CN217403228U - Flat loop heat pipe - Google Patents
Flat loop heat pipe Download PDFInfo
- Publication number
- CN217403228U CN217403228U CN202220988883.1U CN202220988883U CN217403228U CN 217403228 U CN217403228 U CN 217403228U CN 202220988883 U CN202220988883 U CN 202220988883U CN 217403228 U CN217403228 U CN 217403228U
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- China
- Prior art keywords
- source device
- heat source
- communicated
- evaporation
- pipe
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- Expired - Fee Related
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- 238000001704 evaporation Methods 0.000 claims abstract description 69
- 230000008020 evaporation Effects 0.000 claims abstract description 61
- 239000007788 liquid Substances 0.000 claims abstract description 51
- 238000009833 condensation Methods 0.000 claims abstract description 12
- 230000005494 condensation Effects 0.000 claims abstract description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 12
- 229910052802 copper Inorganic materials 0.000 claims description 12
- 239000010949 copper Substances 0.000 claims description 12
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 7
- 239000008367 deionised water Substances 0.000 claims description 3
- 229910021641 deionized water Inorganic materials 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims 1
- 230000000694 effects Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 238000009736 wetting Methods 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000009841 combustion method Methods 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000001802 infusion Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
Images
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses a flat loop heat pipe, which relates to the technical field of phase change heat transfer heat exchangers, and comprises an evaporation element and a condensation element, wherein one end of the condensation element is communicated with a steam outlet on the evaporation element, the other end of the condensation element is communicated with a liquid inlet on the evaporation element, a flowing cavity is arranged in the evaporation element, one end of the flowing cavity is communicated with the liquid inlet, the other end of the flowing cavity is communicated with the steam outlet, bulges are arranged on the side wall of the flowing cavity, which is close to a heat source device, gaps are reserved between the top surface of each bulge, which is far away from the heat source device, and the side wall of the flowing cavity, which is far away from the heat source device, grooves are formed between any two adjacent bulges, one end of each groove is communicated with the liquid inlet, the other end of each groove is communicated with the steam outlet, when liquid in the evaporation element is heated, bubbles can be generated on the side wall of the flowing cavity, which is close to the heat source device, the dry burning phenomenon near the steam outlet on the evaporation end can be avoided.
Description
Technical Field
The utility model relates to a phase transition heat exchanger technical field especially relates to a dull and stereotyped loop heat pipe.
Background
Micro-fluidic chamber flat loop heat pipes are of great interest to meet the cooling needs of lightweight, thin electronic devices. The micro-flow cavity flat loop heat pipe is used as a gas-liquid two-phase-change heat exchange device and mainly comprises an evaporation end and a condensation end, wherein a pipeline of the evaporation end or liquid in a flow cavity absorbs heat on a component to be cooled and then is vaporized into water vapor, the water vapor leaves the evaporation end and enters the condensation end to be condensed into liquid, and the liquid enters the pipeline of the evaporation end or the flow cavity again to circularly cool the component to be cooled.
In the existing micro-flow cavity flat-plate loop heat pipe, in order to increase the heated area of liquid in an evaporation end, a plurality of independent pipelines or independent flow cavities are generally arranged in the evaporation end, the liquid is shunted to each pipeline or flow cavity after entering the evaporation end, and then the liquid in each pipeline or flow cavity absorbs heat, is vaporized into water vapor and flows to a water vapor outlet on the evaporation end along the pipeline or flow cavity to leave the evaporation end. However, the vicinity of the vapor outlet on the evaporation end often causes dry burning due to insufficient wetting, and further causes problems such as damage to the heat pipe.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a dull and stereotyped loop heat pipe to solve the problem that above-mentioned prior art exists, make near the steam export on the evaporation end can avoid appearing the dry combustion method phenomenon.
In order to achieve the above object, the utility model provides a following scheme:
the utility model provides a dull and stereotyped loop heat pipe, including evaporation element and condensing element, condensing element's one end with steam outlet intercommunication on the evaporation element, condensing element's the other end with liquid inlet intercommunication on the evaporation element, set up mobile cavity in the evaporation element, mobile cavity's one end with liquid inlet intercommunication, mobile cavity's the other end with steam outlet intercommunication, mobile cavity has laid the arch on being used for being close to the lateral wall of heat source device, each keep away from in the arch the top surface of heat source device with mobile cavity is used for keeping away from leave the clearance between the lateral wall of heat source device, all form the recess between two arbitrary adjacent archs, each the one end of recess with liquid inlet intercommunication, each the other end of recess with steam outlet intercommunication, liquid in the evaporation element be heated can mobile cavity is used for being close to be close to on the lateral wall of heat source device Bubbles are generated.
Preferably, the grooves are parallel and parallel, the widths of the grooves are equal, the depths of the grooves are equal, and the grooves are uniformly distributed in the flow chamber and used for being close to the side wall of the heat source device.
Preferably, the distance between each top surface and the side wall of the flow chamber for being away from the heat source device is [0.3, 0.7] mm, the depth of each groove is [0.8, 1.2] mm, and the distance from the surface of the evaporation element for being in contact with the heat source device to the surface of the evaporation element for being away from the heat source device is [3.8, 4.2] mm.
Preferably, a surface of the evaporation element for contact with the heat source device is a flat surface.
Preferably, the condensing element is a round tube.
Preferably, the outer wall of the condensing element is connected with a heat radiating fin.
Preferably, the device further comprises a gas pipe and a liquid conveying pipe, wherein one end of the gas pipe is used for being connected and communicated with the steam outlet, the other end of the gas pipe is used for being connected and communicated with one end of the condensing element, one end of the liquid conveying pipe is used for being connected and communicated with the other end of the condensing element, and the other end of the liquid conveying pipe is used for being connected and communicated with the liquid inlet.
Preferably, the evaporation element is a copper body, the condensation element is a copper pipe, the gas pipe is a copper pipe, and the infusion pipe is a copper pipe.
Preferably, the liquid is deionized water.
The utility model discloses for prior art gain following technological effect:
the utility model provides a flat-plate loop heat pipe, the evaporation element is used for setting up and cooling down the heat source device on the heat source device, liquid from the condensing element outflow enters into the evaporation element along liquid inlet, liquid in the evaporation element absorbs the heat in the heat source device transmits to the evaporation element thereby produce the bubble on the lateral wall that the flow chamber is used for being close to the heat source device, the bubble constantly gathers in the clearance between the lateral wall that each bellied top surface and flow chamber are used for keeping away from the heat source device and fuses, the big bubble that forms after gathering and fusing in-process and gathering and fusing can all produce the effect of extrusion and scattering to the liquid that is in the clearance between the lateral wall that each bellied top surface and flow chamber are used for keeping away from the heat source device originally, thereby promote the liquid that is located evaporation element middle part or near the liquid inlet region originally to flow to the upper portion region of evaporation element, thereby wetting the upper part of the evaporation element, avoiding the dry burning phenomenon and improving the heat dispersion performance.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required to be used in the embodiments will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a schematic view of the overall structure of a flat loop heat pipe provided by the present invention;
FIG. 2 is a schematic cross-sectional view of an evaporation element in the flat-plate loop heat pipe of FIG. 1;
FIG. 3 is a schematic diagram of a heat sink fin of the condensing element of the flat-plate loop heat pipe of FIG. 1;
fig. 4 is a schematic diagram of the state change of the liquid in the evaporation element in the flat-plate loop heat pipe of fig. 1 at five moments a, b, c, d, e, and f.
In the figure: 100-flat loop heat pipe, 1-evaporation element, 11-bulge, 12-groove, 2-condensation element, 3-gas pipe, 4-liquid conveying pipe, 5-radiating fin, a-depth of groove, c-distance from surface of evaporation element for contacting with heat source device to surface of evaporation element for far away from heat source device.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
The utility model aims at providing a dull and stereotyped loop heat pipe to solve the problem that above-mentioned prior art exists, make near the steam export on the evaporation end can avoid appearing the dry combustion method phenomenon.
In order to make the above objects, features and advantages of the present invention more comprehensible, the present invention is described in detail with reference to the accompanying drawings and the detailed description.
The utility model provides a dull and stereotyped loop heat pipe 100, as shown in fig. 1 and fig. 2, including evaporating element 1 and condensing element 2, the one end of condensing element 2 and the steam outlet intercommunication on the evaporating element 1, the other end of condensing element 2 and the liquid inlet intercommunication on the evaporating element 1, set up the flow cavity in the evaporating element 1, the one end and the liquid inlet intercommunication of flow cavity, the other end and the steam outlet intercommunication of flow cavity, flow cavity has laid protruding 11 on being used for being close to the lateral wall of heat source device, the top surface of keeping away from the heat source device on each protruding 11 and flow the lateral wall that the cavity is used for keeping away from the heat source device leave the clearance, all form recess 12 between arbitrary two adjacent protruding 11, the one end and the liquid inlet intercommunication of each recess 12, the other end and the steam outlet intercommunication of each recess 12, liquid in the evaporating element 1 is heated and can be used for being close to the lateral wall of heat source device on flowing the cavity and produce the bubble.
Therefore, the present invention provides a flat loop heat pipe 100, the evaporation element 1 is used to be disposed on a heat source device to cool the heat source device, the liquid flowing out from the condensation element 2 enters the evaporation element 1 along the liquid inlet, the liquid state change condition in the evaporation element 1 in the flat loop heat pipe 100 is as shown in fig. 4, the liquid in the evaporation element 1 absorbs the heat transferred from the heat source device to the evaporation element 1 to generate bubbles on the side wall of the flow chamber for being close to the heat source device, specifically, the side wall of the flow chamber for being close to the heat source device is an uneven surface to increase the surface roughness thereof, the bubble formation tendency can be enlarged, the bubble formation difficulty is reduced, so that the bubbles can be smoothly formed on the side wall of the flow chamber for being close to the heat source device, and the boiling heat transfer efficiency is enhanced, the bubbles are continuously converged and fused in the gap between the top surface of each protrusion 11 and the side wall of the flow chamber for being far away from the heat source device, all the bubbles in the converging and fusing process and the large bubbles formed after converging and fusing can extrude and disperse liquid in a gap between the top surface of each protrusion 11 and the side wall of the flowing chamber far away from a heat source device, so that the liquid originally positioned in the middle of the evaporation element 1 or in the area near a liquid inlet is pushed to flow to the upper area of the evaporation element 1, the upper part of the evaporation element 1 is wetted, the dry burning phenomenon is avoided, and the heat dissipation performance is improved.
Furthermore, the grooves 12 are parallel, the widths of the grooves 12 are equal, the depths of the grooves 12 are equal, and the grooves 12 are uniformly distributed on the side wall of the flow chamber close to the heat source device, so that bubbles generated in the grooves 12 are more uniform, the wetting effect on the upper part of the evaporation element 1 and a steam outlet is improved, the manufacturing and processing are convenient, and the cost is reduced.
Further, the distance between the top surface of each protrusion 11 and the side wall of the flow chamber for being away from the heat source device is [0.3, 0.7] mm, the depth a of each groove 12 is [0.8, 1.2] mm, the distance c from the surface of the evaporation element 1 for being in contact with the heat source device to the surface of the evaporation element 1 for being away from the heat source device is [3.8, 4.2] mm, wherein preferably, the distance between the top surface of each protrusion 11 and the side wall of the flow chamber for being away from the heat source device is 0.5 mm, the depth a of each groove 12 is 1.0 mm, the distance c from the surface of the evaporation element 1 for being in contact with the heat source device to the surface of the evaporation element 1 for being away from the heat source device is 4.0 mm, and the heat transfer and dissipation effects are good.
Furthermore, the surface of the evaporation element 1, which is used for being in contact with a heat source device, is a plane, so that the evaporation element 1 can be better attached to the surface of the heat source device, and the heat transfer efficiency is improved.
Further, the condensing element 2 is a circular tube, which is more beneficial to transferring heat in the condensing element 2 to the outside air.
Further, as shown in fig. 3, the outer wall of the condensing element 2 is connected with a heat dissipating fin 5, and the connecting heat dissipating fin 5 can increase the contact area with the outside air, thereby realizing rapid heat dissipation of the condensing element 2.
Further, as shown in fig. 1, the utility model provides a flat loop heat pipe 100 still includes gas-supply pipe 3 and transfer line 4, the one end of gas-supply pipe 3 is used for being connected and the intercommunication with steam outlet, the other end of gas-supply pipe 3 is used for being connected and the intercommunication with condensing element 2's one end, the one end of transfer line 4 is used for being connected and the intercommunication with condensing element 2's the other end, the other end of transfer line 4 is used for being connected and the intercommunication with liquid inlet, wherein comparatively preferentially, pass through welded connection between gas-supply pipe 3 and condensing element 2 and the steam outlet, pass through welded connection between transfer line 4 and condensing element 2 and the liquid inlet.
Furthermore, the evaporation element 1 is made of copper, the condensation element 2 is made of copper, the gas pipe 3 is made of copper, the liquid conveying pipe 4 is made of copper, the heat conducting performance is good, and the manufacturing cost is saved.
Further, the liquid is deionized water, which can prevent ions in the liquid from reacting with various elements and pipelines to cause damage, and prolong the service life of the flat loop heat pipe 100.
The utility model discloses a concrete example is applied to explain the principle and the implementation mode of the utility model, and the explanation of the above example is only used to help understand the method and the core idea of the utility model; meanwhile, for those skilled in the art, the idea of the present invention may be changed in the specific embodiments and the application range. In summary, the content of the present specification should not be construed as a limitation of the present invention.
Claims (9)
1. A flat loop heat pipe, comprising: comprises an evaporation element and a condensation element, one end of the condensation element is communicated with a steam outlet on the evaporation element, the other end of the condensing element is communicated with a liquid inlet on the evaporating element, a flowing chamber is arranged in the evaporating element, one end of the flow chamber is communicated with the liquid inlet, the other end of the flow chamber is communicated with the steam outlet, the side wall of the flow chamber, which is close to the heat source device, is provided with bulges, a gap is reserved between the top surface of each bulge, which is far away from the heat source device, and the side wall of the flow chamber, which is far away from the heat source device, a groove is formed between any two adjacent bulges, one end of each groove is communicated with the liquid inlet, the other end of each groove is communicated with the steam outlet, heating of the liquid in the evaporation element can generate bubbles on the side walls of the flow chamber for proximity to the heat source device.
2. The flat plate loop heat pipe of claim 1, wherein: the grooves are parallel and parallel, the widths of the grooves are equal, the depths of the grooves are equal, and the grooves are uniformly distributed on the side wall of the flowing chamber, which is close to the heat source device.
3. The flat plate loop heat pipe of claim 1, wherein: the distance between each top surface and the side wall of the flow chamber for being away from the heat source device is [0.3, 0.7] mm, the depth of each groove is [0.8, 1.2] mm, and the distance from the surface of the evaporation element for being in contact with the heat source device to the surface of the evaporation element for being away from the heat source device is [3.8, 4.2] mm.
4. The flat plate loop heat pipe of claim 1, wherein: the surface of the evaporation element, which is used for being in contact with the heat source device, is a plane.
5. The flat plate loop heat pipe of claim 1, wherein: the condensing element is a round tube.
6. The flat loop heat pipe of claim 1, wherein: and the outer wall of the condensing element is connected with a radiating fin.
7. The flat plate loop heat pipe of claim 1, wherein: still include gas-supply pipe and transfer line, the one end of gas-supply pipe be used for with steam outlet connects and communicates, the other end of gas-supply pipe be used for with the one end of condensing element is connected and communicates, the one end of transfer line be used for with the other end of condensing element is connected and communicates, the other end of transfer line be used for with liquid inlet connects and communicates.
8. The flat plate loop heat pipe of claim 7, wherein: the evaporation element is made of copper, the condensation element is made of copper, the gas conveying pipe is made of copper, and the liquid conveying pipe is made of copper.
9. The flat plate loop heat pipe of claim 1, wherein: the liquid is deionized water.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220988883.1U CN217403228U (en) | 2022-04-26 | 2022-04-26 | Flat loop heat pipe |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220988883.1U CN217403228U (en) | 2022-04-26 | 2022-04-26 | Flat loop heat pipe |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217403228U true CN217403228U (en) | 2022-09-09 |
Family
ID=83141605
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220988883.1U Expired - Fee Related CN217403228U (en) | 2022-04-26 | 2022-04-26 | Flat loop heat pipe |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217403228U (en) |
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2022
- 2022-04-26 CN CN202220988883.1U patent/CN217403228U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20220909 |