CN217336041U - Special high-frequency PCB (printed circuit board) with stacked structure - Google Patents
Special high-frequency PCB (printed circuit board) with stacked structure Download PDFInfo
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- CN217336041U CN217336041U CN202220605426.XU CN202220605426U CN217336041U CN 217336041 U CN217336041 U CN 217336041U CN 202220605426 U CN202220605426 U CN 202220605426U CN 217336041 U CN217336041 U CN 217336041U
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- 238000005553 drilling Methods 0.000 claims abstract description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 239000003822 epoxy resin Substances 0.000 claims description 2
- 229920000647 polyepoxide Polymers 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 11
- 238000009713 electroplating Methods 0.000 abstract description 5
- 238000000034 method Methods 0.000 abstract description 5
- 229920005989 resin Polymers 0.000 abstract description 5
- 239000011347 resin Substances 0.000 abstract description 5
- 239000004743 Polypropylene Substances 0.000 description 17
- 238000009413 insulation Methods 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- -1 polypropylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 230000008092 positive effect Effects 0.000 description 1
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- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The utility model discloses a special stacked high-frequency PCB, which comprises a PCB body, wherein the PCB body comprises a first circuit layer, a second circuit layer, a third circuit layer and a fourth circuit layer from top to bottom; a first PP insulating layer is arranged between the first circuit layer and the second circuit layer; a first light panel insulating layer, a second PP insulating layer and a second light panel insulating layer are sequentially arranged between the second circuit layer and the third circuit layer from top to bottom; a third PP insulating layer and a third light plate insulating layer are sequentially arranged between the third circuit layer and the fourth circuit layer from top to bottom; the utility model discloses a carry out the folded plate pressfitting back with a plurality of circuit layers, a plurality of PP insulating layer, a plurality of worn-out fur insulating layer for process such as drilling, electroplating, resin consent only need carry out one shot operation, thereby has reduced production cycle and manufacturing cost greatly, has solved simultaneously that there is thick difference of board between each circuit layer big, and each layer conducting hole design is complicated, and board warpage and the serious scheduling problem of harmomegathus deformation after pressfitting many times.
Description
Technical Field
The utility model relates to a PCB board technical field, concretely relates to special high frequency PCB board of folding structure.
Background
The PCB is also called a printed circuit board and a printed circuit board, is an important electronic component, is a support of an electronic component, is a carrier for electrical connection of the electronic component, and is called a printed circuit board because it is manufactured by electronic printing. In order to meet the special requirements of signal integrity, electromagnetic shielding performance and the like in a high-frequency PCB, the PCB needs to adopt a laminated design consisting of a plurality of circuit layers, a plurality of PP (polypropylene) insulating layers and a plurality of light plate insulating layers, and the conventional laminated PCB is subjected to processes of multiple pressing, electroplating, resin hole plugging and the like, so that the production period is long, the manufacturing cost is high, the board thickness difference among the circuit layers of the laminated PCB is large, the design of conducting holes of all layers is complex, and the problems of serious warping, expansion and shrinkage deformation and the like of the board after multiple pressing are solved.
Based on the circumstances, the utility model provides a special high frequency PCB board of piling up can effectively solve above problem.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a special high frequency PCB board of stacking up. The utility model provides a pair of special high frequency PCB board of stacking structure, through carrying out the lamination pressfitting back with a plurality of circuit layers, a plurality of PP insulating layer, a plurality of worn-out fur insulating layer for processes such as drilling, electroplating, resin consent only need carry out one shot operation, thereby production cycle and manufacturing cost have reduced greatly, it is big to have the thick difference of board simultaneously to have solved between each circuit layer, and each layer conducting hole design is complicated, and the serious scheduling problem of board warpage and the harmomegathus deformation after a lot of pressfittings.
The utility model discloses a following technical scheme realizes:
a high-frequency PCB with a special stacked structure comprises a PCB body, wherein the PCB body comprises a first circuit layer, a second circuit layer, a third circuit layer and a fourth circuit layer from top to bottom; a first PP insulating layer is arranged between the first circuit layer and the second circuit layer; a first light plate insulating layer, a second PP insulating layer and a second light plate insulating layer are sequentially arranged between the second circuit layer and the third circuit layer from top to bottom; a third PP insulating layer and a third light plate insulating layer are sequentially arranged between the third circuit layer and the fourth circuit layer from top to bottom; the PCB body is provided with a via hole A, a via hole B, a via hole C and a via hole D; the through hole A and the through hole C penetrate through the PCB body; the through hole B and the through hole D respectively penetrate through the first circuit layer to the third PP insulating layer, and back drilling holes are formed in the bottoms of the through hole B and the through hole D; the back drilling hole penetrates through the third light panel insulating layer and the third circuit layer and is communicated with the through hole B or the through hole D.
According to the above aspect, as a more preferable aspect of the above aspect, the inner side walls of the via hole a, the via hole B, the via hole C, and the via hole D are all plated with copper layers.
According to the above technical means, as a more preferable technical means of the above technical means, the inside of each of the via hole a, the via hole B, the via hole C, the via hole D, and the back-drilled hole is filled with epoxy resin.
According to the above technical solution, as a further preferable technical solution of the above technical solution, the top of the via hole B and the via hole D is provided with a hole ring.
According to the above technical solution, as a further preferable technical solution of the above technical solution, the inside of the orifice ring is filled with solder resist ink.
According to the above aspect, as a further preferable aspect of the above aspect, a diameter of the back-drilled hole is 0.15 to 0.2mm larger than a diameter of the via hole B or the via hole D.
Compared with the prior art, the utility model, following advantage and beneficial effect have:
the utility model provides a pair of special high frequency PCB board of stacking structure, through carrying out the lamination pressfitting back with a plurality of circuit layers, a plurality of PP insulating layer, a plurality of worn-out fur insulating layer for processes such as drilling, electroplating, resin consent only need carry out one shot operation, thereby production cycle and manufacturing cost have reduced greatly, it is big to have the thick difference of board simultaneously to have solved between each circuit layer, and each layer conducting hole design is complicated, and the serious scheduling problem of board warpage and the harmomegathus deformation after a lot of pressfittings.
Drawings
Fig. 1 is a schematic view of the overall structure of the present invention;
fig. 2 is a partially enlarged view of a portion a of fig. 1.
Detailed Description
In order to make the technical solution of the present invention better understood by those skilled in the art, the following description of the preferred embodiments of the present invention is given with reference to the accompanying examples, but it should be understood that the drawings are for illustrative purposes only and are not to be construed as limiting the patent; for the purpose of better illustrating the present embodiments, certain elements of the drawings may be omitted, enlarged or reduced, and do not represent the size of an actual product; it will be understood by those skilled in the art that certain well-known structures in the drawings and descriptions thereof may be omitted. The positional relationships depicted in the drawings are for illustrative purposes only and are not to be construed as limiting the present patent.
Example 1:
a special laminated high-frequency PCB comprises a PCB body, wherein the PCB body comprises a first circuit layer 1, a second circuit layer 2, a third circuit layer 3 and a fourth circuit layer 4 from top to bottom; a first PP insulating layer 5 is arranged between the first circuit layer 1 and the second circuit layer 2; a first light plate insulating layer 6, a second PP insulating layer 7 and a second light plate insulating layer 8 are sequentially arranged between the second circuit layer 2 and the third circuit layer 3 from top to bottom; a third PP insulating layer 9 and a third light plate insulating layer 10 are sequentially arranged between the third circuit layer 3 and the fourth circuit layer 4 from top to bottom; the PCB body is provided with a through hole A11, a through hole B12, a through hole C13 and a through hole D14; the via A11 and the via C13 penetrate the PCB body; the through hole B12 and the through hole D14 respectively penetrate through the first circuit layer 1 to the third PP insulation layer 9, and the bottoms of the through hole B12 and the through hole D14 are both provided with back-drilled holes 15; the back-drilled hole 15 penetrates through the third light panel insulating layer 10 and the third circuit layer 3 and is communicated with the through hole B12 or the through hole D14.
Example 2:
a special stacked high-frequency PCB comprises a PCB body, wherein the PCB body comprises a first circuit layer 1, a second circuit layer 2, a third circuit layer 3 and a fourth circuit layer 4 from top to bottom; a first PP insulating layer 5 is arranged between the first circuit layer 1 and the second circuit layer 2; a first light plate insulating layer 6, a second PP insulating layer 7 and a second light plate insulating layer 8 are sequentially arranged between the second circuit layer 2 and the third circuit layer 3 from top to bottom; a third PP insulating layer 9 and a third light plate insulating layer 10 are sequentially arranged between the third circuit layer 3 and the fourth circuit layer 4 from top to bottom; the PCB body is provided with a through hole A11, a through hole B12, a through hole C13 and a through hole D14; the via A11 and the via C13 penetrate the PCB body; the through hole B12 and the through hole D14 respectively penetrate through the first circuit layer 1 to the third PP insulation layer 9, and the bottoms of the through hole B12 and the through hole D14 are both provided with back-drilled holes 15; the back-drilled hole 15 penetrates through the third light panel insulating layer 10 and the third circuit layer 3 and is communicated with the via B12 or the via D14. The inner sidewalls of the via A11, the via B12, the via C13 and the via D14 are all plated with a copper layer 16. The interiors of the via a11, the via B12, the via C13, the via D14, and the back-drilled hole 15 are filled with epoxy 17. And the top of the through hole B12 and the top of the through hole D14 are provided with a hole ring 18, and the inside of the hole ring 18 is filled with solder resist ink 19.
