CN216485375U

CN216485375U - Supporting probe of semiconductor BGA chip aging testing socket

Info

Publication number: CN216485375U
Application number: CN202122843491.4U
Authority: CN
Inventors: 周勇华; 王永; 仇中燕
Original assignee: Suzhou Qingxing Qiji Technology Co ltd
Current assignee: Suzhou Qingxing Qiji Technology Co ltd
Priority date: 2021-11-19
Filing date: 2021-11-19
Publication date: 2022-05-10
Anticipated expiration: 2031-11-19

Abstract

The utility model belongs to the technical field of chip manufacturing and application, and particularly discloses a supporting probe of a semiconductor BGA chip aging test socket. The supporting probe of the semiconductor BGA chip aging test socket has the beneficial effects that: its reasonable in design, the probe is longe-lived, and the electrical property is better like electric current, frequency etc. satisfies accurate and reliable test operation requirement of BGA chip aging testing socket, is applicable to traditional BGA chip aging testing socket promptly, also is applicable to the BGA chip aging testing socket of customization.

Description

Supporting probe of semiconductor BGA chip aging testing socket

Technical Field

The utility model belongs to the technical field of chip manufacturing and application, and particularly relates to a supporting probe of a semiconductor BGA chip aging test socket, which is used for aging test of a BGA chip.

Background

In recent years, semiconductor processing technology has been advanced rapidly, the rule of moore's law is advanced for several years, at present, the technology has advanced to below 7 nm, products are taught to be light, thin, short, small, IC volume is smaller, function is stronger, and pin number is more and more, and at present, Flip Chip (Flip Chip) type packaging is generally applied to graphic chips, Chip sets, memories, CPUs and the like in order to reduce the occupied area of Chip packaging and improve the IC performance. The high-level packaging method has high unit price, if the chip test can be carried out before the packaging, and the wafer is marked if the defective products exist in the wafer, the marked defective products are abandoned until the back-end packaging process, and the unnecessary packaging cost can be saved.

BGA is a ball grid array packaging technique, a high density surface mount packaging technique. At the bottom of the package, the leads are all spherical and arranged in a grid-like pattern. The mainboard control chip group mostly adopts the packaging technology, the materials are mostly ceramic, and the memory packaged by the BGA technology can improve the memory capacity by two to three times under the condition of unchanging the memory volume, has smaller volume, and has better heat radiation performance and electrical performance.

However, in the actual packaging process, the pin pitch specification of the BGA packaged chip is limited, which is generally several specifications such as 1.27mm, 1mm, 0.65mm, 0.50mm, etc., but the same specification has great difference, so a special socket has to be customized, and the conventional probe is not suitable for the BGA chip aging test socket due to poor electrical performance.

Based on the above problems, the present invention provides a probe for a socket for burn-in test of a semiconductor BGA chip.

SUMMERY OF THE UTILITY MODEL

Utility model purpose: the utility model aims to provide a matched probe of a semiconductor BGA chip aging test socket aiming at the defects of the prior art, and solves the problem of the test probe of the BGA chip aging test socket.

The technical scheme is as follows: the utility model provides a matched probe of a semiconductor BGA chip aging test socket, which comprises a needle tube, a spring arranged in the needle tube, a needle head and a needle tail which are respectively connected with the spring, and a needle tube limiting convex ring arranged on the outer wall of one end of the needle tube.

This technical scheme, the syringe needle, including connecting portion, and set up first transition portion, the second transition portion at connecting portion both sides, and set up spacing portion, the contact site in first transition portion, second transition portion one side respectively, and set up the projection in spacing portion one side, wherein, the diameter size of spacing portion is the same with the diameter size of spring or is greater than the diameter size of spring, the diameter size of second transition portion is the same with the diameter size of needle tubing, the one end of projection sets up to the toper structure.

According to the technical scheme, the contact part is of a conical structure, and one surface of the contact part is of an open type dentate structure.

This technical scheme, the backstitch, including cylindrical contact site, and set up the cylindrical spacing portion in cylindrical contact site one end, and set up the cylindrical connecting portion in cylindrical spacing portion one end, wherein, the diameter size of cylindrical spacing portion, cylindrical contact site, cylindrical connecting portion diminishes in proper order.

According to the technical scheme, the two ends of the cylindrical contact part and the cylindrical connecting part are respectively provided with the smooth structures, and the connecting surface of the cylindrical limiting part and the cylindrical contact part is provided with the conical structure.

Compared with the prior art, the supporting probe of the semiconductor BGA chip aging test socket has the beneficial effects that: its reasonable in design, the probe is longe-lived, and the electrical property is better like electric current, frequency etc. satisfies accurate and reliable test operation requirement of BGA chip aging testing socket, is applicable to traditional BGA chip aging testing socket promptly, also is applicable to the BGA chip aging testing socket of customization.

