CN110911326A - Lifting type transfer device and wafer loading and unloading system - Google Patents
Lifting type transfer device and wafer loading and unloading system Download PDFInfo
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- CN110911326A CN110911326A CN201911218638.1A CN201911218638A CN110911326A CN 110911326 A CN110911326 A CN 110911326A CN 201911218638 A CN201911218638 A CN 201911218638A CN 110911326 A CN110911326 A CN 110911326A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67751—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a single workpiece
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Abstract
The application relates to the technical field of semiconductor equipment, in particular to a lifting type load transferring device and a wafer loading and unloading system. The lifting type load transferring device comprises a bearing assembly, a lifting assembly and a driving system; the bearing component comprises a bearing main body and a positioning component arranged on the bearing main body, wherein the bearing main body is used for bearing a wafer, and the positioning component is used for positioning the wafer; the wafer lifting device comprises a bearing main body, a lifting assembly and a positioning assembly, wherein the bearing main body is provided with a through cavity, the lifting assembly is positioned in the through cavity and can do lifting motion relative to the bearing main body, and when the lifting assembly is lifted to a first set height, the lifting assembly can lift a wafer after the positioning assembly is started; the driving system is used for driving the lifting assembly to move. The application provides a device and wafer loading and unloading system are carried to over-and-under type biography, it is spacing to the wafer through setting up locating component, and the promotion subassembly holds up the wafer and transmits, has improved the position accuracy of wafer at the biography year in-process.
Description
Technical Field
The application relates to the technical field of semiconductor equipment, in particular to a lifting type load transferring device and a wafer loading and unloading system.
Background
At present, in the process of transferring a wafer to a polishing head, the position precision of loading and unloading of the wafer completely depends on the motion precision between a wafer loading device and the polishing head, and the wafer cannot be positioned by the loading device, so that the position of the wafer deviates from the standard.
Disclosure of Invention
The application aims to provide a lifting type transfer device and a wafer loading and unloading system, wherein a wafer is limited by arranging a positioning assembly, and the wafer is lifted and transferred by a lifting assembly, so that the position precision of the wafer in the transfer process is improved.
The application provides a lifting type load transmission device, which comprises a bearing assembly, a lifting assembly and a driving system;
the bearing component comprises a bearing main body and a positioning component arranged on the bearing main body, wherein the bearing main body is used for bearing a wafer, and the positioning component is used for positioning the wafer;
the wafer lifting device comprises a bearing main body, a lifting assembly and a positioning assembly, wherein the bearing main body is provided with a through cavity, the lifting assembly is positioned in the through cavity and can do lifting motion relative to the bearing main body, and when the lifting assembly is lifted to a first set height, the lifting assembly can lift a wafer after the positioning assembly is started;
the driving system is used for driving the lifting assembly to move.
In the above technical solution, further, the positioning assembly includes a positioning clamping jaw and a torsional elastic member, one end of the torsional elastic member is connected to the bearing main body, the other end of the torsional elastic member is connected to the positioning clamping jaw, and the positioning clamping jaw can rotate relative to the bearing main body.
In the above technical solution, further, the bearing main body includes a base platform and a bearing tray inserted on the base platform, and the positioning assembly is mounted on the bearing tray;
the bearing tray and the base platform are arranged at intervals, the base platform is used for supporting the bearing tray, and the lifting assembly is positioned between the bearing tray and the base platform; when the lifting assembly rises to a second set height, the lifting assembly can lift the bearing tray.
In the above technical solution, further, the bearing main body further includes a guide component, and the guide component is located between the bearing tray and the base platform;
the guide assembly comprises a guide sleeve and a guide post, and the guide post can be placed in the guide sleeve and moves relative to the guide sleeve; the guide sleeve is connected with the base station, and the guide column is connected with the bearing tray.
In the above technical solution, further, the lifting assembly includes a first lifting top platform and a second lifting top platform, the first lifting top platform is located on top of the second lifting top platform, the driving system can drive the first lifting top platform to be lifted, and the driving system can drive the second lifting top platform to be lifted;
the first lifting top platform can lift the wafer, and the second lifting top platform can open the positioning assembly.