The utility model discloses a carry out the folded plate pressfitting back with a plurality of circuit layers, a plurality of PP insulating layer, a plurality of worn-out fur insulating layer for process such as drilling, electroplating, resin consent only need carry out one shot operation, thereby has reduced production cycle and manufacturing cost greatly, has solved simultaneously that there is thick difference of board between each circuit layer big, and each layer conducting hole design is complicated, and board warpage and the serious scheduling problem of harmomegathus deformation after pressfitting many times.
Further, in another embodiment, the diameter of the back drilled hole 15 is 0.15-0.2 mm larger than the diameter of the via hole B12 or the via hole D14.
According to the description and drawings of the present invention, it is easy for those skilled in the art to manufacture or use the present invention, which is a special stacked high frequency PCB board, and can produce the positive effects described in the present invention.
Unless otherwise specified, in the present invention, if the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate an orientation or positional relationship based on the orientation or positional relationship shown in the drawings, it is only for the convenience of describing the present invention and simplifying the description, rather than to indicate or imply that the device or element so referred to must have a particular orientation, be constructed and operated in a particular orientation, therefore, the terms describing orientation or positional relationship in the present invention are used for illustrative purposes only, and should not be construed as limiting the present patent, specific meanings of the above terms can be understood by those of ordinary skill in the art in light of the specific circumstances in conjunction with the accompanying drawings.
Unless expressly stated or limited otherwise, the terms "disposed," "connected," and "connected" are used broadly and encompass both fixed and removable connections, or integral connections; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
The above is only the preferred embodiment of the present invention, not to the limitation of the present invention in any form, all the technical matters of the present invention all fall into the protection scope of the present invention to any simple modification and equivalent change of the above embodiments.
Claims (6)
1. A high frequency PCB board of special stack structure which characterized in that: the PCB comprises a PCB body, wherein the PCB body comprises a first circuit layer (1), a second circuit layer (2), a third circuit layer (3) and a fourth circuit layer (4) from top to bottom; a first PP insulating layer (5) is arranged between the first circuit layer (1) and the second circuit layer (2); a first light plate insulating layer (6), a second PP insulating layer (7) and a second light plate insulating layer (8) are sequentially arranged between the second circuit layer (2) and the third circuit layer (3) from top to bottom; a third PP insulating layer (9) and a third light plate insulating layer (10) are sequentially arranged between the third circuit layer (3) and the fourth circuit layer (4) from top to bottom; the PCB body is provided with a via hole A (11), a via hole B (12), a via hole C (13) and a via hole D (14); the through hole A (11) and the through hole C (13) penetrate through the PCB body; the through hole B (12) and the through hole D (14) penetrate through the first circuit layer (1) to the third PP insulating layer (9) respectively, and back drilling holes (15) are formed in the bottoms of the through hole B (12) and the through hole D (14); the back drilling hole (15) penetrates through the third light plate insulating layer (10) and the third circuit layer (3) and is communicated with the through hole B (12) or the through hole D (14).
2. The special stacked high frequency PCB board as claimed in claim 1, wherein: and the inner side walls of the through hole A (11), the through hole B (12), the through hole C (13) and the through hole D (14) are plated with copper layers (16).
3. The special stacked high frequency PCB board as claimed in claim 1, wherein: and epoxy resin (17) is filled in the through hole A (11), the through hole B (12), the through hole C (13), the through hole D (14) and the back drilling hole (15).
4. The special stacked high frequency PCB board as claimed in claim 1, wherein: and the top parts of the through hole B (12) and the through hole D (14) are provided with annular rings (18).
5. The special stacked high-frequency PCB board as claimed in claim 4, wherein: the inner part of the hole ring (18) is filled with solder resist ink (19).
6. The special stacked high frequency PCB board as claimed in claim 1, wherein: the diameter of the back drilling hole (15) is 0.15-0.2 mm larger than that of the through hole B (12) or the through hole D (14).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220605426.XU CN217336041U (en) | 2022-03-18 | 2022-03-18 | Special high-frequency PCB (printed circuit board) with stacked structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220605426.XU CN217336041U (en) | 2022-03-18 | 2022-03-18 | Special high-frequency PCB (printed circuit board) with stacked structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217336041U true CN217336041U (en) | 2022-08-30 |
Family
ID=83001596
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220605426.XU Active CN217336041U (en) | 2022-03-18 | 2022-03-18 | Special high-frequency PCB (printed circuit board) with stacked structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217336041U (en) |
-
2022
- 2022-03-18 CN CN202220605426.XU patent/CN217336041U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: A special stacked high-frequency PCB board Granted publication date: 20220830 Pledgee: China Co. truction Bank Corp Jiaxing branch Pledgor: CHENGYI ELECTRONICS (JIAXING) CO.,LTD. Registration number: Y2024330000090 |
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| PE01 | Entry into force of the registration of the contract for pledge of patent right |