CN221283602U - Heat radiation structure and induction cooker - Google Patents

Heat radiation structure and induction cooker Download PDF

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Publication number
CN221283602U
CN221283602U CN202322617395.7U CN202322617395U CN221283602U CN 221283602 U CN221283602 U CN 221283602U CN 202322617395 U CN202322617395 U CN 202322617395U CN 221283602 U CN221283602 U CN 221283602U
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China
Prior art keywords
heat
heat dissipation
fins
heat dissipating
induction cooker
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CN202322617395.7U
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Chinese (zh)
Inventor
黄亚萍
窦振瑞
邓海林
韦国权
杨肖文
杨飞汗
谢仕荣
覃科铭
杜汉杰
张志林
李锦银
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Foshan Aiting Electric Appliance Co ltd
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Foshan Aiting Electric Appliance Co ltd
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Abstract

The utility model relates to the field of induction cookers, and discloses a heat dissipation structure and an induction cooker, wherein the heat dissipation structure comprises a bottom plate, a heat dissipation device and a support assembly, the support assembly is arranged on the bottom plate, the heat dissipation device is arranged on the support assembly, a heat dissipation space is arranged between the heat dissipation device and the bottom plate, and the top surface of the heat dissipation device is used for mounting an electric element. The utility model also discloses an electromagnetic oven, which comprises an electromagnetic oven shell and the radiating structure, wherein the bottom surface of the bottom plate is the bottom surface of the electromagnetic oven shell. The utility model can efficiently dissipate heat of electric elements needing to dissipate heat in the electromagnetic oven, and avoid the influence of overlarge heat generated by the electric elements on the bottom surface of the electromagnetic oven shell.