Drawings

FIG. 1 is a schematic diagram of the structure of the probe associated with the burn-in socket of the semiconductor BGA chip of the present invention;

fig. 2 and 3 are schematic structural diagrams showing the use states of the probes matched with the semiconductor BGA chip burn-in test socket of the present invention.

Detailed Description

The utility model is further elucidated with reference to the drawings and the embodiments.

Examples

The probe for the semiconductor BGA chip burn-in test socket shown in fig. 1, 2 and 3 comprises a needle tube 3, a spring 4 disposed in the needle tube 3, a needle head and a needle tail connected to the spring 4, and a needle tube limiting convex ring 5 disposed on an outer wall of one end of the needle tube 3.

The probe needle comprises a connecting part 1, a first transition part 1-1 and a second transition part 1-4 which are arranged on two sides of the connecting part 1, a limiting part 1-2 and a contact part 1-5 which are respectively arranged on one side of the first transition part 1-1 and one side of the second transition part 1-4, and a convex column 1-3 which is arranged on one side of the limiting part 1-2, wherein the diameter size of the limiting part 1-2 is the same as that of a spring 4 or larger than that of the spring 4, the diameter size of the second transition part 1-4 is the same as that of a needle tube 3, and one end of the convex column 1-3 is of a conical structure.

The contact parts 1-5 are arranged to be conical structures, and one surface of the contact parts is arranged to be an open type dentate structure.

The matched probe and the pin tail of the conductor BGA chip aging test socket with the structure comprise a cylindrical contact part 2, a cylindrical limiting part 2-1 arranged at one end of the cylindrical contact part 2 and a cylindrical connecting part 2-2 arranged at one end of the cylindrical limiting part 2-1, wherein the diameter sizes of the cylindrical limiting part 2-1, the cylindrical contact part 2 and the cylindrical connecting part 2-2 are gradually reduced.

The supporting probe of the conductor BGA chip aging test socket with the structure is preferred, the two ends of the cylindrical contact part 2 and the cylindrical connecting part 2-2 are respectively provided with a smooth structure, and the connecting surface of the cylindrical limiting part 2-1 and the cylindrical contact part 2 is provided with a conical structure.

The probe matched with the conductor BGA chip aging test socket has long service life, good electrical performance such as current, frequency and the like, meets the accurate and reliable test use requirements of the BGA chip aging test socket, is suitable for the traditional BGA chip aging test socket, and is also suitable for the customized BGA chip aging test socket (the customized BGA chip aging test socket applicant has already made patent application and is named as a semiconductor BGA chip-based aging test socket).

The supporting probe of conductor BGA chip aging testing socket of this structure, the syringe needle is the BECU material, electroplates: ni =2-2.5 μm, Au =3 μm; needle tail: palladium alloy, no electroplating; needle tubing: phosphor copper material, electroplating: ni =1-1.5 μm, Au =1 μm; working spring force of spring 4: 32g ± 3g, maximum stroke: 0.7mm (0.45 mm compressed), and gold-plated spring piano wire (SWPB).

The foregoing is only a preferred embodiment of this invention and it should be noted that modifications can be made by those skilled in the art without departing from the principle of the utility model and these modifications should also be considered as the protection scope of the utility model.

Claims

1. Supporting probe of semiconductor BGA chip aging testing socket, its characterized in that: comprises a needle tube (3), a spring (4) arranged in the needle tube (3), a needle head and a needle tail which are respectively connected with the spring (4), and a needle tube limiting convex ring (5) arranged on the outer wall of one end of the needle tube (3).

2. The mating probe of claim 1, wherein: the needle head comprises a connecting part (1), a first transition part (1-1) and a second transition part (1-4) which are arranged on two sides of the connecting part (1), a limiting part (1-2) and a contact part (1-5) which are respectively arranged on one side of the first transition part (1-1) and one side of the second transition part (1-4), and a convex column (1-3) which is arranged on one side of the limiting part (1-2), wherein the diameter size of the limiting part (1-2) is the same as that of the spring (4) or larger than that of the spring (4), the diameter size of the second transition part (1-4) is the same as that of the needle tube (3), and one end of the convex column (1-3) is of a conical structure.

3. The mating probe of claim 2 for a semiconductor BGA chip burn-in test socket, wherein: the contact parts (1-5) are arranged to be conical structures, and one surface of each contact part is arranged to be an open-type tooth-shaped structure.

4. The mating probe of claim 1, wherein: the needle tail comprises a cylindrical contact part (2), a cylindrical limiting part (2-1) arranged at one end of the cylindrical contact part (2), and a cylindrical connecting part (2-2) arranged at one end of the cylindrical limiting part (2-1), wherein the diameter sizes of the cylindrical limiting part (2-1), the cylindrical contact part (2) and the cylindrical connecting part (2-2) are sequentially decreased progressively.

5. The mating probe of claim 4, wherein: the two ends of the cylindrical contact part (2) and the cylindrical connecting part (2-2) are respectively provided with a smooth structure, and the connecting surface of the cylindrical limiting part (2-1) and the cylindrical contact part (2) is provided with a conical structure.