 9 on this side finished product tool mainboard 6 snatched drop. And then, the robot drives the equipment to reset and rotate reversely, and the electromagnetic valve group 5 controls the cylinder 7 on the other side to be opened synchronously. The material sheet grabbed by the clamping jaw 9 on the finished product jig main board 6 on the other side falls off. Thereby completing the automated transfer of the web.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims (7)

1. A semiconductor package finished product jig is characterized by comprising: carrying a plate;
one end of the bearing plate is provided with a fixture vertical plate, and the other end of the bearing plate is provided with a main plate connecting rib plate; a robot quick-change tool disc and an electromagnetic valve group are mounted on the jig vertical plate; the finished product jig main board is installed on the main board connecting rib plate, the air cylinder is installed on the finished product jig main board, and the electromagnetic valve group is installed on an air path of the air cylinder and used for controlling air supply to the air cylinder; the two sides of the cylinder are respectively connected with a connecting rod, and the cylinder is used for driving the connecting rods to move close to or away from each other; and the connecting rods are respectively provided with a clamping jaw.
2. The jig for semiconductor packages as claimed in claim 1, wherein:
the finished jig main board is provided with a through hole, a bearing is arranged in the through hole, and the bearing is installed on a board body of the finished jig main board through a fixing block; the bearing is inserted with a finished product jig prepressing shaft perpendicular to the finished product jig mainboard, a spring is sleeved on a shaft body of the finished product jig prepressing shaft, and a finished product jig prepressing plate is fixed on one end, away from the finished product jig mainboard, of the finished product jig prepressing shaft.
3. The jig for semiconductor packages as claimed in claim 2, wherein: and a material sheet limiting pin is arranged on one side of the pre-pressing plate of the finished product jig, which faces back to the main board of the finished product jig.
4. The jig for semiconductor packages as claimed in claim 3, further comprising: a detection device comprising a detection sensor and a sensor holder; the sensor bracket is arranged on the finished product jig main board; the detection sensor is assembled on the sensor support and is arranged right opposite to the air cylinder.
5. The jig for semiconductor packages as claimed in claim 4, wherein: and the finished product jig main board is provided with contour columns, and the contour columns are provided with jig shells.
6. The jig for semiconductor packages as claimed in claim 1, wherein: the model number of the electromagnetic valve group is SS5J2-60-04US.
7. The jig for semiconductor packages as claimed in any one of claims 1 to 6, wherein: 2 finished product tool mainboards are symmetrically installed on the mainboard connecting rib plate, and the 2 finished product tool mainboards are located on two sides of the bearing plate.
CN202221764301.8U 2022-07-07 2022-07-07 Semiconductor packaging finished product jig Active CN217822731U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202221764301.8U CN217822731U (en) 2022-07-07 2022-07-07 Semiconductor packaging finished product jig

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202221764301.8U CN217822731U (en) 2022-07-07 2022-07-07 Semiconductor packaging finished product jig

Publications (1)

Publication Number Publication Date
CN217822731U true CN217822731U (en) 2022-11-15

Family

ID=83962475

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202221764301.8U Active CN217822731U (en) 2022-07-07 2022-07-07 Semiconductor packaging finished product jig

Country Status (1)

Country Link
CN (1) CN217822731U (en)

Similar Documents

Publication Publication Date Title
CN111250984B (en) Multi-mechanism terminal assembling machine
CN205496785U (en) Full -automatic kludge of water conservation irrigation pipe top connection
CN110039310B (en) Full-automatic shell assembling machine
CN109822347B (en) Vacuum bottle assembling machine and oiling process thereof
CN210575520U (en) Inductance coil flattens and cuts sticky tin full automatization equipment based on two carousels
CN210755715U (en) A loading attachment for automatic wicking machine
CN209902655U (en) Gear sensor production equipment
CN215514519U (en) Film tearing device
CN217822731U (en) Semiconductor packaging finished product jig
CN111883812B (en) Bending rubber coating machine
CN218275486U (en) Automatic kludge of circuit insurance terminal
CN212244159U (en) A tear membrane pad pasting device for display screen
CN111099090A (en) Automatic labeling and bag opening device for ammunition packaging bag
CN216271506U (en) Automatic feeding device for machining waterproof vent valve
CN216178274U (en) Automatic battery and rear cover loading equipment
CN215824743U (en) High-efficient kludge of touch-sensitive screen
CN212071026U (en) Automatic assembling equipment for gem holes
CN210147438U (en) Vacuum bottle assembling machine
CN110253288B (en) Full-automatic buzzer kludge
CN210745801U (en) Automatic installation equipment for PCB (printed circuit board) of small battery pack
CN110436181B (en) Lithium battery winding core test transfer equipment
CN207223328U (en) A kind of copper piece assembles CCD machines
CN113733498A (en) Insert injection molding robot gripper
CN112837923A (en) Inductance coil flattens and cuts sticky tin full automatization equipment based on two carousels
CN217901200U (en) Valve body automatic checkout device

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant