CN217692001U

CN217692001U - Data interface conversion strengthening power supply device

Info

Publication number: CN217692001U
Application number: CN202221478446.1U
Authority: CN
Inventors: 蔡一鸣
Original assignee: Individual
Current assignee: Individual
Priority date: 2022-06-14
Filing date: 2022-06-14
Publication date: 2022-10-28
Anticipated expiration: 2032-06-14

Abstract

The utility model discloses a power supply unit is strengthened in data interface conversion, including lower casing, the forehead top joint of casing is fixed with the casing down, the inside of going up the casing is fixed with steady voltage power supply controller through the buckle, steady voltage power supply controller is connected with female seat of two at least USB interfaces, female seat of at least one power supply and at least one data public first plug, female seat of USB interface, the female seat of power supply and the public first plug of data are fixed around last casing, the internally mounted of casing has the heat radiation module with steady voltage power supply controller contact down. The utility model discloses a steady voltage power supply controller controls, can realize when more high-power equipment uses or long distance data transmission, carries out the electric energy compensation, does not have the mutual influence, realizes normal use to the electronic equipment of different power supply demands, and can accurate adaptation only support USB 1. X2.0 primary agreement's partial professional equipment.

Description

Data interface conversion strengthening power supply device

Technical Field

The utility model relates to an electronic equipment technical field specifically is a power supply unit is strengthened in data interface conversion.

Background

Along with the rapid popularization of electronic equipment, the power supply requirements of different electronic equipment are different and obviously different, in order to improve the connection compatibility of the electronic equipment with different power supply requirements and ensure the use stability, a data interface conversion strengthening power supply device is appeared, and the electronic equipment with different power supply requirements can be normally used through the device.

The technical defects of the existing strengthening power supply device on the market are as follows:

the interface compatibility is insufficient, and partial professional equipment which only supports the USB 1, X/2.0 native protocol cannot be accurately adapted under the condition of a system native system. Therefore, it is necessary to design a data interface conversion enhancement power supply device.

SUMMERY OF THE UTILITY MODEL

To the above situation, for overcoming prior art's defect, the utility model provides a power supply unit is strengthened in data interface conversion, the utility model discloses a steady voltage power supply controller controls, can realize when great power equipment uses or long distance data transmission, carries out the electric energy compensation, does not have the influence each other, realizes normal use to the electronic equipment of different power supply demands, and can accurate adaptation only support USB 1. The partial professional equipment of X2.0 primary agreement.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a power supply unit is strengthened in data interface conversion, includes casing down, the forehead top joint of casing is fixed with the casing down, the inside of going up the casing is fixed with steady voltage power supply controller through the buckle, steady voltage power supply controller is connected with female seat of two at least USB interfaces, female seat of at least one power supply and at least one data public first plug, female seat of USB interface, the female seat of power supply and data public first plug are fixed around last casing, the internally mounted of casing has the heat radiation module with steady voltage power supply controller contact down.

Preferably, the heat dissipation module comprises heat dissipation holes, a heat conduction silica gel layer, heat conduction fins, heat dissipation fins and a mounting rack;

the heat dissipation device comprises a lower shell, heat dissipation fins, a heat conduction sheet, a voltage stabilization power supply controller and a heat dissipation hole, wherein the heat dissipation fins are fixed inside the lower shell through a mounting rack, the heat conduction sheet is installed at the tops of the heat dissipation fins and is in contact with the voltage stabilization power supply controller through a heat conduction silica gel layer, and the heat dissipation holes are formed in the periphery of the lower shell and are opposite to the corresponding heat dissipation fins.

Preferably, the inner wall of the bottom of the lower shell is provided with a semiconductor refrigeration piece which is in contact with the bottom of the radiating fin, and the voltage-stabilizing power supply controller is provided with a temperature control switch which is electrically connected with the semiconductor refrigeration piece.

Preferably, the lower shell is fixed on the bottom plate, a hook plate is integrally formed on the side edge of the bottom plate, an internal thread hole is formed in the side edge of the hook plate, and a jacking screw is screwed and fixed on the internal thread hole.

Preferably, the data male header plug comprises one or more of a USB 1.X/2.0 9Pin protocol data input male header.

Preferably, the USB interface female socket comprises one or more of USB 1.X/2.0 protocol data output female sockets.

The utility model has the advantages that:

1. the voltage-stabilizing power supply controller is used for controlling, so that electric energy compensation can be carried out when high-power equipment is used or long-distance data transmission is carried out, mutual influence does not exist, normal use of electronic equipment with different power supply requirements is realized, and the voltage-stabilizing power supply controller can be accurately matched with part of professional equipment only supporting a USB 1, X/2.0 native protocol;

2. the heat generated in the working process of the voltage-stabilizing power supply controller is absorbed by the heat-conducting silica gel layer and the heat-conducting fins, transmitted to the heat-radiating fins and dissipated to the external environment through the heat-radiating fins and the heat-radiating holes, so that the heat-radiating performance is improved;

3. when the heat dissipation performance of the heat dissipation holes, the heat conduction silica gel layer, the heat conduction fins and the heat dissipation fins is insufficient, the temperature of the voltage-stabilizing power supply controller rises, and when the starting temperature of the temperature control switch is reached, the semiconductor refrigeration piece refrigerates to perform auxiliary heat dissipation on the heat dissipation fins, so that the heat dissipation performance is further improved;

4. the hook plate is clamped inside the computer, and the jacking screw is used for screwing, so that the compatibility stability of the use environment is improved.

Drawings

The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention, and together with the description serve to explain the invention and not to limit the invention. In the drawings:

FIG. 1 is a schematic view of the overall three-dimensional structure of the present invention;

FIG. 2 is a schematic view of the cross-sectional plane structure of the lower and upper shells of the present invention;

fig. 3 is a schematic diagram of the planar structure of the voltage-stabilizing power supply controller of the present invention;

the reference numbers in the figures: 1. a lower housing; 2. an upper housing; 3. a USB interface female seat; 4. heat dissipation holes; 5. a base plate; 6. a hook plate; 7. an internally threaded bore; 8. jacking the screw tightly; 9. a voltage-stabilizing power supply controller; 10. buckling; 11. a temperature control switch; 12. a heat conductive silica gel layer; 13. a heat conductive sheet; 14. heat dissipation fins; 15. a mounting frame; 16. a semiconductor refrigeration sheet; 17. a power supply female seat; 18. data male plug.

Detailed Description

In the following, only certain exemplary embodiments are briefly described. As those skilled in the art will recognize, the described embodiments may be modified in various different ways, all without departing from the spirit or scope of the present invention. Accordingly, the drawings and description are to be regarded as illustrative in nature, and not as restrictive.

In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first", "second", "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature.

The technical solution of the present invention will be clearly and completely described with reference to the accompanying drawings.

Example one

Given by fig. 1, fig. 2 and fig. 3, the utility model provides the following technical solutions: a data interface conversion strengthening power supply device comprises a lower shell 1, an upper shell 2 is fixed on the forehead top of the lower shell 1 in a clamping mode, a voltage-stabilizing power supply controller 9 is fixed inside the upper shell 2 through a buckle 10, the voltage-stabilizing power supply controller 9 is connected with at least two USB interface female seats 3, at least one power supply female seat 17 and at least one data male plug 18, the USB interface female seats 3, the power supply female seats 17 and the data male plug 18 are fixed on the periphery of the upper shell 2, a heat dissipation module in contact with the voltage-stabilizing power supply controller 9 is installed inside the lower shell 1, the data male plug 18 is used for data input, the USB interface female seats 3 are used for data output and are controlled through the voltage-stabilizing power supply controller 9, electric energy compensation can be achieved when high-power equipment is used or long-distance data transmission is achieved, mutual influence does not exist, normal use of electronic equipment with different power supply requirements is achieved, and the electronic equipment can be accurately matched with partial professional equipment only supporting the USB 1, X/2.0 protocol.

Preferably, the data male header plug 18 comprises one or more of a USB 1.X/2.0 9Pin protocol data input male header.

Preferably, the USB interface female socket 3 comprises one or more of USB 1.X/2.0 protocol data output female sockets.

Example two

Referring to fig. 1 and 2, as another preferred embodiment, the difference from the first embodiment is that the heat dissipation module includes a heat dissipation hole 4, a thermal conductive silica gel layer 12, a heat conducting sheet 13, a heat dissipation fin 14 and a mounting rack 15, the heat dissipation fin 14 is fixed inside the lower housing 1 through the mounting rack 15, the heat conducting sheet 13 is installed on the top of the heat dissipation fin 14, the heat conducting sheet 13 contacts with the voltage-stabilizing power supply controller 9 through the thermal conductive silica gel layer 12, the heat dissipation hole 4 is opened around the lower housing 1 opposite to the heat dissipation fin 14, heat generated in the working process of the voltage-stabilizing power supply controller 9 is absorbed through the thermal conductive silica gel layer 12 and the heat conducting sheet 13 and transmitted to the heat dissipation fin 14, and is dissipated to the external environment through the heat dissipation fin 14 and the heat dissipation hole 4, thereby enhancing the heat dissipation performance.

EXAMPLE III

Referring to fig. 2, as another preferred embodiment, the difference from the first embodiment is that a semiconductor cooling plate 16 contacting with the bottom of the heat dissipation fin 14 is installed on the inner wall of the bottom of the lower casing 1, a temperature control switch 11 electrically connected with the semiconductor cooling plate 16 is installed on the voltage-stabilizing power supply controller 9, when the heat dissipation performance of the heat dissipation hole 4, the heat-conducting silica gel layer 12, the heat conduction plate 13 and the heat dissipation fin 14 is insufficient, the temperature of the voltage-stabilizing power supply controller 9 will rise, and when the starting temperature of the temperature control switch 11 is reached, the semiconductor cooling plate 16 cools to assist in heat dissipation of the heat dissipation fin 14, so as to further improve the heat dissipation performance.

Example four

Referring to fig. 1, as another preferred embodiment, the difference from the first embodiment is that the lower case 1 is fixed on a bottom plate 5, a hook plate 6 is integrally formed at a side edge of the bottom plate 5, an internal thread hole 7 is formed at a side edge of the hook plate 6, a tightening screw 8 is screwed and fixed on the internal thread hole 7, the hook plate 6 is clamped inside a computer, and the tightening screw 8 is used for tightening, so that the compatibility and stability of the use environment are improved.

The working principle is as follows:

the male plug 18 of the data is used for data input, the female seat 3 of the USB interface is used for data output, control through the voltage-stabilizing power supply controller 9, can realize when the high-power apparatus uses or long distance data transmission, carry on the electric energy compensation, there is not mutual influence, realize the normal use to the electronic device of different power supply demands, and can only support some professional equipments of the native agreement of USB 1.X/2.0 accurately.

Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described in the foregoing embodiments, or equivalents may be substituted for elements thereof. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. The utility model provides a power supply unit is strengthened in data interface conversion, includes casing (1) down, the forehead top joint of casing (1) is fixed with casing (2), its characterized in that down: go up the inside of casing (2) and be fixed with steady voltage power supply controller (9) through buckle (10), steady voltage power supply controller (9) are connected with female seat (3) of two at least USB interfaces, female seat (17) of at least one power supply and at least one data public first plug (18), female seat (3) of USB interface, female seat (17) of power supply and data public first plug (18) are fixed around last casing (2), the internally mounted of casing (1) has the heat radiation module with steady voltage power supply controller (9) contact down.

2. A data interface conversion boost power supply apparatus according to claim 1, wherein: the heat dissipation module comprises heat dissipation holes (4), a heat conduction silica gel layer (12), heat conduction fins (13), heat dissipation fins (14) and a mounting frame (15);

the heat dissipation device is characterized in that the heat dissipation fins (14) are fixed inside the lower shell (1) through a mounting frame (15), heat conducting fins (13) are installed at the tops of the heat dissipation fins (14), the heat conducting fins (13) are in contact with the voltage stabilization power supply controller (9) through a heat conducting silica gel layer (12), and heat dissipation holes (4) are formed in the periphery of the lower shell (1) and are right corresponding to the heat dissipation fins (14).

3. A data interface conversion enhancement power supply apparatus according to claim 2, wherein: the semiconductor refrigeration piece (16) which is in contact with the bottom of the heat dissipation fin (14) is installed on the inner wall of the bottom of the lower shell (1), and the temperature control switch (11) which is electrically connected with the semiconductor refrigeration piece (16) is installed on the voltage-stabilizing power supply controller (9).

4. A data interface conversion boost power supply apparatus according to claim 1, wherein: the lower shell (1) is fixed on the bottom plate (5), a hook plate (6) is integrally formed on the side edge of the bottom plate (5), an internal thread hole (7) is formed in the side edge of the hook plate (6), and a jacking screw (8) is screwed and fixed on the internal thread hole (7).

5. A data interface conversion boost power supply apparatus according to claim 1, wherein: the data male header plug (18) comprises one or more of USB 1.X/2.0 9Pin protocol data input male headers.

6. A data interface conversion boost power supply apparatus according to claim 1, wherein: the USB interface female socket (3) comprises one or more of a USB 1.X/2.0 protocol data output female socket.