Description

Heat radiation structure and induction cooker
Technical Field
The utility model relates to the field of induction cookers, in particular to a heat dissipation structure and an induction cooker.
Background
In the electric circuit of the induction cooker, there are some electric elements which generate a lot of heat during operation. Such as a power tube. Power tubes (e.g., IGBTs) are key components for controlling the switching of induction cooker heating elements (e.g., coils). The power tube of the induction cooker is usually subjected to high-frequency switching operation, so that the heating of the power tube is remarkable. Taking an IGBT as an example, since the IGBT has a low on-voltage drop in the on state, there is a certain power loss to be converted into heat, which means that in high power applications, the IGBT generates high heat. In order to sufficiently dissipate heat, these heat-generating components are usually provided in a housing of an induction cooker, and a heat radiation fan and a heat radiation plate are generally provided in the induction cooker, and the heat radiation plate is attached to a power tube mounted on the housing or a circuit board of the induction cooker, and is blown to the heat radiation plate by the heat radiation fan to radiate heat. In this way, however, the heat from the power tube is still transferred directly to the circuit board or to the underside of the housing of the induction cooker. When the power tube is directly arranged on the inner bottom surface of the induction cooker shell, if the heat dissipation effect is not good enough, heat is easy to accumulate on the bottom surface of the induction cooker shell, so that the induction cooker shell is heated to deform or the color is changed. When the power tube is directly arranged on the circuit board of the induction cooker, if the heat dissipation effect is poor, the normal use of the circuit board can be possibly affected.
Disclosure of utility model
The utility model aims to solve the technical problems that: at least one technical problem set forth above is solved.
The utility model solves the technical problems as follows:
the utility model provides a heat radiation structure, includes bottom plate, heat abstractor and supporting component, supporting component sets up on the bottom plate, heat abstractor sets up on supporting component, heat abstractor with be equipped with the heat dissipation space between the bottom plate, heat abstractor's top surface is used for installing electrical components.
As a further improvement of the above technical solution, the heat dissipating device includes a heat dissipating fin and a plurality of heat dissipating fins, the top surface of the heat dissipating fin is used for mounting an electrical component, and all the heat dissipating fins are disposed on the bottom surface of the heat dissipating fin.
As a further improvement of the above technical solution, all the heat dissipation fins are arranged at intervals along the front-rear direction, and all the heat dissipation fins are arranged vertically.
As a further improvement of the above technical solution, the supporting component includes a support pillar, the support pillar is fixed on the bottom plate, the support pillar is fixedly connected with the heat dissipating device, and a space is provided between the heat dissipating device and the bottom plate.
As a further improvement of the technical scheme, the supporting component further comprises a plurality of protruding ribs, the protruding ribs are arranged on the bottom plate, the protruding ribs are fixedly connected with the bottom plate, the protruding ribs are arranged below the heat dissipation device, and the protruding ribs support the heat dissipation device.
As a further improvement of the above technical solution, the electrical component is a power tube.
The utility model also provides an electromagnetic oven, which comprises an electromagnetic oven shell and the radiating structure in any technical scheme, wherein the bottom surface of the bottom plate is the bottom surface of the electromagnetic oven shell.
As a further improvement of the technical scheme, the top surface of the heat radiating device is provided with a power tube, the inner bottom surface of the induction cooker shell is provided with a circuit board, pins of the power tube are connected with the circuit board, the circuit board is arranged beside the heat radiating device, and the top surface of the heat radiating device is higher than the plane where the circuit board is located.
As a further improvement of the technical scheme, the air holes are formed in the left side surface and the right side surface of the induction cooker shell, the heat radiating device comprises radiating fins and a plurality of radiating fins, all the radiating fins are arranged on the bottom surface of the radiating fins, all the radiating fins are distributed at intervals along the left direction and the right direction, and all the radiating fins are arranged vertically.
As a further improvement of the technical scheme, the induction cooker further comprises a fan, wherein the fan is arranged on the bottom surface of the induction cooker shell, and the fan blows to the heat radiating device.
The beneficial effects of the utility model are as follows: the heat dissipation device comprises a base plate, a support assembly, a heat dissipation device and a heat dissipation space, wherein the heat dissipation device is arranged on the base plate, the support assembly is arranged on the base plate, the heat dissipation device is supported by the support assembly, the heat dissipation space is arranged between the heat dissipation device and the base plate, and therefore the space between the heat dissipation device and the base plate is reserved.
Drawings
FIG. 1 is a top view of an induction cooker of the present utility model; wherein the induction cooker conceals the panel to illustrate the structure inside the induction cooker housing.
Fig. 2 is a cross-sectional isometric view at B-B in fig. 1 of the utility model.
Fig. 3 is an enlarged view of a in fig. 2 in the present utility model.
FIG. 4 is a top view of an induction cooker according to the present utility model; wherein the induction cooker conceals the panel to illustrate the structure inside the induction cooker housing.
In the accompanying drawings: 1-bottom plate, 21-radiating fins, 22-radiating fins, 3-supporting components, 31-supporting columns, 32-protruding ribs, 4-electric elements, 5-induction cooker shells, 51-ventilation holes, 6-circuit boards and 7-fans.
Detailed Description
In order to more clearly illustrate the technical solution in the embodiments of the present utility model, the above description of the embodiments refers to the accompanying drawings. It is evident that the drawings described are only some embodiments of the utility model, but not all embodiments, and that other designs and drawings can be obtained from these drawings by a person skilled in the art without inventive effort.
The conception, specific structure, and technical effects produced by the present utility model will be clearly and completely described below with reference to the embodiments and the drawings to fully understand the objects, features, and effects of the present utility model. It is apparent that the described embodiments are only some embodiments of the present utility model, but not all embodiments, and that other embodiments obtained by those skilled in the art without inventive effort are within the scope of the present utility model based on the embodiments of the present utility model. In addition, all coupling/connection relationships mentioned herein do not refer to direct connection of the components, but rather, refer to the fact that a more optimal coupling structure may be formed by adding or subtracting coupling aids depending on the particular implementation. The technical features of the utility model can be interactively combined on the premise of no contradiction and conflict.
Referring to fig. 1 to 4, a heat dissipation structure comprises a base plate 1, a heat dissipation device and a support assembly 3, wherein the support assembly 3 is arranged on the base plate 1, the heat dissipation device is arranged on the support assembly 3, a heat dissipation space is arranged between the heat dissipation device and the base plate 1, and the top surface of the heat dissipation device is used for installing an electrical element 4.
