CN211478546U - Multi-chip Kelvin test seat - Google Patents

Multi-chip Kelvin test seat Download PDF

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Publication number
CN211478546U
CN211478546U CN201922124110.XU CN201922124110U CN211478546U CN 211478546 U CN211478546 U CN 211478546U CN 201922124110 U CN201922124110 U CN 201922124110U CN 211478546 U CN211478546 U CN 211478546U
Authority
CN
China
Prior art keywords
test
shell fragment
chip
mounting panel
kelvin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201922124110.XU
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Chinese (zh)
Inventor
吴志明
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Asiachip Electronic Shenzhen Co ltd
Original Assignee
Asiachip Electronic Shenzhen Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asiachip Electronic Shenzhen Co ltd filed Critical Asiachip Electronic Shenzhen Co ltd
Priority to CN201922124110.XU priority Critical patent/CN211478546U/en
Application granted granted Critical
Publication of CN211478546U publication Critical patent/CN211478546U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model discloses a multicore piece kelvin test seat, including the test seat body, both sides all are provided with test shell fragment mounting panel around the top of test seat body, the inner wall equidistance buckle of test shell fragment mounting panel is connected with the test shell fragment, the inner of test shell fragment is provided with the chip, the top of test shell fragment mounting panel is provided with test shell fragment apron, the fixed surface that screw and test shell fragment mounting panel were passed through at the top of test shell fragment apron is connected, the fixed orifices has all been seted up at both ends about the test seat body, the utility model relates to a chip testing technology field. The multi-chip Kelvin test socket solves the problems that the currently used chip test socket is used for single product detection, the test efficiency is low, the structure is complex, the cost is high, the contact area of a test point is small, and the measurement precision is easily influenced.

Description

Multi-chip Kelvin test seat
Technical Field
The utility model relates to a chip test technical field specifically is a multichip kelvin test seat.
Background
A chip, also called as an integrated circuit, is a miniature electronic device or component, and is characterized by that it adopts a certain technological process to make the elements of transistor, resistor, capacitor and inductor, etc. required in a circuit and wiring interconnection together, and make them be made into a small semiconductor wafer or medium substrate, then make them be packaged in a tube shell so as to form the miniature structure with the required circuit function, in which all the elements are formed into a whole body, so that the electronic element can be miniaturized, low power consumption, intelligent and high reliability. In the production process of the chip, performance testing is an important part, the currently used chip testing seat is used for single-product detection, the testing efficiency is low, the structure is complex, the cost is higher, the contact area of the testing point is small, and the measuring precision is easily influenced.
SUMMERY OF THE UTILITY MODEL
Technical problem to be solved
The utility model provides a not enough to prior art, the utility model provides a multi-chip kelvin test seat has solved the chip test seat that uses at present and has detected for single product, and efficiency of software testing is low, and the structure is complicated, and the cost is higher, and test point area of contact is little, influences measurement accuracy's problem easily.
(II) technical scheme
In order to achieve the above purpose, the utility model discloses a following technical scheme realizes: the utility model provides a multicore piece kelvin test seat, includes the test seat body, both sides all are provided with test shell fragment mounting panel around the top of test seat body, the inner wall equidistance buckle of test shell fragment mounting panel is connected with the test shell fragment, the inner of test shell fragment is provided with the chip, the top of test shell fragment mounting panel is provided with test shell fragment apron, the fixed surface that screw and test shell fragment mounting panel were passed through to the top of test shell fragment apron is connected.
Preferably, the left end and the right end of the test seat body are both provided with fixing holes.
Preferably, 4 test shrapnels are a test group, and the screws are positioned at two sides of the test group.
Preferably, the test spring plate is a kelvin structure spring plate.
Preferably, the chip is an 8-pin chip, and two sides of the chip are fixedly connected with the inner end of the test elastic sheet through pins.
Preferably, the screws are national standard cross screws M3 x 6-6.
(III) advantageous effects
The utility model provides a multichip kelvin test seat. Has the following beneficial effects:
this multi-chip kelvin test seat through utilizing multiunit test shell fragment group cooperation test shell fragment apron on the test shell fragment mounting panel and screw to realize once can testing one or more chips, and kelvin structural design test shell fragment can guarantee the multiply area contact of chip and test shell fragment, and this test seat simple structure simultaneously, the cost of manufacture is extremely low, and every test shell fragment can accomplish 100 ten thousand grades of test times, and actual practicality is stronger.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a three-view diagram of the structure of the present invention;
fig. 3 is an enlarged view of the structure a of the present invention.
In the figure: the test socket comprises a test socket body 1, a test elastic sheet mounting plate 2, a test elastic sheet 3, a chip 4, a test elastic sheet cover plate 5, screws 6, fixing holes 7 and pins 8.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-3, the present invention provides a technical solution: a multi-chip Kelvin test socket comprises a test socket body 1, wherein test spring plate mounting plates 2 are arranged on the front side and the rear side of the top of the test socket body 1, test spring plates 3 are connected to the inner wall of each test spring plate mounting plate 2 in an equidistant buckling mode to realize fixing of one or more chips, chips 4 are arranged at the inner ends of the test spring plates 3 to realize chip testing, a test spring plate cover plate 5 is arranged at the top of each test spring plate mounting plate 2, the top of each test spring plate cover plate 5 is fixedly connected with the surface of the test spring plate mounting plate 2 through screws 6 to realize fixing of the test spring plates, fixing holes 7 are formed in the left end and the right end of the test socket body 1 to facilitate fixing of the test socket body, 34 test spring plates are a test group to realize single-chip testing, the screws 6 are arranged on the two sides of the test group to ensure connection stability, the test spring, chip 4 is the 8 foot chip, and the both sides of chip 4 are through pin 8 and the inner fixed connection of test shell fragment 3, and screw 6 is for adopting national standard cross screw M3 6-6.
During the use, it is fixed with test socket body 1 and test equipment through fixed orifices 7, then will test the mounting hole on shell fragment 3 card income test shell fragment mounting panel 2, then cover test shell fragment apron 5, utilize screw 6 to fix, then with chip 4 pin and test shell fragment 3 fixed can.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation. The use of the phrase "comprising one of the elements does not exclude the presence of other like elements in the process, method, article, or apparatus that comprises the element.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims (6)

