CN217785925U

CN217785925U - Chemical system thermal stress balancing device based on heat pipe technology

Info

Publication number: CN217785925U
Application number: CN202221982732.1U
Authority: CN
Inventors: 陈宝; 张晨; 王俊来; 王慧; 刘士琦
Original assignee: Hulunbuir Branch Of Inner Mongolia Special Equipment Inspection And Research Institute
Current assignee: Hulunbuir Branch Of Inner Mongolia Special Equipment Inspection And Research Institute
Priority date: 2022-07-29
Filing date: 2022-07-29
Publication date: 2022-11-11
Anticipated expiration: 2032-07-29

Abstract

The utility model discloses a chemical industry system thermal stress balancing unit based on heat pipe technique relates to heat pipe technical field, including the mounting panel, the spread groove has been seted up at the lower surface middle part of mounting panel, the bilateral symmetry fixedly connected with side board of mounting panel, the top fixedly connected with locating lever of a plurality of side boards, a plurality of side boards are located the outside fixedly connected with supporting spring of locating lever. The utility model discloses, through when other chemical industry equipment of top installation at the connecting box, the whole atress of connecting box, make fin and heat insulating board down, after the supporting spring shrink, make the top of heat pipe tube move down, make the top bottom contact heat-conducting plate of heat pipe tube, connect through heat-conducting plate and heat conduction groove, with heat direction fin, spacing groove through heat pipe tube bottom top and the pressing plate of heat insulating board bottom are connected, it is spacing to the bottom of heat pipe tube, avoid the bottom in use of heat pipe tube to break away from the range groove, cause the heat conduction effect that the skew influences equipment.

Description

Chemical system thermal stress balancing device based on heat pipe technology

Technical Field

The utility model relates to a heat pipe technical field, more specifically relate to a chemical industry system thermal stress balancing unit based on heat pipe technique.

Background

In recent years, with the rapid development of microelectronic product technology, the power of electronic equipment is rapidly increased, the physical size is smaller and smaller, the problem of product failure caused by high heat flux density is increasingly serious, a heat pipe with the characteristics of high heat conductivity, high reliability, quick thermal response, no need of additional electric power drive and the like becomes an ideal choice for solving the heat dissipation problem of a high heat flux density chip, the heat transfer performance of the heat pipe is mainly determined by a capillary liquid absorption core structure, the conventional heat pipe liquid absorption core structure usually consists of a single-form wire mesh, sintered powder and grooves, wherein the wire mesh type liquid absorption core is gradually replaced by other liquid absorption cores due to poor process repeatability and incapability of adapting to the bending condition of a pipeline, the sintered liquid absorption core has higher capillary pressure and larger heat transfer amount, but due to poor permeability, the contradiction that the capillary pressure is improved and the liquid reflux resistance is increased simultaneously exists, so that the axial heat transfer capability of the heat pipe is limited.

In chinese utility model patent application no: CN201610566396.5 discloses an integrated micro heat pipe heat dissipation based on MEMS technology, which comprises a heat dissipation cavity, a heat absorption cavity, a circulation pipeline and a heat dissipation working medium, wherein the heat dissipation cavity and the heat absorption cavity are both provided with internal micro channel structures, the circulation pipeline is arranged between the heat dissipation cavity and the heat absorption cavity and is communicated with the internal micro channel structures in the heat dissipation cavity and the heat absorption cavity, so as to realize the communication between the heat dissipation cavity and the heat absorption cavity. This integrated little heat pipe heat dissipation based on MEMS technique, when using in the heat pipe chemical industry, the refrigerant liquid is heated the intensification and evaporates the back, and when the poor heat conduction effect of condensation end can not in time condense, causes the local overheat of inside body, can not keep the sufficient wetting of wall, leads to producing hot spot, local dry and the local scale deposit that arouses, and then makes the inner wall atress unbalanced, influences the atress stability of equipment.

