CN115410984A - Wafer cleaning machine flip structure - Google Patents
Wafer cleaning machine flip structure Download PDFInfo
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- CN115410984A CN115410984A CN202211360804.3A CN202211360804A CN115410984A CN 115410984 A CN115410984 A CN 115410984A CN 202211360804 A CN202211360804 A CN 202211360804A CN 115410984 A CN115410984 A CN 115410984A
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- 238000004140 cleaning Methods 0.000 title claims abstract description 29
- 230000007306 turnover Effects 0.000 claims abstract description 26
- 238000000034 method Methods 0.000 claims description 17
- 230000003014 reinforcing effect Effects 0.000 claims description 6
- 230000001681 protective effect Effects 0.000 claims description 5
- 230000000694 effects Effects 0.000 abstract description 6
- 238000012423 maintenance Methods 0.000 abstract description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 239000004065 semiconductor Substances 0.000 abstract description 2
- 235000012431 wafers Nutrition 0.000 description 133
- 230000008569 process Effects 0.000 description 14
- 230000006872 improvement Effects 0.000 description 9
- 239000000370 acceptor Substances 0.000 description 5
- 210000002421 cell wall Anatomy 0.000 description 3
- 238000006073 displacement reaction Methods 0.000 description 3
- 239000003638 chemical reducing agent Substances 0.000 description 2
- 239000003344 environmental pollutant Substances 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 231100000719 pollutant Toxicity 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010924 continuous production Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
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- Microelectronics & Electronic Packaging (AREA)
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention relates to the technical field of semiconductor manufacturing equipment, and provides a wafer cleaning machine turnover structure which comprises a first supporting device, a second supporting device and a rack for mounting the first supporting device and the second supporting device, wherein the first supporting device comprises two first supporting pieces for supporting two radial sides of a wafer, and the second supporting device comprises two second supporting pieces for clamping the wafer; the two first supporting devices are sequentially distributed with a plurality of supporting grooves for supporting two radial sides of the wafer along the axial direction, the two second supporting pieces are sequentially distributed with a plurality of clamping grooves for clamping the wafer along the axial direction, and a lifting assembly and a translation assembly are arranged in the rack; after the lifting assembly drives the two first bearing pieces to rise, the translation assembly drives the two first bearing pieces to translate towards the two second bearing pieces. The turnover structure of the wafer cleaning machine disclosed by the invention has the technical effects of simple and reliable structure and lower maintenance cost.
Description
Technical Field
The invention relates to the technical field of semiconductor manufacturing equipment, in particular to a turnover structure of a wafer cleaning machine.
Background
During the continuous process of forming and polishing, the wafer is contacted with various pollutants such as organic substances, particles and metal impurities, so that the pollutants are attached to the wafer, and therefore, the wafer needs to be cleaned. Wafer cleaning is an important process step in the wafer manufacturing process, and it is required to effectively remove impurities remaining on the wafer surface by using a chemical solution or a gas without damaging the surface characteristics and electrical characteristics of the wafer. In the wafer cleaning process, after one surface of the wafer is cleaned, the wafer needs to be turned over for cleaning the other surface, so that the wafer needs to be turned over.
Wafer flip structure among the prior art usually includes two parts of acceptor and clamping part, namely, when the manipulator puts into flip structure the wafer, through two acceptors mutual approaching play the effect of accepting the wafer, then make two clamping parts mutual approaching centre gripping wafer, two acceptors withdraw from this moment in order to be ready for subsequent wafer upset action, in-process that control two acceptors and two clamping parts mutual approaching and keeping away from needs two sets of drive assembly to control respectively, the structure is comparatively complicated, need maintain respectively and overhaul the drive assembly of control acceptor and control clamping part in daily maintenance, there is great maintenance cost.
In view of the above, there is a need for an improved flip structure of a wafer cleaning machine in the prior art to solve the above problems.
Disclosure of Invention
The invention aims to disclose a turnover structure of a wafer cleaning machine, which is used for solving the defects of the turnover structure of the wafer cleaning machine in the prior art, in particular the problems that the turnover structure of the wafer cleaning machine is complex due to the fact that two groups of driving parts are needed to control a bearing part and a clamping part respectively, and the driving parts controlling the bearing part and the clamping part need to be maintained and overhauled respectively, so that the maintenance cost is high.
In order to achieve the above object, the present invention provides a wafer cleaning machine turnover structure, comprising: the wafer supporting device comprises a first supporting device, a second supporting device and a rack for mounting the first supporting device and the second supporting device, wherein the first supporting device comprises two first supporting pieces for supporting two radial sides of a wafer, and the second supporting device comprises two second supporting pieces for clamping the wafer;
the two first supporting devices are sequentially distributed with a plurality of supporting grooves for supporting two radial sides of a wafer along the axial direction, the two second supporting pieces are sequentially distributed with a plurality of clamping grooves for clamping the wafer along the axial direction, and a lifting component for controlling the two first supporting pieces to lift and a translation component for controlling the two first supporting pieces to be close to or far away from the two second supporting pieces respectively are arranged in the rack;
after the lifting assembly drives the two first bearing pieces to rise, the translation assembly drives the two first bearing pieces to translate towards the two second bearing pieces to the wafer in each bearing groove to be clamped in each clamping groove.
As a further improvement of the invention, a mounting plate is arranged in the rack in parallel with the plane of the wafer, the translation assembly comprises a translation cylinder fixedly connected to the mounting plate, a slide rail and a translation plate arranged in parallel with the mounting plate, the slide rail is connected to the mounting plate and arranged perpendicular to the length direction of the mounting plate, a slide block which is in sliding fit with the slide rail is fixedly arranged on one side of the translation plate close to the mounting plate, the drive end of the translation cylinder drives the translation plate to move along the length direction of the slide rail, and the bottom ends of the two first supporting pieces vertically penetrate through the mounting plate and are in sliding connection.
As a further improvement of the invention, the lifting assembly comprises a lifting cylinder, a guide block, a guide wheel and a lifting plate, the lifting plate is parallel to the translation plate and is positioned on one side of the translation plate, which is far away from the mounting plate, the lifting cylinder is fixedly connected to one side of the translation plate, which is far away from the mounting plate, and a driving end of the lifting cylinder is connected with the guide block and drives the guide block to slide along the direction parallel to the length direction of the slide rail;
the guide wheel is connected to one side, close to the translation plate, of the lifting plate and abuts against the top face of the guide block, the top face of the guide block is a guide face, the guide face of the guide block pushes the guide wheel and the lifting plate to ascend in the process of extending out of the driving end of the lifting cylinder, and the bottom ends of the two first supporting pieces penetrate through the lifting plate and are fixed.
As a further improvement of the invention, the upper surface of the lifting plate is fixedly connected with two rotary cylinders, the top ends of the driving ends of the two rotary cylinders are respectively connected with the first supporting piece and drive the first supporting piece to rotate for 180 degrees, the supporting grooves are symmetrically distributed on two sides of the first supporting piece, and the driving ends of the rotary cylinders rotate for 180 degrees to form supporting grooves on the other side of the first supporting piece for supporting wafers.
As a further improvement of the invention, the groove wall of the bearing groove for bearing the wafer forms a bearing surface, the bearing surface is set to be a cambered surface, the heights of two sides of the bearing surface are higher than the height of the midpoint, and the outline of the joint of the bearing surface and the groove wall is consistent with the edge of the wafer.
As a further improvement of the invention, the rack comprises a roll-over stand and two side plates, the roll-over stand comprises a bottom plate and a back plate, the bottom plate is parallel to the mounting plate and is positioned on one side of the mounting plate far away from the first supporting piece, the back plate is vertically fixed on one side of the bottom plate in the length direction, and the back plate is connected with a mounting rack for mounting a second supporting piece;
the two side plates are vertically arranged on two opposite sides of the back plate, the side plates are provided with turnover motors, and the driving ends of the turnover motors penetrate through the side plates and then are fixed with the mounting rack.
As a further improvement of the invention, the mounting rack comprises a connecting plate parallel to the length direction of the back plate and two fixing plates vertically fixed between the connecting plate and the back plate, one side of the connecting plate, which is far away from the back plate, is connected with two mounting blocks, the two second bearing pieces are respectively and rotatably connected in one mounting block, and the mounting blocks are connected with a rotating cylinder for controlling the second bearing pieces to rotate 180 degrees;
the centers of the clamping grooves are symmetrically distributed on two sides of the second supporting piece, and the driving end of the rotating cylinder rotates 180 degrees to form a clamping groove on the other side of the second supporting piece for clamping the wafer.
As a further improvement of the invention, the clamping groove comprises an arc-shaped surface matched with the edge of the wafer and slopes connected to the upper side and the lower side of the arc-shaped surface, and the distance between the two slopes far away from the arc-shaped surface is smaller than the distance between the two slopes and the side connected with the arc-shaped surface.
As a further improvement of the invention, a guide groove is formed at the joint of one side of the guide block close to the translation plate and one side of the guide block close to the guide wheels, the groove wall of the guide groove close to the guide surface is arranged in parallel to the guide surface, the number of the guide wheels is two, and the two guide wheels are respectively arranged with the guide surface and the groove wall of the guide groove in parallel to the guide surface.
As a further improvement of the invention, the mounting plate is connected with the bottom plate through a vertically arranged reinforcing plate, a protective plate is vertically fixed between the two side plates, and the protective plate is arranged below the bottom plate.
Compared with the prior art, the invention has the beneficial effects that: firstly, all wafers are sent into a turnover structure of a wafer cleaning machine through a manipulator, the radial two sides of the wafers are supported through a supporting groove arranged on a first supporting piece, then the first supporting piece is controlled by a lifting assembly to be lifted upwards by a certain height until the lower edge of each supporting groove is opposite to the lower edge of each clamping groove, and a translation assembly controls the first supporting piece to move towards a second supporting piece until the wafers supported in each supporting groove are inserted into the clamping grooves arranged on each second supporting piece until the wafers are stably clamped. Through the setting, only rely on the lift and the translation of controlling first supporting piece to reach and stabilize the purpose of bearing and centre gripping to every wafer, compare in prior art need through being close to each other and keeping away from of two sets of drive assembly control supporting piece and holder respectively and effectively simplified flip structure to overhaul and maintain it.
Secondly, the bearing brackets are axially and symmetrically distributed on two sides of the first bearing piece, the clamping grooves are centrally and symmetrically distributed on two sides of the second bearing piece, the rotary cylinder is used for controlling the first bearing piece to rotate 180 degrees, and the rotary cylinder is used for controlling the second bearing piece to rotate 180 degrees.
Finally, through the bearing face that is formed in the bearing groove, because the profile of the cell wall junction of bearing face and bearing groove is unanimous with the profile at wafer edge, and the bearing face forms the arc that the high centre in both ends is low, therefore the midpoint of the cell wall junction of bearing face and bearing groove is for forming the highest bearing point that is used for bearing wafer, when the wafer is placed in the bearing groove the radial both sides of wafer contact with the bearing point respectively, thereby effectively reduced the area of contact of department between wafer and the bearing groove, and then effectively avoid the contaminated possibility of wafer.
Drawings
FIG. 1 is a schematic structural view of the entire flip structure of the present invention;
FIG. 2 is a side view of the flip structure of the present invention;
FIG. 3 is a cross-sectional view of a set of the first and second supporting means of FIG. 1 taken along the X-axis;
FIG. 4 is an exploded view of the roll-over stand, lift assembly and translation assembly of the present invention;
FIG. 5 is an enlarged view of portion A of FIG. 2;
FIG. 6 is a partial schematic view of a first support member of the present invention;
FIG. 7 is a partial schematic view of a second bearing of the present invention;
FIG. 8 is an enlarged view of portion B of FIG. 2;
FIG. 9 is an enlarged view of portion C of FIG. 3;
FIG. 10 is an enlarged view of portion D of FIG. 3;
FIG. 11 is an enlarged view of section E of FIG. 4;
FIG. 12 is a schematic view of a second support member stably clamping a wafer according to the present invention;
FIG. 13 is a schematic view of the first support member supporting a wafer in an initial state according to the present invention;
fig. 14 is a schematic structural view showing a state where the first supporting means and the second supporting means are turned over by 90 ° in the present invention.
Detailed Description
The present invention is described in detail with reference to the embodiments shown in the drawings, but it should be understood that these embodiments are not intended to limit the present invention, and those skilled in the art should understand that functional, methodological, or structural equivalents or substitutions made by these embodiments are within the scope of the present invention.
Referring to fig. 1 to 14, in comparison with a conventional wafer cleaning machine turnover structure, the turnover structure supports two radial sides of a wafer 6 through a supporting groove 12 formed in a first supporting member 11, then controls a lifting assembly 4 to lift the first supporting member 11 upward by a certain height until a lower edge of each supporting groove 12 faces a lower edge of each clamping groove 22, controls a translation assembly 5 to move the first supporting member 11 toward a second supporting member 21 until the wafer 6 supported in each supporting groove 12 is inserted into the clamping groove 22 formed in each second supporting member 21, achieves a purpose of stably clamping the wafer 6 after an arc surface 222 of the clamping groove 22 is attached to an edge of the wafer 6, and then drives a turnover frame 32 to turn 90 ° integrally through a turnover motor 331 to achieve a purpose of turning over the wafer 6. Through the arrangement, the purpose of stably supporting and clamping each wafer 6 can be achieved only by controlling the lifting and the translation of the first bearing piece 11, and compared with the prior art, the overturning structure is effectively simplified by controlling the mutual approaching and the keeping away of the bearing piece and the clamping piece through two groups of driving parts respectively, so that the wafer is convenient to overhaul and maintain. After the wafer 6 is turned over, the wafer 6 is pushed out from the holding groove 22 and the supporting groove 12 by a jacking mechanism (not shown), and the wafer 6 is received by the supporting mechanism (not shown), so that the wafer 6 which is turned over by 90 degrees can be wholly moved out from the turning structure of the wafer cleaning machine.
Referring to fig. 1 to 14, in the present embodiment, a wafer cleaning machine flip structure (hereinafter referred to as a flip structure) includes: the wafer supporting device comprises a first supporting device 1, a second supporting device 2 and a rack 3 for mounting the first supporting device 1 and the second supporting device 2, wherein the first supporting device 1 comprises two first supporting pieces 11 for supporting two radial sides of a wafer 6, and the second supporting device 2 comprises two second supporting pieces 21 for clamping the wafer 6; the two first supporting pieces 11 are sequentially distributed with a plurality of supporting grooves 12 for supporting two radial sides of the wafer 6 along the axial direction, the two second supporting pieces 21 are sequentially distributed with a plurality of clamping grooves 22 for clamping the wafer 6 along the axial direction, and a lifting component 4 for controlling the lifting of the two first supporting pieces 11 and a translation component 5 for controlling the two first supporting pieces 11 to be respectively close to or far away from the two second supporting pieces 21 are installed in the machine frame 3; after the lifting assembly 4 drives the two first supporting members 11 to rise, the translation assembly 5 drives the two first supporting members 11 to translate towards the two second supporting members 21, and the wafer 6 in each supporting slot 12 is clamped in each clamping groove 22.
