CN219873464U - Wafer positioning structure and full-automatic wet cleaning equipment - Google Patents

Abstract

The utility model belongs to the technical field of cleaning, and particularly relates to a wafer positioning structure and full-automatic wet cleaning equipment, wherein a plurality of movable long holes are formed in a carrier plate along the radial direction of the carrier plate; the positioning mechanisms correspond to the movable long holes, are arranged below the carrier plate and extend out of the corresponding movable long holes; the positioning mechanisms are suitable for synchronously moving in the moving long holes so as to adjust the distance between each positioning mechanism and the center of the carrier plate and adapt to wafers with corresponding sizes; the wafer positioning device is suitable for wafers with different sizes, and is convenient for positioning the wafers with different sizes before drying or wet cleaning.

Description

Wafer positioning structure and full-automatic wet cleaning equipment

Technical Field

The utility model belongs to the technical field of cleaning, and particularly relates to a wafer positioning structure and full-automatic wet cleaning equipment.

Background

In the cleaning industry, in full-automatic wet cleaning equipment, a single wafer is required to be cleaned, the wafer is required to be positioned, and then the positioned wafer is placed into a cleaning cavity by a mechanical arm, so that the accuracy of the position of the wafer in the cleaning process is ensured, and the cleaning effect is ensured; at the same time, the risk of wafer damage caused by incorrect positioning of the striker is avoided. Some cleaning processes require compatibility with wafers of multiple specifications. The wafer is generally fed by a manipulator before the single wafer is cleaned, so that at present, several conditions exist, the first wafer is fragile and fragile, the grabbing precision is important, the second same equipment can be used for cleaning wafers with different sizes, the conventional common solution is to additionally arrange a vision component on the feeding part of the manipulator, so that the size of the wafer can be judged, the position of the manipulator can be adjusted, the grabbing precision is also obvious, and the first moment increases the load of the manipulator because the single wafer grabs the manipulator is very small.

Therefore, a new wafer positioning structure and a full-automatic wet cleaning device are needed to be designed based on the technical problems.

Disclosure of Invention

The utility model aims to provide a wafer positioning structure and full-automatic wet cleaning equipment, so as to solve the technical problem of adapting wafers with various sizes.

In order to solve the above technical problems, the present utility model provides a wafer positioning structure, including:

the support plate is provided with a plurality of movable long holes along the radial direction of the support plate;

the positioning mechanisms correspond to the movable long holes, are arranged below the carrier plate and extend out of the corresponding movable long holes;

the positioning mechanisms are suitable for synchronously moving in the moving long holes so as to adjust the distance between each positioning mechanism and the center of the carrier plate and adapt to wafers with corresponding sizes.

Further, the wafer positioning structure further includes: a driving mechanism;

the driving mechanism is connected with each positioning mechanism and is suitable for driving the positioning mechanisms to move in the corresponding moving long holes.

Further, a plurality of connecting holes are formed in the carrier plate at equal intervals in the circumferential direction, and the connecting holes are arranged close to the edges of the carrier plate.

Further, a plurality of support columns are arranged on the support plate, and the heights of the support columns are lower than the heights of the positioning mechanisms extending out of the movable long holes.

Further, the positioning mechanism includes: a bottom plate;

a plurality of connecting columns are circumferentially and equidistantly arranged on the bottom plate, and the connecting columns are arranged close to the edge of the bottom plate;

a groove is formed in the side wall of the connecting column;

the connecting column corresponds to the connecting hole, and is suitable for extending out of the corresponding connecting hole;

a plurality of positioning components are circumferentially equidistant on the bottom plate and are suitable for extending out of the corresponding movable long holes.

Further, a through hole is formed in the center of the bottom plate.

Further, the positioning assembly includes: a slide rail;

the sliding rail is arranged along the radial direction of the bottom plate;

an adaptive sliding block is arranged on the sliding rail;

the sliding block is provided with a positioning column which is suitable for extending out of the movable long hole;

and a bearing is sleeved on the positioning column.

Further, the top end of the support column is a spherical surface.

Further, the driving mechanism includes: the motor, the speed reducer and the rotating plate;

the motor is connected with the speed reducer;

the rotating end of the speed reducer is connected with the rotating plate;

the rotating plate is arranged between the bottom plate and the carrier plate;

the rotating plate is obliquely provided with strip-shaped holes corresponding to the movable long holes, and the inclination degree of each strip-shaped hole is the same;

the bearings in the positioning mechanisms are arranged in the corresponding strip-shaped holes, and the bearings are matched with the inner walls of the strip-shaped holes;

the bottom plate in the positioning mechanism is arranged on the speed reducer.