Therefore, it is necessary to provide a heat pipe technology-based thermal stress balancing apparatus for chemical systems to solve the above problems.

SUMMERY OF THE UTILITY MODEL

Technical problem to be solved

The utility model aims to provide a: in order to solve the heat dissipation of integrated little heat pipe based on MEMS technique, when using in the heat pipe chemical industry, after the refrigerant liquid is heated and heaies up the evaporation, when the poor timely condensation of heat conduction effect of condensation end, causes the local overheat of inside body, can not keep enough moist of wall, leads to producing hot spot, local drying and the local scale deposit that arouses, and then makes the inner wall atress unbalanced, influences the stable problem of atress of equipment, the utility model provides a chemical industry system thermal stress balancing unit based on heat pipe technique.

(II) technical scheme

The utility model discloses a realize above-mentioned purpose and specifically adopt following technical scheme:

the utility model provides a chemical industry system thermal stress balancing unit based on heat pipe technique, includes the mounting panel, the spread groove has been seted up at the lower surface middle part of mounting panel, the bilateral symmetry fixedly connected with side board of mounting panel, it is a plurality of the top fixedly connected with locating lever of side board, it is a plurality of the side board is located the outside fixedly connected with supporting spring of locating lever, and is a plurality of supporting spring's top fixedly connected with heat insulating board, it is a plurality of one side of heat insulating board is run through on the top of locating lever, the upper surface middle part fixedly connected with fin of heat insulating board.

Furthermore, the top of the radiating fin is fixedly connected with a connecting box, and positioning holes are symmetrically formed in two sides of the top of the connecting box.

Furthermore, through holes are symmetrically formed in two sides of the connecting box, and a sealing plate is fixedly connected to the top of the connecting box.

Furthermore, a plurality of through holes are attached to the inside of the heat pipe shell, and the bottom end of the sealing plate is attached to the top of the heat pipe shell and connected with a waist plate.

Furthermore, a plurality of porous runners are arranged inside the heat pipe shells, and embedded groove bodies with the same axial length as the porous runners are symmetrically arranged on the inner walls of the plurality of porous runners.

Further, the bottom of the through holes is fixedly connected with a heat conducting plate, the top of the radiating fin is symmetrically provided with heat conducting grooves, and the insides of the heat conducting grooves are connected with the bottom of the heat conducting plate in a fitting mode.

Furthermore, the top bilateral symmetry of mounting panel has seted up the range groove, and is a plurality of the inside in range groove is connected with the bottom laminating of heat pipe shell, and is a plurality of spacing groove has been seted up at the bottom top of heat pipe shell.

Furthermore, the both sides of the bottom of heat insulating board symmetry fixedly connected with press plate, a plurality of the bottom of press plate and the spacing groove laminating of the top of heat pipe tube are connected.

(III) advantageous effects

The utility model has the advantages as follows:

1. the utility model discloses, through the spread groove of mounting panel bottom, install heat balance instrument on chemical industry equipment, absorb the produced heat of chemical industry equipment operation, through the bottom installation of a plurality of side boards to the locating lever, make supporting spring promote the heat insulating board apart from the mounting panel displacement, through the bottom installation of heat insulating board to the fin, avoid the fin at the radiating process and heat pipe contact, lead to the heat backward flow to reduce the radiating effect, through installing the connecting box at the top of fin, through a plurality of through-hole of connecting box one side to the top installation location of heat pipe shell.

2. The utility model discloses, locating hole through connecting box top both sides is to other chemical industry equipment erection location, and keep the use of heat balance instrument stable, through the inside rotatory pressfitting in a plurality of wainscots of sealed board bottom to the top of heat pipe tube, the connection that increases equipment beautifully spends and use strength, through the porous runner of internally mounted at the heat pipe tube, the embedded cell body inside through porous runner then has reduced the liquid reflux resistance, the permeability has been improved, the porous base member of sintering has further improved capillary pressure simultaneously, thereby improve the heat transfer performance of heat pipe by a wide margin.