In the above technical scheme, furtherly, it bears the boss to be provided with on the inner wall that runs through the chamber, it is used for the bearing to bear the boss the wafer, seted up on the global groove of dodging of first promotion top platform, dodge the groove and can dodge bear the boss.
In the above technical scheme, further, an opening upright is arranged on the upper surface of the second lifting top platform, and the opening upright can open the positioning assembly.
In the above technical solution, the driving system further includes a first driving device and a second driving device, a through hole is formed in the second lifting top platform, an output shaft of the first driving device can penetrate through the through hole to be connected with the first lifting top platform, and an output shaft of the second driving device is connected with the second lifting top platform.
In the above technical scheme, further, still include support frame, mounting bracket and spliced pole, the support frame with carrier assembly connects, just actuating system installs on the support frame, the spliced pole with first drive arrangement's output shaft, the mounting bracket with second drive arrangement's output shaft, the support frame can be right the mounting bracket slides spacingly.
The application also provides a wafer loading and unloading system which comprises the lifting type load transferring device.
Compared with the prior art, the beneficial effect of this application is:
the lifting type load transmission device comprises a bearing assembly, a lifting assembly and a driving system; the bearing component comprises a bearing main body and a positioning component arranged on the bearing main body, wherein the bearing main body is used for bearing a wafer, and the positioning component is used for positioning the wafer; the wafer lifting device comprises a bearing main body, a lifting assembly and a positioning assembly, wherein the bearing main body is provided with a through cavity, the lifting assembly is positioned in the through cavity and can do lifting motion relative to the bearing main body, and when the lifting assembly rises to a first set height, the lifting assembly can lift a wafer after the positioning assembly is opened; the driving system is used for driving the lifting assembly to move.
Specifically, the lifting type load transferring device comprises a bearing component, a lifting component and a driving system, wherein the bearing component is provided with a bearing main body capable of initially bearing a wafer, and a positioning component is arranged on the bearing main body and capable of positioning the initial position of the wafer; the bearing main body is provided with a through cavity, the lifting assembly can move in the through cavity to change the position of the lifting assembly relative to the bearing main body, and when the lifting assembly rises to a first set height, namely the lifting assembly moves to the positioning assembly, the positioning assembly can be opened, so that the wafer is separated from the limit of the positioning assembly; after the positioning component is started, the lifting component further lifts, so that the lifting component supports the wafer from the bearing main body, namely the wafer is transferred from the bearing main body to the lifting component; when the lifting assembly is lifted to the height required by the transfer equipment in the next procedure, the transfer equipment can take the wafer away, namely, the transfer process is completed once, and specifically, the transfer equipment can be equipment capable of realizing wafer transfer, such as a polishing head or a mechanical arm. The drive system is used to power the movement of the lift assembly.
The application provides a device is carried to over-and-under type biography is spacing to the wafer through setting up locating component, and the transmission is held up with the wafer to the promotion subassembly, has improved the position accuracy of wafer at the biography year in-process.
The application also provides a wafer loading and unloading system which comprises the lifting type loading and unloading device. Based on the analysis, the wafer loading and unloading system limits the position of the wafer by arranging the positioning assembly, the lifting assembly lifts the wafer for transfer, and the position precision of the wafer in the process of transferring is improved.
Drawings
In order to more clearly illustrate the detailed description of the present application or the technical solutions in the prior art, the drawings needed to be used in the detailed description of the present application or the prior art description will be briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative efforts.
Fig. 1 is a schematic structural view of a lifting type load carrying device according to an embodiment of the present application;
fig. 2 is a schematic structural diagram of a carrier assembly according to an embodiment of the present disclosure;
FIG. 3 is a schematic cross-sectional view of a load bearing assembly according to an embodiment of the present disclosure;
fig. 4 is a schematic structural diagram of a positioning assembly according to an embodiment of the present application;
fig. 5 is a partial structure diagram illustrating an assembly of the lifting assembly and the carrying body according to the second embodiment of the present application;
fig. 6 is a schematic cross-sectional structural view of a lifting assembly according to a second embodiment of the present application;
FIG. 7 is a cross-sectional view of a first assembly of a load bearing assembly and a lift assembly provided in accordance with a second embodiment of the present application;
fig. 8 is a schematic structural diagram of a driving system according to a second embodiment of the present application;
FIG. 9 is a second assembled cross-sectional structural schematic view of the load bearing assembly and the lifting assembly provided in the second embodiment of the present application;
fig. 10 is a sectional view of a third assembly of the load bearing assembly and the lifting assembly provided in the second embodiment of the present application.
