CN217690518U - Two-sided blackened copper conducting film - Google Patents
Two-sided blackened copper conducting film Download PDFInfo
- Publication number
- CN217690518U CN217690518U CN202221351892.6U CN202221351892U CN217690518U CN 217690518 U CN217690518 U CN 217690518U CN 202221351892 U CN202221351892 U CN 202221351892U CN 217690518 U CN217690518 U CN 217690518U
- Authority
- CN
- China
- Prior art keywords
- copper
- layer
- film
- copper oxide
- ions
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Abstract
The utility model discloses a two-sided copper blackened conducting film, including the PET carrier film, PET carrier film lower extreme face is equipped with first copper oxide coating film layer, and the terminal surface is equipped with first pure copper coating film layer under the first copper oxide coating film layer, and PET carrier film up end is equipped with second pure copper coating film layer, and second pure copper coating film layer up end is equipped with second copper oxide coating film layer. The utility model reduces a layer of PET transparent film by plating copper on the front and back surfaces of the PET carrier film, has thinner total thickness of products, reduces rear end processing procedures, saves cost, has tight combination between each plating layer and the PET film, and is not easy to drop off to cause wire breakage when a fine circuit is subsequently etched; the copper conducting layer is plated with a layer of copper oxide under the condition that the conducting performance is not influenced, air and the like are reduced to be in contact with the conducting layer in the subsequent processing process, the conducting layer is protected, and the conducting layer is prevented from being corroded and oxidized; the black copper oxide film coating layer with low reflectivity can better obstruct a circuit etched subsequently, so that the display effect of the finally manufactured display screen is better.
Description
Technical Field
The utility model relates to a touch-sensitive screen field, especially a two-sided blackening copper conducting film and preparation method thereof.
Background
In the prior art, an ITO conductive film is also used as a low-impedance metal conductive film for a large screen, and is a high-technology product obtained by sputtering an indium tin oxide conductive film coating on ultrathin glass by using a planar cathode magnetron sputtering technology and performing high-temperature annealing treatment. ITO conductive film glasses are widely used in liquid crystal displays, solar cells, microelectronic ITO conductive film glasses, optoelectronics, and various optical fields.
The main parameters of the ITO conductive film are as follows: surface square resistance, surface resistance uniformity, light transmittance, reflectivity difference before and after etching, thermal stability, acid and alkali stability, scratch resistance and the like. Wherein the light transmittance is mainly related to the base material used for the ITO film and the ITO film thickness. Under the condition that the substrate materials are the same, the smaller the surface resistance of the ITO film is, the larger the thickness of the ITO film layer is, and the light transmittance is correspondingly reduced to a certain degree.
The structure of the existing ITO conductive film is as follows: the structure is etched into a line, and the appearance of the touch screen is influenced due to the fact that the ITO electrode line is very obvious in appearance because the reflection difference before and after etching is large. Under visible light, the transmittance of the whole film layer is lower and is only about 88%, and if the resistance value is lower, the transmittance is also lower, so that the reflectivity is high, therefore, under visible light, the etched circuit is very obvious, and the display effect of the display screen can be directly influenced when the etched circuit is used on the display screen.
Because the ITO coating of the ITO conductive film in the prior art is plated on PET with a lower protective layer and then etched into the touch circuit board, although the ITO conductive film is also transparent, the reflection is larger than that of the surface of the PET due to the different refractive index of the ITO conductive film and the PET, and a heavier shadow is generated. In the prior art, the conductive film is prepared by different priming layers (copper nickel, zirconium oxide and the like), or a copper layer is directly plated on a base material in an evaporating way, so that the falling phenomenon can be caused, the adhesive force is not strong, the integral thickness of the conductive film is increased, and the copper layer and the base material are not tightly bonded to cause the generation of light holes.
In addition, when the PET is plated on the back surface, the front surface plating layer is easily affected, and the front surface plating layer is easily scratched, thereby affecting the adhesion of the front surface plating layer.
Disclosure of Invention
The utility model discloses a solve not enough that exist among the prior art, provide a two-sided blackening copper conducting film and preparation method thereof.
In order to achieve the purpose, the utility model is implemented according to the following technical scheme:
the utility model provides a two-sided blackened copper conducting film, includes the PET carrier film, PET carrier film bottom end face is equipped with first copper oxide coating film layer, the terminal surface is equipped with first pure copper coating film layer under the first copper oxide coating film layer, PET carrier film up end is equipped with the pure copper coating film layer of second, the pure copper coating film layer up end of second is equipped with second copper oxide coating film layer.