According to the heat dissipation device, the electric element 4 needing heat dissipation is arranged on the heat dissipation device, the supporting component 3 is arranged on the bottom plate 1, the heat dissipation device is supported by the supporting component 3, and a heat dissipation space is arranged between the heat dissipation device and the bottom plate 1, so that a space exists between the heat dissipation device and the bottom plate 1, the heat transfer of the heat dissipation device to the bottom plate 1 caused by direct contact of the heat dissipation device and the bottom plate 1 is avoided, and air flow can pass through the arrangement of the heat dissipation space to improve the heat exchange efficiency of the heat dissipation device.
The heat dissipation device is used for dissipating heat of the electrical component 4 needing to be dissipated, in some embodiments, the heat dissipation device comprises a heat dissipation fin 21 and a plurality of heat dissipation fins 22, the top surface of the heat dissipation fin 21 is used for installing the electrical component 4, and all the heat dissipation fins 22 are arranged on the bottom surface of the heat dissipation fin 21. When in use, the electric element 4 is arranged on the radiating fin 21 and is in abutting contact with the radiating fin 21, so that heat generated by the electric element 4 can be directly transmitted to the radiating fin 21 through heat transfer, and the heat is further transmitted to the radiating fin 22 through the radiating fin 21 in a heat transfer mode, so that the contact area with air is increased, and the radiating efficiency is improved. In this embodiment, the electrical components 4 can be effectively prevented from directly contacting the base plate 1 or the circuit board 6, and the normal use of the induction cooker is prevented from being affected by the heat generated by the electrical components 4 generating a large amount of heat.
The heat dissipation fins 22 are used for receiving the heat transferred by the heat dissipation fins 21 and conducting the heat to the air so as to improve the heat dissipation efficiency. In some embodiments, all the heat dissipating fins 22 are arranged at intervals in the front-rear direction, and all the heat dissipating fins 22 are arranged vertically. This simple structure, setting are convenient, through the setting of this structure, have formed the heat dissipation passageway along controlling the direction between the adjacent fin 22 for the air can flow about the heat dissipation passageway, so that the air that flows drives the heat on the fin 22, improves the efficiency of heat transfer.
The support assembly 3 is used for supporting a heat dissipating device, in some embodiments, the support assembly 3 includes a support column 31, the support column 31 is fixed on the base plate 1, the support column 31 is fixedly connected with the heat dissipating device, and a space is provided between the heat dissipating device and the base plate 1. In practical use, the strut 31 and the heat sink 21 in the heat dissipating device are fixed by screws, for example, screw holes are formed in the top surface of the strut 31, and then the heat sink 21 and the screw holes are fixed by screws, so that the heat sink 21 can be limited. Further, the fin 21 can be supported by the stay 31.
In order to make the support assembly 3 relatively stable when supporting the heat dissipating device, in some embodiments, the support assembly 3 further includes a plurality of raised ribs 32, the raised ribs 32 are disposed on the bottom plate 1, the raised ribs 32 are fixedly connected with the bottom plate 1, the raised ribs 32 are disposed below the heat dissipating device, and the raised ribs 32 support the heat dissipating device. In some embodiments, the raised ribs 32 are configured to support the fins 22, such that when all of the fins 22 are spaced apart in the front-to-back direction, the raised ribs 32 extend in the front-to-back direction along the length of the raised ribs 32, such that the raised ribs 32 support one or more of the fins 22. Further, since the width of the raised ribs 32 is relatively small, the contact area of the raised ribs 32 and the heat sink fins 22 is also small to reduce the amount of heat transferred from the heat sink fins 22 to the raised ribs 32.
In some embodiments, the electrical component 4 is a power tube. Thus, the heat dissipation structure of the present utility model can dissipate heat of the electrical components 4 such as the power tube. In use, although the power tube is disposed on the top surface of the heat sink 21, the pins of the power tube are still connected to the circuit board 6 of the induction cooker.
The utility model also provides an induction cooker, which comprises an induction cooker shell 5 and the heat radiation structure in any embodiment, wherein the bottom surface of the bottom plate 1 is the bottom surface of the induction cooker shell 5. Since the foregoing has been described with respect to the heat dissipation structure, those skilled in the art will understand in connection with the drawings of the specification, the description of the heat dissipation structure is not repeated herein.
The electromagnetic oven comprises a power tube, and in order to realize heat dissipation of the power tube, in some embodiments, the top surface of the heat dissipation device is provided with the power tube, the inner bottom surface of the electromagnetic oven shell 5 is provided with a circuit board 6, pins of the power tube are connected with the circuit board 6, the circuit board 6 is arranged beside the heat dissipation device, and the top surface of the heat dissipation device is higher than the plane where the circuit board 6 is located. The circuit board 6 is arranged beside the heat dissipating device, so that the heat dissipating device is prevented from being directly arranged on the circuit board 6, and heat is effectively prevented from being intensively generated on the circuit board 6. Meanwhile, the top surface of the heat dissipation device is higher than the circuit board 6, and the power tube is arranged on the top surface of the heat dissipation device, so that after the air flow passes through the heat dissipation device, heat generated by the power tube can be prevented from being directly transferred to the circuit board 6, and heat on the heat dissipation device is effectively reduced to be transferred to the circuit board 6.
In order to improve the heat dissipation efficiency of the induction cooker, in some embodiments, the left and right side surfaces of the induction cooker housing 5 are provided with ventilation holes 51, the heat dissipation device includes a heat dissipation fin 21 and a plurality of heat dissipation fins 22, all the heat dissipation fins 22 are disposed on the bottom surface of the heat dissipation fin 21, all the heat dissipation fins 22 are arranged at intervals along the left and right directions, and all the heat dissipation fins 22 are disposed vertically. The electromagnetic oven is simple in structure and convenient to set, through the air holes 51 arranged on the left side and the right side of the electromagnetic oven shell 5, air convection can be formed between the air holes 51 on the left side and the right side, and the air flow can pass through the space between the adjacent radiating fins 22 to drive heat on the radiating fins 22, so that radiating efficiency is improved.
To further increase the heat dissipation efficiency of the induction cooker, in some embodiments, the induction cooker further comprises a fan 7, wherein the fan 7 is arranged on the bottom surface of the induction cooker housing 5, and the fan 7 blows to the heat dissipation device. In combination with the above embodiments, the heat dissipating device is disposed between the fan 7 and the circuit board 6, such that the fan 7 is disposed on the right side of the heat dissipating device, and the circuit board 6 is disposed on the left side of the heat dissipating device, and the fan 7 blows air to the heat dissipating device, thereby dissipating heat from the heat dissipating device and the circuit board 6. In addition, the top surface of the heat dissipating device is higher than the circuit board 6, so that heat of the power tube on the heat dissipating device can be effectively reduced to be directly transferred to the circuit board 6.
While the preferred embodiment of the present utility model has been described in detail, the present utility model is not limited to the embodiments described above, and various equivalent modifications and substitutions can be made by those skilled in the art without departing from the spirit of the present utility model, and these equivalent modifications and substitutions are intended to be included in the scope of the present utility model as defined in the appended claims.

Claims (10)

1. The utility model provides a heat radiation structure, includes bottom plate (1), its characterized in that still includes heat abstractor and supporting component (3), supporting component (3) set up on bottom plate (1), heat abstractor sets up on supporting component (3), heat abstractor with be equipped with the heat dissipation space between bottom plate (1), heat abstractor's top surface is used for installing electrical components (4).
2. The heat dissipation structure as defined in claim 1, wherein the heat dissipation device comprises a heat dissipation fin (21) and a plurality of heat dissipation fins (22), a top surface of the heat dissipation fin (21) is used for mounting the electrical component (4), and all the heat dissipation fins (22) are disposed on a bottom surface of the heat dissipation fin (21).
3. The heat radiation structure according to claim 2, wherein all the heat radiation fins (22) are arranged at intervals in the front-rear direction, and all the heat radiation fins (22) are arranged vertically.
4. The heat dissipation structure as defined in claim 1, wherein the support assembly (3) comprises a support (31), the support (31) is fixed on the base plate (1), the support (31) is fixedly connected with the heat dissipation device, and a space is provided between the heat dissipation device and the base plate (1).
5. The heat dissipation structure as defined in claim 4, wherein the support assembly (3) further comprises a plurality of protruding ribs (32), the protruding ribs (32) are disposed on the base plate (1), the protruding ribs (32) are fixedly connected with the base plate (1), the protruding ribs (32) are disposed below the heat dissipation device, and the protruding ribs (32) support the heat dissipation device.
6. The heat dissipation structure as defined in claim 1, characterized in that the electrical component (4) is a power tube.
7. An induction hob, characterized in, that it comprises an induction hob housing (5), and a heat dissipation structure according to any one of the claims 1-6, the bottom surface of the soleplate (1) being the bottom surface of the induction hob housing (5).
8. The induction cooker according to claim 7, wherein the top surface of the heat dissipating device is provided with a power tube, the inner bottom surface of the induction cooker housing (5) is provided with a circuit board (6), pins of the power tube are connected with the circuit board (6), the circuit board (6) is arranged beside the heat dissipating device, and the top surface of the heat dissipating device is higher than the plane of the circuit board (6).
9. The induction cooker according to claim 7, wherein ventilation holes (51) are formed in the left and right side surfaces of the induction cooker outer shell (5), the heat dissipating device comprises a heat dissipating fin (21) and a plurality of heat dissipating fins (22), all the heat dissipating fins (22) are arranged on the bottom surface of the heat dissipating fin (21), all the heat dissipating fins (22) are arranged at intervals in the left and right direction, and all the heat dissipating fins (22) are arranged vertically.
10. The induction hob according to claim 7, characterized in, that the induction hob further comprises a fan (7), said fan (7) being arranged on the bottom surface of the induction hob housing (5), said fan (7) blowing towards said heat dissipating device.
CN202322617395.7U 2023-09-25 2023-09-25 Heat radiation structure and induction cooker Active CN221283602U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202322617395.7U CN221283602U (en) 2023-09-25 2023-09-25 Heat radiation structure and induction cooker

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202322617395.7U CN221283602U (en) 2023-09-25 2023-09-25 Heat radiation structure and induction cooker

Publications (1)

Publication Number Publication Date
CN221283602U true CN221283602U (en) 2024-07-05

Family

ID=91694246

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202322617395.7U Active CN221283602U (en) 2023-09-25 2023-09-25 Heat radiation structure and induction cooker

Country Status (1)

Country Link
CN (1) CN221283602U (en)

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