3. The utility model discloses, through when other chemical industry equipment of top installation at the connecting box, the whole atress of connecting box, make fin and heat insulating board down, after the supporting spring shrink, make the top of heat pipe tube move down, make the top bottom contact heat-conducting plate of heat pipe tube, connect through heat-conducting plate and heat conduction groove, with heat direction fin, spacing groove through heat pipe tube bottom top and the pressing plate of heat insulating board bottom are connected, it is spacing to the bottom of heat pipe tube, avoid the bottom in use of heat pipe tube to break away from the range groove, cause the heat conduction effect that the skew influences equipment.

Drawings

Fig. 1 is a schematic perspective view of the structure of the present invention;

FIG. 2 is a schematic bottom view of the structure of the present invention;

FIG. 3 is a schematic perspective sectional view of the structure of the present invention;

fig. 4 is an enlarged schematic view of the structure of region a in fig. 3 according to the present invention.

Reference numerals are as follows: 1. mounting a plate; 2. connecting grooves; 3. a side board; 4. positioning a rod; 5. a support spring; 6. a heat insulation plate; 7. a heat sink; 8. a connecting box; 9. positioning holes; 10. sealing plates; 11. a waist panel; 12. a heat pipe shell; 13. a porous flow channel; 14. an embedded groove body; 15. a heat conducting plate; 16. a heat conducting groove; 17. a limiting groove; 18. a pressing plate; 19. arranging grooves; 20. and a through hole.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Example 1

Please refer to fig. 1-4, a chemical industry system thermal stress balancing unit based on heat pipe technique, including mounting panel 1, spread groove 2 has been seted up at mounting panel 1's lower surface middle part, mounting panel 1's bilateral symmetry fixedly connected with side board 3, the top fixedly connected with locating lever 4 of a plurality of side board 3, a plurality of side board 3 are located the outside fixedly connected with supporting spring 5 of locating lever 4, a plurality of supporting spring 5's top fixedly connected with heat insulating board 6, one side of heat insulating board 6 is run through on the top of a plurality of locating levers 4, the upper surface middle part fixedly connected with fin 7 of heat insulating board 6, the top fixedly connected with connecting box 8 of fin 7, through-hole 20 has been seted up to connecting box 8's bilateral symmetry, the inside laminating of a plurality of through-holes 20 is connected with heat pipe shell 12.

In this embodiment, spread groove 2 through 1 bottom of mounting panel, install heat balance instrument on chemical industry equipment, absorb the produced heat of chemical industry equipment operation, install the bottom of locating lever 4 through a plurality of side boards 3, make supporting spring 5 promote heat insulating board 6 apart from 1 migration distance of mounting panel, install the bottom of fin 7 through heat insulating board 6, avoid fin 7 at the radiating process and heat pipe contact, lead to the heat backward flow to reduce the radiating effect, through installing the top at fin 7 with connecting box 8, through a plurality of through-holes 20 of connecting box 8 one side to the top installation location of heat pipe shell 12.

Example 2

Referring to fig. 1-4, the present embodiment is further optimized on the basis of embodiment 1, specifically, positioning holes 9 are symmetrically formed on two sides of the top of the connection box 8, a sealing plate 10 is fixedly connected to the top of the connection box 8, and a waist plate 11 is attached to the bottom end of the sealing plate 10 at the top of the heat pipe shell 12.

Specifically, a plurality of heat pipe shells 12 are provided with a porous flow passage 13 inside, and the inner walls of the plurality of porous flow passages 13 are symmetrically provided with embedded groove bodies 14 having the same axial length as that of the porous flow passage 13.