Furthermore, the reflectivity of the first copper oxide coating layer and the second copper oxide coating layer is more than or equal to 10% and less than or equal to 20%.
Furthermore, the thicknesses of the first pure copper coating layer and the second pure copper coating layer are both 500 nanometers.
Further, the thickness of the first copper oxide coating layer and the second copper oxide coating layer is 200 nanometers.
In addition, the utility model also provides a preparation method of two-sided blackening copper conducting film, including following step:
under the high vacuum state of 10-7Torr, filling argon and oxygen into a first copper rotating target of magnetron sputtering equipment; applying high-voltage direct current of 20A and 460V to ionize argon and oxygen into argon ions and oxygen ions, accelerating the argon ions to impact a pure copper target, and sputtering copper ions; copper ions and oxygen ions are combined to generate copper oxide, the copper oxide is accelerated to be sputtered on the PET carrier film in an electric field, and a black first copper oxide coating film layer with the thickness of 200 nanometers and the reflectivity of more than or equal to 10% and less than or equal to 20% is formed; argon is filled into a second copper rotating target of the magnetron sputtering equipment; applying high-voltage direct current of 20A and 460V to ionize argon into argon ions, accelerating the argon ions to impact a pure copper target, and sputtering copper ions; copper ions are sputtered on the first copper oxide coating layer in an electric field at a high speed to form a first pure copper coating layer with the thickness of 500 nanometers;
turning over the PET carrier film plated with the first copper oxide coating layer and the first pure copper coating layer, and filling argon into a first copper rotating target of magnetron sputtering equipment in a high vacuum state of 10-7 Torr; applying high-voltage direct current of 20A and 460V to ionize argon into argon ions, accelerating the argon ions to impact a pure copper target, and sputtering copper ions; copper ions are accelerated to sputter on the PET carrier film in an electric field to form a second pure copper coating film with the coating thickness of 500 nanometers; filling argon and oxygen into a second copper rotating target of the magnetron sputtering equipment; applying high-voltage direct current of 20A and 460V to ionize argon and oxygen into argon ions and oxygen ions, accelerating the argon ions to impact a pure copper target, and sputtering copper ions; copper ions and oxygen ions are combined to generate copper oxide which is sputtered on the second pure copper coating layer in an electric field in an accelerating way to form a black second copper oxide coating layer with the thickness of 200 nanometers and the reflectivity of not less than 10% and not more than 20%.
Preferably, the flow rate of argon gas is charged at 500sccm and the flow rate of oxygen gas is charged at 200sccm.
Compared with the prior art, the utility model reduces a layer of PET transparent film by plating copper on the front and back surfaces of the PET carrier film, the total thickness of the product is thinner, the rear end processing procedures are reduced, the cost is saved, and the combination between each plating layer and the PET film is tight, so that the plating layer is not easy to fall off to cause wire breakage when a fine line is etched subsequently; the copper conductive layer is plated with a layer of copper oxide on the surface of the copper conductive layer under the condition of not influencing the conductive performance, air and the like are reduced to be in contact with the conductive layer in the subsequent processing process, the conductive layer is protected, the conductive layer is prevented from being corroded and oxidized, and the service life of a product is prolonged; in addition, the black copper oxide coating film layer with low reflectivity can better obstruct the circuit of subsequent etching, so that the display effect of the finally manufactured display screen is better.
Drawings
Fig. 1 is a schematic structural view of the double-sided blackened copper conductive film of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be further described in detail with reference to the following embodiments. The specific embodiments described herein are merely illustrative of the invention and do not limit the invention.