1. A multi-chip Kelvin test socket comprises a test socket body (1), and is characterized in that: both sides all are provided with test shell fragment mounting panel (2) around the top of test seat body (1), the inner wall equidistance buckle of test shell fragment mounting panel (2) is connected with test shell fragment (3), the inner of test shell fragment (3) is provided with chip (4), the top of test shell fragment mounting panel (2) is provided with test shell fragment apron (5), the fixed surface who passes through screw (6) and test shell fragment mounting panel (2) is connected at the top of test shell fragment apron (5).
2. The multi-chip kelvin test socket of claim 1, wherein: the left end and the right end of the test seat body (1) are provided with fixing holes (7).
3. The multi-chip kelvin test socket of claim 1, wherein: the 4 test elastic pieces (3) are a test group, and the screws (6) are positioned on two sides of the test group.
4. The multi-chip kelvin test socket of claim 1, wherein: the testing elastic sheet (3) is a Kelvin structure elastic sheet.
5. The multi-chip kelvin test socket of claim 1, wherein: the chip (4) is an 8-pin chip, and two sides of the chip (4) are fixedly connected with the inner end of the testing elastic sheet (3) through pins (8).
6. The multi-chip kelvin test socket of claim 1, wherein: the screw (6) is a national standard cross screw M3 x 6-6.
CN201922124110.XU 2019-12-02 2019-12-02 Multi-chip Kelvin test seat Expired - Fee Related CN211478546U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201922124110.XU CN211478546U (en) 2019-12-02 2019-12-02 Multi-chip Kelvin test seat

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201922124110.XU CN211478546U (en) 2019-12-02 2019-12-02 Multi-chip Kelvin test seat

Publications (1)

Publication Number Publication Date
CN211478546U true CN211478546U (en) 2020-09-11

Family

ID=72379118

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201922124110.XU Expired - Fee Related CN211478546U (en) 2019-12-02 2019-12-02 Multi-chip Kelvin test seat

Country Status (1)

Country Link
CN (1) CN211478546U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112083315A (en) * 2020-09-15 2020-12-15 苏州韬盛电子科技有限公司 Kelvin test socket for QFN

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112083315A (en) * 2020-09-15 2020-12-15 苏州韬盛电子科技有限公司 Kelvin test socket for QFN

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CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20200911

Termination date: 20211202

CF01 Termination of patent right due to non-payment of annual fee