In this embodiment, the positioning holes 9 on two sides of the top of the connection box 8 are used for installing and positioning other chemical equipment, and the use stability of a heat balance instrument is kept, the connection attractiveness and the use strength of the equipment are increased by rotationally pressing the top ends of the heat pipe shells 12 through the plurality of waist plates 11 at the bottoms of the sealing plates 10, the porous flow channels 13 are installed inside the heat pipe shells 12, the liquid backflow resistance is reduced through the embedded groove bodies 14 inside the porous flow channels 13, the permeability is improved, meanwhile, the capillary pressure is further improved by sintering the porous matrix, so that the heat transfer performance of the heat pipe is greatly improved, the porous flow channels 13 are specifically heat pipe liquid absorption cores, the porous pore structures of the porous flow channels 13 have high specific areas, the heat transfer area is remarkably increased, the liquid absorption cores of a large number of boiling cores can be remarkably enhanced, the reverse shearing effect of vapor flow in the heat pipe cavities on the liquid flow in the channels is effectively weakened through the liquid absorption cores of the heat pipe cavities, and the capillary flow heat transfer performance is greatly enhanced.

Example 3

Referring to fig. 1-4, the present embodiment is optimized based on the embodiment 1 or 2, specifically, the heat conducting plate 15 is fixedly connected to the bottoms of the plurality of through holes 20, the heat conducting grooves 16 are symmetrically formed on the top of the heat dissipating fin 7, and the interiors of the plurality of heat conducting grooves 16 are attached to the bottom of the heat conducting plate 15.

Specifically, the arrangement grooves 19 are symmetrically formed in the two sides of the top of the mounting plate 1, the plurality of arrangement grooves 19 are connected with the bottom end of the heat pipe shell 12 in an attached mode, and the limiting grooves 17 are formed in the tops of the bottom ends of the plurality of heat pipe shells 12.

Specifically, the two sides of the bottom of the heat insulation plate 6 are symmetrically and fixedly connected with pressing plates 18, and the bottoms of the pressing plates 18 are attached and connected with limiting grooves 17 at the top of the heat pipe shell 12.

In this embodiment, through when other chemical industry equipment are installed at the top of junction box 8, the whole atress of junction box 8, make fin 7 and heat insulating board 6 down, after supporting spring 5 shrink, make the top of heat pipe tube 12 move down, make the top bottom contact heat-conducting plate 15 of heat pipe tube 12, connect through heat-conducting plate 15 and heat-conducting groove 16, lead to heat fin 7, spacing groove 17 through heat pipe tube 12 bottom top and the pressboard 18 of heat insulating board 6 bottom are connected, it is spacing to the bottom of heat pipe tube 12, avoid the bottom in use of heat pipe tube 12 to break away from range groove 19, cause the heat conduction effect that the skew influences equipment.

In summary, the following steps: the utility model, through the connecting groove 2 at the bottom of the mounting plate 1, the heat balance instrument is mounted on the chemical equipment, the heat generated by the operation of the chemical equipment is absorbed, the heat insulation plate 6 is pushed to move away from the mounting plate 1 by the bottom mounting of the positioning rods 4 through the side plates 3, the heat insulation plate 6 is mounted at the bottom of the heat radiation plate 7, the heat radiation plate 7 is prevented from contacting with the heat pipe in the heat radiation process, the heat reflux is caused, the heat radiation effect is reduced, through mounting the connecting box 8 at the top of the heat radiation plate 7, the top mounting and positioning of the heat pipe shell 12 are realized through the through holes 20 at one side of the connecting box 8, the mounting and positioning of other chemical equipment are realized through the positioning holes 9 at the two sides of the top of the connecting box 8, the use stability of the heat balance instrument is kept, the connecting aesthetic degree and the use strength of the equipment are increased through the rotary pressing of the waist plates 11 at the bottom of the sealing plate 10 to the top of the heat pipe shell 12, by installing the porous flow channel 13 in the heat pipe shell 12, the liquid reflux resistance is reduced and the permeability is improved through the embedded groove body 14 in the porous flow channel 13, and simultaneously, the capillary pressure is further improved by sintering the porous matrix, thereby greatly improving the heat transfer performance of the heat pipe, when other chemical equipment is installed on the top of the connecting box 8, the connecting box 8 is integrally stressed to enable the radiating fins 7 and the heat insulation plate 6 to descend, after the supporting spring 5 contracts, the top end of the heat pipe shell 12 moves downwards, the bottom of the top end of the heat pipe shell 12 is contacted with the heat conduction plate 15, the heat conduction plate 15 is connected with the heat conduction groove 16, the heat is guided to the radiating fins 7, the heat is connected with the pressing plate 18 at the bottom of the heat pipe shell 12 through the limiting groove 17 at the top of the bottom end of the heat pipe shell 12, the bottom end of the heat pipe shell 12 is prevented from being separated from the arrangement groove 19 in use, causing the offset to affect the thermal conductivity of the device.