Before the wafer 6 needs to be turned over, a plurality of wafers 6 are firstly placed into each supporting groove 12 in sequence by a manipulator (not shown) of the wafer cleaning machine, the depth of each supporting groove 12 is larger than the thickness of the wafer 6, so that the manipulator (not shown) is inserted into the supporting groove 12 and places the wafer 6 into the supporting groove 12, and the manipulator is withdrawn from the supporting groove 12 after the supporting grooves 12 formed by the two first supporting pieces 11 which are symmetrically arranged provide stable supporting force for the radial two sides of the wafer 6. Then, the lifting assembly 4 drives the two first supporting pieces 11 to rise to the same level as the clamping groove 22 of the groove wall of each supporting groove 12 contacted with the wafer 6, and then the translation assembly 5 drives the first supporting pieces 11 to move towards the second supporting pieces 21 to the position that the wafer 6 in each supporting groove 12 is inserted into one clamping groove 22.
Referring to fig. 2 to 4, 11 and 12, a mounting plate 31 is disposed in the frame 3 parallel to the plane of the wafer 6, the translation assembly 5 includes a translation cylinder 51 fixedly connected to the mounting plate 31, a slide rail 52 and a translation plate 53 disposed parallel to the mounting plate 31, the slide rail 52 is connected to the mounting plate 31 and disposed perpendicular to the length direction of the mounting plate 31, a slide block 531 slidably engaged with the slide rail 52 is fixedly mounted on one side of the translation plate 53 close to the mounting plate 31, the driving end of the translation cylinder 51 drives the translation plate 53 to move along the length direction of the slide rail 52, and the bottom ends of the two first supporting members 11 vertically penetrate through the mounting plate 31 and are slidably connected. When the wafer 6 in each supporting groove 12 of the first supporting member 11 is controlled to be placed in the clamping groove 22, firstly, after the lower edge of each supporting groove 12 is aligned with the lower edge of the clamping groove 22 through the lifting assembly 4, the translation cylinder 51 pushes the translation plate 53 to drive the first supporting member 11 to integrally translate towards the second supporting member 21, the slider 531 connected to the lower surface of the translation plate 53 moves along the length direction of the slide rail 52 fixed on the mounting plate 31 in the process of translating the translation plate 53 until the wafer 6 in each supporting groove 12 of the first supporting member 11 is inserted into the clamping groove 22 of the second supporting member 21, and the clamping groove 22 is attached to the edge of the wafer 6 to clamp the upper and lower sides of the wafer 6, so that stable clamping can be provided for the wafer 6 in the process of integrally overturning the rack 3 to prevent the wafer 6 from falling from the clamping groove 22 in the overturning process.
Referring to fig. 2 to 11, the lifting assembly 4 includes a lifting cylinder 41, a guide block 42, a guide wheel 43, and a lifting plate 44, the lifting plate 44 is parallel to the translation plate 53 and located on a side of the translation plate 53 away from the mounting plate 31, the lifting cylinder 41 is fixedly connected to a side of the translation plate 53 away from the mounting plate 31, a driving end of the lifting cylinder 41 is connected to the guide block 42 and drives the guide block 42 to slide along a direction parallel to a length direction of the slide rail 52; the guide wheel 43 is connected to one side of the lifting plate 44 close to the translation plate 53 and abuts against the top surface of the guide block 42, the top surface of the guide block 42 is provided with an inclined guide surface 421, due to the height difference of the guide surface 421, the guide surface 421 of the guide block 42 can push the guide wheel 43 and the lifting plate 44 to ascend in the process of extending the driving end of the lifting cylinder 41, and the bottom ends of the two first supporting pieces 11 penetrate through the lifting plate 44 and are fixed. The guide block 42 is close to the translation plate 53 and forms a guide groove 422 with the junction of the side close to the guide wheel 43, the groove wall of the guide groove 422 close to the guide surface 421 is parallel to the guide surface 421, the number of the guide wheels 43 is two, and the two guide wheels 43 are respectively parallel to the groove wall of the guide surface 421 with the guide surface 421 and the guide groove 422.
When the wafer 6 needs to be turned over, after the robot (not shown) places the wafer 6 into the supporting groove 12, the piston rod of the lifting cylinder 41 extends out to push the guide block 42 to move toward the direction close to the second supporting member 21, due to the arrangement of the guide surface 421 formed on the top surface of the guide block 42 and the guide groove 422 opened on the side surface of the guide block 42, the two guide wheels 43 are respectively matched with the guide surface 421 and the groove wall of the guide groove 422 parallel to the guide surface 421, in the process of translating the guide block 42, since the height of the guide surface 421 close to one side of the lifting cylinder 41 is higher than that of the other side, the two guide wheels 43 respectively move upwards along the groove walls of the guide surface 421 and the guide groove 422 gradually in the process of gradually leaving the lifting cylinder 41, and the guide wheels 43 drive the lifting plate 44 fixed thereto to ascend until the first supporting member 11 fixed to the lifting plate 44 rises to each supporting groove 12 for supporting the groove wall of the wafer 6 facing to each clamping groove 22 opened on the second supporting member 21 for clamping the lower edge of the wafer 6.
Referring to fig. 9 and 11, the upper surface of the translation plate 53 is provided with a guide rail 532 parallel to the slide rail 52, the lower surface of the guide block 42 is fixedly connected with a guide block (not shown), and the guide block (not shown) is in sliding fit with the guide rail 532. The two limiting posts 533 are vertically fixed on the upper surface of the translation plate 53, when the guide wheel 43 moves to the highest point or the lowest point along the guide block 42, the two ends of the guide block 42 respectively abut against the two limiting posts 533, so as to achieve the purpose of controlling the alignment between the bracket 12 and the clamping groove 22, and simultaneously prevent the guide block (not shown) from being separated from the guide rail 532. Through the arrangement, when the turnover structure is assembled, the position of the limiting column 533 can be adjusted according to actual needs, the limiting column 533 is installed after the bearing groove 12 and the clamping groove 22 are located at the same height capable of clamping the wafer when the device is debugged, and therefore the first bearing piece 11 and the second bearing piece 21 are prevented from having installation errors to the minimum extent, and the problem that the wafer 6 is unstable in clamping and falls off due to inaccurate alignment between the clamping groove 22 and the bearing groove 12 is caused. As shown in fig. 5, the first support member 11 is raised to a height L.
Referring to fig. 3 and 10, the upper surface of the lifting plate 44 is fixedly connected with two rotary cylinders 441, top ends of driving ends of the two rotary cylinders 441 are respectively connected with the first supporting member 11 and drive the first supporting member 11 to rotate 180 °, the supporting brackets 12 are symmetrically distributed on two sides of the first supporting member 11, and the driving ends of the rotary cylinders 441 rotate 180 ° to form the supporting brackets 12 on the other side of the first supporting member 11 for supporting the wafer 6. The first supporting unit 1 further includes a first supporting portion 13 disposed along the Z-axis shown in fig. 1, the first supporting portion 13 includes a sleeve 132 and a lifting shaft 131, wherein the top end of the lifting shaft 131 is fixedly connected to the lower surface of the lifting plate 44, the sleeve 132 passes through the translation plate 53 and is fixedly connected to the translation plate 53, and the lifting shaft 131 axially passes through the sleeve 132 and is slidably connected to the sleeve 132. The mounting plate 31 is provided with a guide hole 312 parallel to the slide rail 52, and the sleeve 132 and the bottom end of the lifting shaft 131 pass through the guide hole 312 and are in sliding fit. Through the arrangement, in the process of the displacement of the translation plate 53, the sleeve 132 fixed with the translation plate 53 is displaced along with the translation plate 53, and due to the axial fit between the lifting shaft 131 and the sleeve 132, the lifting shaft 131 is displaced along with the sleeve 132 in the process of the displacement of the sleeve 132 along with the translation plate 53, and the sleeve 132 and the bottom end of the lifting shaft 131, which extends out of the guide hole 312, slide along the length direction of the guide hole 312. Moreover, since the top end of the lifting shaft 131 is fixed to the lifting plate 44, during the lifting of the lifting plate 44, the lifting shaft 131 is lifted together with the lifting plate 44, and the part of the lifting shaft 131 located in the sleeve 132 slides in the sleeve 132, so that the functions of the first support 11, the lifting assembly 4 and the translation assembly 5 can be integrated by the arrangement of the sleeve 132 and the lifting shaft 131, and the purpose of stably clamping the wafer 6 can be achieved by only controlling the displacement of the first support 11 in the X, Z axial direction as shown in fig. 1.
Referring to fig. 6 to 13, the groove wall of the supporting groove 12 for supporting the wafer 6 forms a supporting surface 121, the supporting surface 121 is a cambered surface, the heights of the two sides of the supporting surface 121 are higher than the height of the midpoint, and the contour of the joint of the supporting surface 121 and the groove wall is consistent with the edge of the wafer 6. The holding groove 22 includes an arc-shaped surface 222 adapted to the edge of the wafer 6 and slopes 221 connected to the upper and lower sides of the arc-shaped surface 222, wherein the distance between the two slopes 221 away from the arc-shaped surface 222 is smaller than the distance between the slopes 222 and the sides connected to the arc-shaped surface 222. When bearing the wafer 6 in bearing groove 12, because bearing face 121 is the profile that the arc set up and bearing face 121 and bearing groove 12 junction is unanimous with wafer 6, consequently wafer 6 only contacts with the arc profile of bearing face 121 and bearing groove 12 junction when arranging in bearing groove 12, compare in the mode that a whole among the prior art carries out the bearing to wafer 6, improve the surface contact between bearing groove 12 and the wafer 6 into line contact, effectively reduced the area of contact between the cell wall of bearing groove 12 and the wafer 6, thereby avoided because the too big problem of the pollution wafer that can exist of area of contact between wafer 6 and the bearing groove 12. As shown in fig. 13, in a state that the piston rod of the translation cylinder 51 is not extended, a large distance exists between the first supporting member 11 and the second supporting member 21, at this time, the wafer 6 is supported only by the contact contour line of the supporting surface 121 and the supporting groove 12, and the central angle of the contact contour line of the supporting surface 121 and the supporting groove 12 is 25 °, so that the two symmetrically arranged supporting grooves 12 can respectively support the wafer within a circumferential range of 25 ° to provide effective support; as shown in fig. 12, after the piston rod of the translation cylinder 51 is extended, the wafer 6 is inserted into the holding groove 22 until the periphery of the wafer 6 is attached to the arc-shaped surface 222. In this embodiment, the angle between the side of the two clamping grooves 22 away from each other and the line connecting the centers of the two wafers 6 is 145 °, which is close to the radial clamping effect of the wafers 6, so that the second supporting member 21 can provide an effective and stable clamping effect for the wafers 6 during the turning process.
Referring to fig. 1 to 14, the rack 3 includes a roll-over stand 32 and two side plates 33, the roll-over stand 32 includes a bottom plate 321 and a back plate 322, the bottom plate 321 is parallel to the mounting plate 31 and is located on one side of the mounting plate 31 away from the first supporting member 11, the back plate 322 is vertically fixed on one side of the bottom plate 321 in the length direction, and the back plate 322 is connected to a mounting frame 323 for mounting the second supporting member 21; the two side plates 33 are vertically arranged on two opposite sides of the back plate 322, the side plates 33 are provided with the turning motor 331, and the driving end of the turning motor 331 passes through the side plates 33 and then is fixed with the mounting frame 323. The mounting frame 323 comprises a connecting plate 3231 parallel to the length direction of the back plate 322 and two fixing plates 3232 vertically fixed between the connecting plate 3231 and the back plate 322, one side of the connecting plate 3231, which is far away from the back plate 322, is connected with two mounting blocks 3233, the two second supporting pieces 21 are respectively rotatably connected in one mounting block 3233, and the mounting block 3233 is connected with a rotating cylinder 3234 for controlling the second supporting piece 21 to rotate 180 degrees. The mounting plate 31 is connected to the bottom plate 321 by a vertically disposed reinforcing plate 311, the protective plate 332 is vertically fixed between the two side plates 33, and the protective plate 332 is disposed below the bottom plate 321.
In this embodiment, the two reinforcing plates 311 are integrally formed with the two fixing plates 3232, the two integrally formed fixing plates 3232 and the reinforcing plate 311 are vertically fixed between the bottom plate 321 and the back plate 322, the mounting plate 31 is connected to the upper surfaces of the two reinforcing plates 311, the driving end of the flipping motor 331 penetrates through the side plate 33 and then is connected to the fixing plate 3232, and the flipping frame 32, the mounting plate 31, the lifting assembly 4 and the translating assembly 5 are compactly assembled together through the above arrangement, so that the first supporting device 1 and the second supporting device 2 can be driven to flip when the flipping motor 331 is started. When the wafer 6 is inserted into the two clamping grooves 22 respectively and the edge of the wafer 6 is attached to the arc-shaped surface 222, at this time, the wafer 6 reaches a stable clamping state in the clamping grooves 22, the flipping motor 331 can be started to drive the flipping frame 32 to flip integrally, the first supporting device 1 and the second supporting device 2 mounted on the frame 3 rotate together with the flipping frame 32, when the rotor of the flipping motor 331 rotates by 90 °, the frame 3 and the first supporting device 1 and the second supporting device 2 rotate by 90 ° synchronously, and the wafer 6 clamped in the clamping groove 22 completes the 90 ° flipping, in this embodiment, when the flipping frame 32 rotates by 90 °, the states of the first supporting member 11 and the second supporting member 21 are as shown in fig. 14, a speed reducer 34 is disposed between the flipping motor 331 and the side plate 33, and the speed reducer 34 is connected to a sensor 341 for detecting the initial state of the flipping frame 32.
Referring to fig. 1 to 14, the turning motor 331 drives the turning frame 32 to turn toward the side close to the second supporting member 21, and meanwhile, the side of the connecting plate 3231 away from the mounting block 3233 is connected to the retaining column 7 by sliding through a sliding rail (not labeled), the height of the retaining column 7 is consistent with that of the second supporting portion 23, and the position of the retaining column 7 on the sliding rail (not labeled) is adjusted by sliding, so that the retaining column 7 is attached to the edge of the wafer 6. In the process of roll-over stand 32 upset, because roll-over stand 32's upset direction sets up to whole orientation and is close to second support 21 one side, the cooperation with the setting of 6 edge joints's of wafer bumping post 7, provide effectual support and spacing to wafer 6 in the roll-over process of wafer 6 to avoid the condition that wafer 6 drops and take place the damage in the roll-over process. After the wafer 6 is turned over, the wafer 6 is still held in the holding groove 22, as shown in fig. 6, the height of the supporting groove 12 is greater than the thickness of the wafer 6, when the wafer 6 that has been turned over needs to be taken out from the turning structure, a robot (not shown) of the wafer cleaning machine is inserted into a gap between the side of the supporting groove 12 far from the supporting surface 121 and the wafer 6 to support the lower surface of the wafer 6 to lift the wafer 6 out, then the driving end of the turning motor 331 is reversed, the first supporting member 11 and the second supporting member 21 return to the positions shown in fig. 2, the piston rod of the translation cylinder 51 retracts to drive the first supporting portion 13 to be far away from the second supporting portion, and then the piston rod of the lifting cylinder 41 retracts to the position where the guide wheel 43 moves to the lower position of the guide surface 421 for the next wafer turning operation.
Referring to fig. 3 and 11, the clamping grooves 22 are centrally and symmetrically distributed on both sides of the second support member 21, and the driving end of the rotating cylinder 3234 rotates 180 ° to form the clamping groove 22 on the other side of the second support member 21 to clamp the wafer 6. After the wafer 6 is turned over once and the roll-over stand 32 returns to the original position, the second supporting piece 21 is controlled to rotate 180 degrees through the rotating cylinder 3234, the clamping grooves 22 which are centrally and symmetrically distributed on the other side of the second supporting piece 21 rotate to the clamping station, and the clamping grooves 22 which are just used for clamping the wafer 6 rotate to the other side; through the first bearing piece 11 of above-mentioned revolving cylinder 441 control and rotate 180, axisymmetric distribution rotates to the bearing station in the bearing groove 12 of first bearing piece 11 opposite side, and just is used for the bearing groove 12 of bearing wafer 6 to rotate to the opposite side, through the aforesaid setting, when reaching the effect that avoids contaminated bearing groove 12 and centre gripping groove 22 to pollute subsequent waiting to overturn the wafer, so that clear up bearing groove 12 and centre gripping groove 22 that receive the pollution. The second supporting part 23 is axially connected with the second supporting device 2, the second supporting part 23 axially penetrates through the mounting block 3233, the second supporting part 23 is rotatably connected with the mounting block 3233 through a bearing 231, and the bearing 231 plays an effective supporting role while achieving the effect of connecting the second supporting part 23 with the mounting block 3233. The bottom end of the mounting block 3233 is provided with a connecting piece 3235 for connecting the rotary cylinder 441, and the bottom end of the second supporting portion 23 is connected with the driving end of the rotary cylinder 441 after penetrating through the mounting block 3233.
The above-listed detailed description is merely a detailed description of possible embodiments of the present invention, and it is not intended to limit the scope of the invention, and equivalent embodiments or modifications made without departing from the technical spirit of the present invention are intended to be included within the scope of the present invention.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (10)
1. A wafer cleaning machine flip structure, which is characterized by comprising: the wafer clamping device comprises a first supporting device, a second supporting device and a rack for mounting the first supporting device and the second supporting device, wherein the first supporting device comprises two first supporting pieces for supporting two radial sides of a wafer, and the second supporting device comprises two second supporting pieces for clamping the wafer;
the two first supporting pieces are sequentially distributed with a plurality of supporting grooves for supporting two radial sides of a wafer along the axial direction, the two second supporting pieces are sequentially distributed with a plurality of clamping grooves for clamping the wafer along the axial direction, and a lifting component for controlling the two first supporting pieces to lift and a translation component for controlling the two first supporting pieces to respectively approach or keep away from the two second supporting pieces are installed in the rack;
after the lifting assembly drives the two first bearing pieces to rise, the translation assembly drives the two first bearing pieces to translate towards the two second bearing pieces to the wafer in each bearing groove to be clamped in each clamping groove.
2. The wafer cleaning machine turnover structure of claim 1, wherein a mounting plate is disposed in the frame parallel to a plane of the wafer, the translation assembly includes a translation cylinder fixedly connected to the mounting plate, a slide rail, and a translation plate disposed parallel to the mounting plate, the slide rail is connected to the mounting plate and disposed perpendicular to a length direction of the mounting plate, a slide block slidably engaged with the slide rail is fixedly mounted on a side of the translation plate close to the mounting plate, a driving end of the translation cylinder drives the translation plate to move along the length direction of the slide rail, and bottom ends of the two first supporting members vertically penetrate through the mounting plate and are slidably connected.
3. The wafer cleaning machine turnover structure of claim 2, wherein the lifting assembly comprises a lifting cylinder, a guide block, a guide wheel and a lifting plate, the lifting plate is parallel to the translation plate and is located on one side of the translation plate, which is far away from the mounting plate, the lifting cylinder is fixedly connected to one side of the translation plate, which is far away from the mounting plate, and a driving end of the lifting cylinder is connected with the guide block and drives the guide block to slide along a direction parallel to the length direction of the slide rail;
the guide wheel connect in the lifter plate is close to translation board one side and support hold in the top surface of guide block, the top surface of guide block sets up to be formed with the spigot surface of slope, the drive end of lift cylinder stretches out the in-process the spigot surface of guide block promotes the guide wheel and the lifter plate rises, two first supporting piece bottom is passed the lifter plate is fixed.
4. The wafer cleaning machine turnover structure of claim 3, wherein the upper surface of the lifting plate is fixedly connected with two rotary cylinders, top ends of driving ends of the two rotary cylinders are respectively connected with the first supporting member and drive the first supporting member to rotate 180 °, the supporting brackets are symmetrically distributed on two sides of the first supporting member, and the driving ends of the rotary cylinders rotate 180 ° to form supporting grooves on the other side of the first supporting member for supporting the wafer.
5. The wafer cleaning machine overturning structure as claimed in claim 4, wherein the slot wall of the supporting slot for supporting the wafer forms a supporting surface, the supporting surface is set to be a cambered surface, the heights of two sides of the supporting surface are higher than the height of the midpoint, and the contour of the joint of the supporting surface and the slot wall is consistent with the edge of the wafer.
6. The wafer cleaning machine turnover structure of claim 2, wherein the frame comprises a turnover frame and two side plates, the turnover frame comprises a bottom plate and a back plate, the bottom plate is parallel to the mounting plate and is positioned on one side of the mounting plate away from the first supporting piece, the back plate is vertically fixed on one side of the bottom plate in the length direction, and the back plate is connected with a mounting frame for mounting the second supporting piece;
the two side plates are vertically arranged on two opposite sides of the back plate, the side plates are provided with turnover motors, and the driving ends of the turnover motors penetrate through the side plates and then are fixed with the mounting rack.
7. The wafer cleaning machine turnover structure of claim 6, wherein the mounting frame comprises a connecting plate parallel to the length direction of the back plate and two fixing plates vertically fixed between the connecting plate and the back plate, one side of the connecting plate away from the back plate is connected with two mounting blocks, the two second supporting members are respectively and rotatably connected in one mounting block, and the mounting blocks are connected with a rotating cylinder for controlling the second supporting members to rotate 180 degrees;
the centers of the clamping grooves are symmetrically distributed on two sides of the second supporting piece, and the driving end of the rotating cylinder rotates 180 degrees to form a clamping groove on the other side of the second supporting piece for clamping the wafer.
8. The wafer cleaning machine flip structure of claim 6, wherein the clamping slot comprises an arc-shaped surface adapted to the edge of the wafer and slopes connected to the upper and lower sides of the arc-shaped surface, and the distance between the two slopes away from the arc-shaped surface is smaller than the distance between the slopes connected to the arc-shaped surface.
9. The wafer cleaning machine turnover structure of claim 3, wherein a guide groove is formed at a junction of a side of the guide block close to the translation plate and a side of the guide block close to the guide wheel, a groove wall of the guide groove close to the guide surface is arranged parallel to the guide surface, the number of the guide wheels is two, and the two guide wheels are respectively arranged with the guide surface and a groove wall of the guide groove parallel to the guide surface.
10. The wafer cleaning machine turnover structure of claim 6, wherein the mounting plate is connected to the bottom plate through a vertically disposed reinforcing plate, and a protective plate is vertically fixed between the two side plates and disposed below the bottom plate.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211360804.3A CN115410984A (en) | 2022-11-02 | 2022-11-02 | Wafer cleaning machine flip structure |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211360804.3A CN115410984A (en) | 2022-11-02 | 2022-11-02 | Wafer cleaning machine flip structure |
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| CN202211360804.3A Pending CN115410984A (en) | 2022-11-02 | 2022-11-02 | Wafer cleaning machine flip structure |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116913848A (en) * | 2023-05-31 | 2023-10-20 | 江苏亚电科技有限公司 | Wafer overturning device |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JPH11163088A (en) * | 1997-12-02 | 1999-06-18 | Dainippon Screen Mfg Co Ltd | Wafer processing system |
| CN113078089A (en) * | 2021-06-07 | 2021-07-06 | 北京北方华创微电子装备有限公司 | Wafer transfer device, semiconductor process equipment and wafer transfer control method |
| CN113745139A (en) * | 2021-05-07 | 2021-12-03 | 上海大族富创得科技有限公司 | Wafer transfer system and method |
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2022
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11163088A (en) * | 1997-12-02 | 1999-06-18 | Dainippon Screen Mfg Co Ltd | Wafer processing system |
| CN113745139A (en) * | 2021-05-07 | 2021-12-03 | 上海大族富创得科技有限公司 | Wafer transfer system and method |
| CN113078089A (en) * | 2021-06-07 | 2021-07-06 | 北京北方华创微电子装备有限公司 | Wafer transfer device, semiconductor process equipment and wafer transfer control method |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116913848A (en) * | 2023-05-31 | 2023-10-20 | 江苏亚电科技有限公司 | Wafer overturning device |
| CN116913848B (en) * | 2023-05-31 | 2024-03-29 | 江苏亚电科技股份有限公司 | Wafer overturning device |
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Application publication date: 20221129 |