CN217484451U - Manual test socket for image sensor chip - Google Patents
Manual test socket for image sensor chip Download PDFInfo
- Publication number
- CN217484451U CN217484451U CN202220788049.8U CN202220788049U CN217484451U CN 217484451 U CN217484451 U CN 217484451U CN 202220788049 U CN202220788049 U CN 202220788049U CN 217484451 U CN217484451 U CN 217484451U
- Authority
- CN
- China
- Prior art keywords
- test socket
- image sensor
- sensor chip
- pressing block
- manual test
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The utility model belongs to the technical field of chip manufacturing and application, and particularly discloses a manual test socket for an image sensor chip, which comprises a laser transmitter, an attenuation sheet, a mica sheet, a pressing block and a spring probe test socket; the laser emitter, the attenuation sheet mica sheet, the pressing block and the spring probe test socket are sequentially stacked from top to bottom, wherein a chip to be tested is placed in one surface of the spring probe test socket. The utility model discloses a manual test socket of image sensor chip's beneficial effect lies in: (1) the design is reasonable, a laser testing environment is set up, various materials are integrated into the clamp, the working environment of the image sensor chip is simulated, and the test of the image sensor chip is realized; (2) and a spring probe is selected to contact a product to be detected, so that the contact stability is ensured.
Description
Technical Field
The utility model belongs to the technical field of the chip preparation is used, concretely relates to manual test socket of image sensor chip for the test of image sensor chip.
Background
In recent years, semiconductor processing technology has been advanced rapidly, the rule of moore's law is advanced for several years, at present, the technology has advanced to below 7 nm, products are taught to be light, thin, short, small, IC volume is smaller, function is stronger, and pin number is more and more, and at present, Flip Chip (Flip Chip) type packaging is generally applied to graphic chips, Chip sets, memories, CPUs and the like in order to reduce the occupied area of Chip packaging and improve the IC performance. The high-level packaging method has high unit price, if the chip test can be carried out before the packaging, and the wafer is marked if the defective products exist in the wafer, the marked defective products are abandoned until the back-end packaging process, and the unnecessary packaging cost can be saved.
The image sensor chip belongs to a new product, and the industry has no mature test scheme.
Based on the problem, the utility model provides a manual test socket of image sensor chip.
SUMMERY OF THE UTILITY MODEL
Utility model purpose: the utility model aims at prior art's not enough, provide the manual test socket of image sensor chip, solved the test problem of image sensor chip.
The technical scheme is as follows: the utility model provides a manual test socket for image sensor chips, which comprises a laser emitter, an attenuation sheet, a mica sheet, a pressing block and a spring probe test socket; the laser emitter, the mica sheet of the attenuation sheet, the pressing block and the spring probe test socket are sequentially stacked from top to bottom in a layered mode, and the chip to be tested is placed in one face of the spring probe test socket.
According to the technical scheme, the manual test socket for the image sensor chip further comprises an upper laser emitter fixing seat, a middle attenuation sheet fixing seat and a lower pressing block fixing seat.
According to the technical scheme, at least two attenuation sheets are stacked.
According to the technical scheme, the manual testing socket for the image sensor chip is provided with a laser transmitter mounting cavity, an attenuation sheet mounting cavity and a pressing block mounting cavity which are matched with the laser transmitter, the attenuation sheet and a pressing block for use in the upper laser transmitter fixing seat, the middle attenuation sheet fixing seat and the lower pressing block fixing seat respectively.
According to the technical scheme, the sizes of the laser transmitter installation cavity, the attenuation sheet installation cavity and the pressing block installation cavity are sequentially increased.
According to the technical scheme, the manual testing socket for the image sensor chip further comprises a positioning cavity arranged in one surface of the spring probe testing socket.
According to the technical scheme, the upper laser transmitter fixing seat, the lower pressing block fixing seat and the spring probe testing socket are the same in size.
Compared with the prior art, the utility model discloses a manual test socket of image sensor chip's beneficial effect lies in: (1) the design is reasonable, the laser testing environment is built, various materials are integrated into the clamp, the working environment of the image sensor chip is simulated, and the testing of the image sensor chip is realized; (2) and a spring probe is selected to contact a product to be detected, so that the contact stability is ensured.
Drawings
Fig. 1 is a schematic sectional view of the assembly of the manual testing socket for image sensor chips of the present invention;
wherein, the sequence numbers in the figure are as follows: the device comprises a 1-laser emitter, a 2-attenuation sheet, a 3-mica sheet, a 4-pressing block, a 5-spring probe test socket, a 1-1-upper laser emitter fixing seat, a 1-2-laser emitter installation cavity, a 2-1-middle attenuation sheet fixing seat, a 2-2-attenuation sheet installation cavity, a 4-1-lower pressing block fixing seat, a 4-2-pressing block installation cavity and a 5-1-positioning cavity.
Detailed Description
The invention will be further elucidated with reference to the drawings and the embodiments.
Example one
The manual test socket for the image sensor chip shown in fig. 1 comprises a laser emitter 1, an attenuation sheet 2, a mica sheet 3, a pressing block 4 and a spring probe test socket 5;
the laser emitter 1, the attenuation sheet 2, the mica sheet 3, the pressing block 4 and the spring probe test socket 5 are sequentially stacked from top to bottom in a layered mode, and a chip to be tested is placed in one surface of the spring probe test socket 5.