Example 1
In the manufacturing process of the double-sided blackened copper conductive film, the back side is plated firstly, the lower end face of a PET carrier film is turned upwards, argon and oxygen are filled into a first copper rotating target of magnetron sputtering equipment in a 7Torr high vacuum state, the flow of the filled argon is 500sccm, and the flow of the filled oxygen is 200sccm; applying high-voltage direct current of 20A and 460V to ionize argon and oxygen into argon ions and oxygen ions, accelerating the argon ions to impact a pure copper target, and sputtering copper ions; copper ions and oxygen ions are combined to generate copper oxide, the copper oxide is accelerated to sputter on a PET carrier film in an electric field, and a black first copper oxide coating film layer with the thickness of 200 nanometers and the reflectivity of more than or equal to 10% and less than or equal to 20% is formed; argon gas with the flow of 500sccm is filled into a second copper rotating target of the magnetron sputtering equipment; applying high-voltage direct current of 20A and 460V to ionize argon gas into argon ions, accelerating the argon ions to impact a pure copper target material, and sputtering copper ions; copper ions are sputtered on the first copper oxide coating layer in an electric field at a high speed to form a first pure copper coating layer with the thickness of 500 nanometers, wherein the first pure copper coating layer is a conductive layer;
turning over a PET carrier film plated with a first copper oxide coating layer and a first pure copper coating layer, namely turning the upper end face of the PET carrier film upwards, and filling argon with the flow of 500sccm into a first copper rotating target of magnetron sputtering equipment in a high vacuum state of 7 Torr; applying high-voltage direct current of 20A and 460V to ionize argon gas into argon ions, accelerating the argon ions to impact a pure copper target material, and sputtering copper ions; copper ions are accelerated to sputter on the PET carrier film in an electric field to form a second pure copper coating film layer with the coating thickness of 500 nanometers, wherein the second pure copper coating film layer is a conductive layer; filling argon and oxygen into a second copper rotating target of the magnetron sputtering equipment, wherein the flow of the argon is 500sccm, and the flow of the oxygen is 200sccm; applying high-voltage direct current of 20A and 460V to ionize argon and oxygen into argon ions and oxygen ions, accelerating the argon ions to impact a pure copper target material, and sputtering copper ions; copper ions and oxygen ions are combined to generate copper oxide which is accelerated to sputter on the second pure copper coating layer in an electric field, and a black second copper oxide coating layer with the thickness of 200 nanometers and the reflectivity of more than or equal to 10% and less than or equal to 20% is formed.
The prepared double-sided blackened copper conductive film is shown in figure 1 and comprises a PET carrier film 1, wherein a first copper oxide coating layer 4 is arranged on the lower end face of the PET carrier film 1, a first pure copper coating layer 5 is arranged on the lower end face of the first copper oxide coating layer 4, a second pure copper coating layer 2 is arranged on the upper end face of the PET carrier film 1, and a second copper oxide coating layer 3 is arranged on the end face of the second pure copper coating layer 2.
Example 2
In the manufacturing process of the double-sided blackened copper conductive film, the back surface is plated firstly, the lower end face of a PET carrier film is turned upwards, argon and oxygen are filled into a first copper rotating target of magnetron sputtering equipment under the high vacuum state of 10Torr, the flow of the filled argon is 500sccm, and the flow of the filled oxygen is 200sccm; applying high-voltage direct current of 20A and 460V to ionize argon and oxygen into argon ions and oxygen ions, accelerating the argon ions to impact a pure copper target, and sputtering copper ions; copper ions and oxygen ions are combined to generate copper oxide, the copper oxide is accelerated to be sputtered on the PET carrier film in an electric field, and a black first copper oxide coating film layer with the thickness of 200 nanometers and the reflectivity of more than or equal to 10% and less than or equal to 20% is formed; argon gas with the flow of 500sccm is filled into a second copper rotating target of the magnetron sputtering equipment; applying high-voltage direct current of 20A and 460V to ionize argon gas into argon ions, accelerating the argon ions to impact a pure copper target material, and sputtering copper ions; copper ions are sputtered on the first copper oxide coating layer in an electric field at a high speed to form a first pure copper coating layer with the thickness of 500 nanometers, wherein the first pure copper coating layer is a conductive layer;
turning over the PET carrier film plated with the first copper oxide coating layer and the first pure copper coating layer, namely turning the upper end face of the PET carrier film upwards, and filling argon with the flow of 500sccm into a first copper rotating target of magnetron sputtering equipment in a 10Torr high vacuum state; applying high-voltage direct current of 20A and 460V to ionize argon into argon ions, accelerating the argon ions to impact a pure copper target, and sputtering copper ions; copper ions are accelerated to sputter on the PET carrier film in an electric field to form a second pure copper coating film layer with the coating thickness of 500 nanometers, wherein the second pure copper coating film layer is a conductive layer; filling argon and oxygen into a second copper rotating target of the magnetron sputtering equipment, wherein the flow of the argon is 500sccm, and the flow of the oxygen is 200sccm; applying high-voltage direct current of 20A and 460V to ionize argon and oxygen into argon ions and oxygen ions, accelerating the argon ions to impact a pure copper target, and sputtering copper ions; copper ions and oxygen ions are combined to generate copper oxide which is accelerated to sputter on the second pure copper coating layer in an electric field, and a black second copper oxide coating layer with the thickness of 200 nanometers and the reflectivity of more than or equal to 10% and less than or equal to 20% is formed.
