CN217691106U - Accurate positioning device for wafer - Google Patents
Accurate positioning device for wafer Download PDFInfo
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- CN217691106U CN217691106U CN202220693437.8U CN202220693437U CN217691106U CN 217691106 U CN217691106 U CN 217691106U CN 202220693437 U CN202220693437 U CN 202220693437U CN 217691106 U CN217691106 U CN 217691106U
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- fine adjustment
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Abstract
The utility model relates to the technical field of chemical mechanical polishing, in particular to a wafer accurate positioning device, which comprises a placing mechanism, a first driving cylinder, a retaining ring and a back membrane, wherein the placing mechanism is fixedly connected with the first driving cylinder and is positioned at the output end of the first driving cylinder, and the back membrane is arranged at the lower end of the retaining ring and also comprises a fine adjustment mechanism; the fine adjustment mechanism comprises first springs, a placing cavity, a bottom plate, a support, a second driving cylinder, a first fine adjustment ring and a second fine adjustment ring, each first spring is fixedly connected with the placing cavity, the bottom plate is fixedly connected with the plurality of first springs, the first fine adjustment ring is fixedly connected with the bottom plate, the placing mechanism is fixedly connected with the first driving cylinder, the second fine adjustment ring is fixedly connected with a retaining ring, and the first fine adjustment ring is matched with the second fine adjustment ring. Through the arrangement of the structure, the precision reduction of the positioning device can be reduced, so that the wafer is not easy to clamp and damage in the positioning process.
Description
Technical Field
The utility model relates to a chemical mechanical polishing technical field especially relates to a wafer accurate positioning device.
Background
At present, a wafer refers to a silicon wafer for manufacturing a silicon semiconductor, and during the chemical polishing process of the wafer, the wafer is easy to shake, so that the positioning is not accurate, and the subsequent wafer is easy to damage or be polluted.
In the prior art, the wafer is clamped by the spring and the limiting block, and then the wafer carrying table is moved upwards until the wafer is contacted with the back film on the retaining ring.
In the prior art, the wafer is limited by the limit block, so that the wafer is not easily damaged, but the slide holder can be loosened in the long-time use process, so that the slide holder is not accurate enough in contact with the retaining ring, and the slide holder and the retaining ring are easily misplaced to cause the wafer damage.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a wafer accurate positioning device has solved the long-time use of slide holder, and the precision reduces, leads to the wafer to be damaged by the centre gripping easily problem.
In order to achieve the above purpose, the present invention provides a wafer precise positioning device, which comprises a placing mechanism, a first driving cylinder, a retaining ring and a back membrane, wherein the placing mechanism is fixedly connected with the first driving cylinder and is located at the output end of the first driving cylinder, the retaining ring is arranged above the placing mechanism, the back membrane is arranged at the lower end of the retaining ring,
the device also comprises a fine adjustment mechanism;
fine setting mechanism includes first spring, places chamber, bottom plate, support, first fine setting ring and second fine setting ring, the quantity of first spring is many, every first spring respectively with place chamber fixed connection, and be located place the inside in chamber, bottom plate and many first spring fixed connection, and many first spring all is located the exterior wall of bottom plate, first actuating cylinder that drives set up in the inside of bottom plate, just the output of first actuating cylinder runs through the bottom plate, first fine setting ring with bottom plate fixed connection, and be located the top of bottom plate, place the mechanism with first actuating cylinder fixed connection that drives, and be located the first output that drives actuating cylinder, place the mechanism be located the inside of first fine setting ring, just place the mechanism with first fine setting ring sliding connection, the support set up in place one side in chamber, the retaining ring set up in the below of support, and the notacoria set up in the inside of retaining ring, the second fine setting ring with retaining ring fixed connection, and be located the below of retaining ring, and the second fine setting ring in the adaptation of fine setting ring each other in the actuating cylinder.
The fine adjustment mechanism further comprises an adjusting component, the support is fixedly connected with the adjusting component and located above the adjusting component, and the adjusting component is arranged on one side of the placing cavity.
The adjusting assembly comprises a fixing column, adjusting columns and side strips, the fixing column is arranged on one side of the placing cavity, the adjusting columns are connected with the fixing column in a sliding mode, the adjusting columns are located in the fixing column, the number of the side strips is two, and the side strips are respectively fixedly connected with the adjusting columns and are respectively located on the outer surface wall of the adjusting columns.
The adjusting assembly further comprises a limiting plate, the limiting plate is fixedly connected with the adjusting column and located at the lower end of the adjusting column, and the limiting plate is located inside the fixing column.
The accurate wafer positioning device further comprises a direction adjusting mechanism.
Wherein, direction adjustment mechanism includes base plate, adjustment tank, lead screw, first driving motor and horizontal adjusting part, the fixed column with base plate fixed connection, and be located the top of base plate, the adjustment tank with base plate fixed connection, and be located the top of base plate, the lead screw with the adjustment tank rotates to be connected, and is located the inside of adjustment tank, first driving motor set up in one side of adjustment tank, just first driving motor's output runs through the adjustment tank and with lead screw fixed connection, horizontal adjusting part with lead screw threaded connection, horizontal adjusting part cover is located the exterior wall of lead screw, just horizontal adjusting part is located the top of adjustment tank, place the chamber set up in horizontal adjusting part's top.
Wherein, the horizontal adjusting part includes sliding tray, second driving motor, threaded rod and slider, the sliding tray with lead screw threaded connection to the cover is located the exterior wall of lead screw, the both ends of threaded rod respectively with the sliding tray rotates to be connected, and is located the inside of sliding tray, second driving motor set up in one side of sliding tray, just second driving motor's output runs through the sliding tray and with threaded rod fixed connection, the slider with threaded rod threaded connection, and the cover is located the exterior wall of threaded rod, place the chamber with slider fixed connection, and be located the top of slider.
Wherein, placing the mechanism and including second spring, stopper and slide glass board, the slide glass board with the first output fixed connection who drives actuating cylinder, and be located the first top that drives actuating cylinder, the slide glass board has three recess, the second spring with the quantity of stopper is three, every the second spring set up respectively in corresponding the inside of recess, every the stopper respectively with correspond the one end fixed connection of second spring, and be located respectively corresponding the inside of recess.
The utility model discloses a wafer accurate positioning device, through place the wafer place the top of placement mechanism, and pass through actuating mechanism is right placement mechanism goes up and down for the wafer passes through the retaining ring with the notacoria is held to the card, it is right to drive actuating cylinder through starting the second upwards carry out the jacking to the bottom plate, make first fine setting ring with second fine setting ring is adjusted as the benchmark, and the card is held in the inside of second fine setting ring, the setting of first spring can be right the bottom plate supports, is in simultaneously can remove to arbitrary direction when the bottom plate is adjusted, reaches the purpose of fine setting, and the setting of above structure can pass through first fine setting ring with adaptation between the second fine setting ring reaches the purpose that the fine setting is carried out in the time for in long-time use, also can be accurate fix a position the wafer.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a first embodiment of the present invention.
Fig. 2 is a plan view of a first embodiment of the present invention.
Fig. 3 isbase:Sub>A sectional view of thebase:Sub>A-base:Sub>A line structure of fig. 2 according to the present invention.
Fig. 4 is a cross-sectional view of the B-B line structure of fig. 2 according to the present invention.
Fig. 5 is a schematic structural diagram of a second embodiment of the present invention.
Fig. 6 is a plan view of a second embodiment of the present invention.
Fig. 7 isbase:Sub>A cross-sectional view of thebase:Sub>A-base:Sub>A line structure of fig. 6 according to the present invention.
Fig. 8 is a cross-sectional view of the B-B line structure of fig. 6 according to the present invention.
101-placing mechanism, 102-first driving cylinder, 103-retaining ring, 104-back membrane, 105-fine adjustment mechanism, 106-first spring, 107-placing cavity, 108-bottom plate, 109-bracket, 110-second driving cylinder, 111-first fine adjustment ring, 112-second fine adjustment ring, 113-adjustment assembly, 114-fixed column, 115-adjustment column, 116-lateral strip, 117-limit plate, 118-second spring, 119-limit block, 120-slide plate, 121-groove, 201-direction adjustment mechanism, 202-base plate, 203-adjustment groove, 204-lead screw, 205-first driving motor, 206-transverse adjustment assembly, 207-sliding groove, 208-second driving motor, 209-threaded rod and 210-sliding block.
Detailed Description
Reference will now be made in detail to the embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the drawings are exemplary and intended to be used for explaining the present invention, and should not be construed as limiting the present invention.
The first embodiment of the present application is:
referring to fig. 1 to 4, the device includes a placement mechanism 101, a first driving cylinder 102, a retaining ring 103, and a back membrane 104, where the placement mechanism 101 is fixedly connected to the first driving cylinder 102 and located at an output end of the first driving cylinder 102, the retaining ring 103 is disposed above the placement mechanism 101, the back membrane 104 is disposed at a lower end of the retaining ring 103, and the device further includes a fine adjustment mechanism 105; the fine adjustment mechanism 105 includes a first spring 106, a placement cavity 107, a bottom plate 108, a support 109, a second driving cylinder 110, a first fine adjustment ring 111 and a second fine adjustment ring 112, the number of the first springs 106 is multiple, each first spring 106 is respectively and fixedly connected to the placement cavity 107 and located inside the placement cavity 107, the bottom plate 108 is fixedly connected to the multiple first springs 106, and the multiple first springs 106 are located on an outer surface wall of the bottom plate 108, the first driving cylinder 102 is disposed inside the bottom plate 108, an output end of the first driving cylinder 102 penetrates through the bottom plate 108, the first fine adjustment ring 111 is fixedly connected to the bottom plate 108 and located above the bottom plate 108, the placement mechanism 101 is fixedly connected to the first driving cylinder 102 and located at an output end of the first driving cylinder 102, the placement mechanism 101 is located inside the first fine adjustment ring 111, the placement mechanism 101 is slidably connected to the first fine adjustment ring 111, the fine adjustment support 109 is disposed on one side of the placement cavity 107, the support 103 is disposed below the holding ring 103, the holding ring 103 is disposed inside the holding ring 103, and the second fine adjustment ring 103 is disposed below the holding ring 103, and the holding ring 103 is connected to the holding ring 103, and the second fine adjustment ring 103, and the holding ring 103 is disposed below the holding ring 103, and the fine adjustment ring 112 is disposed below the holding ring 103.
The fine adjustment mechanism 105 further comprises an adjustment assembly 113, the support 109 is fixedly connected with the adjustment assembly 113 and is located above the adjustment assembly 113, and the adjustment assembly 113 is arranged on one side of the placement cavity 107.
The adjusting assembly 113 comprises a fixed column 114, adjusting columns 115 and side strips 116, the fixed column 114 is arranged on one side of the placing cavity 107, the adjusting columns 115 are connected with the fixed column 114 in a sliding mode, the adjusting columns 115 are located inside the fixed column 114, the number of the side strips 116 is two, and the two side strips 116 are respectively fixedly connected with the adjusting columns 115 and are respectively located on the outer surface wall of the adjusting columns 115.
The adjusting assembly 113 further includes a limiting plate 117, the limiting plate 117 is fixedly connected to the adjusting column 115 and located at a lower end of the adjusting column 115, and the limiting plate 117 is located inside the fixing column 114.
The placing mechanism 101 comprises a second spring 118, a limiting block 119 and a slide plate 120, the slide plate 120 is fixedly connected with the output end of the first driving cylinder 102 and is located above the first driving cylinder 102, the slide plate 120 is provided with three grooves 121, the second spring 118 is three and the limiting block 119 is arranged in the grooves 121, and each of the second spring 118 is arranged in the corresponding groove 121 and is located in the corresponding groove 121.
When the wafer is used, a wafer is placed above the placing mechanism 101, the wafer is fixed through the limiting block 119, the second spring 118 is arranged to adjust the limiting block 119, the retaining ring 103, the back membrane 104 and the second fine adjustment ring 112 are supported and fixed through the support 109, after the wafer is placed, the second driving cylinder 110 is started to extend upwards, so that the output end of the second driving cylinder 110 pushes the bottom plate 108 to move upwards, the first fine adjustment ring 111 is in contact with the second fine adjustment ring 112, the bottom plate 108 is finely adjusted through the cooperation of the first spring 106, after the bottom plate 108 is adjusted in place, the first driving cylinder 102 is lifted to push the wafer carrying plate 120 to move upwards, the wafer is fixed through the retaining ring 103 and the back membrane 104, the placing cavity 107 fixes the first spring 106, the adjusting mechanism can adjust the height of the support 109, the adjusting column 115 moves inside the fixed column 114, the side column 116 can move inside the fixed column 114, the side column 116 can be separated from the adjusting mechanism, the wafer can be prevented from being clamped by the adjusting column 116, the adjusting mechanism can be used for a long time, and the wafer can be prevented from being damaged easily when the adjusting mechanism is used, and the wafer is arranged in a long time, and the wafer can be used, and the wafer can be prevented from being damaged easily.
The second embodiment of the present application is:
referring to fig. 5 to 8, based on the first embodiment, the apparatus for accurately positioning a wafer of the present embodiment further includes a direction adjustment mechanism 201.
The direction adjusting mechanism 201 comprises a substrate 202, an adjusting groove 203, a screw rod 204, a first driving motor 205 and a transverse adjusting assembly 206, the fixing column 114 is fixedly connected with the substrate 202 and is located above the substrate 202, the adjusting groove 203 is fixedly connected with the substrate 202 and is located above the substrate 202, the screw rod 204 is rotatably connected with the adjusting groove 203 and is located inside the adjusting groove, the first driving motor 205 is arranged on one side of the adjusting groove 203, an output end of the first driving motor 205 penetrates through the adjusting groove and is fixedly connected with the screw rod 204, the transverse adjusting assembly 206 is in threaded connection with the screw rod 204, the transverse adjusting assembly 206 is sleeved on an outer wall of the screw rod 204, the transverse adjusting assembly 206 is located above the adjusting groove 203, and the placing cavity 107 is arranged above the transverse adjusting assembly 206.
Horizontal adjusting part 206 includes sliding tray 207, second driving motor 208, threaded rod 209 and slider 210, sliding tray 207 with lead screw 204 threaded connection, and the cover is located the outward appearance wall of lead screw 204, the both ends of threaded rod 209 respectively with sliding tray 207 rotates the connection, and is located sliding tray 207's inside, second driving motor 208 set up in sliding tray 207's one side, just second driving motor 208's output runs through sliding tray 207 and with threaded rod 209 fixed connection, slider 210 with threaded rod 209 threaded connection, and the cover is located threaded rod 209's outward appearance wall, place the chamber 107 with slider 210 fixed connection, and be located slider 210's top.
Through direction adjustment mechanism 201 can be right place the position of chamber 107 and adjust, base plate 202 is right the adjustment tank 203 supports, horizontal adjusting part 206 can be to placing chamber 107 and carry out horizontal regulation, through starting first driving motor 205 rotates, and then has driven lead screw 204 rotates, simultaneously by lead screw 204 has driven horizontal adjusting part 206 cigarette the adjustment tank 203 removes, can also play simultaneously second driving motor 208 rotates, drives simultaneously threaded rod 209 rotates, and threaded rod 209 drives slider 210 is followed sliding tray 207 removes, finally passes through slider 210 has driven place chamber 107 and removes, the setting of above structure can be right place chamber 107 carries out wide-angle modulation to this reaches required position.
While the invention has been described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention.
Claims (8)
1. A wafer accurate positioning device comprises a placing mechanism, a first driving cylinder, a retaining ring and a back membrane, wherein the placing mechanism is fixedly connected with the first driving cylinder and is positioned at the output end of the first driving cylinder, the retaining ring is arranged above the placing mechanism, the back membrane is arranged at the lower end of the retaining ring, and the wafer accurate positioning device is characterized in that,
the device also comprises a fine adjustment mechanism;
the fine adjustment mechanism comprises a first spring, a placing cavity, a bottom plate, a support, a second driving cylinder, a first fine adjustment ring and a second fine adjustment ring, the number of the first springs is multiple, each first spring is respectively connected with the placing cavity and located inside the placing cavity, the bottom plate is fixedly connected with the multiple first springs and multiple first springs are located on the outer wall of the bottom plate, the first driving cylinder is arranged inside the bottom plate, the output end of the first driving cylinder penetrates through the bottom plate, the first fine adjustment ring is fixedly connected with the bottom plate and located above the bottom plate, the placing mechanism is fixedly connected with the first driving cylinder and located at the output end of the first driving cylinder, the placing mechanism is located inside the first fine adjustment ring and is in sliding connection with the first fine adjustment ring, the support is arranged on one side of the placing cavity, the holding ring is arranged below the support, a back membrane is arranged inside the holding ring, the second fine adjustment ring is fixedly connected with the holding ring and is located below the second fine adjustment ring and is matched with the second fine adjustment ring.
2. The wafer fine positioning device of claim 1,
the fine adjustment mechanism further comprises an adjusting component, the support is fixedly connected with the adjusting component and is positioned above the adjusting component, and the adjusting component is arranged on one side of the placing cavity.
3. The wafer fine positioning device of claim 2,
the adjusting assembly comprises a fixing column, adjusting columns and side strips, the fixing column is arranged on one side of the placing cavity, the adjusting columns are connected with the fixing column in a sliding mode, the adjusting columns are located inside the fixing column, the number of the side strips is two, and the side strips are respectively fixedly connected with the adjusting columns and respectively located on the outer surface wall of the adjusting columns.
4. A wafer fine positioning apparatus according to claim 3,
the adjusting assembly further comprises a limiting plate, the limiting plate is fixedly connected with the adjusting column and is located at the lower end of the adjusting column, and the limiting plate is located inside the fixing column.
5. A wafer fine positioning apparatus according to claim 4,
the accurate positioning device for the wafer further comprises a direction adjusting mechanism.
6. The wafer fine positioning device of claim 5,
the direction adjustment mechanism comprises a base plate, an adjusting groove, a lead screw, a first driving motor and a transverse adjustment assembly, wherein the fixing column is fixedly connected with the base plate and is positioned above the base plate, the adjusting groove is fixedly connected with the base plate and is positioned above the base plate, the lead screw is rotatably connected with the adjusting groove and is positioned inside the adjusting groove, the first driving motor is arranged on one side of the adjusting groove, the output end of the first driving motor penetrates through the adjusting groove and is fixedly connected with the lead screw, the transverse adjustment assembly is in threaded connection with the lead screw, the transverse adjustment assembly is sleeved with the outer wall of the lead screw, the transverse adjustment assembly is positioned above the adjusting groove, and the placement cavity is formed in the top of the transverse adjustment assembly.
7. The wafer fine positioning device of claim 6,
the horizontal adjusting part includes sliding tray, second driving motor, threaded rod and slider, the sliding tray with lead screw threaded connection to the cover is located the outward appearance wall of lead screw, the both ends of threaded rod respectively with the sliding tray rotates to be connected, and is located the inside of sliding tray, second driving motor set up in one side of sliding tray, just second driving motor's output runs through the sliding tray and with threaded rod fixed connection, the slider with threaded rod threaded connection, and the cover is located the outward appearance wall of threaded rod, place the chamber with slider fixed connection, and be located the top of slider.
8. The wafer fine positioning apparatus of claim 7,
the placing mechanism comprises a second spring, a limiting block and a slide glass plate, the slide glass plate is fixedly connected with the output end of the first driving cylinder and is located above the first driving cylinder, the slide glass plate is provided with three grooves, the second spring is three and corresponds to the limiting block, the second spring is arranged in the corresponding groove, and the limiting block is fixedly connected with one end of the second spring and corresponds to the groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220693437.8U CN217691106U (en) | 2022-03-28 | 2022-03-28 | Accurate positioning device for wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220693437.8U CN217691106U (en) | 2022-03-28 | 2022-03-28 | Accurate positioning device for wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217691106U true CN217691106U (en) | 2022-10-28 |
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ID=83733011
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220693437.8U Active CN217691106U (en) | 2022-03-28 | 2022-03-28 | Accurate positioning device for wafer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217691106U (en) |
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2022
- 2022-03-28 CN CN202220693437.8U patent/CN217691106U/en active Active
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