CN217523001U

CN217523001U - Circuit board assembly and household appliance

Info

Publication number: CN217523001U
Application number: CN202220982700.5U
Authority: CN
Inventors: 管吉林
Original assignee: Shenzhen Topband Co Ltd
Current assignee: Shenzhen Topband Co Ltd
Priority date: 2022-04-26
Filing date: 2022-04-26
Publication date: 2022-09-30
Anticipated expiration: 2032-04-26

Abstract

The utility model is suitable for a domestic appliance technical field provides a circuit board subassembly and domestic appliance, and circuit board subassembly includes circuit board, radiator and power device. The radiator comprises a substrate and a plurality of first radiating fins, the substrate comprises a first surface and a second surface which are opposite, the first radiating fins are arranged on the first surface at intervals and extend towards one side where the circuit board is located, at least part of the first radiating fins abut against the circuit board, and a radiating air duct is formed between every two adjacent first radiating fins. The power device is stacked on the second surface and electrically connected with the circuit board, and air flow flows through the heat dissipation air duct and the power device along the extension direction of the heat dissipation air duct. Therefore, air flow can not only flow through the heat dissipation air duct formed by the first heat dissipation fins at intervals to realize indirect heat dissipation of the power device, but also directly flow through the power device to directly dissipate heat of the power device, and the heat dissipation efficiency of the power device is improved to solve the problem of temperature rise of the power device.

Description

Circuit board assembly and household appliance

Technical Field

The utility model relates to the technical field of household appliances, especially, relate to a circuit board assembly and household appliances.

Background

The household appliances such as the induction cooker, the electromagnetic cooking rice cooker and the like are common household appliances for household cooking, and when the household appliances such as the electromagnetic cooking rice cooker and the induction cooker work, high-frequency alternating current is usually utilized to pass through the coil panel so that eddy current is generated at the bottom of a pot placed on the household appliances, and the pot arranged on the household appliances is heated.

In the related art, power devices such as IGBTs and bridge stacks are usually arranged on circuit boards of household appliances such as electromagnetic cooking rice cookers and induction cookers, and the power during working is high, and the temperature rise of the devices is high, so that how to solve the problem of the temperature rise of the power devices on the circuit boards of the household appliances becomes a technical problem researched by technicians.

SUMMERY OF THE UTILITY MODEL

The utility model provides a circuit board assembly and domestic appliance aims at solving the technical problem of the power device temperature rise on domestic appliance's the circuit board among the prior art.

The utility model discloses a realize like this, the utility model discloses a circuit board assembly is used for domestic appliance, circuit board assembly includes:

a circuit board;

the radiator comprises a substrate and a plurality of first radiating fins, the substrate and the circuit board are arranged oppositely at intervals, the substrate comprises a first surface and a second surface which are opposite, the first surface faces the circuit board, the first radiating fins are arranged on the first surface at intervals and extend towards one side where the circuit board is located, at least part of the first radiating fins support against the circuit board, and a radiating air duct is formed between every two adjacent first radiating fins;

and the power device is stacked on the second surface and is electrically connected with the circuit board, and air flow flows through the heat dissipation air duct and the power device along the extending direction of the heat dissipation air duct.

Furthermore, the substrate is arranged in parallel with the circuit board, and the first heat sink is perpendicular to the substrate and the circuit board.

Furthermore, the first radiating fins at the two ends of the substrate are abutted against the circuit board, and the height of the first radiating fins in the middle of the substrate is lower than that of the first radiating fins at the two ends of the substrate.

Still further, the heat sink further includes at least one second fin that is protrudingly provided on the second surface.

Furthermore, the power device comprises an IGBT module and a rectifier module, wherein the IGBT module and the rectifier module are arranged on the second surface and are respectively positioned on two opposite sides of the second radiating fin.

Furthermore, one end of the IGBT module facing the second heat sink abuts against the second heat sink, and one end of the rectifier module facing the second heat sink abuts against the second heat sink.

Furthermore, the IGBT module comprises a plurality of first pins, the rectifier module comprises a plurality of second pins, the first pins are bent towards one side where the circuit board is located and welded with the circuit board, and the second pins are also bent towards one side where the circuit board is located and welded with the circuit board so that the radiator is fixed on the circuit board through the first pins and the second pins.

Furthermore, the plurality of first pins are positioned at one end of the IGBT module, which is far away from the second heat sink, and the second pins are positioned at one end of the rectifier module, which is far away from the second heat sink; or

The plurality of first pins are distributed on different sides of the IGBT module, and the plurality of second pins are distributed on different sides of the rectifying module.

Furthermore, a fixing hole is formed in the circuit board, and the circuit board assembly further comprises a fastener, wherein the fastener penetrates through the fixing hole and extends into the space between the two first cooling fins to be fixedly connected with the two adjacent first cooling fins.

The utility model also provides a domestic appliance, domestic appliance includes above-mentioned arbitrary circuit board assembly.

The utility model discloses the beneficial effect who reaches is:

the first radiating fins of the radiator are arranged on the first surface of the base plate and are derived towards one side of the circuit board to abut against the circuit board, the power device is arranged on the second surface of the base plate, and air flow (such as air flow formed by a fan of a household appliance) can not only flow through the radiating air channels formed at intervals by the first radiating fins to realize indirect heat radiation of the power device, but also directly flow through the power device to directly radiate the power device, so that the heat radiation efficiency of the power device is improved to solve the problem of temperature rise of the power device.

Drawings

Fig. 1 is a schematic structural diagram of a household appliance provided by the present invention;

fig. 2 is a schematic perspective view of a circuit board assembly provided by the present invention;

fig. 3 is a schematic perspective view of the circuit board assembly and the fan provided by the present invention;

fig. 4 is another schematic perspective view of the circuit board assembly provided by the present invention;

fig. 5 is a schematic plan view of a circuit board assembly provided by the present invention;

FIG. 6 is a cross-sectional schematic view of the circuit board assembly of FIG. 5 taken along line VI-VI;

fig. 7 is another schematic plan view of the circuit board assembly provided by the present invention;

fig. 8 is another schematic cross-sectional view of a circuit board assembly provided by the present invention.

Description of the main element symbols:

the household appliance comprises a household appliance 1000, a circuit board assembly 100, a circuit board 10, a fixing hole 11, a radiator 20, a substrate 21, a first surface 211, a second surface 212, a first radiating fin 22, a radiating air duct 221, a second radiating fin 23, a power device 30, an IGBT module 31, a first pin 311, a rectifying module 32, a second pin 321 and a fastener 40;

fan 200, coil panel 300, casing 400, lid 500.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. Examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are exemplary only for explaining the present invention, and should not be construed as limiting the present invention. Furthermore, it should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

In the description of the present invention, it is to be understood that the terms "length", "width", "upper", "lower", "left", "right", "horizontal", "top", "bottom", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first" and "second" may explicitly or implicitly include one or more of the described features. In the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; may be mechanically connected, may be electrically connected or may be in communication with each other; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

In the present disclosure, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact between the first and second features, or may comprise contact between the first and second features not directly. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

The following disclosure provides many different embodiments, or examples, for implementing different features of the invention. In order to simplify the disclosure of the present invention, the components and arrangements of specific examples are described below. Of course, they are merely examples and are not intended to limit the present invention. Furthermore, the present invention may repeat reference numerals and/or reference letters in the various examples, which have been repeated for purposes of simplicity and clarity and do not in themselves dictate a relationship between the various embodiments and/or arrangements discussed. In addition, the present disclosure provides examples of various specific processes and materials, but one of ordinary skill in the art will recognize that other processes may be used and/or other materials may be used.

In the prior art, power devices such as an IGBT (insulated gate bipolar translator) and a rectifier bridge stack are usually arranged on a circuit board of household appliances such as an electromagnetic cooking rice cooker, an induction cooker and the like, the power during working is high, and the temperature rise of each device is high.

The utility model discloses in, set up first fin 22 of radiator 20 on the first surface 211 of base plate 21 and derive towards circuit board 10 place one side in order to support and hold circuit board 10, set up power device 30 on the second surface 212 of base plate 21, the air current (for example the air current that fan 200 of domestic appliance 1000 formed) not only can flow through the radiating air duct 221 that first fin 22 interval formed in order to realize the indirect heat dissipation to power device 30, also can directly flow through power device 30 in order to directly dispel the heat to power device 30, the radiating efficiency of power device 30 has been improved in order to solve the technical problem of its temperature rise.

Example one

Referring to fig. 1, the household electrical appliance 1000 of the present invention may include the circuit board assembly 100 and the fan 200 of the present invention, and the household electrical appliance 1000 may be an electric appliance such as an electromagnetic cooking rice cooker, an electromagnetic oven, a microwave oven, etc. that needs to use power elements such as an IGBT module, a rectifier bridge stack, or a frequency converter. Hereinafter, the description will be given taking a household appliance as an electromagnetic cooking rice cooker.

Referring to fig. 1, taking an electromagnetic cooking rice cooker as an example, the household electrical appliance 1000 may further include a housing 400 and a cover 500, the cover 500 may be covered on the housing 400, the cover 500 may be detachably or rotatably connected to the housing 400, the circuit board assembly 100 may be mounted in the housing 400, for example, a mounting bracket (not shown) may be disposed in the housing 400, the circuit board assembly 100 may be mounted on the mounting bracket, the fan 200 may also be mounted on the mounting bracket, and the fan 200 is used for dissipating heat of the circuit board assembly 100.

Referring to fig. 2-4, a circuit board assembly 100 according to an embodiment of the present invention may include a circuit board 10, a heat sink 20, and a power device 30.

The heat sink 20 may include a substrate 21 and a plurality of first heat dissipation fins 22, the substrate 21 and the circuit board 10 are disposed opposite to each other at an interval, the substrate 21 includes a first surface 211 and a second surface 212 opposite to each other, the first surface 211 faces the circuit board 10, the plurality of first heat dissipation fins 22 are disposed on the first surface 211 at an interval and extend toward one side of the circuit board 10, at least a portion of the first heat dissipation fins 22 support the circuit board 10, and a heat dissipation air duct 221 is formed between two adjacent first heat dissipation fins 22. The power devices 30 are stacked on the second surface 212 and electrically connected to the circuit board 10, wherein an air flow (e.g., an air flow formed by the fan 200) can flow through the heat dissipation air duct 221 and the power devices 30 along an extending direction of the heat dissipation air duct 221, for example, as shown in fig. 4, the fan 200 of the household appliance 1000 may be disposed at one side of the heat sink 20, and the air flow formed by the fan 200 flows through the heat dissipation air duct 221 and the power devices 30 along the extending direction of the heat dissipation air duct 221 (a dotted arrow in fig. 3 indicates a flowing direction of the air flow).

In the embodiment of the present invention, in the circuit board assembly 100 and the household electrical appliance 1000, the substrate 21 and the circuit board 10 are oppositely disposed at an interval, the substrate 21 includes the first surface 211 and the second surface 212 which are opposite to each other, the first surface 211 faces the circuit board 10, the plurality of first heat dissipation fins 22 are disposed on the first surface 211 at an interval, extend towards one side of the circuit board 10 and support the circuit board 10, and the heat dissipation air duct 221 is formed between two adjacent first heat dissipation fins 22. The power devices 30 are stacked on the second surface 212 and electrically connected to the circuit board 10, wherein an air flow (e.g., an air flow generated by the fan 200 of the household appliance 1000) can flow through the heat dissipating air duct 221 and the power devices 30 along an extending direction of the heat dissipating air duct 221. Thus, the first heat sink 22 of the heat sink 20 is disposed on the first surface 211 of the substrate 21 and extends toward the side of the circuit board 10 to support the circuit board 10, and the power device 30 is disposed on the second surface 212 of the substrate 21, so that the airflow can not only flow through the heat dissipation air duct 221 formed at intervals by the first heat sink 22 to indirectly dissipate heat of the power device 30, but also directly flow through the power device 30 to directly dissipate heat of the power device 30, thereby improving the heat dissipation efficiency of the power device 30 to solve the temperature rise problem thereof.

Specifically, in the present invention, the household electrical appliance 100 is preferably provided with the fan 200 to establish a fast flowing air flow to realize heat dissipation of the power device 30, it can be understood that when the heat generation amount of the power device 30 is small, the fan 200 does not need to be provided to accelerate the flow rate of the air flow, but the heat dissipation of the power device 30 is realized by adopting a natural convection manner, and hereinafter, the case that the household electrical appliance 100 is provided with the fan 200 is taken as an example for explanation.

In the embodiment of the present invention, the first surface 211 and the second surface 212 are the lower surface and the upper surface of the substrate 21, respectively, the first heat sink 22 is disposed on the lower surface of the substrate 21, and the power device 30 is disposed on the upper surface of the substrate 21. The fan 200 is disposed at one side of the heat dissipation air duct 221 of the heat sink 20, and the airflow generated by the fan 200 can directly flow into the heat dissipation air duct 221 from the one side of the heat dissipation air duct 221, and can also directly flow through the power device 30 on the second surface 212. The fan 200 may adopt a blowing manner or an air-sucking manner, and is not limited herein, and only needs to be able to establish that the air flows through the heat-dissipating air duct 221 and the power device 30 along the extending direction of the heat-dissipating air duct 221.

For example, as shown in the figure, in some embodiments, the plurality of first heat dissipation fins 22 may be disposed in parallel at intervals along the length direction of the circuit board 10, the heat dissipation air channel 221 formed by two adjacent first heat dissipation fins 22 extends along the width direction of the circuit board 10, the power device 30 is exposed from the second surface 212 of the substrate 21 (i.e., the upper surface of the substrate 21), the fan 200 may be disposed on one side of the heat sink 20 along the width direction, and the airflow formed by the fan 200 flows through the heat dissipation air channel 221 and the power device 30 along the width direction to dissipate heat of the power device 30.

In the embodiment of the present invention, the first heat sink 22 may be integrally formed with the substrate 21 and disposed on the first surface 211 of the substrate 21, or the first heat sink 22 may be fixedly mounted on the first surface 211 of the substrate 21 by welding or the like, which is not limited herein.

The power device 30 can be mounted on the second surface 212 of the substrate 21 by the fastening member 40 such as a screw, so that heat generated by the power device 30 during operation can be transferred to the substrate 21 and the first heat sink 22, the power device 30 can be in direct contact with the substrate 21 or in indirect heat-conducting contact with the substrate 21 through a heat-conducting element such as heat-conducting silica gel, and when the airflow formed by the fan 200 flows through the heat-radiating duct 221, the airflow can take away the heat on the first heat sink 22 and the substrate 21 to realize heat dissipation and temperature reduction of the power device 30, and meanwhile, a part of the airflow can directly flow through the power device 30, or the heat of the power device 30 can be directly taken away to realize better heat dissipation and temperature reduction.

In the embodiment of the present invention, the heat sink 20 can be made of a metal material with good thermal conductivity, for example, aluminum or aluminum alloy can be used for making the heat sink 20, and of course, in some embodiments, in order to reduce the electromagnetic interference of the heat sink 20 to the circuit board assembly 100, the heat sink 20 can also be made of a non-magnetic material, for example, graphene can be used for making the heat sink 20, and the embodiment is not limited herein.

More specifically, taking the electric household appliance 1000 as an electromagnetic cooking rice cooker as an example, the power device 30 may include an IGBT module and a rectifier module, and the circuit board 10 may further be provided with a filter capacitor, a common mode inductor, a differential mode inductor, a resonant capacitor, a control module and other elements (not shown in the figure), the resonant capacitor may be connected to the coil panel 300 of the electric household appliance 1000 to form a resonant module of the electric household appliance 1000, the coil panel 300 may be externally connected to the circuit board 10, and the control module may control the coil panel 300 to perform resonant heating by controlling conduction of the IGBT module 31, so as to implement an electromagnetic cooking function of the electric household appliance 1000.

Referring to fig. 2-6, in some embodiments, the substrate 21 is disposed parallel to the circuit board 10, and the first heat sink 22 is perpendicular to the substrate 21 and the circuit board 10.

Thus, the substrate 21 is disposed parallel to the circuit board 10, so that the height of the whole circuit board assembly 100 is substantially the same, and it is avoided that one end of the substrate 21 tilts due to the inclined disposition, which results in a large occupied space, which is beneficial to the miniaturization of the circuit board assembly 100, and is also convenient for the installation of the power device 30, and is also convenient for the manufacture of the heat sink 20.

Of course, it is understood that in other embodiments, the substrate 21 may be disposed obliquely with respect to the circuit board 10 and the power device 30 without considering the occupied space, and it is only necessary that the airflow generated by the fan 200 can flow through the heat dissipation air duct 221 and the power device 30, and the specific details are not limited herein.

Further, referring to fig. 6, in some embodiments, the first heat sinks 22 at the two ends of the base plate 21 abut against the circuit board 10, and the height of the first heat sink 22 in the middle of the base plate 21 is lower than the height of the first heat sinks 22 at the two ends of the base plate 21.

Therefore, the heat sink 20 can be mounted and matched only by pressing the first heat dissipation fins 22 at the two ends of the substrate 21 against the circuit board 10, so that the manufacturing material is saved, and meanwhile, the height of the first heat dissipation fins 22 at the middle part is set to be lower, so that the heat dissipation air channels 221 formed by two adjacent first heat dissipation fins 22 can be communicated, and the air flow can flow more smoothly.

Specifically, referring to fig. 6, in the illustrated embodiment, the heights of the first heat dissipation fins 22 at the two ends of the substrate 21 are higher than the height of the first heat dissipation fin 22 at the middle position, and a gap exists between the first heat dissipation fin 22 at the middle portion and the circuit board 10, so that the plurality of heat dissipation air channels 221 can communicate with each other, and the air flow can flow more smoothly.

Example two

Referring to fig. 2-6, in the present embodiment, the heat sink 20 may further include at least one second heat dissipation fin 23 protruding on the second surface 212.

In this way, the heat dissipation area can be further increased by disposing the second heat sink 23 on the second surface 212, and the heat dissipation efficiency can be improved.

Specifically, in such an embodiment, the number of the second heat dissipation fins 23 may be one, two, or more than two, and preferably, referring to fig. 2 to 4 and fig. 6, the number of the second heat dissipation fins 23 may be two, and a heat dissipation air duct is also formed between the two second heat dissipation fins 23, so that when the air flows through the heat dissipation air duct between the two second heat dissipation fins 23, the air flow takes away heat to dissipate heat of the power device 30.

Further, referring to fig. 2-6, in some embodiments, the power device 30 may include an IGBT module 31 and a rectifier module 32, and the IGBT module 31 and the rectifier module 32 are disposed on the second surface 212 and located on two opposite sides of the second heat sink 23.

In this way, the second heat sink 23 can not only increase the heat dissipation area, but also divide the second surface 212 into two distinct regions, thereby facilitating the guidance of the installation of the IGBT module 31 and the rectifier module 32.

Specifically, in such an embodiment, mounting holes (not shown) may be provided on both side regions of the second heat sink 23 of the second surface 212, and mounting holes (not shown) may also be provided on the IGBT module 31 and the rectifier module 32, and the IGBT module 31 and the rectifier module 32 may be mounted on the second surface 212 of the substrate 21 by fastening elements such as screws through which the mounting holes are bored. In such an embodiment, the rectifier module 32 may be a bridge stack.

Still further, referring to fig. 6, in some embodiments, one end of the IGBT module 31 facing the second heat sink 23 abuts against the second heat sink 23, and one end of the rectifier module 32 facing the second heat sink 23 abuts against the second heat sink 23.

In this way, the IGBT module 31 and the rectifier module 32 can be positioned by the second heat sink 23 when the IGBT module 31 and the rectifier module 32 are mounted by abutting one end of the IGBT module 31 against the second heat sink 23 and also abutting the rectifier module 32 against the second heat sink 23, so as to improve the assembly efficiency.

Specifically, referring to fig. 6, in the illustrated embodiment, the number of the second heat sinks 23 is two, the IGBT module 31 is disposed in a right region of the second heat sink 23 and abuts against the right second heat sink 23, the rectifier module 32 is disposed in a left region of the second heat sink 23 and abuts against the left second heat sink 23, and thus, when the IGBT module 31 is mounted, the IGBT module 31 can be positioned by merely holding one end of the IGBT module 31 against the left second heat sink 23 to facilitate the mounting of the IGBT module 31, for example, when supporting IGBT module 31 and holding second fin 23 on right side, the mounting hole on IGBT module 31 aligns with the mounting hole on circuit board 10, and at this moment, only need directly wear to establish these two mounting holes and screw up the back through fasteners 40 such as screws and can realize IGBT module 31's fixed mounting, and need not the manual work and carry out extra counterpoint, improved the installation effectiveness. For another example, when the rectifier module 32 abuts against the second heat sink 23 on the left side, the mounting holes on the rectifier module 32 are aligned with the mounting holes on the circuit board 10, and at this time, the rectifier module 32 can be fixedly mounted only by directly penetrating the two mounting holes through the fasteners 40 such as screws and tightening the fasteners, and no extra alignment is needed to be performed manually, so that the mounting efficiency is improved.

Of course, it is understood that, in some embodiments, the number of the second heat dissipation fins 23 may also be greater than 2, the IGBT module 31 abuts against the second heat dissipation fin 23 at the rightmost end, and the rectifier module 32 abuts against the second heat dissipation fin 23 at the leftmost end, which is not limited herein. Furthermore, in other embodiments, the number of the second heat sinks 23 may also be single, in which case, the IGBT module 31 and the rectifier module 32 may respectively abut against both sides of the single second heat sink 23.

EXAMPLE III

Referring to fig. 2-6, in the present embodiment, the IGBT module 31 includes a plurality of first pins 311, the rectifier module 32 includes a plurality of second pins 321, the first pins 311 are bent toward the side where the circuit board 10 is located and soldered to the circuit board 10, and the second pins 321 are also bent toward the side where the circuit board 10 is located and soldered to the circuit board 10 to fix the heat sink 20 on the circuit board 10 through the first pins 311 and the second pins 321.

In this way, the pins of the IGBT module 31 and the pins of the rectifier module 32 can be used to fix the heat sink 20, and the heat sink 20 can be electrically connected to the circuit board 10 and fixed without using another fixing structure for fixing the heat sink 20.

Specifically, referring to fig. 6, in such an embodiment, the first leads 311 are bent and inserted into the circuit board 10 and soldered to corresponding pads on the circuit board 10, and the second leads 321 are bent and inserted into the circuit board 10 and soldered to corresponding pads on the circuit board 10.

As shown in fig. 6, in some embodiments, the first lead 311 may include a first lead-out section 3111 and a first bent section 3112, the first lead-out section 3111 is disposed substantially parallel to the second surface 212, the first bent section 3112 is bent from the first lead-out section 3111 to a side where the circuit board 10 is located and is inserted into the circuit board 10, and the first bent section 3112 and the first lead-out section 3111 may be disposed perpendicularly. Similarly, the second pin 321 may include a second outgoing section 3211 and a second bending section 3212, the second outgoing section 3211 is disposed substantially parallel to the second surface 212, the second bending section 3212 is bent from the second outgoing section 3211 toward two sides of the circuit board 10 and is inserted into the circuit board 10, and the second bending section 3212 and the second outgoing section 3211 may be disposed perpendicularly.

More specifically, referring to fig. 4 and 5, in the illustrated embodiment, the number of the first pins 311 may be 3, and the number of the second pins 321 may be 4, so that the heat sink 20 may be stably fixed by the 3 first pins 311 and the 4 second pins 321 to ensure the mounting strength.

Further, referring to fig. 5, in some embodiments, the plurality of first pins 311 are located at an end of the IGBT module 31 away from the second heat sink 23, and the second pins 321 are located at an end of the second heat sink 23 away from the rectifier module 32.

Thus, the first pins 311 and the second pins 321 are respectively located at two ends of the whole heat sink 20, the heat sink 20 can be stably fixed by the first pins 311 and the second pins 321 at the two ends, meanwhile, all the first pins 311 are arranged at one end of the heat sink 20, and all the second pins 321 are arranged at the other end of the heat sink 20, so that the first pins 311 and the second pins 321 can be conveniently plugged.

Of course, referring to fig. 7, in some embodiments, the plurality of first pins 311 may be distributed on different sides of the IGBT module 31, and the plurality of second pins 321 may be distributed on different sides of the rectifier module 32.

In this way, the first pins 311 are disposed on different sides, and the second pins 321 are also disposed on different sides, so that the heat sink 20 can be fixed from multiple sides to further ensure the stability and reliability of the installation.

Specifically, referring to fig. 7, in the illustrated embodiment, the number of the first pins 311 is 3, and the number of the second pins 321 is 4, in which case, the 3 first pins 311 may be respectively disposed at the right side, the lower side, and the upper side of the IGBT module 31, and thus, the 3 first pins 311 may fix the right side, the lower side, and the upper side of the heat sink 20. Meanwhile, two of the second pins 321 may be disposed at the left side of the rectifier module 32, and the other two second pins 321 may be disposed at the upper and lower sides of the rectifier module 32, respectively, so that the second pins 321 may fix the left, upper and lower sides of the heat sink 20. It is thus understood that the first pin 311 and the second pin 321 are provided on different sides, whereby the heat sink 20 can be more stably fixed, and the reliability of mounting the heat sink 20 is improved.

Of course, it is understood that in other embodiments, 2 first pins 311 may be disposed on the right side of the IGBT module 31, another first pin 311 is disposed on the upper side of the IGBT module 31, 2 second pins 321 is disposed on the right side of the rectifier module 32, and another two second pins 321 are disposed on the lower side of the rectifier module 32, which is not limited herein, and it is only necessary that all of the plurality of first pins 311 and the plurality of second pins 321 are not disposed on the same side.

Example four

Referring to fig. 8, in some embodiments, the circuit board 10 may have fixing holes 11 formed therein, and the circuit board assembly 100 may further include fasteners 40, where the fasteners 40 penetrate through the fixing holes 11 and extend into between two first heat sinks 22 to be fixedly connected with two adjacent first heat sinks 22.

In this way, the fastener 40 penetrating the fixing hole 11 and extending between the two first heat sinks 22 can stably and fixedly mount the heat sink 20 on the circuit board 10 to improve the mounting reliability.

Specifically, in such an embodiment, the fastening member 40 may be a common fastening element such as a screw, a bolt, etc., the fixing hole 11 may be a threaded hole, and the distance between two adjacent first heat dissipation fins 22 corresponding to the fixing hole 11 (i.e., the width of the heat dissipation air duct 221) is smaller than slightly smaller than the outer diameter of the fastening member 40, so that during the tightening process of the fastening member 40, the two first heat dissipation fins 22 may tightly clamp the fastening member 40 to fix the heat sink 20. Of course, in some embodiments, threads may be formed on two adjacent first heat dissipation fins 22 corresponding to the fixing holes 11, and during the process of tightening the fastening member 40, the fastening member 40 is in threaded fit with the two first heat dissipation fins 22 to fix the heat sink 20, and the specific arrangement manner is not limited herein, and only needs that the fastening member 40 can be fixedly connected with the heat sink 20.

In addition, it is understood that, in some embodiments, the heat sink 20 may be doubly fixed by combining the fixing manner of the first pin 311 and the second pin 321 in the above embodiments and the fixing manner of the fastener 40 in this embodiment, so as to avoid the first pin 311 and the second pin 321 from being broken when being impacted by a large external force.

Furthermore, it is understood that, in some embodiments, the width of a part of the plurality of first heat sinks 22 may be set to be wider, for example, as shown in fig. 6, the width of the first heat sinks 22 at two ends of the substrate 21 may be set to be wider, threaded holes corresponding to the fixing holes on the circuit board 10 may be formed on the two first heat sinks 22, and then the fixing holes are directly penetrated by fastening elements such as screws and are in threaded fit with the threaded holes to fix the heat sink 20, and the specific arrangement manner may be limited according to practical situations, and is not limited herein.

In the description of the present specification, reference to the description of "some embodiments," "exemplary embodiments," "examples," "specific examples," or "some examples" or the like means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

In addition, the above description is only for the purpose of illustrating the preferred embodiments of the present invention and should not be construed as limiting the present invention, and any modifications, equivalents and improvements made within the spirit and principle of the present invention should be included in the scope of the present invention.

Claims

1. A circuit board assembly for a household appliance, the circuit board assembly comprising:

a circuit board;

2. The circuit board assembly of claim 1, wherein the base plate is disposed parallel to the circuit board and the first heat sink is perpendicular to the base plate and the circuit board.

3. The circuit board assembly of claim 1, wherein the first heat sinks at the two ends of the substrate are abutted against the circuit board, and the height of the first heat sink in the middle of the substrate is lower than the height of the first heat sinks at the two ends of the substrate.

4. The circuit board assembly of claim 1, wherein the heat sink further comprises at least one second heat sink fin that is embossed on the second surface.

5. The circuit board assembly of claim 4, wherein the power device comprises an IGBT module and a rectifier module, the IGBT module and the rectifier module being disposed on the second surface and on opposite sides of the second heat sink, respectively.

6. The circuit board assembly of claim 5, wherein an end of the IGBT module facing the second heat sink abuts the second heat sink, and an end of the rectifier module facing the second heat sink abuts the second heat sink.

7. The circuit board assembly of claim 5, wherein the IGBT module comprises a plurality of first pins, the rectifying module comprises a plurality of second pins, the first pins are bent toward a side where the circuit board is located and soldered to the circuit board, and the second pins are also bent toward a side where the circuit board is located and soldered to the circuit board to fix the heat sink on the circuit board through the first pins and the second pins.

8. The circuit board assembly of claim 7, wherein a plurality of the first pins are located at an end of the IGBT module distal from the second heat sink, and the second pins are located at an end of the rectifier module distal from the second heat sink; or

9. The circuit board assembly according to claim 1, wherein a fixing hole is formed in the circuit board, and the circuit board assembly further comprises a fastener, wherein the fastener penetrates through the fixing hole and extends into a space between two first heat sinks to be fixedly connected with two adjacent first heat sinks.

10. A domestic appliance comprising a circuit board assembly according to any one of claims 1-9.