Above, only be the preferred embodiment of the present invention, not be used for limiting the present invention, the patent protection scope of the present invention is based on the claims, all the structural changes made by the content of the description and the drawings of the present invention are used, and the same principle should be included in the protection scope of the present invention.

Claims

1. The utility model provides a chemical industry system thermal stress balancing unit based on heat pipe technique, includes mounting panel (1), its characterized in that: spread groove (2) have been seted up at the lower surface middle part of mounting panel (1), the bilateral symmetry fixedly connected with side board (3) of mounting panel (1), it is a plurality of top fixedly connected with locating lever (4) of side board (3), it is a plurality of outside fixedly connected with supporting spring (5) that side board (3) are located locating lever (4), it is a plurality of top fixedly connected with heat insulating board (6) of supporting spring (5), it is a plurality of one side of heat insulating board (6) is run through on the top of locating lever (4), the upper surface middle part fixedly connected with fin (7) of heat insulating board (6).

2. The heat pipe technology-based chemical system thermal stress balancing apparatus of claim 1, wherein: the top fixedly connected with connecting box (8) of fin (7), locating hole (9) have been seted up to the top bilateral symmetry of connecting box (8).

3. The heat pipe technology-based chemical system thermal stress balancing apparatus of claim 2, wherein: through holes (20) are symmetrically formed in two sides of the connecting box (8), and a sealing plate (10) is fixedly connected to the top of the connecting box (8).

4. The heat pipe technology-based chemical system thermal stress balancing device of claim 3, wherein: a plurality of the through holes (20) are connected with a heat pipe shell (12) in an attaching mode, and the bottom end of the sealing plate (10) is located at the top of the heat pipe shell (12) in an attaching mode and is connected with a waist plate (11).

5. The heat pipe technology-based chemical system thermal stress balancing apparatus of claim 4, wherein: a plurality of porous runners (13) are arranged inside the heat pipe shells (12), and embedded groove bodies (14) with the same axial length as the porous runners (13) are symmetrically arranged on the inner walls of the plurality of porous runners (13).

6. The heat pipe technology-based chemical system thermal stress balancing device of claim 5, wherein: the bottom of the through holes (20) is fixedly connected with a heat conducting plate (15), the top of the radiating fin (7) is symmetrically provided with heat conducting grooves (16), and the insides of the heat conducting grooves (16) are connected with the bottom of the heat conducting plate (15) in an attaching mode.

7. The heat pipe technology-based chemical system thermal stress balancing device of claim 6, wherein: the top bilateral symmetry of mounting panel (1) has seted up arrangement groove (19), and is a plurality of the inside of arrangement groove (19) is connected with the bottom laminating of heat pipe shell (12), and is a plurality of spacing groove (17) have been seted up at the bottom top of heat pipe shell (12).

8. The heat pipe technology-based chemical system thermal stress balancing device of claim 7, wherein: the heat pipe comprises a heat insulation plate (6), wherein two sides of the bottom of the heat insulation plate (6) are symmetrically and fixedly connected with pressing plates (18), and the bottoms of the pressing plates (18) are in fit connection with limiting grooves (17) in the top of a heat pipe shell (12).