On the other hand, the utility model also provides full-automatic wet cleaning equipment adopting the wafer positioning structure, which comprises the following components:

the cleaning device is arranged above the wafer positioning structure and is suitable for cleaning the wafer positioned on the wafer positioning structure.

The utility model has the beneficial effects that the carrier plate is provided with a plurality of movable long holes along the radial direction of the carrier plate; the positioning mechanisms correspond to the movable long holes, are arranged below the carrier plate and extend out of the corresponding movable long holes; the positioning mechanisms are suitable for synchronously moving in the moving long holes so as to adjust the distance between each positioning mechanism and the center of the carrier plate and adapt to wafers with corresponding sizes; the wafer positioning device is suitable for wafers with different sizes and is convenient to position the wafers with different sizes.

Additional features and advantages of the utility model will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the utility model. The objectives and other advantages of the utility model will be realized and attained by the structure particularly pointed out in the written description and drawings.

In order to make the above objects, features and advantages of the present utility model more comprehensible, preferred embodiments accompanied with figures are described in detail below.

Drawings

In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the drawings that are needed in the description of the embodiments or the prior art will be briefly described, and it is obvious that the drawings in the description below are some embodiments of the present utility model, and other drawings can be obtained according to the drawings without inventive effort for a person skilled in the art.

FIG. 1 is a schematic view of a wafer positioning structure according to the present utility model;

FIG. 2 is a schematic view of a carrier plate according to the present utility model;

FIG. 3 is a schematic view of the driving mechanism of the present utility model;

FIG. 4 is a schematic view of the positioning mechanism of the present utility model;

FIG. 5 is an exploded view of a wafer positioning structure according to the present utility model.

In the figure:

1, a carrier plate, 11 moving long holes, 12 connecting holes and 13 supporting columns;

the positioning mechanism, the 21 bottom plate, the 22 connecting column, the 23 groove, the 24 through hole, the 25 slide rail, the 26 slide block, the 27 positioning column and the 28 bearing are arranged;

3 driving mechanism, 31 motor, 32 speed reducer, 33 rotation plate, 34 bar hole.

Detailed Description

For the purpose of making the objects, technical solutions and advantages of the embodiments of the present utility model more apparent, the technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings, and it is apparent that the described embodiments are some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Example 1

As shown in fig. 1 to 5, embodiment 1 provides a wafer positioning structure, including: the support plate 1, a plurality of movable long holes 11 are formed in the support plate 1 along the radial direction of the support plate 1; a plurality of positioning mechanisms 2, wherein the positioning mechanisms 2 correspond to the movable long holes 11, the positioning mechanisms 2 are arranged below the carrier plate 1, and the positioning mechanisms 2 extend out of the corresponding movable long holes 11; the positioning mechanisms 2 are suitable for synchronously moving in the moving long holes 11 so as to adjust the distance between each positioning mechanism 2 and the center of the carrier plate 1 and adapt to wafers with corresponding sizes; the wafer alignment device has the advantages that wafers with different sizes are matched, the wafers with different sizes are conveniently positioned, the wafers can be aligned to the center position (circle center) of the carrier plate 1 through the movement of the positioning mechanism 2, the alignment of the wafers is realized, no matter the sizes of the wafers, the circle center of the wafers is ensured to coincide with the circle center of the carrier plate 1 by adopting the positioning mechanism 2, and the grabbing position of the manipulator is fixed because the wafer positioning structure is fixed on the ground; the width of the moving long hole 11 may be slightly larger than the width of the positioning post 27, facilitating the passage of the positioning post 27.

In this embodiment, the wafer positioning structure further includes: a driving mechanism 3; the driving mechanism 3 is connected with each positioning mechanism 2, and the driving mechanism 3 is suitable for driving the positioning mechanisms 2 to move in the corresponding moving long holes 11; the distance between the positioning mechanism 2 and the central position of the carrier plate 1 can be adjusted through the driving mechanism 3, so that the size of the range enclosed by all the positioning mechanisms 2 can be adjusted to adapt to wafers with different sizes, such as 6-inch, 8-inch and 12-inch wafers, and the wafers are limited in the area enclosed by all the positioning mechanisms 2.

In this embodiment, a plurality of connection holes 12 are formed on the carrier plate 1 at equal intervals in the circumferential direction, and the connection holes 12 are disposed near the edge of the carrier plate 1; the carrier plate 1 and the bottom plate 21 can be positioned and connected through the connecting holes 12, so that the carrier plate 1 is prevented from rotating.

