CN217485424U - 一种晶圆吸附装置 - Google Patents
一种晶圆吸附装置 Download PDFInfo
- Publication number
- CN217485424U CN217485424U CN202221555075.2U CN202221555075U CN217485424U CN 217485424 U CN217485424 U CN 217485424U CN 202221555075 U CN202221555075 U CN 202221555075U CN 217485424 U CN217485424 U CN 217485424U
- Authority
- CN
- China
- Prior art keywords
- wafer
- air channel
- negative pressure
- air
- chuck
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000001179 sorption measurement Methods 0.000 title claims abstract description 38
- 230000007246 mechanism Effects 0.000 claims abstract description 39
- 238000007789 sealing Methods 0.000 claims description 9
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 abstract description 60
- 229910052742 iron Inorganic materials 0.000 abstract description 30
- 239000012528 membrane Substances 0.000 abstract description 15
- 238000004519 manufacturing process Methods 0.000 abstract description 13
- 230000008859 change Effects 0.000 abstract description 12
- 235000012431 wafers Nutrition 0.000 description 64
- 238000010586 diagram Methods 0.000 description 6
- 241000252254 Catostomidae Species 0.000 description 5
- 241000252253 Catostomus Species 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 206010022000 influenza Diseases 0.000 description 2
- 230000007547 defect Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202221555075.2U CN217485424U (zh) | 2022-06-21 | 2022-06-21 | 一种晶圆吸附装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202221555075.2U CN217485424U (zh) | 2022-06-21 | 2022-06-21 | 一种晶圆吸附装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN217485424U true CN217485424U (zh) | 2022-09-23 |
Family
ID=83315786
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202221555075.2U Active CN217485424U (zh) | 2022-06-21 | 2022-06-21 | 一种晶圆吸附装置 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN217485424U (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN117594514A (zh) * | 2024-01-18 | 2024-02-23 | 天津中科晶禾电子科技有限责任公司 | 晶圆夹具、晶圆夹持方法、晶圆清洗设备 |
-
2022
- 2022-06-21 CN CN202221555075.2U patent/CN217485424U/zh active Active
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN117594514A (zh) * | 2024-01-18 | 2024-02-23 | 天津中科晶禾电子科技有限责任公司 | 晶圆夹具、晶圆夹持方法、晶圆清洗设备 |
CN117594514B (zh) * | 2024-01-18 | 2024-04-30 | 天津中科晶禾电子科技有限责任公司 | 晶圆夹具、晶圆夹持方法、晶圆清洗设备 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN217485424U (zh) | 一种晶圆吸附装置 | |
CN205689974U (zh) | 导气滑环以及旋转转盘夹取装置 | |
CN207217498U (zh) | 一种晶圆和掩膜版接触夹紧装置 | |
JPH01100508A (ja) | 顕微鏡の万能型対象物保持装置 | |
JPS618250A (ja) | 真空吸着台 | |
CN209487484U (zh) | 晶圆加工工艺中的传输装置 | |
JP2546652B2 (ja) | チヤツクテ−ブル | |
CN218827036U (zh) | 一种吸附晶圆的真空调节装置 | |
KR102570475B1 (ko) | 진공 시스템용 체크밸브 조립체 | |
JP2020145295A (ja) | ウエハ保持装置 | |
CN114220762A (zh) | 半导体工艺设备及其晶圆传输装置 | |
CN115083986A (zh) | 一种具有End effect的SCARA机器人手臂 | |
JPH1126553A (ja) | 吸着コレット | |
CN105739235A (zh) | 掩膜板检测用带背光多功能吸盘装置 | |
JPH06260409A (ja) | 熱処理装置 | |
CN208156353U (zh) | 背光板加工用装置 | |
CN219751211U (zh) | 取料装置及光刻设备 | |
JP2010245155A (ja) | ウェハ吸引パッド及びそれを備えたプリアライナ | |
CN219370992U (zh) | 芯片转移装置 | |
CN220807032U (zh) | 一种适用于平面及曲面类产品吸附固定装置 | |
CN108519694A (zh) | 背光板加工用装置 | |
CN112539773A (zh) | 一种吸盘及运动系统 | |
CN212028633U (zh) | 一种用于盛装高纯化学品的专用源瓶与阀门 | |
CN215433719U (zh) | 一种可兼容多种尺寸晶圆传送手臂 | |
CN215973899U (zh) | 一种取料装置及设备 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
GR01 | Patent grant | ||
GR01 | Patent grant | ||
CP03 | Change of name, title or address | ||
CP03 | Change of name, title or address |
Address after: Unit 1, 1st Floor, No. 670 Hong'an Road, Xiang'an Industrial Zone, Xiamen Torch High tech Zone, Xiamen, Fujian Province, 361000 Patentee after: Koer Microelectronics Equipment (Xiamen) Co.,Ltd. Address before: 361103 unit 1, floor 1, No. 670, Honglong Road, torch high tech Zone (Xiang'an) Industrial Zone, Xiamen, Fujian Patentee before: COER AUTOMATION EQUIPMENT CO.,LTD. |
|
PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: A wafer adsorption device Effective date of registration: 20231222 Granted publication date: 20220923 Pledgee: China Everbright Bank Limited by Share Ltd. Xiamen branch Pledgor: Koer Microelectronics Equipment (Xiamen) Co.,Ltd. Registration number: Y2023980073410 |