CN219723894U

CN219723894U - Chip QDR washing tank

Info

Publication number: CN219723894U
Application number: CN202321330980.2U
Authority: CN
Inventors: 李坤; 段良飞; 曾宪瑞; 董国庆; 文国昇; 金从龙
Original assignee: Jiangxi Zhao Chi Semiconductor Co Ltd
Current assignee: Jiangxi Zhao Chi Semiconductor Co Ltd
Priority date: 2023-05-29
Filing date: 2023-05-29
Publication date: 2023-09-22
Anticipated expiration: 2033-05-29

Abstract

The utility model provides a chip QDR cleaning tank, which comprises a tank body, a filtering bottom plate, a nitrogen device and a spraying device, wherein the tank body is used for containing DI water, a plurality of filtering holes are formed in the filtering bottom plate in a penetrating mode, the filtering holes are used for filtering fragments generated by LED chips accidentally, the nitrogen device comprises an air outlet part, an air inlet part and a nitrogen conveying part, the nitrogen conveying part is used for supplying nitrogen, the air inlet part is connected with the nitrogen conveying part, the filtering bottom plate and the air outlet part are both arranged in the tank body, the filtering bottom plate is covered on the air outlet part, the air outlet part is provided with a plurality of air outlet holes, the nitrogen passes through the air outlet holes and the filtering holes so as to bubble the DI water, the spraying device comprises a first water inlet pipe and a spraying part, the spraying part is arranged on the first water inlet pipe and is arranged towards the inside of the tank body, the chip QDR cleaning tank is matched with the nitrogen device to clean the wafer strongly when abnormal fragments are filtered through the filtering bottom plate, and finally residual liquid medicine is removed through the spraying device, and the cleaning effect is improved.

Description

Chip QDR washing tank

Technical Field

The utility model relates to the technical field of LED chip processing, in particular to a chip QDR cleaning tank.

Background

In the LED industry, wet cleaning refers to a process of using various chemical reagents to chemically react or dissolve impurities and oil stains adsorbed on the surface of an object to be cleaned, or using physical measures such as ultrasound, heating, vacuumizing, etc. to desorb (desorb) impurities from the surface of the object to be cleaned, and then flushing with a large amount of high-purity deionized water, thereby obtaining a clean surface. The product can bring chemicals into the water tank when being put into the water tank from the chemical tank in the process, so the water tank for bearing the high-purity deionized water and matched components have higher corrosion resistance and friction coefficient requirements, the corrosion resistance can ensure the normal operation of the mechanism, the low friction coefficient can ensure that dirt is not easy to remain, and the tank body is formed by welding and processing NPP plates in a mode of cleaning and using before the corrosion resistance, is not easy to adhere to dirt and is easy to clean. The quick injection and discharge of the tank body is realized by a quick discharge valve arranged at the bottom of the tank body and a DI water injection hole at the bottom.

However, the following problems exist in the prior art: 1. the bottom of the cleaning tank is not provided with a filtering device, abnormal fragments of the wafer can cause blockage of a water inlet and a water outlet, and the inconvenience of water inlet and water outlet is caused; the QDR cleaning tank only adopts simple soaking cleaning, and the cleaning efficiency and quality are low.

Disclosure of Invention

Aiming at the defects of the prior art, the utility model aims to provide a chip QDR cleaning tank, which aims to solve the problems that the bottom of the cleaning tank is not provided with a filtering device in the prior art, abnormal fragments of a wafer can cause blockage of a water inlet and a water outlet, and the water inlet and the water outlet are inconvenient to enter and discharge; and the QDR cleaning tank only adopts simple soaking cleaning, and has low cleaning efficiency and quality.

In order to achieve the above object, the present utility model is achieved by the following technical scheme:

the utility model provides a chip QDR washing tank, includes cell body, filtration bottom plate, nitrogen gas device and spray set, the cell body is used for holding DI water, run through on the filtration bottom plate and be provided with a plurality of filtration holes, nitrogen gas device includes the portion of giving vent to anger, inlet portion and nitrogen gas transport portion, nitrogen gas transport portion is used for providing nitrogen gas, inlet portion with nitrogen gas transport portion connects, filtration bottom plate with the portion of giving vent to anger all is located inside the cell body just filtration bottom plate covers and locates on the portion of giving vent to anger, be equipped with a plurality of ventholes on the portion of giving vent to anger, nitrogen gas passes through the venthole with the filtration hole makes DI water bubbles, spray set includes first inlet tube and spray part, spray part locate on the first inlet tube, just spray part orientation the inside setting of cell body.

Compared with the prior art, the utility model has the beneficial effects that:

the filtering holes on the filtering bottom plate can filter abnormal fragments of the wafer, prevent the blockage of the water outlet and the water inlet, and the nitrogen device is added at the bottom of the filtering bottom plate, nitrogen passes through the air outlet and the filtering holes, so that DI water can reach the bubbling effect, the flow of DI water is accelerated, the cleaning effect is improved, residual liquid medicine is remained on a product after the wafer is soaked and cleaned in the tank body, the spraying device is additionally arranged, the product can be sprayed and washed by the DI water after being soaked by the liquid medicine, and the cleaning effect is greatly improved.

Further, the air outlet portions are arranged in the groove body in a winding mode at equal intervals, so that the air outlet portions are uniformly distributed in the groove body, and the air outlet holes face to one side of the filtering bottom plate.

Further, the chip QDR cleaning tank further comprises a fixing component, the fixing component is located inside the tank body, the fixing component comprises a supporting portion and an adjusting nut, one end of the supporting portion is fixedly connected with the bottom surface of the tank body, the other end of the supporting portion is detachably connected with the adjusting nut, the upper surface of the supporting portion is higher than the top surface of the air outlet portion, and the filtering bottom plate is located between the supporting portion and the adjusting nut, so that the filtering bottom plate is fixed inside the tank body through the fixing component.

Further, the number of the spraying devices is two, the two spraying devices are oppositely arranged and fixedly connected to the upper portion of the tank body through the support, one end of the first water inlet pipe is opened and connected with a water source, the other end of the first water inlet pipe is closed, the number of the spraying parts is multiple, and the spraying parts are equidistantly arranged on the first water inlet pipe.

Further, the chip QDR cleaning tank further comprises an overflow tank, wherein the overflow tank is arranged around the upper edge of the tank body, and the bottom surface of the overflow tank is lower than the upper edge of the tank body.

Further, the chip QDR cleaning tank further comprises a water resistance meter, wherein the water resistance meter is positioned in the overflow tank, and an alarm module is arranged in the water resistance meter.

Further, the chip QDR cleaning tank further comprises a second water inlet pipe, both ends of the second water inlet pipe are open, one end of the second water inlet pipe penetrates through the side wall of the tank body, one end of the second water inlet pipe on the outer side of the tank body is connected with a water source of DI water, and an opening of one end of the inner side of the tank body of the second water inlet pipe is located below the filtering bottom plate.

Further, the chip QDR washing tank further comprises a water outlet and a sealing part, wherein the water outlet penetrates through the bottom surface of the tank body, the sealing part is positioned below the tank body, the sealing part comprises a supporting base and a telescopic assembly arranged on the supporting base, and the telescopic assembly stretches towards the direction of the water outlet.

Further, the telescopic assembly comprises a cylinder, a piston rod and a sealing ring, the cylinder is fixedly connected to the supporting base, the cylinder is used for providing power for the piston rod, so that the piston rod stretches towards the direction of the water outlet, the sealing ring is located at one end, close to the water outlet, of the piston rod, and the sealing ring is driven to be close to or far away from the water outlet by stretching of the piston rod, so that the water outlet is closed or opened.

Further, the water outlet of the spraying part is outwards unfolded from the center to form fan-shaped spraying.

Drawings

FIG. 1 is a perspective view of a chip QDR cleaning tank at a first viewing angle in an embodiment of the present utility model;

FIG. 2 is a perspective view of a chip QDR cleaning tank in a second view angle in accordance with an embodiment of the present utility model;

FIG. 3 is a perspective view of a chip QDR cleaning tank in a third view angle in accordance with an embodiment of the present utility model;

FIG. 4 is a perspective view of the filter base plate of FIG. 2 with the filter base plate removed;

description of main reference numerals:

the utility model will be further described in the following detailed description in conjunction with the above-described figures.

Detailed Description

In order that the utility model may be readily understood, a more complete description of the utility model will be rendered by reference to the appended drawings. Several embodiments of the utility model are presented in the figures. This utility model may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

It will be understood that when an element is referred to as being "mounted" on another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like are used herein for illustrative purposes only.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this utility model belongs. The terminology used herein in the description of the utility model is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model. The term "and/or" as used herein includes any and all combinations of one or more of the associated listed items.

Referring to fig. 1 to 4, a chip QDR cleaning tank in an embodiment of the present utility model is shown, and is used for cleaning an LED chip, the chip QDR cleaning tank includes a tank body 10, a filter bottom plate 50, a nitrogen device and a spraying device, the tank body 10 is used for containing DI water, the filter bottom plate 50 is provided with a plurality of filter holes 55 in a penetrating manner, the filter holes 55 are used for filtering fragments generated by accidents of the LED chip, the nitrogen device includes an air outlet portion 65, an air inlet portion 60 and a nitrogen delivery portion, the nitrogen delivery portion is used for providing nitrogen, the air inlet portion 60 is connected with the nitrogen delivery portion, the filter bottom plate 50 and the air outlet portion 65 are both located inside the tank body 10, the filter bottom plate 50 is covered on the air outlet portion 65, the air outlet portion 65 is provided with a plurality of air outlet holes 66, the nitrogen passes through the air outlet holes 66 and the filter holes 55 so as to bubble the DI water, and the spraying device includes a first water inlet pipe 20 and a spraying portion 25, and the spraying portion 25 is provided on the first water inlet pipe 20 and the spraying portion 25 is disposed toward the inside the tank body 10.

Preferably, the air outlet portions 65 are arranged in the tank 10 at equal intervals in a meandering manner, so that the air outlet portions 65 are uniformly distributed in the tank 10, and the air outlet holes 66 are arranged toward one side of the filter bottom plate 50.

In this embodiment, the filtering holes 55 on the filtering bottom plate 50 are uniformly distributed on the filtering bottom plate 50 at equal intervals, and the air outlets 66 are uniformly arranged in an array along the arrangement direction of the air outlet portions 65, the tank body 10 is a rectangular tank body 10, and the air outlet portions 65 inside the rectangular tank body 10 are fully distributed in the tank body 10, so that the DI water in each position on the filtering bottom plate 50 can be bubbled when the nitrogen device is started, so as to obtain strong cleaning.

It can be appreciated that when the LED chip is cleaned, abnormal fragments of the wafer may cause blockage of the water inlet and the water outlet, resulting in inconvenience of water inlet and water outlet, so that the filter bottom plate 50 is additionally installed in the tank body 10, and large objects such as fragments and the like are prevented from entering the water outlet water inlet during the production process, resulting in blockage of the water inlet and the water outlet, resulting in failure of DI water flow;

simply soaking the LED chip with DI water has an unsatisfactory effect, and therefore, a serpentine air outlet portion 65 is provided below the filter base plate 50, and the air outlet portion 65 supplies nitrogen gas from the outside through the air inlet portion 60 penetrating the filter base plate 50, and the nitrogen gas passes through the air outlet hole 66 and the filter hole 55, so that the DI water has a bubbling effect, the flow of the DI water is accelerated, and the cleaning effect is improved.

In this embodiment, the number of the spraying devices is two, the two spraying devices are oppositely arranged and fixedly connected to the upper side of the tank body 10 through a bracket, one end of the first water inlet pipe 20 is opened and connected with a water source, the other end of the first water inlet pipe 20 is closed, the number of the spraying portions 25 is plural, the spraying portions 25 are arranged on the first water inlet pipe 20 at equal intervals, and the water outlets 75 of the spraying portions 25 are outwards unfolded from the center to form fan-shaped spraying.

It can be understood that, after the wafer is soaked and cleaned in the tank body 10, the residual liquid medicine still remains on the product, the spraying device is additionally arranged above the tank body 10, the product can be sprayed and washed by DI water after being soaked by the liquid medicine, the cleaning effect is greatly improved, the spraying nozzle adopts fan-shaped spraying, the spraying range of the spraying mode is wider, and the damage to the product can be avoided.

Further, the chip QDR cleaning tank further includes a fixing component, the fixing component is located inside the tank 10, the fixing component includes a supporting portion 90 and an adjusting nut 95, one end of the supporting portion 90 is fixedly connected with the bottom surface of the tank 10, the other end is detachably connected with the adjusting nut 95, the level of the upper surface of the supporting portion 90 is higher than the level of the top surface of the air outlet portion 65, and the filtering bottom plate 50 is located between the supporting portion 90 and the adjusting nut 95, so that the filtering bottom plate 50 is fixed inside the tank 10 through the fixing component.

In this embodiment, the fixing components are four and distributed at four corners inside the tank 10, and the top surfaces of the four supporting portions 90 are uniform in height.

It will be appreciated that the adjustment nut 95 is removed, and the filter base plate 50 is then secured to the inside of the tank body 10 by adjusting the nut 95 after the filter base plate 50 is laid on the upper surface of the support portion 90.

Further, when the filter bottom plate 50 is fixed, the side wall of the filter bottom plate 50 is tightly attached to the inner side wall of the tank 10, so as to prevent abnormal fragments of the wafer from sliding out of the gap.

Further, the chip QDR cleaning tank further comprises an overflow tank 30, wherein the overflow tank 30 is arranged around the upper edge of the tank body 10, and the bottom surface of the overflow tank 30 is lower than the upper edge of the tank body 10; the chip QDR cleaning tank further comprises a water resistance meter 40, the water resistance meter 40 is located in the overflow tank 30, an alarm module is arranged in the water resistance meter 40, and a connecting rod 45 electrically connected with an external machine (shown in the figure) is arranged on the water resistance meter 40.

It can be appreciated that by providing the overflow tank 30, the DI water that overflows the tank body 10 flows into the overflow tank 30, so as to prevent the DI water from falling to the ground, and by monitoring the water resistance in real time through the water resistance meter 40 provided in the overflow tank 30, the water resistance alarm function is set, the cleanliness of the DI water is blocked and controlled, and the problem of the cleanliness of the DI water is prevented from causing abnormal batch property of the product.

It should be noted that, the larger the water resistance value, the less impurities in the DI water, i.e., the higher the cleanliness of the DI water, and conversely, the lower the cleanliness of the DI water.

Further, the chip QDR cleaning tank further includes a second water inlet pipe 70, two ends of the second water inlet pipe 70 are open, one end of the second water inlet pipe penetrates through the side wall of the tank body 10, one end of the second water inlet pipe 70 outside the tank body 10 is connected with the DI water source, and an opening of one end of the second water inlet pipe 70 inside the tank body 10 is located below the filtering bottom plate 50.

Further, the chip QDR cleaning tank further includes a water outlet 75 and a sealing portion, the water outlet 75 penetrates through the bottom surface of the tank body 10, the sealing portion is located below the tank body 10, the sealing portion includes a support base 80 and a telescopic assembly disposed on the support base 80, and the telescopic assembly stretches towards the direction of the water outlet 75; the telescopic assembly comprises an air cylinder 81, a piston rod 82 and a sealing ring 83, wherein the air cylinder 81 is fixedly connected to the supporting base 80, the air cylinder 81 is used for providing power for the piston rod 82, so that the piston rod 82 stretches towards the direction of the water outlet 75, the sealing ring 83 is located at one end, close to the water outlet 75, of the piston rod 82, and the sealing part is driven to be close to or far away from the water outlet 75 by stretching of the piston rod 82, so that the water outlet 75 is closed or opened.

It can be appreciated that after the LED chip is soaked and cleaned, compressed air is input or discharged to the air cylinder 81 to drive the piston rod 82 and the sealing ring 83 to block or open the water outlet 75, and in this embodiment, an air hole is provided at a position of the support base 80 corresponding to the air cylinder 81.

The operation steps of cleaning the LED chip of the product are as follows:

1) After the LED chips to be cleaned are reacted by the liquid medicine in the liquid medicine tank (not shown), clamping plugs (not shown) for loading the LED chips are sent into the chip QDR cleaning tank provided by the utility model by clamping jaws (not shown);

2) Closing the water outlet 75, injecting the DI water from the second water inlet pipe 70, and stopping injecting the DI water after the DI water is immersed in the overflow tank 30, wherein the water resistance meter 40 at the overflow tank 30 monitors the water resistance value in real time and provides an early warning function, so as to prevent the water resistance value from failing to meet the expected effect;

3) When the LED chip is soaked, the nitrogen device discharges nitrogen, the nitrogen is blown up from the bottom to be bubbled, and the flow of DI water is accelerated, so that stripping of attachments on the surface of a product is accelerated;

4) After the soaking and cleaning are finished, the water outlet 75 is opened through the telescopic assembly to start draining, the spraying device is opened to flush the surface of the LED chip after the water is emptied, residual liquid medicine on the surface of the LED chip is removed, and the cleaning effect is improved;

5) After the flushing is finished, the clamping plugs loaded with the LED chips are taken out by the clamping jaws and sent to the next working groove body 10.

In summary, in the chip QDR cleaning tank in the above embodiment of the present utility model, abnormal fragments of a wafer are filtered by the filtering bottom plate, and the wafer is also subjected to powerful cleaning in cooperation with the nitrogen device, and finally, residual liquid medicine is removed by the spraying device, so that the cleaning effect is improved;

and the water resistance meter is added at the overflow groove, the water resistance value is monitored in real time, the water resistance value alarm function is set, the cleanliness of DI water is clamped and controlled, and the problem of DI water cleanliness is prevented from causing abnormal batch property of products

In the description of the present specification, a description referring to terms "one embodiment," "some embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present utility model. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

The foregoing examples illustrate only a few embodiments of the utility model and are described in detail herein without thereby limiting the scope of the utility model. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the utility model, which are all within the scope of the utility model. Accordingly, the scope of protection of the present utility model is to be determined by the appended claims.

Claims

1. The utility model provides a chip QDR washing tank, its characterized in that, includes cell body, filtration bottom plate, nitrogen gas device and spray set, the cell body is used for holding DI water, it is provided with a plurality of filtration holes to run through on the filtration bottom plate, nitrogen gas device includes the portion of giving vent to anger, inlet portion and nitrogen gas transport portion, nitrogen gas transport portion is used for providing nitrogen gas, inlet portion with nitrogen gas transport portion connects, filtration bottom plate with the portion of giving vent to anger all is located the cell body is inside, just filtration bottom plate cover is located on the portion of giving vent to anger, be equipped with a plurality of ventholes on the portion of giving vent to anger, nitrogen gas passes through the venthole with the filtration hole makes DI water bubble, spray set includes first inlet tube and spray portion, spray portion locates on the first inlet tube, just spray portion orientation the inside setting of cell body.

2. The chip QDR cleaning tank according to claim 1, wherein said air outlet portions are arranged at equal intervals inside said tank body so that said air outlet portions are uniformly distributed inside said tank body, and said air outlet holes are arranged toward one side of said filter bottom plate.

3. The chip QDR cleaning tank according to claim 1, further comprising a fixing assembly located inside the tank body, the fixing assembly comprising a supporting portion and an adjusting nut, one end of the supporting portion being fixedly connected to the bottom surface of the tank body, the other end being detachably connected to the adjusting nut, the upper surface of the supporting portion having a level higher than that of the top surface of the air outlet portion, the filter base plate being located between the supporting portion and the adjusting nut so that the filter base plate is fixed inside the tank body by the fixing assembly.

4. The chip QDR cleaning tank according to claim 1, wherein two spraying devices are oppositely arranged and fixedly connected above the tank body through a bracket, one end of the first water inlet pipe is opened and connected with a water source, the other end of the first water inlet pipe is closed, a plurality of spraying parts are arranged, and a plurality of spraying parts are equidistantly arranged on the first water inlet pipe.

5. The chip QDR cleaning tank according to claim 1, further comprising an overflow tank, said overflow tank being disposed around an upper edge of said tank body, and a bottom surface of said overflow tank being lower than said upper edge of said tank body.

6. The chip QDR cleaning tank according to claim 5, further comprising a water resistance meter, wherein said water resistance meter is located in said overflow tank, and wherein an alarm module is provided in said water resistance meter.

7. The chip QDR cleaning tank according to claim 1, further comprising a second water inlet pipe, wherein both ends of the second water inlet pipe are open, one end of the second water inlet pipe penetrates through the side wall of the tank body, one end of the second water inlet pipe outside the tank body is connected with the DI water source, and the opening of one end of the second water inlet pipe inside the tank body is located below the filtering bottom plate.

8. The chip QDR cleaning tank according to claim 1, further comprising a water outlet and a sealing portion, wherein the water outlet penetrates through the bottom surface of the tank body, the sealing portion is located below the tank body, the sealing portion comprises a support base and a telescopic assembly arranged on the support base, and the telescopic assembly stretches towards the direction of the water outlet.

9. The chip QDR cleaning tank according to claim 8, wherein the telescoping assembly comprises a cylinder, a piston rod and a sealing ring, the cylinder is fixedly connected to the support base, the cylinder is used for providing power for the piston rod so that the piston rod stretches towards the direction of the water outlet, the sealing ring is located at one end of the piston rod close to the water outlet, and the telescoping of the piston rod drives the sealing ring to be close to or far away from the water outlet so as to close or open the water outlet.

10. The chip QDR cleaning tank according to claim 1, wherein the water outlet of said spray section is flared from the center to form a fan spray.