The prepared double-sided blackened copper conductive film is shown in figure 1 and comprises a PET carrier film 1, wherein a first copper oxide coating layer 4 is arranged on the lower end face of the PET carrier film 1, a first pure copper coating layer 5 is arranged on the lower end face of the first copper oxide coating layer 4, a second pure copper coating layer 2 is arranged on the upper end face of the PET carrier film 1, and a second copper oxide coating layer 3 is arranged on the end face of the second pure copper coating layer 2.
Example 3
In the manufacturing process of the double-sided blackened copper conductive film, the back side is plated firstly, the lower end face of a PET carrier film is turned upwards, argon and oxygen are filled into a first copper rotating target of magnetron sputtering equipment under the vacuum state with the height of 9Torr, the flow of the filled argon is 500sccm, and the flow of the filled oxygen is 200sccm; applying high-voltage direct current of 20A and 460V to ionize argon and oxygen into argon ions and oxygen ions, accelerating the argon ions to impact a pure copper target, and sputtering copper ions; copper ions and oxygen ions are combined to generate copper oxide, the copper oxide is accelerated to sputter on a PET carrier film in an electric field, and a black first copper oxide coating film layer with the thickness of 200 nanometers and the reflectivity of more than or equal to 10% and less than or equal to 20% is formed; argon gas with the flow of 500sccm is filled into a second copper rotating target of the magnetron sputtering equipment; applying high-voltage direct current of 20A and 460V to ionize argon into argon ions, accelerating the argon ions to impact a pure copper target, and sputtering copper ions; copper ions are sputtered on the first copper oxide coating layer in an electric field at a high speed to form a first pure copper coating layer with the thickness of 500 nanometers, wherein the first pure copper coating layer is a conductive layer;
turning over a PET carrier film plated with a first copper oxide coating layer and a first pure copper coating layer, namely turning the upper end face of the PET carrier film upwards, and filling argon with the flow of 500sccm into a first copper rotating target of magnetron sputtering equipment under the high vacuum state of 9 Torr; applying high-voltage direct current of 20A and 460V to ionize argon into argon ions, accelerating the argon ions to impact a pure copper target, and sputtering copper ions; copper ions are accelerated to sputter on the PET carrier film in an electric field to form a second pure copper coating film layer with the coating thickness of 500 nanometers, wherein the second pure copper coating film layer is a conductive layer; filling argon and oxygen into a second copper rotating target of the magnetron sputtering equipment, wherein the flow of the filled argon is 500sccm, and the flow of the filled oxygen is 200sccm; applying high-voltage direct current of 20A and 460V to ionize argon and oxygen into argon ions and oxygen ions, accelerating the argon ions to impact a pure copper target material, and sputtering copper ions; copper ions and oxygen ions are combined to generate copper oxide which is accelerated to sputter on the second pure copper coating layer in an electric field, and a black second copper oxide coating layer with the thickness of 200 nanometers and the reflectivity of more than or equal to 10% and less than or equal to 20% is formed.
The prepared double-sided blackened copper conductive film is shown in figure 1 and comprises a PET carrier film 1, wherein a first copper oxide coating layer 4 is arranged on the lower end face of the PET carrier film 1, a first pure copper coating layer 5 is arranged on the lower end face of the first copper oxide coating layer 4, a second pure copper coating layer 2 is arranged on the upper end face of the PET carrier film 1, and a second copper oxide coating layer 3 is arranged on the end face of the second pure copper coating layer 2.
Further, the double-sided blackened copper conductive film obtained in example 3 was subjected to optical detection, impedance and linearity detection, and physical property detection by a method conventional in the art, and the performance parameters thereof are specifically shown in tables 1, 2, 3, 4, and 5.
TABLE 1
TABLE 2
TABLE 3
TABLE 4
TABLE 5
As can be seen from table 1, the double-sided blackened copper conductive film prepared in example 3 is provided with the black copper oxide film with a reflectivity of less than 20%, and the black copper oxide film can block the etched lines after the lines are subsequently etched on the front and back sides under visible light, so that the display effect of the display screen using the double-sided blackened copper conductive film is better.
As can be seen from tables 2, 3, and 4, the resistance values of the front and back surfaces of the double-sided blackened copper conductive film prepared in example 3 are uniform, and after the circuit is subsequently etched, the current becomes more stable when a certain voltage is applied to the circuit.
As can be seen from table 5, the ASTM registration of the check of the hundreds grid reaches 5B, that is, the edge of the notch is completely smooth, and the edge of the grid does not peel off at all, and the two-sided blackened copper conductive film prepared in example 3 is reacted with the first copper oxide film, the first pure copper film, the second copper oxide film and the PET carrier film to be tightly combined, so that the plating layer is not easy to fall off to cause wire breakage when the fine circuit is made; the front and back surface dyne values of the double-sided blackened copper conductive film prepared in the embodiment 3 reach 44dyn/cm, which shows that the front and back surfaces of the double-sided blackened copper conductive film are easier to adhere, so that the double-sided blackened copper conductive film can be better combined with other film layers for manufacturing a display screen when the display screen is manufactured.
The technical scheme of the utility model is not limited to the restriction of above-mentioned specific embodiment, all according to the utility model discloses a technical scheme makes technical deformation, all falls into within the protection scope of the utility model.
Claims (4)
1. The utility model provides a two-sided blackened copper conducting film, includes the PET carrier film, its characterized in that: the PET carrier film lower extreme face is equipped with first copper oxide coating film layer, the terminal surface is equipped with first pure copper coating film layer under the first copper oxide coating film layer, PET carrier film up end is equipped with the pure copper coating film layer of second, the pure copper coating film layer up end of second is equipped with the pure copper oxide coating film layer of second.
2. The double-sided blackened copper conductive film according to claim 1, wherein: the reflectivity of the first copper oxide coating layer and the second copper oxide coating layer is more than or equal to 10% and less than or equal to 20%.
3. The double-sided blackened copper conductive film according to claim 1, wherein: the thicknesses of the first pure copper coating layer and the second pure copper coating layer are both 500 nanometers.
4. The double-sided blackened copper conductive film according to claim 1, wherein: the thickness of the first copper oxide coating layer and the second copper oxide coating layer is 200 nanometers.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221351892.6U CN217690518U (en) | 2022-05-30 | 2022-05-30 | Two-sided blackened copper conducting film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221351892.6U CN217690518U (en) | 2022-05-30 | 2022-05-30 | Two-sided blackened copper conducting film |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217690518U true CN217690518U (en) | 2022-10-28 |
Family
ID=83705084
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221351892.6U Active CN217690518U (en) | 2022-05-30 | 2022-05-30 | Two-sided blackened copper conducting film |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217690518U (en) |
-
2022
- 2022-05-30 CN CN202221351892.6U patent/CN217690518U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6329044B1 (en) | Transparent conductive film and method of making the film | |
| JP2000356706A (en) | Light absorbing reflection preventing body and its manufacture | |
| US20120207988A1 (en) | Coated glass and method for making the same | |
| CN111627598A (en) | Low-impedance metal conductive film for large screen and preparation method thereof | |
| JPWO2004065656A1 (en) | ITO thin film, film forming method thereof, transparent conductive film, and touch panel | |
| WO2014064939A1 (en) | Transparent conductor | |
| EP4160624B1 (en) | Double-sided conductive film, coating method, and touch screen | |
| JP2003109434A (en) | Transparent conductive film and touch panel | |
| CN217690518U (en) | Two-sided blackened copper conducting film | |
| JP4894103B2 (en) | Transparent conductive film and touch panel | |
| CN114927261A (en) | Double-sided blackened copper conductive film and preparation method thereof | |
| CN106560458A (en) | Production process for thinned touch screen glass | |
| JP2005268616A (en) | Transparent conductive film and manufacturing method | |
| CN218647648U (en) | Double-sided ITO copper conductive film | |
| CN205486019U (en) | Touch screen circuit board | |
| CN109298578A (en) | A kind of compound electrochomeric glass and its processing method | |
| JP2000113732A (en) | Transparent conductive film, its manufacture, substrate with transparent conductive film, and touch panel | |
| JPH10114008A (en) | Transparent electrical conductive laminate and touch panel using laminate | |
| JP3654841B2 (en) | Transparent conductive film and method for producing the same | |
| CN114231903A (en) | Niobium oxide/silver nanowire double-layer structure flexible transparent conductive film and preparation method thereof | |
| JP3489844B2 (en) | Transparent conductive film and method for producing the same | |
| CN212694855U (en) | Low-impedance metal conductive film for large screen | |
| CN209297774U (en) | A kind of two-sided shadow ITO conductive film that disappears of touch screen double-sided coating | |
| CN101863626A (en) | New type compound transparent conductive glass and preparation method thereof | |
| JP3369728B2 (en) | Laminated transparent conductive substrate |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |