CN217608068U

CN217608068U - PCB circuit board hot air solder leveling assembly line

Info

Publication number: CN217608068U
Application number: CN202221511878.8U
Authority: CN
Inventors: 贺洪牛
Original assignee: Dongguan Dongshen Automation Equipment Co ltd
Current assignee: Dongguan Dongshen Automation Equipment Co ltd
Priority date: 2022-06-16
Filing date: 2022-06-16
Publication date: 2022-10-18
Anticipated expiration: 2032-06-16

Abstract

The utility model discloses a PCB circuit board hot air solder leveling assembly line, it includes: the tin spraying equipment is used for carrying out tin spraying on the PCB; the pretreatment assembly line is used for carrying out pretreatment before tin spraying on the PCB; the post-treatment assembly line is used for post-treating the circuit board subjected to tin spraying; the pretreatment production line is provided with temporary storage equipment; the PCB temporary storage device is used for temporarily storing the PCB conveyed in the pretreatment assembly line when the tin spraying equipment or the post-treatment assembly line is overhauled.

Description

PCB circuit board hot air solder leveling assembly line

Technical Field

The utility model relates to a PCB circuit board production technical field, concretely relates to PCB circuit board hot air solder leveling assembly line.

Background

In the prior art, a general PCB board and a tin spraying process generally comprise a working process that a PCB board firstly enters from a pretreatment line, reaches a rosin machine through a series of chemical treatments to roll rosin after the rosin machine carries out a back treatment, then reaches a clapper positioning machine, then is grabbed by a plate loading robot to place the PCB board into the tin spraying machine to carry out tin spraying treatment, the lower plate robot enters the tin spraying machine to take the board after the tin spraying is finished, and then is put back to an air cushion floating bed to carry out a post treatment process, but some abnormal problems may occur in the tin spraying process, if the tin spraying machine or the post treatment process needs to be maintained, the instant noodle equipment needs to be stopped, so that the production efficiency is reduced.

SUMMERY OF THE UTILITY MODEL

The utility model discloses an it is not enough to overcome above-mentioned condition, aims at providing the technical scheme that can solve above-mentioned problem.

A PCB circuit board hot air solder leveling assembly line, it includes:

the tin spraying equipment is used for carrying out tin spraying on the PCB;

the pretreatment assembly line is used for carrying out pretreatment before tin spraying on the PCB;

the post-treatment assembly line is used for post-treating the circuit board subjected to tin spraying;

the method is characterized in that a temporary storage device is arranged in the pretreatment production line; the temporary storage equipment is used for temporarily storing the PCB conveyed in the pretreatment assembly line when the tin spraying equipment or the post-treatment assembly line is overhauled.

Preferably, the temporary storage equipment comprises a rack, roller conveying assemblies for conveying the PCB circuit boards are arranged on the rack, the lower portion of the rack is provided with storage assemblies which are used for storing the PCB circuit boards conveyed by the roller conveying assemblies one by one and conveying the PCB circuit boards after the maintenance of the tin spraying equipment or the post-treatment assembly line is completed, and baffle mechanisms for blocking the PCB circuit boards from being conveyed forwards are arranged on the left side of the middle portion of the rack.

Preferably, roller conveying assembly includes that many intervals set up the gyro wheel that is used for carrying the PCB circuit board in the middle part of the frame, all is equipped with the backup pad that is used for the supporting roller and rotates with the gyro wheel and be connected on the front and back both sides in the middle part of the frame.

Preferably, deposit the subassembly including setting up the mounting panel of frame middle part rear side, the vertical many guide rails that are equipped with on the mounting panel, the upper end of guide rail is connected with the top of frame, the lower extreme of guide rail is connected with the bottom of frame, the upper portion of guide rail is equipped with rather than sliding connection's upper junction plate, the lower part of guide rail is equipped with the lower connecting plate with sliding connection, be equipped with the fixed plate that many intervals set up between the front side of upper junction plate and lower connecting plate, the fixed plate is located the clearance between the gyro wheel, equal interval is equipped with many bracing pieces that are used for holding up the PCB circuit board on the fixed plate, be equipped with the drive arrangement of drive upper junction plate and lower connecting plate up-and-down motion on the guide rail on the mounting panel.

Preferably, the baffle mechanism comprises a bracket arranged at the left end of the middle part of the rack, a plurality of guide rods in sliding connection with the bracket are vertically arranged on the bracket, a baffle is arranged at the top of each guide rod, an air cylinder for driving the baffle to move up and down is arranged at the bottom of the bracket, and a piston rod of the air cylinder penetrates through the bracket and then is connected with the bottom of the baffle.

Preferably, the driving device comprises a motor arranged on the mounting plate and a screw rod seat arranged at the rear end of the lower connecting plate, a screw rod is arranged on the screw rod seat, the upper end of the screw rod is connected with a rotating shaft of the motor through a coupler, and the lower end of the screw rod is rotatably connected with the bottom of the rack.

Compared with the prior art, the beneficial effects of the utility model are that: the utility model relates to a PCB circuit board hot air solder leveling assembly line through setting up the equipment of keeping in, when needs are overhauld, need not stop, and the equipment of keeping in keeps the PCB circuit board in, and after the maintenance is accomplished, the PCB circuit board that will keep in one by one again is carried back to the assembly line, can improve production efficiency.

Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.

Fig. 1 is a schematic structural diagram of the present invention.

Fig. 2 is a schematic structural diagram of the temporary storage device of the present invention.

Fig. 3 is another schematic structural diagram of the temporary storage apparatus of the present invention.

Fig. 4 is a schematic structural diagram of the driving device of the present invention.

Fig. 5 is a schematic structural diagram of the middle baffle mechanism of the present invention.

Fig. 6 is a schematic structural view of the storage module of the present invention.

In the figure: 1. tin spraying equipment; 10. a feeding manipulator; 11. a feeding manipulator; 12. a tin spraying machine;

2. a pretreatment production line; 20. placing the plate equipment; 21. micro-etching equipment; 22. a first overflow water wash device; 23. a plate grinding device; 24. a second overflow water wash device; 25. strong wind drying equipment; 26. inspecting the equipment; 27. rolling rosin equipment; 28. clapper positioning machine.

3. A post-processing assembly line; 30. an air cushion type floating bed; 31. hot water washing equipment; 32. a light scrubbing board device; 33. a pressurized water washing device; 34. air-drying equipment; 35. plate collecting equipment;

4. temporary storage equipment; 5. a frame;

6. a roller conveying assembly; 60. a roller; 61. a support plate;

7. storing the assembly; 70. mounting a plate; 71. a guide rail; 72. an upper connecting plate; 73. a lower connecting plate; 74. a fixing plate; 75. a support bar;

8. a baffle mechanism; 80. a bracket; 81. a guide bar; 82. a baffle plate; 83. a cylinder;

9. a drive device; 90. a motor; 91. a screw base; 92. and a screw rod.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely below, and it should be understood that the described embodiments are only some embodiments of the present invention, but not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts all belong to the protection scope of the present invention.

Referring to fig. 1 to 6, in an embodiment of the present invention, a PCB circuit board solder spraying assembly line includes:

the tin spraying equipment 1 is used for carrying out tin spraying on the PCB; the tin spraying equipment 1 consists of a feeding manipulator 10, a discharging manipulator 11 and a tin spraying machine 12;

the pretreatment assembly line 2 is used for carrying out pretreatment before tin spraying on the PCB; the pretreatment assembly line 2 comprises a board placing device 20, a micro-etching device 21, a first overflow washing device 22, a board grinding device 23, a second overflow washing device 24, a strong air drying device 25, an inspection device 26, a windlass rosin device 27 and a clapper positioning machine 28 which are sequentially arranged according to the PCB processing assembly line direction; the board placing device 20 conveys the PCB into a production line by adopting an inclined vertical board placing machine, and the clapper positioning machine 28 positions the PCB subjected to rosin rolling, so that the feeding manipulator 10 can conveniently clamp the PCB;

the post-treatment assembly line 3 is used for post-treating the circuit board subjected to tin spraying; the post-treatment assembly line 3 comprises an air cushion type floating bed 30, a hot water washing device 31, a light board wiping device 32, a pressurized water washing device 33, an air drying device 34 and a board collecting device 35 which are sequentially arranged according to the PCB processing flow direction, wherein the board collecting device 35 adopts an inclined vertical board placing machine to send out the PCB;

the pretreatment production line 2 is provided with a temporary storage device 4; the temporary storage device 4 is arranged between the inspection device 26 and the rumble rosin device 27 and is used for temporarily storing the PCB circuit boards conveyed in the pretreatment assembly line 2 when the tin spraying device 1 or the post-treatment assembly line 3 is overhauled.

Further, equipment 4 of keeping in includes frame 5, be equipped with the gyro wheel conveyor components 6 that are used for carrying the PCB circuit board in

frame

5, 5 lower parts of frame are equipped with when tin spraying equipment 1 or aftertreatment assembly line 3 overhaul, carry out the PCB circuit board of carrying in gyro wheel conveyor components 6 and save one by one and can examine and repair PCB circuit board that accomplishes the back and send back the storage subassembly 7 that carries in gyro wheel conveyor components 6 at tin spraying equipment 1 or aftertreatment assembly line 3, the middle part left side of frame 5 is equipped with the baffle mechanism 8 that is used for blockking that the PCB circuit board carries forward.

Further, roller conveying assembly 6 includes that many intervals set up the gyro wheel 60 that is used for carrying the PCB circuit board on frame 5 middle part, all is equipped with the backup pad 61 that is used for supporting roller 60 and rotates with gyro wheel 60 and is connected on the front and back both sides in frame 5 middle part.

Further, the storage assembly 7 includes a mounting plate 70 disposed at the rear side of the middle of the rack 5, a plurality of guide rails 71 are vertically disposed on the mounting plate 70, the upper ends of the guide rails 71 are connected to the top of the rack 5, the lower ends of the guide rails 71 are connected to the bottom of the rack 5, an upper connecting plate 72 slidably connected to the upper portions of the guide rails 71 is disposed at the upper portions of the guide rails 71, a lower connecting plate 73 slidably connected to the lower portions of the guide rails 71 is disposed at the lower portions of the guide rails 71, a plurality of fixing plates 74 disposed at intervals are disposed between the upper connecting plate 72 and the lower connecting plate 73, the fixing plates 74 are disposed in gaps between the rollers 60, a plurality of support rods 75 for supporting the PCB circuit board are disposed at intervals on the fixing plates 74, and a driving device 9 for driving the upper connecting plate 72 and the lower connecting plate 73 to move up and down on the guide rails 71 is disposed on the mounting plate 70;

when the maintenance is needed, the baffle mechanism 8 blocks the PCB on the roller conveying assembly 6 to limit the PCB to be conveyed forward continuously, the driving device 9 drives the upper connecting plate 72 and the lower connecting plate 73 to move upwards for one station, the PCB is supported by the supporting rod 75, and when the next PCB is conveyed to the roller conveying assembly 6 continuously, the driving device 9 drives the upper connecting plate 72 and the lower connecting plate 73 to move upwards for one station continuously, and then the PCB is supported by the supporting rod 75 continuously;

after the maintenance is finished, the driving device 9 drives the upper connecting plate 72 and the lower connecting plate 73 to move downwards continuously, the PCB circuit boards are placed back on the roller conveying assembly 6 one by one, and the PCB circuit boards are conveyed forwards continuously by the roller conveying assembly 6.

Further, baffle mechanism 8 is including setting up bracket 80 at 5 middle parts left ends of frame, the vertical many guide arms 81 rather than sliding connection that are equipped with on bracket 80, the guide arm 81 top is equipped with baffle 82, the bottom of bracket 80 is equipped with the cylinder 83 of drive baffle 82 up-and-down motion, the piston rod of cylinder 83 passes behind bracket 80 and is connected with the bottom of baffle 82, cylinder 83 drive baffle 82 after the upward motion, baffle 82 is located the left side of gyro wheel conveyor assembly 6, restrict the PCB circuit board and continue the forward motion, make the PCB circuit board be located gyro wheel conveyor assembly 6, be convenient for deposit subassembly 7 and deposit the PCB circuit board.

Further, the driving device 9 includes a motor 90 disposed on the mounting plate 70 and a screw seat 91 disposed at the rear end of the lower connecting plate 73, a screw 92 is disposed on the screw seat 91, an upper end of the screw 92 is connected to a rotating shaft of the motor 90 through a coupling (not shown), and a lower end of the screw 92 is rotatably connected to the bottom of the rack 5.

It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.

Claims

1. A PCB circuit board hot air solder leveling assembly line, it includes:

the tin spraying equipment is used for carrying out tin spraying on the PCB;

2. The PCB circuit board tin spraying assembly line of claim 1, wherein the temporary storage device comprises a rack, a roller conveying assembly for conveying the PCB circuit boards is arranged on the rack, a storage assembly for storing the PCB circuit boards conveyed in the roller conveying assembly one by one and conveying the stored PCB circuit boards back to the roller conveying assembly after the tin spraying device or the post-treatment assembly line is overhauled is arranged at the lower part of the rack, and a baffle mechanism for blocking the PCB circuit boards from being conveyed forwards is arranged on the left side of the middle part of the rack.

3. The PCB circuit board tin spraying assembly line of claim 2, wherein the roller conveying assembly comprises a plurality of rollers which are arranged at intervals on the middle part of the frame and are used for conveying the PCB circuit board, and supporting plates which are used for supporting the rollers and are rotatably connected with the rollers are arranged on the front side and the rear side of the middle part of the frame.

4. The PCB circuit board tin spraying assembly line of claim 3, wherein the storage assembly comprises a mounting plate arranged at the rear side of the middle part of the rack, a plurality of guide rails are vertically arranged on the mounting plate, the upper ends of the guide rails are connected with the top of the rack, the lower ends of the guide rails are connected with the bottom of the rack, an upper connecting plate in sliding connection with the guide rails is arranged at the upper parts of the guide rails, a lower connecting plate in sliding connection with the guide rails is arranged at the lower parts of the guide rails, a plurality of fixing plates arranged at intervals are arranged between the front sides of the upper connecting plate and the lower connecting plate, the fixing plates are positioned in gaps between the rollers, a plurality of supporting rods for supporting the PCB circuit board are arranged on the fixing plates at intervals, and a driving device for driving the upper connecting plate and the lower connecting plate to move up and down on the guide rails is arranged on the mounting plate.

5. The PCB hot air solder leveling assembly line of claim 2, wherein the baffle mechanism comprises a bracket arranged at the left end of the middle part of the frame, a plurality of guide rods are vertically arranged on the bracket and slidably connected with the bracket, a baffle is arranged at the top of each guide rod, an air cylinder for driving the baffle to move up and down is arranged at the bottom of the bracket, and a piston rod of the air cylinder penetrates through the bracket and then is connected with the bottom of the baffle.

6. A PCB hot air leveling assembly line of claim 4, wherein the driving device includes a motor disposed on the mounting plate and a screw seat disposed at a rear end of the lower connecting plate, a screw is disposed on the screw seat, an upper end of the screw is connected to a rotating shaft of the motor through a coupling, and a lower end of the screw is rotatably connected to a bottom of the frame.