Example two
The image sensor chip manual test socket shown in fig. 1 comprises a laser emitter 1, an attenuation sheet 2, a mica sheet 3, a pressing block 4 and a spring probe test socket 5;
the laser probe testing device comprises a laser transmitter 1, an attenuation sheet 2, a mica sheet 3, a pressing block 4 and a spring probe testing socket 5 which are sequentially stacked from top to bottom, wherein a chip to be tested is placed in one surface of the spring probe testing socket 5, an upper laser transmitter fixing seat 1-1, a middle attenuation sheet fixing seat 2-1 and a lower pressing block fixing seat 4-1, and a laser transmitter mounting cavity 1-2, an attenuation sheet mounting cavity 2-2 and a pressing block mounting cavity 4-2 which are matched with the laser transmitter 1, the attenuation sheet 2 and the pressing block 4 for use are respectively arranged in the upper laser transmitter fixing seat 1-1, the middle attenuation sheet fixing seat 2-1 and the lower pressing block fixing seat 4-1.
In the manual test socket for an image sensor chip according to the first or second embodiment of the present invention, preferably, at least two, for example, three, attenuation sheets 2 are stacked.
In the manual test socket for an image sensor chip according to the first or second embodiment of the present invention, preferably, the size of the attenuation sheet 2 is smaller than that of the mica sheet 3.
The utility model discloses an use, an image sensor chip testing arrangement or system, the erection joint install the manual test socket of image sensor chip.
The working principle or the structural principle of the image sensor chip manual testing socket with the structure is as follows: when the test device is used, a product to be tested is manually placed in the positioning cavity 5-1 of the spring probe test socket 5, and the chip product to be tested is electrically connected with the test board card through the spring probe, so that test operation can be performed (the spring probe and the test board card are not marked in the drawing).
The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, a plurality of modifications can be made without departing from the principle of the present invention, and these modifications should also be regarded as the protection scope of the present invention.
Claims (7)
1. Manual test socket of image sensor chip, its characterized in that: the device comprises a laser transmitter (1), an attenuation sheet (2), a mica sheet (3), a pressing block (4) and a spring probe test socket (5); laser emitter (1), decay piece (2), mica sheet (3), briquetting (4), spring probe test socket (5) stack the setting from last to lower stratiform in proper order, and wherein, the chip that awaits measuring is placed in spring probe test socket (5) one.
2. The image sensor chip manual test socket of claim 1, wherein: the manual test socket for the image sensor chip further comprises an upper laser emitter fixing seat (1-1), a middle attenuation sheet fixing seat (2-1) and a lower pressing block fixing seat (4-1).
3. The image sensor chip manual test socket according to claim 1 or 2, wherein: the attenuation sheets (2) are stacked and arranged at least more than two.
4. The image sensor chip manual test socket of claim 2, wherein: the manual test socket for the image sensor chip is characterized in that an upper laser transmitter fixing seat (1-1), a middle attenuation sheet fixing seat (2-1) and a lower pressing block fixing seat (4-1) are internally provided with a laser transmitter mounting cavity (1-2), an attenuation sheet mounting cavity (2-2) and a pressing block mounting cavity (4-2) which are matched with a laser transmitter (1), an attenuation sheet (2) and a pressing block (4) for use respectively.
5. The image sensor chip manual test socket of claim 4, wherein: the sizes of the laser transmitter installation cavity (1-2), the attenuation sheet installation cavity (2-2) and the pressing block installation cavity (4-2) are sequentially increased.
6. The image sensor chip manual test socket of claim 1, wherein: the manual test socket for the image sensor chip further comprises a positioning cavity (5-1) arranged in one surface of the spring probe test socket (5).
7. The image sensor chip manual test socket of claim 2, wherein: the upper laser transmitter fixing seat (1-1), the lower pressing block fixing seat (4-1) and the spring probe testing socket (5) are the same in size.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220788049.8U CN217484451U (en) | 2022-04-07 | 2022-04-07 | Manual test socket for image sensor chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220788049.8U CN217484451U (en) | 2022-04-07 | 2022-04-07 | Manual test socket for image sensor chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217484451U true CN217484451U (en) | 2022-09-23 |
Family
ID=83309148
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220788049.8U Active CN217484451U (en) | 2022-04-07 | 2022-04-07 | Manual test socket for image sensor chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217484451U (en) |
-
2022
- 2022-04-07 CN CN202220788049.8U patent/CN217484451U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5483174A (en) | Temporary connection of semiconductor die using optical alignment techniques | |
| CN105891626A (en) | High-reliability pressure-adjusting automatic testing apparatus for fingerprint module group | |
| CN108807212A (en) | Crystal round test approach and wafer tester | |
| CN207036342U (en) | Hybrid package pressure sensor module batch checking tool | |
| CN217484451U (en) | Manual test socket for image sensor chip | |
| CN205049602U (en) | Two -sided pin array semiconductor chip test fixture | |
| CN205943469U (en) | TF card testing arrangement | |
| CN207050762U (en) | Chip testing jig and chip test system | |
| CN1328779C (en) | Detecting clamp and its top cover | |
| CN214923646U (en) | Efficient automatic chip test fixture | |
| CN205231060U (en) | Testing arrangement of camera module | |
| CN217484452U (en) | Multi-station test socket for temperature measurement chip | |
| CN211478546U (en) | Multi-chip Kelvin test seat | |
| CN211698066U (en) | Electrical property detector of QFP packaging integrated circuit | |
| CN207215859U (en) | Test fixture | |
| CN205049698U (en) | Test fixture based on two -sided pin array semiconductor chip | |
| CN203038674U (en) | Memory chip testing machine | |
| CN201298047Y (en) | Multifunctional inspection jig | |
| CN217689282U (en) | Tooling for circuit testing | |
| CN218732384U (en) | Double-station laser temperature control device | |
| CN1790656A (en) | Power MOS device testing method and product for realizing the same | |
| CN216485375U (en) | Supporting probe of semiconductor BGA chip aging testing socket | |
| CN209979798U (en) | Test fixture | |
| CN104181336A (en) | Test module | |
| CN220872519U (en) | Socket for BGA chip test |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |