CN217468349U

CN217468349U - Quick cleaning device suitable for wafer carrier

Info

Publication number: CN217468349U
Application number: CN202221246121.0U
Authority: CN
Inventors: 孙雪峰; 孙文杰; 肖凌峰
Original assignee: Shengying Semiconductor Equipment Jiangsu Co ltd
Current assignee: Shengying Semiconductor Equipment Jiangsu Co ltd
Priority date: 2022-05-23
Filing date: 2022-05-23
Publication date: 2022-09-20
Anticipated expiration: 2032-05-23

Abstract

The utility model relates to a quick cleaning device suitable for wafer carrier, it includes cleaning unit and flowing back unit, cleaning unit includes washing tank, liquid inlet pipeline, and air inlet pipeline, wherein is formed with the washing chamber in the washing tank, and liquid inlet pipeline and air inlet pipeline are linked together the setting with the washing chamber respectively; the liquid discharge unit comprises a liquid discharge groove, a liquid discharge valve and a liquid discharge pipeline, wherein the liquid discharge groove is arranged below the cleaning tank and is provided with a liquid discharge cavity, the liquid discharge valve is communicated between the cleaning cavity and the liquid discharge cavity and has an open state and a closed state, and the liquid discharge pipeline is communicated with the liquid discharge cavity. On one hand, the cleaning liquid can be conveniently and quickly filled through the cleaning cavity matched with the wafer carrier, and meanwhile, the waste liquid after cleaning can be discharged from the top down, so that the liquid inlet speed and the liquid discharge speed are increased, and the cleaning speed is effectively improved; on the other hand, through the matching of the air inlet pipeline and the liquid inlet pipeline, the cleaning effect is effectively improved, and the wafer carrier is guaranteed to realize high cleanliness.

Description

Quick cleaning device suitable for wafer carrier

Technical Field

The utility model belongs to the cleaning device field, concretely relates to quick cleaning device suitable for wafer carrier.

Background

As is well known, a wafer refers to a silicon wafer used for manufacturing a silicon semiconductor circuit, and is a silicon wafer formed by grinding, polishing and slicing a silicon crystal bar, wherein when the wafer is subjected to a surface electroplating process, the wafer to be electroplated needs to be flatly placed on a carrier for positioning the wafer, then the wafer is loaded onto an electroplating rack through a loading and unloading device by the carrier to be electroplated, and after the electroplating is completed, the wafer also needs to be unloaded from the electroplating rack to be electroplated for the next wafer.

However, since a wafer carrier as a loading device for wafers in direct contact is very vulnerable to a large amount of plating solution, activation chemicals, etching chemicals, etc. during a plating process, the wafer carrier needs to be cleaned for continuous use, but the conventional cleaning device has the following drawbacks:

1. the cleaning is not thorough, plating solution and other chemical substances are easy to remain on the surface of the wafer carrier, and the high cleanliness cannot be met;

2. the cleaning consumes long time and has low efficiency.

Disclosure of Invention

The utility model aims to solve the technical problem that a quick cleaning device that is applicable to wafer carrier of modified is provided.

For solving the technical problem, the utility model discloses take following technical scheme:

a quick cleaning device suitable for a wafer carrier comprises a cleaning unit and a liquid drainage unit, wherein the cleaning unit comprises a cleaning tank, a liquid inlet pipeline and an air inlet pipeline, a cleaning cavity matched with the outer contour of the wafer carrier is formed in the cleaning tank, and the liquid inlet pipeline and the air inlet pipeline are respectively communicated with the cleaning cavity; the liquid discharging unit comprises a liquid discharging groove, a liquid discharging valve and a liquid discharging pipeline, wherein the liquid discharging groove is arranged below the cleaning tank and is provided with a liquid discharging cavity, the liquid discharging valve is communicated between the cleaning cavity and the liquid discharging cavity and has an open state and a closed state, the liquid discharging pipeline is communicated with the liquid discharging cavity, and the liquid discharging valve is in the closed state during cleaning; when liquid is discharged, the liquid discharge valve is in an open state, and the cleaning waste liquid is discharged from the liquid discharge cavity from top to bottom.

Preferably, the cleaning chamber extends in the vertical direction, the cleaning chamber is arranged from the top in an open mode and is respectively communicated with the liquid inlet pipeline and the gas inlet pipeline from the bottom, and during cleaning, the wafer carrier is vertically inserted into the cleaning chamber from the top opening of the cleaning chamber. The arrangement makes the wafer carrier convenient to put in or take out of the cleaning cavity, and effectively avoids the cleaning liquid residue on the wafer carrier under the action of gravity.

Furthermore, the quick cleaning device also comprises a channel which extends downwards from the bottom of the cleaning tank and is inserted into the liquid discharge cavity, wherein the channel is respectively communicated with the cleaning cavity, the liquid discharge valve and the liquid inlet pipeline.

Preferably, the channel is communicated with the cleaning cavity from the top and is arranged in a closed mode from the bottom, a detection sensor for detecting the cleanliness of the cleaning liquid is arranged at the bottom of the channel, and the drain valve and the liquid inlet pipeline are respectively connected to two opposite sides of the channel. By the arrangement, when cleaning is carried out, the fact that the wafer carrier is cleaned can be confirmed by detecting the cleanliness of the cleaning liquid accumulated at the bottom of the channel.

Specifically, the channel is coincident with the central line of the cleaning cavity. By the arrangement, the cleaning liquid in the cleaning cavity can rise uniformly, and the cleaning effect is ensured.

Preferably, the air inlet pipeline is inserted into the cleaning cavity and is arranged close to the bottom of the cleaning cavity, wherein a plurality of air holes are formed on the air inlet pipeline, and inert gas is supplied into the cleaning cavity from each air hole. The arrangement is adopted, the surface of the wafer carrier is dried in all directions, the cleaning liquid is prevented from being remained, meanwhile, in the cleaning process, the cleaning force can be enhanced by discharging inert gas through the air holes, and the cleaning effect is improved.

Preferably, the cleaning chamber has a rectangular cross-section, wherein the sides of the rectangle extend in the width and thickness directions of the wafer carrier in the vertical position, respectively.

Specifically, the cleaning chamber is further provided with vertically extending guide rails along the two opposite sides of the vertical wafer carrier in the width direction, and the wafer carrier is inserted into the cleaning chamber from the top opening of the cleaning chamber downwards along the guide rails. The arrangement makes the wafer carrier conveniently and rapidly put into or take out of the cleaning cavity, and avoids interference or collision.

Preferably, the top of the cleaning tank is also provided with a liquid level sensor for monitoring the liquid level of the cleaning liquid in the cleaning cavity. Set up like this, but real-time supervision washs intracavity liquid level, conveniently controls the feed liquor volume.

In addition, the tank bottom of the liquid discharge tank is obliquely and extends from top to bottom, a liquid discharge port is formed on the side wall of the lower side edge of the liquid discharge tank close to the tank bottom of the liquid discharge tank, and the liquid discharge pipeline is communicated with the liquid discharge port. So set up, the washing waste liquid can gather in the downside of flowing back tank bottom downwards automatically, realizes quick flowing back.

Due to the implementation of the above technical scheme, compared with the prior art, the utility model have the following advantage:

on one hand, the cleaning liquid can be conveniently and quickly filled through the cleaning cavity matched with the wafer carrier, and meanwhile, the waste liquid after cleaning can be discharged from top to bottom, so that the liquid inlet speed and the liquid discharge speed are increased, and the cleaning speed is effectively improved; on the other hand, through the matching of the air inlet pipeline and the liquid inlet pipeline, the cleaning effect is effectively improved, and the wafer carrier is guaranteed to realize high cleanliness.