In the figure: 101-a carrier assembly; 102-a lifting assembly; 103-a drive system; 104-a carrier body; 105-a positioning assembly; 106-wafer; 107-through cavity; 108-positioning the clamping jaw; 109-a torsional elastic member; 110-a base station; 111-a carrying tray; 112-a guide assembly; 113-a guide sleeve; 114-a guide post; 115-a first lifting top platform; 116-a second elevated ceiling platform; 117-load bearing boss; 118-a limiting groove; 119-opening the upright post; 120-a first drive; 121-a second drive; 122-through holes; 123-a support frame; 124-a mounting frame; 125-connecting column; 126-a first bevel; 127-a second bevel; 128-a polishing head; 129-positioning groove.
Detailed Description
The technical solutions of the present application will be described clearly and completely with reference to the accompanying drawings, and it should be understood that the described embodiments are only some embodiments of the present application, but not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
In the description of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present application. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art.
Example one
Referring to fig. 1 to 3, the lifting type load transferring device provided by the present application includes a bearing assembly 101, a lifting assembly 102 and a driving system 103; the carrier assembly 101 includes a carrier body 104 and a positioning assembly 105 mounted on the carrier body 104, the carrier body 104 is used for holding the wafer 106, and the positioning assembly 105 is used for positioning the wafer 106; the carrier body 104 is provided with a through cavity 107, the lifting assembly 102 is located in the through cavity 107 and can perform a lifting motion relative to the carrier body 104, and when the lifting assembly 102 is lifted to a first set height, the lifting assembly 102 can lift the wafer 106 after the positioning assembly 105 is opened; the drive system 103 is used for driving the lifting assembly 102 to move.
Specifically, the lifting type transfer device includes a carrier assembly 101, a lifting assembly 102 and a driving system 103, wherein the carrier assembly 101 has a carrier body 104 capable of initially supporting the wafer 106, and the carrier body 104 is provided with a positioning assembly 105 capable of positioning an initial position of the wafer 106; the carrier body 104 is provided with a through cavity 107, the lifting assembly 102 can move in the through cavity 107 to change the position of the lifting assembly 102 relative to the carrier body 104, and when the lifting assembly 102 is lifted to a first set height, that is, the lifting assembly 102 moves to the positioning assembly 105, the positioning assembly 105 can be opened, so that the wafer 106 is separated from the limit position of the positioning assembly 105; after the positioning assembly 105 is opened, the lifting assembly 102 lifts the wafer 106 from the carrier body 104 as the lifting assembly 102 is further raised, i.e., the wafer 106 is transferred from the carrier body 104 onto the lifting assembly 102; when the lifting assembly 102 is raised to a height required by the transfer device in the next process, the transfer device can take away the wafer 106, i.e., complete a transfer process, and specifically, the transfer device can be a polishing head 128 or a robot or other device capable of transferring the wafer 106. The drive system 103 is used to power the movement of the lift assembly 102.
According to the lifting type transferring device, the wafer 106 is limited by the positioning assembly 105, the wafer 106 is lifted and transferred by the lifting assembly 102, and the position accuracy of the wafer 106 in the transferring process is improved.
Referring to fig. 2 and 4, in an alternative embodiment of this embodiment, the positioning assembly 105 includes a positioning jaw 108 and a torsional elastic member 109, one end of the torsional elastic member 109 is connected to the carrier body 104, the other end of the torsional elastic member 109 is connected to the positioning jaw 108, and the positioning jaw 108 is capable of rotating relative to the carrier body 104.
In this embodiment, the positioning assembly 105 includes two states, a positioning state and an open state, and the transition from the positioning state to the open state or the transition from the open state to the open state positioning state is achieved by rotating the positioning jaw 108. The positioning assembly 105 includes a positioning clamping jaw 108 and a torsional elastic member 109, the positioning clamping jaw 108 is connected to the carrier body 104 through the torsional elastic member 109, and the wafer 106 is clamped and fixed by the elastic force of the torsional elastic member 109, so as to prevent the wafer 106 from moving. The above arrangement enables reliable positioning of the wafer 106 and facilitates opening of the positioning assembly 105.
Referring to fig. 4, in an alternative embodiment of the present invention, the positioning jaw 108 includes a first inclined surface 126 at the top and a second inclined surface 127 at the bottom, and pushing either the first inclined surface 126 or the second inclined surface 127 can rotate the positioning jaw 108, i.e. two ways of opening the positioning jaw 108 are achieved: the lifting assembly 102 may contact the second ramp 127 by squeezing the second ramp 127 to twist the positioning jaw 108; the lower edge of the polishing head 128 may twist the positioning jaw 108 by pressing the first bevel 126. The two opening modes can exist in parallel and are not influenced mutually. The dual assurance jaws can be opened to avoid crushing the wafer 106.
Optionally, the number of the positioning elements 105 is multiple, and the plurality of positioning elements 105 are uniformly distributed on the carrier body 104, so as to uniformly position the wafer 106.
In an alternative scheme of this embodiment, the bearing main body 104 includes a base 110 and a bearing tray 111 inserted on the base 110, the positioning assembly 105 is mounted on the bearing tray 111, a positioning groove 129 is formed at the top of the bearing tray 111, and the positioning groove 129 is used for positioning the polishing head 128; the bearing tray 111 and the base platform 110 are arranged at intervals, the base platform 110 is used for supporting the bearing tray 111, and the lifting assembly 102 is positioned between the bearing tray 111 and the base platform 110; when the lifting assembly 102 is lifted to the second set height, the lifting assembly 102 can lift the carrying tray 111.
In this embodiment, the bearing body 104 includes a base 110 and a bearing tray 111 arranged at intervals, the bearing body 104 and the base 110 are connected by plugging, and the bearing body 104 can change the distance between the bearing body and the base 110. In the process of lifting the lifting assembly 102, the lifting assembly 102 can also lift the upper tray 111, so as to change the height of the tray 111 to meet different working conditions. The top of the carrier tray 111 is provided with a positioning groove 129, the bottom of the positioning groove 129 is used for positioning the end face of the polishing head 128, and the groove wall of the positioning groove 129 is used for positioning the circumferential surface of the polishing head 128. The position of the wafer 106 and the position of the polishing head 128 can be accurately positioned, thereby ensuring the position accuracy of the wafer 106 in the transfer process.
In this embodiment, the positioning slot 129 is capable of positioning the polishing head 128 and the positioning assembly 105 is capable of positioning the wafer 106, which in combination improve the positional accuracy of the wafer 106 during transfer.
In an alternative solution of this embodiment, the bearing body 104 further includes a guide assembly 112, and the guide assembly 112 is located between the bearing tray 111 and the base table 110; the guide assembly 112 comprises a guide sleeve 113 and a guide post 114, wherein the guide post 114 can be placed in the guide sleeve 113 and moves relative to the guide sleeve 113; the guide sleeve 113 is connected to the base 110, and the guide post 114 is connected to the carrier tray 111.
In this embodiment, the bearing body 104 further includes a guide assembly 112, and the guide assembly 112 can support the bearing tray 111 and serve to guide the ascending movement of the bearing tray 111 and prevent the position of the bearing tray 111 from being shifted. The guide assembly 112 comprises a guide sleeve 113 and a guide column 114, the guide column 114 is arranged in the guide sleeve 113, and the guide sleeve 113 can limit the position of the guide column 114. The application has limited guide sleeve 113 and has been connected with base station 110, and guide post 114 is connected with bearing tray 111, and guide sleeve 113 can play the supporting effect to guide post 114. Alternatively, the guide sleeve 113 may be connected to the carrier tray 111, and the guide post 114 may be connected to the base 110.
In an optional scheme of this embodiment, the number of the guide assemblies 112 is multiple, and the plurality of guide assemblies 112 are uniformly distributed on the bearing main body 104, so as to guide the movement of the bearing tray 111.
Example two
The lifting type carrying device in the second embodiment is an improvement on the basis of the second embodiment, technical contents disclosed in the second embodiment are not described repeatedly, and the contents disclosed in the second embodiment also belong to the contents disclosed in the second embodiment.
Referring to fig. 5 to 7, in an alternative of this embodiment, the lifting assembly 102 includes a first lifting top platform 115 and a second lifting top platform 116, the first lifting top platform 115 is located on top of the second lifting top platform 116, the driving system 103 can drive the first lifting top platform 115 to be lifted, and the driving system 103 can drive the second lifting top platform 116 to be lifted; the first lift top 115 is capable of lifting the wafer 106 and the second lift top 116 is capable of opening the positioning assembly 105.
In this embodiment, the lifting assembly 102 includes a first lifting top platform 115 and a second lifting top platform 116, the second lifting top platform 116 can open the positioning assembly 105 after being lifted to the positioning assembly 105, the first lifting top platform 115 is located on top of the second lifting top platform 116, after the positioning assembly 105 is opened, the first lifting top platform 115 is lifted to the position of the wafer 106, and the upper end surface thereof directly contacts with the wafer 106, so as to lift the wafer 106, thereby changing the height of the wafer 106.
In the optional scheme of this embodiment, the device further comprises a limiting component, wherein the limiting component comprises a bearing boss 117 and a limiting groove 118; a bearing boss 117 is arranged on the inner wall of the through cavity 107, the bearing boss 117 is used for bearing the wafer 106, a limit groove 118 is arranged on the circumferential surface of the first lifting top platform 115, and the position of the limit groove 118 is opposite to that of the bearing boss 117; the bearing boss 117 is located in the limiting groove 118, and the limiting groove 118 can slide relative to the bearing boss 117.
In this embodiment, a limit assembly is provided between the carrier body 104 and the first lift top stage 115 for limiting the movement of the first lift top stage 115 to prevent the wafer 106 from changing position. Specifically, the limiting assembly includes a bearing boss 117 and a limiting groove 118, the wafer 106 is supported on the upper surface of the bearing boss 117, when the first lifting top platform 115 moves upward, the limiting groove 118 can avoid the bearing boss 117, and the bearing boss 117 is located in the limiting groove 118, so that the guiding and limiting effects can be achieved on the movement of the first lifting top platform 115.
In the optional scheme of this embodiment, the number of the limiting components is plural, the plurality of bearing bosses 117 are uniformly distributed on the bearing main body 104, and the plurality of limiting grooves 118 are uniformly distributed on the first lifting top platform 115, so as to realize the motion guiding limitation of the first lifting top platform 115.
In an alternative of this embodiment, the upper surface of the second lifting top platform 116 is provided with an opening pillar 119, and the opening pillar 119 can open the positioning assembly 105.
In this embodiment, the upper surface of the second elevating platform 116 is provided with an opening pillar 119, and the positioning assembly 105 can be opened when the opening pillar 119 is lifted to the positioning assembly 105. Specifically, the opening column 119 is abutted against the second inclined surface 127 of the positioning clamping jaw 108, so that the positioning clamping jaw 108 rotates, the wafer 106 can be separated from the clamping of the positioning clamping jaw 108, and the wafer 106 is jacked up by the first lifting jacking platform 115. Alternatively, the number of opening posts 119 corresponds to the number of positioning members 105, and the position of the opening posts 119 is opposite to the position of the positioning members 105.
Referring to fig. 8, in an alternative embodiment of the present invention, the driving system 103 includes a first driving device 120 and a second driving device 121, a through hole 122 is formed in the second lifting top platform 116, an output shaft of the first driving device 120 can pass through the through hole 122 to be connected to the first lifting top platform 115, and an output shaft of the second driving device 121 is connected to the second lifting top platform 116.
In this embodiment, the first lifting top platform 115 is located above the second lifting top platform 116, and a through hole 122 is formed in the second lifting top platform 116, so that the first driving device 120 can be connected to the first lifting top platform 115 to realize the function of driving the first lifting top platform 115 to move. The first driving device 120 drives the first lifting top platform 115 to move, and the second driving device 121 drives the second lifting top platform 116 to move, so that the lifting heights of the first lifting top platform 115 and the second lifting top platform 116 can be controlled respectively, and different working condition requirements can be met.
Specifically, the first driving device 120 may be formed by connecting two cylinders in series, and the second driving device 121 may be formed by connecting two cylinders in series, so that three station states of high, medium and low can be realized.
In the optional scheme of this embodiment, still include support frame 123, mounting bracket 124 and spliced pole 125, support frame 123 is connected with carrier assembly 101, and actuating system 103 installs on support frame 123, and spliced pole 125 and the output shaft of first drive 120, mounting bracket 124 and the output shaft of second drive 121, and support frame 123 can be spacing to mounting bracket 124 slip.
In this embodiment, the support frame 123 is used as a support mechanism of the whole device, and holds the carrier assembly 101 and the driving system 103, and the end of the output shaft of the first driving device 120 is provided with a connecting column 125, so that the first driving device 120 can be connected with the first elevating top table 115. The output shaft of the second driving device 121 is provided with a mounting bracket 124, the mounting bracket 124 is connected with the second lifting top platform 116, and the contact surface between the mounting bracket 124 and the second lifting top platform 116 is large, so that the movement of the second lifting top platform 116 is more stable. The mounting block 124 is provided with a slide rail, the support frame 123 is provided with a slide limiting member, and when the mounting block 124 moves, the support frame 123 can limit the mounting block 124 in a sliding manner.
Referring to fig. 7, 9 and 10, the wafer 106 transferring process by the three position states of the lifting type transfer device will be described by way of example:
step one, fig. 7 shows a positioning and clamping state of the wafer 106, wherein the first lifting top platform 115 and the second lifting top platform 116 are located at a low position, the positioning clamping jaw 108 clamps the wafer 106 to position the wafer 106, the wafer 106 is placed on the bearing boss 117, and the wafer 106 is not in contact with the first lifting top platform 115;
step two, fig. 9 shows a state in which the wafer 106 is ready for loading, the first lift table 115 and the second lift table 116 are located at the middle positions, the positioning clamping jaw 108 is in the open state, the upper surface of the first lift table 115 contacts with the wafer 106, and the second lift table 116 supports the load tray 111;
step three, fig. 10 shows a state where the position of the wafer 106 is raised, the first lift table 115 and the second lift table 116 are located at a high position, the positioning jaw 108 is in an open state, the first lift table 115 lifts the wafer 106, and the second lift table 116 further lifts the carrier tray 111.
The above process is a wafer 106 loading process, and the wafer 106 unloading process is a reverse order of the above process.
The wafer 106 transfer process is not limited to the above three states, and other states can be realized by the combination control of the air cylinders, for example: the first lifting top platform 115 is in a low position, the wafer 106 is placed on the bearing boss 117, the distance between the first lifting top platform 115 and the wafer 106 is large, and the distance between the first lifting top platform 115 and the wafer 106 is further increased when the second lifting top platform 116 is in a high position, so that the wafer 106 can be conveniently taken and placed on the bearing tray 111 manually.
EXAMPLE III
A third embodiment of the present application provides a wafer loading and unloading system, including the lifting type load transferring device according to any one of the above embodiments, so that all the beneficial technical effects of the lifting type load transferring device according to any one of the above embodiments are achieved, and further description is omitted here.
Finally, it should be noted that: the above embodiments are only used for illustrating the technical solutions of the present application, and not for limiting the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present application. Moreover, those skilled in the art will appreciate that while some embodiments herein include some features included in other embodiments, rather than other features, combinations of features of different embodiments are meant to be within the scope of the application and form different embodiments.
Claims (10)
1. A lifting type load transmission device is characterized by comprising a bearing assembly, a lifting assembly and a driving system;
the bearing component comprises a bearing main body and a positioning component arranged on the bearing main body, wherein the bearing main body is used for bearing a wafer, and the positioning component is used for positioning the wafer;
the wafer lifting device comprises a bearing main body, a lifting assembly and a positioning assembly, wherein the bearing main body is provided with a through cavity, the lifting assembly is positioned in the through cavity and can do lifting motion relative to the bearing main body, and when the lifting assembly is lifted to a first set height, the lifting assembly can lift a wafer after the positioning assembly is started;
the driving system is used for driving the lifting assembly to move.
