CN217693863U

CN217693863U - Mini and Micro backlight substrate pad structure

Info

Publication number: CN217693863U
Application number: CN202221114156.9U
Authority: CN
Inventors: 饶巍巍; 姜发明; 徐贤强
Original assignee: Shenzhen Australis Electronic Technology Co Ltd
Current assignee: Shenzhen Australis Electronic Technology Co Ltd
Priority date: 2022-05-10
Filing date: 2022-05-10
Publication date: 2022-10-28
Anticipated expiration: 2032-05-10

Abstract

The utility model discloses a Mini, micro base plate pad structure in a poor light, include: the circuit comprises a substrate, a plurality of welding pad groups arranged on the substrate and a grid circuit arranged around the welding pad groups and electrically connected with the welding pad groups; the pad group comprises a first pad and a second pad; one end of the first bonding pad, which is far away from the second bonding pad, is connected with the grid line, and one end of the second bonding pad, which is far away from the first bonding pad, is connected with the grid line; the width of the first pad and the second pad is the same as the width of the grid line. The utility model discloses a with the both ends of pad circuit design at the pad, and strict control circuit width dimension is unanimous with the pad width, and this base plate pad structure of being shaded can guarantee that the base plate pad size is unanimous after the shaping of windowing, and the printing tin cream volume of every pad at the paster in-process is the same for the paster straightness accuracy is less than 0.05mm, and rotation angle is less than 1, and the roughness is less than 0.05mm.

Description

Mini and Micro backlight substrate pad structure

Technical Field

The utility model relates to a liquid crystal display technology field especially relates to a Mini, micro base plate pad structure in a poor light.

Background

A pad structure of a conventional Mini, micro backlight substrate is shown in fig. 1, which includes pads of a plurality of chips, and is shown in fig. 2, wherein one circuit of one chip pad is above the pad, and the other circuit is right to the pad; one circuit of the other chip bonding pad is arranged at the left of the bonding pad, and the other circuit is arranged below the bonding pad; the connection circuit directions of each bonding pad are different, and the length and width of the bonding pad after windowing molding of the substrate are different, so that the problems of position deviation, rotation angle, high flatness and the like of the chip in the chip can be caused.

Therefore, the existing pad structure design of the Mini and Micro backlight substrates affects the problems of straightness, rotation angle, flatness, insufficient soldering, false soldering and the like of the chip, so that the luminous effect, brightness, uniformity and the like of a finished product are affected.

Accordingly, the prior art is yet to be improved and developed.

SUMMERY OF THE UTILITY MODEL

In view of the above-mentioned prior art not enough, the utility model aims at providing a Mini, micro base plate pad structure in a poor light aims at solving when using Mini/Micro base plate pad structure in a poor light among the prior art to carry out the paster, and offset, rotation angle and the great problem of roughness can appear to the chip.

The technical scheme of the utility model as follows:

a Mini, micro backlight substrate pad structure, comprising: the circuit comprises a substrate, a plurality of welding pad groups arranged on the substrate and a grid circuit arranged around the welding pad groups and electrically connected with the welding pad groups;

the bonding pad group comprises a first bonding pad and a second bonding pad; one end of the first bonding pad, which is far away from the second bonding pad, is connected with the grid line, and one end of the second bonding pad, which is far away from the first bonding pad, is connected with the grid line; the width of the first pad and the second pad is the same as the width of the grid line.

The pad structure of the Mini and Micro backlight substrate is characterized in that the grid lines comprise outer ring wires and inner connecting wires; the pad group is surrounded by the outer ring wire, and the inner connection wire connects the pad group with the outer ring wire surrounding the pad group.

In the Mini and Micro backlight substrate pad structure, every 4 pad groups form a Z-shaped structure, and the Z-shaped structures are arranged on the substrate in a matrix manner.

The Mini and Micro backlight substrate pad structure is characterized in that the first pad and the second pad are arranged in parallel in the transverse direction.

The Mini and Micro backlight substrate pad structure is characterized in that the pad groups are connected with each other through the internal connecting wires.

Mini, micro backlight base plate pad structure, wherein, the base plate includes that the follow is supreme sets gradually down hinders white film layer, first copper plate, substrate, second copper plate, second and hinders white film layer.

The Mini and Micro backlight substrate pad structure is characterized in that the first pad and the second pad are square in shape.

The Mini and Micro backlight substrate pad structure is characterized in that the first pad and the second pad are both 0.24mm in length and 0.23mm in width.