In this embodiment, the carrier 1 is provided with a plurality of support columns 13, and the height of the support columns 13 is lower than the height of the positioning mechanism 2 extending out of the movable slot 11; the wafer can be supported by the support column 13, and after the support column 13 supports the wafer, the positioning mechanism 2 is driven by the driving mechanism 3 to move towards the center position of the carrier plate 1, so that the positioning mechanism 2 contacts with the edge of the wafer, and the wafer is limited on the support column 13 by the positioning mechanism 2; the top ends of the support columns 13 are spherical, that is, the top ends of the support columns 13 are rounded, so that the wafer can be moved when the positioning columns 27 contact the edge of the wafer, and the rounded top ends of the support columns 13 can facilitate the movement of the wafer.

In this embodiment, the positioning mechanism 2 includes: a bottom plate 21; a plurality of connecting columns 22 are circumferentially and equidistantly arranged on the bottom plate 21, and the connecting columns 22 are arranged close to the edge of the bottom plate 21; a groove 23 is formed in the side wall of the connecting column 22; the connecting posts 22 correspond to the connecting holes 12, and the connecting posts 22 are adapted to extend out of the corresponding connecting holes 12; a plurality of positioning components are circumferentially equidistant on the bottom plate 21, and the positioning components are suitable for extending out of the corresponding movable long holes 11; the connecting posts 22 penetrate through the connecting holes 12, and the connecting posts 22 and the connecting holes 12 can be limited through the grooves 23, so that the bottom plate 21 is connected with the carrier plate 1.

In this embodiment, a through hole 24 is formed at the center of the bottom plate 21; the speed reducer 32 is convenient to pass through the through hole 24 and then is connected with the rotating plate 33, and the speed reducer 32 is convenient to drive the rotating plate 33 to rotate.

In this embodiment, the positioning assembly includes: a slide rail 25; the slide rail 25 is disposed along a radial direction of the bottom plate 21; the slide rail 25 is provided with an adaptive slide block 26; the slide block 26 is provided with a positioning column 27, and the positioning column 27 is suitable for extending out of the movable long hole 11; a bearing 28 is sleeved on the positioning column 27; the positioning column 27 can be provided with a key groove, and the bearing 28 is arranged on the key groove; the sliding block 26 is suitable for moving on the sliding rail 25 so as to drive the positioning column 27 to move on the sliding rail 25; the bearing 28 may be first disposed on the positioning post 27, the positioning post 27 may be fixed on the slide block 26, and the slide block 26 may be disposed on the slide rail 25, so that the slide block 26 may move along the slide rail 25.

In this embodiment, the positioning column 27 may be a cylinder, so as to avoid damage to the wafer caused by collision of the edge with the wafer during the movement of the positioning column 27.

In the present embodiment, the driving mechanism 3 includes: a motor 31, a speed reducer 32, and a rotating plate 33; the motor 31 is connected with the speed reducer 32; the rotating end of the speed reducer 32 is connected with the rotating plate 33; the rotating plate 33 is arranged between the bottom plate 21 and the carrier plate 1; the rotating plate 33 is provided with bar-shaped holes 34 corresponding to the moving long holes 11 in an inclined manner, and the inclination degree of each bar-shaped hole 34 is the same; the number of the strip-shaped holes 34 can be 6, so that the wafer can be centered more accurately; the bearing 28 in the positioning mechanism 2 is arranged in the corresponding strip-shaped hole 34, and the bearing 28 is matched with the inner wall of the strip-shaped hole 34; the bottom plate 21 in the positioning mechanism 2 is arranged on the speed reducer 32; the rotating speed of the motor 31 is reduced and the output torque is improved through the speed reducer 32, the rotating plate 33 is driven to rotate through the speed reducer 32, and the bearing 28 is arranged in the strip-shaped hole 34, so that the bearing 28 drives the positioning column 27 to move along the sliding rail 25 through the strip-shaped hole 34 when the rotating plate 33 rotates, the positioning column 27 is close to or far away from the center position (circle center) of the carrier plate 1, and the positioning column 27 can be reset or the positioning column 27 can limit the wafer.

Example 2

On the basis of embodiment 1, embodiment 2 further provides a full-automatic wet cleaning apparatus adopting the wafer positioning structure in embodiment 1, including: the cleaning device is arranged above the wafer positioning structure and is suitable for cleaning the wafer positioned on the wafer positioning structure. In some cases, the cleaned wafer may be transferred to a drying module by a robot for drying.

In summary, according to the present utility model, through the carrier plate 1, a plurality of moving long holes 11 are formed on the carrier plate 1 along the radial direction of the carrier plate 1; a plurality of positioning mechanisms 2, wherein the positioning mechanisms 2 correspond to the movable long holes 11, the positioning mechanisms 2 are arranged below the carrier plate 1, and the positioning mechanisms 2 extend out of the corresponding movable long holes 11; the positioning mechanisms 2 are suitable for synchronously moving in the moving long holes 11 so as to adjust the distance between each positioning mechanism 2 and the center of the carrier plate 1 and adapt to wafers with corresponding sizes; the wafer positioning device is suitable for wafers with different sizes and is convenient to position the wafers with different sizes.

The components (components not illustrating the specific structure) selected in the present utility model are common standard components or components known to those skilled in the art, and the structures and principles thereof are known to those skilled in the art through technical manuals or through routine experimental methods.

In the description of embodiments of the present utility model, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.

In the description of the present utility model, it should be noted that the directions or positional relationships indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the several embodiments provided by the present utility model, it should be understood that the disclosed systems, devices, and methods may be implemented in other manners. The above-described apparatus embodiments are merely illustrative, for example, the division of the units is merely a logical function division, and there may be other manners of division in actual implementation, and for example, multiple units or components may be combined or integrated into another system, or some features may be omitted, or not performed. Alternatively, the coupling or direct coupling or communication connection shown or discussed with each other may be through some communication interface, device or unit indirect coupling or communication connection, which may be in electrical, mechanical or other form.

The units described as separate units may or may not be physically separate, and units shown as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

In addition, each functional unit in the embodiments of the present utility model may be integrated in one processing unit, or each unit may exist alone physically, or two or more units may be integrated in one unit.

With the above-described preferred embodiments according to the present utility model as an illustration, the above-described descriptions can be used by persons skilled in the relevant art to make various changes and modifications without departing from the scope of the technical idea of the present utility model. The technical scope of the present utility model is not limited to the description, but must be determined according to the scope of claims.

Claims (10)

1. A wafer positioning structure, comprising:

the support plate is provided with a plurality of movable long holes along the radial direction of the support plate;

the positioning mechanisms correspond to the movable long holes, are arranged below the carrier plate and extend out of the corresponding movable long holes;

the positioning mechanisms are suitable for synchronously moving in the moving long holes so as to adjust the distance between each positioning mechanism and the center of the carrier plate and adapt to wafers with corresponding sizes.

2. The wafer positioning structure of claim 1, wherein,

the wafer positioning structure further includes: a driving mechanism;

the driving mechanism is connected with each positioning mechanism and is suitable for driving the positioning mechanisms to move in the corresponding moving long holes.

3. The wafer positioning structure of claim 1, wherein,

a plurality of connecting holes are formed in the carrier plate at equal intervals in the circumferential direction, and the connecting holes are arranged close to the edge of the carrier plate.

4. The wafer positioning structure of claim 1, wherein,

the support plate is provided with a plurality of support columns, and the height of the support columns is lower than the height of the positioning mechanism extending out of the movable long holes.

5. The wafer positioning structure of claim 3,

the positioning mechanism comprises: a bottom plate;

a plurality of connecting columns are circumferentially and equidistantly arranged on the bottom plate, and the connecting columns are arranged close to the edge of the bottom plate;

a groove is formed in the side wall of the connecting column;

the connecting column corresponds to the connecting hole, and is suitable for extending out of the corresponding connecting hole;

a plurality of positioning components are circumferentially equidistant on the bottom plate and are suitable for extending out of the corresponding movable long holes.

6. The wafer positioning structure of claim 5,

and a through hole is formed in the center of the bottom plate.

7. The wafer positioning structure of claim 5,

the positioning assembly includes: a slide rail;

the sliding rail is arranged along the radial direction of the bottom plate;

an adaptive sliding block is arranged on the sliding rail;

the sliding block is provided with a positioning column which is suitable for extending out of the movable long hole;

and a bearing is sleeved on the positioning column.

8. The wafer positioning structure of claim 4,

the top of the support column is spherical.

9. The wafer positioning structure of claim 2, wherein,

the driving mechanism includes: the motor, the speed reducer and the rotating plate;

the motor is connected with the speed reducer;

the rotating end of the speed reducer is connected with the rotating plate;

the rotating plate is arranged between the bottom plate and the carrier plate;

the rotating plate is obliquely provided with strip-shaped holes corresponding to the movable long holes, and the inclination degree of each strip-shaped hole is the same;

the bearings in the positioning mechanisms are arranged in the corresponding strip-shaped holes, and the bearings are matched with the inner walls of the strip-shaped holes;

the bottom plate in the positioning mechanism is arranged on the speed reducer.

10. A full-automatic wet cleaning apparatus employing the wafer positioning structure of claim 1, comprising:

the cleaning device is arranged above the wafer positioning structure and is suitable for cleaning the wafer positioned on the wafer positioning structure.