Drawings

The invention will be described in further detail with reference to the following drawings and specific embodiments:

fig. 1 is a schematic structural diagram of a rapid cleaning apparatus for a wafer carrier according to the present invention;

FIG. 2 is a schematic front view of FIG. 1;

FIG. 3 is a schematic sectional view taken along line A-A in FIG. 2;

in the drawings: 1. a cleaning unit; 10. a cleaning tank; k1, vias; q1, cleaning cavity; g. a guide rail; g0, guide rail body; g1, guide wheel; 11. an air intake line; 12. a liquid inlet pipeline;

2. a liquid discharge unit; 20. a liquid discharge tank; q2, a liquid discharge cavity; k2, drain port; 21. a drain valve; 210. a valve body; 211. a piston; 212. an elastic member; 22. a drainage line;

3. a channel; a. a detection sensor; k3, outlet.

Detailed Description

In order to make the aforementioned objects, features and advantages of the present application more comprehensible, embodiments accompanying the present application are described in detail below with reference to the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. This application is capable of embodiments in many different forms than those described herein and that modifications may be made by one skilled in the art without departing from the spirit and scope of the application and it is therefore not intended to be limited to the specific embodiments disclosed below.

In the description of the present application, it is to be understood that the terms "central," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the present application and to simplify the description, but are not intended to indicate or imply that the device or element so referred to must have a particular orientation, be constructed and operated in a particular orientation, and are not to be construed as limiting the present application.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the feature. In the description of the present application, "plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.

In this application, unless expressly stated or limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can include, for example, fixed connections, removable connections, or integral parts; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.

In this application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through intervening media. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like as used herein are for illustrative purposes only and do not denote a unique embodiment.

As shown in fig. 1, the rapid cleaning apparatus for a wafer carrier of the present embodiment includes a cleaning unit 1 and a liquid discharge unit 2.

Specifically, the cleaning unit 1 includes a cleaning tank 10, an air inlet pipeline 11, and an air inlet pipeline 12.

As shown in fig. 2 and 3, the drain unit 2 includes a drain tank 20, a drain valve 21, and a drain line 22.

The cleaning tank 10 extends along the vertical direction, and a cleaning cavity q1 matched with the outer contour of the wafer carrier is formed in the cleaning tank 10, wherein the cleaning cavity q1 is arranged from the top in an open mode and is respectively communicated with the liquid inlet pipeline 12 and the air inlet pipeline 11 from the bottom, and during cleaning, the wafer carrier is vertically inserted into the cleaning cavity q1 from the top open port of the wafer carrier q 1. The arrangement makes the wafer carrier convenient to put in or take out of the cleaning cavity, and effectively avoids the cleaning liquid residue on the wafer carrier under the action of gravity.

Specifically, the cleaning chamber q1 has a rectangular cross-section with the sides of the rectangle extending along the width and thickness directions of the wafer carrier in an upright position.

Meanwhile, the top opening of the cleaning cavity q1 is gradually narrowed from top to bottom, and the two opposite sides of the cleaning cavity q1 along the width direction of the wafer carrier in the vertical state are respectively provided with a vertically extending guide rail g, and the top opening of the wafer carrier self-cleaning cavity q1 is downwards inserted into the cleaning cavity q1 along the guide rails g. The arrangement makes the wafer carrier conveniently and rapidly put into or take out of the cleaning cavity, and avoids interference or collision.

Specifically, the guide rail g on each side comprises a guide rail body g0 and guide wheels g1 which are distributed on the guide rail body g0 at intervals along the vertical direction.

For convenience of implementation, the top of the cleaning tank 10 is further provided with a level sensor (not shown, but not contemplated) for monitoring the level of the cleaning liquid in the cleaning chamber q 1. Set up like this, but real-time supervision washs intracavity liquid level, conveniently controls the feed liquor volume.

Specifically, the air intake duct 11 is horizontally inserted into the purge chamber q1 along the width direction of the purge chamber q1 and is disposed near the bottom of the purge chamber q1, wherein the air intake duct 11 is formed with a plurality of air holes (not shown, but not inconsiderable), and supplies an inert gas into the purge chamber q1 from each air hole. The arrangement is adopted, the surface of the wafer carrier is dried in all directions, the cleaning liquid is prevented from being remained, meanwhile, in the cleaning process, the cleaning force can be enhanced by discharging inert gas through the air holes, and the cleaning effect is improved.

In this embodiment, a through hole k1 is formed in the middle of the bottom of the cleaning tank 10, and the rapid cleaning apparatus of this embodiment further comprises a channel 3 extending downward from the bottom of the cleaning tank 10, wherein the channel 3 is respectively communicated with the cleaning chamber q1, the drain valve 21, and the liquid inlet pipe 12.

Specifically, the channel 3 is communicated with the cleaning cavity q1 from the top and is arranged in a closed mode from the bottom, the detection sensor a for detecting the cleanliness of cleaning liquid is arranged at the bottom of the channel 3, and the drain valve 21 and the liquid inlet pipeline 12 are connected to two opposite sides of the channel 3 respectively. By the arrangement, when cleaning is carried out, the fact that the wafer carrier is cleaned can be confirmed by detecting the cleanliness of the cleaning liquid accumulated at the bottom of the channel.

Meanwhile, the passage 3 is arranged to coincide with the center line of the cleaning chamber q 1. By the arrangement, the cleaning liquid in the cleaning cavity can rise uniformly, and the cleaning effect is ensured.

In this example, drain tank 20 is disposed below washing tank 10 and formed with drain chamber q2, duct 3 is inserted downward into drain chamber q2 from the bottom of washing tank 10, and drain chamber q2 and washing chamber q1 are connected or not through the cooperation of duct 3 and drain valve 21.

Specifically, the bottom of the drain tank 20 is inclined from top to bottom, a drain port k2 is formed on the side wall of the drain tank 20 close to the lower side of the bottom of the drain tank, and the drain pipeline 22 is communicated with the drain port k 2. So set up, the washing waste liquid can gather in the downside of flowing back tank bottom downwards automatically, realizes quick flowing back.

In addition, the drain valve 21 has an open state and a closed state, wherein an outlet k3 is formed on the side wall of the channel 3, the drain valve 21 comprises a valve body 210, a piston 211 movably arranged in the valve body 210 and matched with the outlet k3, when the drain valve 21 is in the closed state, the piston 211 is blocked at the outlet k3, and at this time, the cleaning chamber q1 can be filled with cleaning liquid and inert gas and clean the wafer carrier; when the drain valve 21 is in the open state, the piston 211 is disengaged from the outlet k3, and the waste cleaning liquid is discharged from the drain chamber q2 from the top down.

Specifically, the drain valve 21 further includes an elastic member 212 connected between the piston 211 and the valve body 210, wherein the elastic member 212 maintains the tendency of the piston 211 to move toward the outlet k 3.

In summary, the present embodiment has the following advantages:

1. through the cleaning cavity matched with the wafer carrier, the cleaning liquid can be conveniently and quickly filled, and meanwhile, the waste liquid after cleaning can be discharged from top to bottom, so that the liquid inlet speed and the liquid discharge speed are increased, and the cleaning speed is effectively improved;

2. through the matching of the air inlet pipeline and the liquid inlet pipeline, the cleaning effect is effectively improved, and the wafer carrier is ensured to realize high cleanliness;

3. through the matching of the vertically extending cleaning cavity and the guide rail, the wafer carrier can be conveniently placed into or taken out of the cleaning cavity, and under the action of gravity, the cleaning liquid residue on the wafer carrier is effectively avoided, and meanwhile, interference and collision are avoided;

4. during cleaning, the cleanliness of the cleaning liquid accumulated at the bottom of the channel can be detected to confirm that the wafer carrier is cleaned;

5. the cleaning waste liquid can be automatically accumulated at the lower side of the bottom of the liquid discharge groove downwards, so that quick liquid discharge is realized.

The present invention has been described in detail, and the purpose thereof is to enable those skilled in the art to understand the contents of the present invention and to implement the same, and the protection scope of the present invention should not be limited thereby, and all equivalent changes or modifications made according to the spirit of the present invention should be covered by the protection scope of the present invention.