2. The elevating type load carrying device according to claim 1,
the positioning assembly comprises a positioning clamping jaw and a torsional elastic piece, one end of the torsional elastic piece is connected with the bearing body, the other end of the torsional elastic piece is connected with the positioning clamping jaw, and the positioning clamping jaw can rotate relative to the bearing body.
3. The elevating type load carrying device according to claim 1,
the bearing main body comprises a base station and a bearing tray inserted on the base station, the positioning assembly is installed on the bearing tray, the top of the bearing tray is provided with a positioning groove, and the positioning groove is used for positioning the polishing head;
the bearing tray and the base platform are arranged at intervals, the base platform is used for supporting the bearing tray, and the lifting assembly is positioned between the bearing tray and the base platform; when the lifting assembly rises to a second set height, the lifting assembly can lift the bearing tray.
4. The elevating type load carrying device according to claim 3,
the bearing main body further comprises a guide assembly, and the guide assembly is positioned between the bearing tray and the base platform;
the guide assembly comprises a guide sleeve and a guide post, and the guide post can be placed in the guide sleeve and moves relative to the guide sleeve; the guide sleeve is connected with the base station, and the guide column is connected with the bearing tray.
5. The elevating type load carrying device according to claim 1,
the lifting assembly comprises a first lifting top platform and a second lifting top platform, the first lifting top platform is positioned at the top of the second lifting top platform, the driving system can drive the first lifting top platform to be lifted, and the driving system can drive the second lifting top platform to be lifted;
the first lifting top platform can lift the wafer, and the second lifting top platform can open the positioning assembly.
6. The elevating type load carrying device according to claim 5, further comprising a limiting component, wherein the limiting component comprises a bearing boss and a limiting groove;
a bearing boss is arranged on the inner wall of the through cavity and used for bearing the wafer, a limiting groove is formed in the peripheral surface of the first lifting top platform, and the limiting groove is opposite to the bearing boss; the bearing boss is positioned in the limiting groove, and the limiting groove can slide relative to the bearing boss.
7. The elevating type load carrying device according to claim 5,
the upper surface of second promotion top platform is provided with opens the stand, it can open to open the stand locating component.
8. The elevating type load carrying device according to claim 5, wherein the driving system comprises a first driving device and a second driving device, a through hole is formed in the second elevating top platform, an output shaft of the first driving device can pass through the through hole to be connected with the first elevating top platform, and an output shaft of the second driving device is connected with the second elevating top platform.
9. The lifting type load transmission device according to claim 8, further comprising a support frame, a mounting frame and a connecting column, wherein the support frame is connected with the bearing assembly, the driving system is mounted on the support frame, the connecting column is connected with an output shaft of the first driving device, the mounting frame is connected with an output shaft of the second driving device, and the support frame can limit the mounting frame in a sliding manner.
10. A wafer handling system comprising the elevating type load carrying device according to any one of claims 1 to 9.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201911218638.1A CN110911326A (en) | 2019-12-03 | 2019-12-03 | Lifting type transfer device and wafer loading and unloading system |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201911218638.1A CN110911326A (en) | 2019-12-03 | 2019-12-03 | Lifting type transfer device and wafer loading and unloading system |
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| CN110911326A true CN110911326A (en) | 2020-03-24 |
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| CN201911218638.1A Pending CN110911326A (en) | 2019-12-03 | 2019-12-03 | Lifting type transfer device and wafer loading and unloading system |
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| CN111725129A (en) * | 2020-06-29 | 2020-09-29 | 北京北方华创微电子装备有限公司 | Wafer bearing device and semiconductor process equipment |
| CN112635376A (en) * | 2020-12-14 | 2021-04-09 | 华虹半导体(无锡)有限公司 | Wafer conveying device |
| WO2023123602A1 (en) * | 2021-12-29 | 2023-07-06 | 华海清科股份有限公司 | Rotary wafer exchange system |
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