Has the advantages that: the utility model provides a Mini, micro base plate pad structure in a poor light, include: the circuit comprises a substrate, a plurality of pad groups arranged on the substrate and a grid circuit which is arranged around the pad groups and electrically connected with the pad groups; the pad group comprises a first pad and a second pad; one end of the first bonding pad, which is far away from the second bonding pad, is connected with the grid line, and one end of the second bonding pad, which is far away from the first bonding pad, is connected with the grid line; the width of the first pad and the second pad is the same as the width of the grid line. The utility model discloses a with the both ends of pad circuit design at the pad, and strict control circuit width dimension is unanimous with the pad width, this Mini, micro backlight substrate pad structure can guarantee that the base plate is unanimous at windowing shaping back pad size, the printing tin cream volume of every pad at the paster in-process is the same, make the paster straightness accuracy be less than 0.05mm, rotation angle is less than 1, the roughness is less than 0.05mm, thereby make off-the-shelf display effect good, homogeneity and luminance are high.

Drawings

FIG. 1 is a schematic diagram of a pad structure of a Mini and Micro backlight substrate in the prior art;

FIG. 2 is an enlarged view taken at A in FIG. 1;

FIG. 3 is a schematic diagram of the pad structure of the Mini and Micro backlight substrates of the present invention;

FIG. 4 is an enlarged view of FIG. 3 at B;

FIG. 5 is a schematic view of the structure of the base plate of the present invention;

description of the reference numerals: the circuit board comprises a substrate 10, a pad group 20, a grid line 30, a first pad 201, a second pad 202, an outer ring lead 301, an inner connecting lead 302, a first solder mask blank film layer 101, a first copper plating layer 102, a base material 103, a second copper plating layer 104 and a second solder mask blank film layer 105.

Detailed Description

The utility model provides a Mini, micro base plate pad structure in a poor light, for making the utility model discloses a purpose, technical scheme and effect are clearer, clear and definite, and is following right the utility model discloses further detailed description. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

In the embodiments and claims, the articles "a", "an", "the" and "the" may include plural forms as well, unless the context specifically dictates otherwise. If there is a description relating to "first", "second", etc. in the embodiments of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature.

It will be further understood that the terms "comprises" and/or "comprising," when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof. It will be understood that when an element is referred to as being "connected" or "coupled" to another element, it can be directly connected or coupled to the other element or intervening elements may also be present. Further, "connected" or "coupled" as used herein may include wirelessly connected or wirelessly coupled. As used herein, the term "and/or" includes all or any element and all combinations of one or more of the associated listed items.

It will be understood by those within the art that, unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the prior art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

In the prior art, as shown in fig. 1, the width of the line connected to the pad is smaller than the width of the pad, and as shown in fig. 2, one line is above the pad and the other line is to the right of the pad of one chip; one circuit is arranged at the left side of the bonding pad of the other chip, and the other circuit is arranged below the bonding pad; make every pad interconnecting link direction different, the base plate is after the shaping of windowing, and the length and width size of pad is also different, finally leads to chip position excursion, rotation angle and roughness scheduling problem to appear in the paster.

Based on this, as shown in fig. 3, the utility model provides a Mini, micro base plate pad structure in a poor light, include: a substrate 10, a plurality of pad groups 20 disposed on the substrate 10, and a grid line 30 disposed around the pad groups 20 and electrically connected to the pad groups 20; also, the pad group 20 includes a first pad 201 and a second pad 202; one end of the first pad 201, which is far away from the second pad 202, is connected with the grid line 30, and one end of the second pad 202, which is far away from the first pad 201, is connected with the grid line 30; the width of the first pad 201 and the second pad 202 is the same as the width of the mesh line 30.

The utility model discloses a set up the grid circuit at the both ends of pad to and guarantee that the width of pad is unanimous with the width size of grid circuit, can guarantee that the base plate is after the shaping of windowing, the size of pad is homogeneous, and in the paster in-process, the printing tin cream volume can keep equal, avoids chip position offset, rotation angle and the great problem of roughness to take place in the paster in-process; through verifying, the utility model discloses a Mini, micro base plate pad structure in a poor light can be controlled the straightness accuracy within 0.05mm when the paster, and rotation angle control is within 1, and the roughness is less than 0.05mm.

In some embodiments, the mesh circuitry 30 includes outer loop wires 301 and inner connection wires 302; the pad group 20 is surrounded by the outer ring conductive line 301, and the inner connection conductive line 302 connects the pad group 20 with the outer ring conductive line surrounding the pad group. That is, one end of the inner connecting wire 302 is connected to a pad, and the other end is connected to the outer ring wire 301. And, the inner connection wires are connected between the pads and the outer ring wires through respective different directions. After the bonding pad is subjected to surface mounting, a complete path can be formed on the Mini and Micro backlight substrates.

Because the area of the bonding pad is fixed and unchanged, and the area of the pin of the chip is also fixed, when the chip is welded on the bonding pad, if the chip is displaced, rotated or uneven, the contact area between the chip and the bonding pad is small, and the luminous effect, brightness, uniformity and the like of a finished product are further influenced; the utility model discloses a circuit setting that will be connected with the pad is at the both ends of pad (promptly first pad 201 deviates from the one end of second pad 202 with grid line 30 is connected, second pad 202 deviates from the one end of first pad 201 with grid line 30 is connected to and guarantee that the pad width equals with the line width, make the chip weld with the pad accurately, all fall to minimum with straightness accuracy, rotation angle and roughness, thereby make off-the-shelf display effect good, homogeneity and luminance height.

In some embodiments, every 4 of the pad groups form a "Z" shaped structure, and the "Z" shaped structures are arranged on the substrate in a matrix manner. Specifically, every 4 bonding pad groups and the internal connecting lead form a Z-shaped structure, and the bonding pad groups are arranged on the substrate by utilizing the Z-shaped structure and a matrix arrangement mode, so that the material of grid lines can be saved to the greatest extent, and the cost is saved; and the arrangement of the welding pad groups is well ordered, thereby being beneficial to automatic production.

In some embodiments, as shown in fig. 4, the first pad 201 is juxtaposed with the second pad 202 in a lateral direction; the first pad 201 and the second pad 202 are arranged at intervals; namely, a gap is left between the first pad 201 and the second pad 202, and the first pad and the second pad are not in a conducting state.

In some embodiments, the pad groups are connected to each other through the interconnection wires 302. Except for the gap between the first bonding pad and the second bonding pad, the bonding pad groups are connected through the gap of the internal connecting wire and finally connected to the outer ring wire 301, so that after the bonding, the backlight substrate forms a complete conductive path.

In some embodiments, as shown in fig. 5, the substrate 10 includes a first solder mask blank film layer 101, a first copper plating layer 102, a base material 103, a second copper plating layer 104, and a second solder mask blank film layer 105, which are sequentially disposed from bottom to top. The pad group can be arranged on the first solder mask white film layer or the second solder mask white film layer.

In some embodiments, the first and second pads are square in shape; in a preferred embodiment, the first pad and the second pad have a rectangular outer shape. The pad chooses for use rectangular shape, can be so that the area of contact between chip and the pad is great, improves the welded steadiness of chip and pad to can avoid the emergence of chip offset and chip position rotation.

In some embodiments, the first and second pads are each 0.24mm long and 0.23mm wide.

To sum up, the utility model provides a Mini, micro base plate pad structure in a poor light, include: the circuit comprises a substrate, a plurality of welding pad groups arranged on the substrate and a grid circuit arranged around the welding pad groups and electrically connected with the welding pad groups; the pad group comprises a first pad and a second pad; one end of the first bonding pad, which is far away from the second bonding pad, is connected with the grid line, and one end of the second bonding pad, which is far away from the first bonding pad, is connected with the grid line; the width of the first pad and the second pad is the same as the width of the grid line. The utility model discloses a with the both ends of pad circuit design at the pad, and strict control circuit width dimension is unanimous with the pad width, this Mini, micro base plate pad structure in a poor light can guarantee that the base plate is unanimous at windowing shaping back pad size, the printing tin cream volume at every pad of paster in-process is the same, make the paster straightness accuracy be less than 0.05mm, rotation angle is less than 1, the roughness is less than 0.05mm, thereby make off-the-shelf display effect good, homogeneity and luminance are high.

It is to be understood that the invention is not limited to the above-described embodiments, and that modifications and variations may be made by those skilled in the art in light of the above teachings, and all such modifications and variations are intended to be included within the scope of the invention as defined in the appended claims.

Claims

1. The utility model provides a Mini, micro base plate pad structure in a poor light which characterized in that includes: the circuit comprises a substrate, a plurality of pad groups arranged on the substrate and a grid circuit which is arranged around the pad groups and electrically connected with the pad groups;

2. The Mini, micro backlight substrate pad structure of claim 1, wherein the grid wires comprise outer ring wires and inner connecting wires; the pad group is surrounded by the outer ring conductive lines, and the inner connection conductive lines connect the pad group with the outer ring conductive lines surrounding the pad group.

3. The Mini, micro backlight substrate pad structure of claim 1, wherein every 4 pad groups form a "Z" shaped structure, and the "Z" shaped structures are arranged on the substrate in a matrix.

4. The Mini, micro backlight substrate pad structure of claim 1, wherein the first pads and the second pads are juxtaposed in a lateral direction.

5. The Mini, micro backlight substrate pad structure of claim 2, wherein the pad groups are connected to each other through the interconnection wires.

6. The Mini, micro backlight substrate pad structure of claim 1, wherein the substrate comprises a first solder mask white film layer, a first copper plating layer, a base material, a second copper plating layer, and a second solder mask white film layer, which are sequentially disposed from bottom to top.

7. The Mini, micro backlight substrate pad structure of claim 1, wherein the first pad and the second pad have a square shape.

8. The Mini, micro backlight substrate pad structure of claim 7, wherein the first pad and the second pad are both 0.24mm long and 0.23mm wide.