Claims

1. A quick cleaning device suitable for a wafer carrier comprises a cleaning unit and a liquid discharge unit, and is characterized in that: the cleaning unit comprises a cleaning tank, a liquid inlet pipeline and an air inlet pipeline, wherein a cleaning cavity matched with the outer contour of the wafer carrier is formed in the cleaning tank, and the liquid inlet pipeline and the air inlet pipeline are respectively communicated with the cleaning cavity; the liquid discharging unit comprises a liquid discharging groove, a liquid discharging valve and a liquid discharging pipeline, wherein the liquid discharging groove is arranged below the cleaning groove and is provided with a liquid discharging cavity, the liquid discharging valve is communicated between the cleaning cavity and the liquid discharging cavity and has an open state and a closed state, the liquid discharging pipeline is communicated with the liquid discharging cavity, and the liquid discharging valve is in a closed state during cleaning; and when the liquid is discharged, the liquid discharge valve is in an open state, and the cleaning waste liquid is discharged from the liquid discharge cavity from top to bottom.

2. A rapid cleaning apparatus adapted for use with a wafer carrier as claimed in claim 1, wherein: the cleaning cavity extends along the vertical direction, the cleaning cavity is opened from the top and is communicated with the liquid inlet pipeline and the gas inlet pipeline from the bottom, and during cleaning, the wafer carrier is vertically inserted into the cleaning cavity from the opening at the top of the cleaning cavity.

3. A rapid cleaning apparatus adapted for use with a wafer carrier as claimed in claim 2, wherein: the quick cleaning device also comprises a channel which extends downwards from the bottom of the cleaning tank and is inserted into the liquid discharge cavity, wherein the channel is respectively communicated with the cleaning cavity, the liquid discharge valve and the liquid inlet pipeline.

4. A rapid cleaning apparatus adapted for use with a wafer carrier as claimed in claim 3, wherein: the channel is communicated with the cleaning cavity from the top and is arranged in a closed mode from the bottom, a detection sensor used for detecting the cleanliness of cleaning liquid is arranged at the bottom of the channel, and the liquid discharge valve and the liquid inlet pipeline are connected to two opposite sides of the channel respectively.

5. A rapid cleaning device suitable for wafer carriers according to claim 3 or 4, characterized in that: the channel is arranged in a manner of being overlapped with the central line of the cleaning cavity.

6. A rapid cleaning apparatus adapted for use with a wafer carrier as claimed in claim 2, wherein: the air inlet pipeline is inserted into the cleaning cavity and is arranged close to the bottom of the cleaning cavity, a plurality of air holes are formed in the air inlet pipeline, and inert gas is supplied into the cleaning cavity from each air hole.

7. A rapid cleaning apparatus adapted for use with a wafer carrier as claimed in claim 2, wherein: the cross section of the cleaning cavity is rectangular, wherein the side edges of the rectangle respectively extend along the width direction and the thickness direction of the wafer carrier in a vertical state.

8. A rapid cleaning apparatus adapted for use with a wafer carrier as claimed in claim 7, wherein: the cleaning cavity is also provided with vertically extending guide rails along two opposite sides of the width direction of the wafer carrier in a vertical state, and the wafer carrier is downwards inserted into the cleaning cavity from the top opening of the cleaning cavity along the guide rails.

9. A rapid cleaning apparatus adapted for use with a wafer carrier as claimed in claim 2, wherein: and the top of the cleaning tank is also provided with a liquid level sensor for monitoring the liquid level of the cleaning liquid in the cleaning cavity.

10. A rapid cleaning apparatus adapted for use with a wafer carrier as claimed in claim 1, wherein: the bottom of the liquid discharge tank extends from top to bottom in an inclined mode, a liquid discharge port is formed in the side wall, close to the lower side edge of the bottom of the liquid discharge tank, and the liquid discharge pipeline is communicated with the liquid discharge port.